CN110147151B - Computer host heat abstractor - Google Patents
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- CN110147151B CN110147151B CN201910448093.7A CN201910448093A CN110147151B CN 110147151 B CN110147151 B CN 110147151B CN 201910448093 A CN201910448093 A CN 201910448093A CN 110147151 B CN110147151 B CN 110147151B
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- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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Abstract
The invention discloses a heat dissipation device of a computer host, and relates to the technical field of computer hosts. The invention comprises a main shell, a cover body, a main board heat dissipation assembly, an air inlet assembly and an air exhaust assembly, wherein a main board heat conduction shell, a cold water shell and a cold air shell are fixed on the inner wall of the main shell, a plurality of first baffles are fixed on the inner wall of the main board heat conduction shell side by side, the main board heat conduction shell is formed into a plurality of flow guide cavities by the first baffles, water pipes are fixedly communicated with the opposite sides of the flow guide cavities, and second baffles are fixed on the opposite inner walls of the cold water shell. The invention can carry out water cooling treatment by matching the silica gel plate, the copper plate, the heat conducting plate, the micro water pump, the water service pipe, the flow guide cavity, the S-shaped water guide cavity and the semiconductor refrigerating sheet, and can carry out air cooling treatment by matching the exhaust fan, the air inlet pipe, the air inlet assembly, the semiconductor refrigerating sheet, the air outlet pipe and the air exhaust assembly, thereby solving the problem of poor heat dissipation effect of the traditional computer host.
Description
Technical Field
The invention belongs to the technical field of computer hosts, and particularly relates to a heat dissipation device of a computer host.
Background
The heat dissipation of the inside of the existing computer host is processed by heat dissipation in a mode of air cooling or water cooling or combined use of air cooling and water cooling, wherein the water cooling mainly aims at heat dissipation of the processor, the air cooling mainly aims at heat dissipation of air circulation inside and outside the case, the heat dissipation effect is insufficient, and when the air cooling is used for processing, external dust and impurities can be brought in to influence the use of the host.
Disclosure of Invention
The invention aims to provide a heat dissipation device of a computer mainframe, which can carry out water cooling treatment by matching a silica gel plate, a copper plate, a heat conduction plate, a micro water pump, a water through pipe, a flow guide cavity, an S-shaped water guide cavity and a semiconductor refrigerating sheet, and can carry out air cooling treatment by matching an exhaust fan, an air inlet pipe, an air inlet assembly, a semiconductor refrigerating sheet, an air outlet pipe and an air exhaust assembly, thereby solving the problem of poor heat dissipation effect of the existing computer mainframe.
In order to solve the technical problems, the invention is realized by the following technical scheme:
the invention relates to a heat dissipation device of a computer mainframe, which comprises a main shell, a cover body, a mainboard heat dissipation assembly, an air inlet assembly and an air exhaust assembly, wherein the main shell is provided with a plurality of heat dissipation holes;
a main board heat conduction shell, a cold water shell and a cold air shell are fixed on the inner wall of the main shell;
a plurality of first baffles are fixed on the inner wall of the main board heat conduction shell side by side, the main board heat conduction shell is formed into a plurality of flow guide cavities by the first baffles, and water service pipes are fixedly communicated with the opposite sides of the flow guide cavities;
a second baffle is fixed on one opposite inner wall of the cold water shell, the cold water shell is formed into an S-shaped water guide cavity by the two second baffles, a water inlet of the S-shaped water guide cavity is communicated with one water through pipe through a pipeline, a water outlet of the S-shaped water guide cavity is communicated with the other water through pipe through a pipeline, and a micro water pump is fixedly communicated between the S-shaped water guide cavity and the water through pipe;
the cooling air shell is internally and fixedly provided with a snake-shaped radiating pipe, the inner bottom surface of the cooling air shell and the inner bottom surface of the cooling water shell are fixedly provided with a plurality of semiconductor refrigerating sheets, one end of an air inlet of the snake-shaped radiating pipe penetrates through one side of the cooling air shell and is fixedly communicated with an air inlet pipe, one end of an air outlet of the snake-shaped radiating pipe penetrates through the other side of the cooling air shell and is fixedly communicated with an air outlet pipe, and a connecting part of the air outlet pipe and the snake-shaped radiating pipe is communicated with an exhaust fan;
one surface of the cover body is fixedly connected with one surface of the main shell, and a plurality of first through holes are formed in the cover body;
the heat dissipation assembly of the main board comprises a silica gel plate, one surface of the silica gel plate is fixedly connected with one surface of the cover body, a copper plate is embedded and fixed on the bottom surface of the silica gel plate, a plurality of heat conduction plates are fixed on one surface of the copper plate, and one end of each heat conduction plate penetrates through the first through hole and is positioned in the corresponding flow guide cavity;
the air inlet assembly comprises an air ventilation shell, a connecting pipe is fixedly communicated with one end face of the air ventilation shell, a plurality of air ventilation holes are formed in one side face of the air ventilation shell side by side, and the structural characteristics of the air inlet assembly are the same as those of the air exhaust assembly.
Furthermore, one end of the upper connecting pipe of the air inlet assembly is fixedly communicated with one end of the air inlet pipe through a quick connector, and one end of the upper connecting pipe of the air exhaust assembly is fixedly communicated with one end of the air outlet pipe through a quick connector.
Furthermore, a set of second through holes is formed in one surface of the cover body, and one ends of the air inlet pipe and the air outlet pipe penetrate through the cover body through the two second through holes respectively.
Furthermore, a plurality of annular holes are formed in the silica gel plate, a plurality of thread sleeves are fixed on one surface of the cover body, the annular holes are in clearance fit with the thread sleeves, the length of each thread sleeve is the same as the thickness of the silica gel plate, and the first through holes are located in the middle of the thread sleeves.
Furthermore, a rubber plate is fixed on the inner side face of the cover body, and the main board heat conduction shell, the cold water shell and the cold water shell are sealed with the cover body through the rubber plate.
Furthermore, the heat-conducting plates are arranged in a plurality of rows, the heat-conducting plates are arranged by the first heat-conducting plate and the second heat-conducting plate at intervals, and the first heat-conducting plate and the second heat-conducting plate are distributed in a splayed shape.
Furthermore, the inner diameters of the plurality of ventilation holes are sequentially increased from one end of the ventilation shell with the connecting pipe to the other end of the ventilation shell, and the increased range is 0.2-0.4 cm.
Furthermore, a plurality of thread lugs are fixed on the opposite sides of the ventilation shell.
Further, mainboard heat conduction shell, cold water shell and cold air shell week side all the cladding have the insulating layer, snakelike cooling tube is copper tubular construction.
The invention has the following beneficial effects:
1. according to the invention, heat can be discharged into water in the diversion cavity through the silica gel plate, the copper plate and the heat conducting plate, water circulation between the diversion cavity and the S-shaped water guide cavity can be formed through the micro water pump and the water through pipe, water in the S-shaped water guide cavity can be refrigerated through the semiconductor refrigeration sheet in the cold water shell, water cooling treatment can be carried out, heat on the main board can be efficiently conducted into the diversion cavity through the silica gel plate and the copper plate, and the water cooling effect on the main machine is improved.
2. The hot gas in the case is discharged into the serpentine heat dissipation pipe through the exhaust fan, the air inlet pipe and the air inlet assembly, the gas in the serpentine heat dissipation pipe can be refrigerated through the semiconductor refrigeration sheet in the cold air shell and the water in the cold air shell, the cold air can be discharged through the air outlet pipe and the air exhaust assembly to form air circulation, air cooling treatment can be performed, cooling by combining water cooling and air cooling is performed, the heat dissipation effect of the host is greatly improved, the use effect of the host is improved, meanwhile, the device is used for air cooling, hollow holes do not need to be used to be communicated with the outside, and the situation that external dust and impurities enter the case is avoided.
Of course, it is not necessary for any product in which the invention is practiced to achieve all of the above-described advantages at the same time.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a heat dissipation device of a computer host according to the present invention;
FIG. 2 is an exploded view of the structure of FIG. 1;
FIG. 3 is a schematic structural diagram of the main housing;
FIG. 4 is a schematic structural view of the cover;
FIG. 5 is a schematic structural diagram of a motherboard heat dissipation assembly;
FIG. 6 is a schematic structural view of the air intake assembly;
in the drawings, the components represented by the respective reference numerals are listed below:
1-a main shell, 2-a cover body, 3-a main board heat dissipation component, 4-an air inlet component, 5-an air exhaust component, 101-a main board heat conduction shell, 102-a cold water shell, 103-a cold air shell, 104-a first baffle, 105-a flow guide cavity, 106-a water through pipe, 107-a second baffle, 108-an S-shaped water guide cavity, 109-a micro water pump, 110-a serpentine heat dissipation pipe, 111-a semiconductor refrigeration sheet, 112-an air inlet pipe, 113-an air outlet pipe, 114-an exhaust fan, 201-a first through hole, 202-a second through hole, 203-a thread sleeve, 301-a silica gel plate, 302-a copper plate, 303-a heat conduction plate, 304-an annular hole, 401-an air through shell, 402-a connection pipe, 403-a vent hole and 404-a thread support lug.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-6, the present invention is a heat dissipation device for a computer host, which includes a main housing 1, a cover 2, a main board heat dissipation assembly 3, an air intake assembly 4 and an air exhaust assembly 5;
a mainboard heat conduction shell 101, a cold water shell 102 and a cold air shell 103 are fixed on one inner wall of the main shell 1, the main shell 1 is in clearance fit with the chassis, the main shell 1 is fixedly connected with the inner wall of the chassis through bolts, and the installation position is the original installation position of the mainboard of the existing chassis;
a plurality of first baffles 104 are fixed on the inner wall of the main board heat conduction shell 101 side by side, the plurality of first baffles 104 form a plurality of flow guide cavities 105 on the main board heat conduction shell 101, and water pipes 106 are fixedly communicated with the opposite sides of the plurality of flow guide cavities 105;
a second baffle 107 is fixed on one opposite inner wall of the cold water shell 102, the cold water shell 102 is formed into an S-shaped water guide cavity 108 by the two second baffles 107, a water inlet of the S-shaped water guide cavity 108 is communicated with one water through pipe 106 through a pipeline, a water outlet of the S-shaped water guide cavity 108 is communicated with the other water through pipe 106 through a pipeline, and a micro water pump 109 is fixedly communicated between the S-shaped water guide cavity 108 and the water through pipe 106;
a serpentine radiating pipe 110 is fixed in the cold air shell 103, a plurality of semiconductor refrigerating fins 111 are fixed on the inner bottom surface of the cold air shell 103 and the inner bottom surface of the cold water shell 102, one end of an air inlet of the serpentine radiating pipe 110 penetrates through one side of the cold air shell 103 and is fixedly communicated with an air inlet pipe 112, one end of an air outlet of the serpentine radiating pipe 110 penetrates through the other side of the cold air shell 103 and is fixedly communicated with an air outlet pipe 113, and a connection part of the air outlet pipe 113 and the serpentine radiating pipe 110 is communicated with an exhaust fan 114;
one surface of the cover body 2 is fixedly connected with one surface of the main shell body 1, and a plurality of first through holes 201 are formed in the cover body 2;
the main board heat dissipation assembly 3 comprises a silica gel plate 301, one surface of the silica gel plate 301 is fixedly connected with one surface of the cover body 2, a copper plate 302 is fixedly embedded on the bottom surface of the silica gel plate 301, a plurality of heat conduction plates 303 are fixed on one surface of the copper plate 302, and one end of each heat conduction plate 303 penetrates through the first through hole 201 and is positioned inside the flow guide cavity 105;
the air inlet component 4 comprises an air ventilation shell 401, one end face of the air ventilation shell 401 is fixedly communicated with a connecting pipe 402, a plurality of air ventilation holes 403 are formed in one side face of the air ventilation shell 401 side by side, the structural characteristics of the air inlet component 4 are the same as those of the air exhaust component 5, and the air ventilation shell 401 on the air inlet component 4 and the air exhaust component 5 are fixedly connected with the relative inner wall of the case through a threaded support lug 404 and a bolt.
As shown in fig. 1, one end of the connecting pipe 402 on the air intake assembly 4 is fixedly connected to one end of the air intake pipe 112 through a quick connector, and one end of the connecting pipe 402 on the air exhaust assembly 5 is fixedly connected to one end of the air outlet pipe 113 through a quick connector.
As shown in fig. 1 and fig. 4, a set of second through holes 202 is formed on one surface of the cover 2, and one end of the air inlet pipe 112 and one end of the air outlet pipe 113 penetrate through the cover 2 through the two second through holes 202 respectively.
As shown in fig. 1 and 5, a plurality of annular holes 304 are formed in the silica gel plate 301, a plurality of thread sleeves 203 are fixed on one surface of the cover body 2, the annular holes 304 are in clearance fit with the thread sleeves 203, the length of the thread sleeves 203 is the same as the thickness of the silica gel plate 301, and the first through holes 201 are located at the middle positions of the thread sleeves 203.
Wherein, a rubber plate is fixed on the inner side surface of the cover body 2, and the main board heat conduction shell 101, the cold water shell 102 and the cold air shell 103 are sealed with the cover body 2 through the rubber plate.
As shown in fig. 5, the plurality of heat conducting plates 303 are arranged in a plurality of rows, the plurality of rows of heat conducting plates 303 are arranged by the first heat conducting plate and the second heat conducting plate at intervals, and the first heat conducting plate and the second heat conducting plate are distributed in a splayed shape.
As shown in fig. 6, the inner diameters of the plurality of ventilation holes 403 increase in sequence from the end of the ventilation housing 401 with the connection pipe 402 to the other end of the ventilation housing 401, and the increase range is 0.2-0.4 cm.
Wherein a plurality of screw lugs 404 are fixed on one opposite side of the ventilation housing 401, as shown in fig. 6.
Wherein, mainboard heat conduction shell 101, cold water shell 102 and the all claddings of cold wind shell 103 week side have the insulating layer, and snakelike cooling tube 110 is copper tubular construction.
One specific application of this embodiment is: the heat dissipation mode of the case is the combination of water cooling and air cooling, during water cooling heat dissipation, the silica gel plate 301 absorbs heat on the mainboard and discharges the heat to the water in the diversion cavity 105 through the copper plate 302 and the heat conduction plate 303, the micro water pump 109 pumps the water in the diversion cavity 105 through the water service pipe 106 and discharges the water to the S-shaped water guide cavity 108 in the cold water shell 102, the semiconductor refrigeration piece 111 in the cold water shell 102 refrigerates the water in the S-shaped water guide cavity 108, the water after refrigeration flows back to the diversion cavity 105 through the water service pipe 106 to form water circulation, and water cooling treatment can be carried out.
During the air-cooled heat dissipation, the air exhauster 114 takes out the hot gas of quick-witted incasement through air-supply line 112 and air inlet subassembly 4, and side by side to snakelike cooling tube 110 in, the semiconductor refrigeration piece 111 in the cold wind shell 103 carries out the refrigeration treatment to the water in the cold wind shell 103, and the cold water in the cold wind shell 103 carries out the refrigeration treatment to the gas in the snakelike cooling tube 110, and the cold air is through going out tuber pipe 113 and air exhaust subassembly 5 backward flow to quick-witted incasement portion, can carry out the forced air cooling and handle.
In the description herein, references to the description of "one embodiment," "an example," "a specific example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The preferred embodiments of the invention disclosed above are intended to be illustrative only. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best utilize the invention. The invention is limited only by the claims and their full scope and equivalents.
Claims (9)
1. A kind of computer host computer heat dissipating double-fuselage, characterized by: comprises a main shell (1), a cover body (2), a main board radiating assembly (3), an air inlet assembly (4) and an air exhaust assembly (5);
a main board heat conduction shell (101), a cold water shell (102) and a cold air shell (103) are fixed on one inner wall of the main shell (1);
a plurality of first baffles (104) are fixed on one inner wall of the main board heat conduction shell (101) side by side, the main board heat conduction shell (101) is formed into a plurality of flow guide cavities (105) by the plurality of first baffles (104), and water pipes (106) are fixedly communicated with one opposite sides of the plurality of flow guide cavities (105);
a second baffle (107) is fixed on one opposite inner wall of the cold water shell (102), the cold water shell (102) is formed into an S-shaped water guide cavity (108) by the two second baffles (107), a water inlet of the S-shaped water guide cavity (108) is communicated with one water through pipe (106) through a pipeline, a water outlet of the S-shaped water guide cavity (108) is communicated with the other water through pipe (106) through a pipeline, and a micro water pump (109) is fixedly communicated between the S-shaped water guide cavity (108) and the water through pipe (106);
the cooling air shell (103) is internally fixed with a serpentine radiating pipe (110), the bottom surface in the cooling air shell (103) and the bottom surface in the cooling water shell (102) are fixed with a plurality of semiconductor refrigerating sheets (111), one end of an air inlet of the serpentine radiating pipe (110) penetrates through one side of the cooling air shell (103) and is fixedly communicated with an air inlet pipe (112), one end of an air outlet of the serpentine radiating pipe (110) penetrates through the other side of the cooling air shell (103) and is fixedly communicated with an air outlet pipe (113), and a connection part of the air outlet pipe (113) and the serpentine radiating pipe (110) is communicated with an exhaust fan (114);
one surface of the cover body (2) is fixedly connected with one surface of the main shell body (1), and a plurality of first through holes (201) are formed in the cover body (2);
the main board heat dissipation assembly (3) comprises a silica gel plate (301), one surface of the silica gel plate (301) is fixedly connected with one surface of the cover body (2), a copper plate (302) is fixedly embedded in the bottom surface of the silica gel plate (301), a plurality of heat conduction plates (303) are fixed on one surface of the copper plate (302), and one ends of the heat conduction plates (303) penetrate through the first through holes (201) and are located inside the flow guide cavity (105);
the air inlet component (4) comprises an air ventilation shell (401), a connecting pipe (402) is fixedly communicated with one end face of the air ventilation shell (401), a plurality of air vents (403) are formed in one side face of the air ventilation shell (401) side by side, and the structural characteristics of the air inlet component (4) are the same as those of the air exhaust component (5).
2. The heat dissipating device of a host computer of a computer according to claim 1, wherein one end of the connecting pipe (402) on the air intake assembly (4) is fixedly communicated with one end of the air intake pipe (112) through a quick-connect joint, and one end of the connecting pipe (402) on the air exhaust assembly (5) is fixedly communicated with one end of the air outlet pipe (113) through a quick-connect joint.
3. The heat dissipating device of a host computer according to claim 1, wherein a set of second through holes (202) is formed on a surface of the cover (2), and one ends of the air inlet pipe (112) and the air outlet pipe (113) respectively penetrate through the cover (2) through the two second through holes (202).
4. The heat dissipation device of the host computer of the computer according to claim 1, wherein the silicon rubber plate (301) is provided with a plurality of annular holes (304), a plurality of thread sleeves (203) are fixed on one surface of the cover body (2), the annular holes (304) are in clearance fit with the thread sleeves (203), the length of the thread sleeves (203) is the same as the thickness of the silicon rubber plate (301), and the first through holes (201) are located at the middle positions of the thread sleeves (203).
5. The heat dissipation device of a host computer of a computer according to claim 1, wherein a rubber plate is fixed on the inner side surface of the cover body (2), and the main board heat conduction shell (101), the cold water shell (102) and the cold air shell (103) are sealed with the cover body (2) through the rubber plate.
6. The heat sink for host computer of computer as claimed in claim 1, wherein said plurality of heat-conducting plates (303) are arranged in a plurality of rows, said plurality of rows of said heat-conducting plates (303) are arranged by spacing said first heat-conducting plate and said second heat-conducting plate, said first heat-conducting plate and said second heat-conducting plate are arranged in a splayed configuration.
7. The heat sink for host computer of computer according to claim 1, wherein the inner diameter of the plurality of said ventilation holes (403) increases from one end of the ventilation housing (401) with the connecting pipe (402) to the other end of the ventilation housing (401), and the increase range is 0.2-0.4 cm.
8. The heat sink device of claim 1, wherein a plurality of threaded lugs (404) are fixed to an opposite side of the ventilation housing (401).
9. The heat dissipation device of a host computer of a computer according to claim 1, wherein the peripheral sides of the main board heat conduction shell (101), the cold water shell (102) and the cold air shell (103) are all coated with heat insulation layers, and the serpentine heat dissipation pipe (110) is a copper pipe structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910448093.7A CN110147151B (en) | 2019-05-27 | 2019-05-27 | Computer host heat abstractor |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910448093.7A CN110147151B (en) | 2019-05-27 | 2019-05-27 | Computer host heat abstractor |
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| CN110147151A CN110147151A (en) | 2019-08-20 |
| CN110147151B true CN110147151B (en) | 2022-06-24 |
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| CN111240442B (en) * | 2019-11-09 | 2021-03-19 | 湖南化工职业技术学院 | Computer electronic element cooling device |
| CN112867350B (en) * | 2020-12-31 | 2022-08-02 | 广东技术师范大学 | Intelligent heat dissipation type robot controller |
| CN117369597A (en) * | 2023-10-12 | 2024-01-09 | 沐曦科技(北京)有限公司 | Main board |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN203595424U (en) * | 2013-11-22 | 2014-05-14 | 电子科技大学 | Water-cooled radiator |
| CN206434091U (en) * | 2016-11-18 | 2017-08-25 | 深圳市北冰洋半导体有限公司 | A kind of changes in temperature constant temperature mattress main frame of the magnetic water tank with highly effective refrigeration and heating |
| CN207115307U (en) * | 2017-06-15 | 2018-03-16 | 东莞市世盈五金电气有限公司 | A kind of cabinet dustproof heat radiator |
| CN207037591U (en) * | 2017-08-18 | 2018-02-23 | 李志坤 | A kind of computer host box with high-efficient radiating function |
| CN107728758B (en) * | 2017-11-20 | 2020-11-03 | 运城学院 | High radiating efficiency's radiator for notebook |
| CN107704049B (en) * | 2017-11-21 | 2020-04-28 | 运城学院 | Computer constant temperature machine case |
| CN207488940U (en) * | 2017-11-30 | 2018-06-12 | 郑志刚 | A kind of computer host radiator |
| CN108255274A (en) * | 2018-03-22 | 2018-07-06 | 河南趣读信息科技有限公司 | A kind of compound server radiating case |
| CN109032313B (en) * | 2018-09-18 | 2021-06-11 | 温州职业技术学院 | High-efficient heat dissipation cooling device of computer machine case |
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