CN107656600A - A kind of regenerative apparatus for computer CPU radiating - Google Patents

Abstract

The invention discloses a heat storage device for heat dissipation of computer CPU, which comprises a heat-absorbing sheet, a heat-storage box and a control system, the lower end of the heat-absorbing sheet is in contact with the CPU; The tank is filled with heat storage material, the heat-absorbing plate is connected with a heat conduction plate, and the heat conduction plate passes through the heat storage tank to contact the heat storage material. There is a pipe between them, and a heat dissipation pipe is connected between the inlet and the outlet. The heat dissipation pipe is fixed on the outer wall of the heat storage tank through several fixing parts. The control system includes a control box, a mounting plate inside the box and a mounting plate outside the box. On the upper surface of the heat storage box, the installation plate inside the box is fixed in the heat storage box, and the installation plate inside the box extends into the heat storage material, and the installation plate outside the box is fixed on the outer wall of the heat storage box, the structure is simple and the cost is low , can run for a long time and can maintain efficient heat dissipation.

Description

Heat storage device for computer CPU heat dissipation

technical field

The invention relates to the technical field of heat dissipation of electronic equipment, in particular to a heat storage device for heat dissipation of a computer CPU.

Background technique

Computer (computer), commonly known as computer, is a modern electronic computing machine used for high-speed computing. It can perform numerical calculations, logic calculations, and storage and memory functions. It is a modern intelligent electronic device that can run according to the program and process massive data automatically and at high speed. When the computer is running, the internal electronic components will generate heat, and the CPU is the largest heat generating device in the computer. The normal operating temperature of electronic devices should be lower than 65 degrees Celsius. If it exceeds this range, the components will not work stably and affect the operation. In order to ensure the working efficiency and service life of the CPU, it is necessary to dissipate the heat generated by it in time.

Nowadays, the common heat dissipation methods of computers are: air cooling, water cooling and heat pipe cooling. If the air-cooled heat dissipation takes a long time, a large amount of dust will easily accumulate on the fan blades, resulting in a sharp drop in heat dissipation effect, and the heat dissipation effect is average, which is likely to cause noise. The main problems of water cooling and heat dissipation: higher price, and higher installation requirements. In comparison, heat pipe heat dissipation uses heat pipes as heat-conducting components, relying on their excellent thermal conductivity to reduce the heat on the heat-generating components, but the price of heat pipes is comparable to that of water cooling, and the cost performance is not high.

Contents of the invention

In order to overcome the deficiencies of the existing technical solutions, the present invention provides a heat storage device for computer CPU heat dissipation that has a simple structure, low cost, long-term operation and high heat dissipation effect, so as to solve the problems raised by the background technology.

The technical solution adopted by the present invention to solve the technical problem is: a heat storage device for dissipating heat from the CPU of a computer, including a heat absorbing sheet, a heat storage box and a control system, the lower end of the heat absorbing sheet is in contact with the CPU, and the The inside of the tank wall of the heat storage tank has a vacuum structure. The heat storage tank is filled with heat storage materials. The heat absorbing sheet is connected with a heat conducting sheet. The hot box is provided with an inlet and an outlet, and a circulating pump is arranged in the heat storage tank, and a pipeline is arranged between the circulating pump and the outlet, and a heat dissipation pipeline is connected between the entrance and the outlet, and the heat dissipation pipeline passes through several fixed The parts are fixed on the outer wall of the heat storage tank;

The control system includes a control box, an inner mounting plate and an outer mounting plate, the control box is fixed on the upper surface of the heat storage tank, the inner mounting plate is fixed in the heat storage tank, and the inner mounting plate extends into the heat storage material, and the outside installation plate is fixed on the outer wall of the heat storage box.

As a preferred technical solution of the present invention, the heat storage substance is water.

As a preferred technical solution of the present invention, the heat dissipation pipes are arranged in a spiral.

As a preferred technical solution of the present invention, the fixing piece includes a "U"-shaped fixing ring and fixing pieces located on both sides of the fixing ring, and the fixing pieces are fixed on the outer wall of the heat storage tank by screws.

As a preferred technical solution of the present invention, the depth of the fixing ring is the same as the diameter of the heat dissipation pipe, the bottom of the fixing ring is semicircular, and the diameter of the bottom of the fixing ring is the same as the diameter of the heat dissipation pipe.

As a preferred technical solution of the present invention, an STC89C51 single-chip circuit board is provided in the control box, and the STC89C51 single-chip circuit board is connected with a solenoid valve and a temperature sensor, and the STC89C51 single-chip circuit board is connected with a circulating pump.

As a preferred technical solution of the present invention, there are two solenoid valves, and the two solenoid valves are respectively arranged in the inlet and the outlet.

As a preferred technical solution of the present invention, there are two temperature sensors, and the two temperature sensors are respectively installed on the installation board inside the box and the installation board outside the box.

Compared with prior art, the beneficial effect of the present invention is:

(1) In the present invention, the heat on the CPU is transferred to the heat-conducting sheet through the heat-absorbing sheet, and then transferred to the heat storage substance in the heat storage tank through the heat conduction sheet, and the circulation pump pumps the heat storage substance in the heat storage box to the heat dissipation pipe Inside, so that the heat is transferred to the outside, so that the CPU can dissipate heat, the structure is simple, the cost is low, and by setting the heat storage box, the heat storage capacity of this solution is strong, thereby improving the heat dissipation effect;

(2) The present invention transmits the temperature of the CPU and the heat storage material to the STC89C51 single-chip circuit board by setting the control system, and the STC89C51 single-chip circuit board controls the opening of the two solenoid valves and the circulation pump, so that the heat storage material can circulate to the heat sink. In the pipeline, so that the heat in the heat storage tank is transferred to the outside, avoiding the problem of shortening the service life of the circulation pump caused by continuous operation, so that the present invention can operate for a long time.

Description of drawings

Fig. 1 is the overall structure schematic diagram of the present invention;

Fig. 2 is a structural schematic diagram of a cooling pipe of the present invention;

Fig. 3 is a structural schematic diagram of the fixing member of the present invention.

In the figure: 1-heat absorber; 2-heat storage tank; 3-control system; 4-heat storage material; 5-heat conduction sheet; 6-inlet; 7-exit; 8-circulation pump; Heat dissipation pipe; 11-Fixer; 12-Control box; 13-Mounting board inside the box; 14-Mounting board outside the box; 15-Fixing ring; 16-Fixer piece; 17-Screw; Solenoid valve; 20-temperature sensor.

Detailed ways

The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

The following descriptions of various embodiments refer to the accompanying drawings to illustrate specific embodiments in which the present invention can be implemented. The terms of direction and position mentioned in the present invention, such as "upper", "middle", "lower", "front", "rear", "left", "right", "inner", "outer", "side ", etc., are only for reference to the orientation and position of the attached drawings. Therefore, the terms of direction and position are used to illustrate and understand the present invention, but not to limit the present invention.

Example:

As shown in Fig. 1 to Fig. 3, the present invention provides a kind of heat storage device that is used for the heat dissipation of computer CPU, comprises heat-absorbing sheet 1, heat-storage box 2 and control system 3, the lower end of described heat-absorbing sheet 1 and CPU In contact, the inside of the wall of the heat storage tank 2 has a vacuum structure, and the heat storage tank 2 is filled with a heat storage material 4. Considering the high specific heat capacity and cost, water is used as the heat storage material 4, and the heat-absorbing sheet 1 A heat conduction sheet 5 is connected, the heat conduction sheet 5 passes through the heat storage tank 2 and contacts the heat storage material 4, the heat storage tank 2 is provided with an inlet 6 and an outlet 7, and the heat storage tank 2 is provided with a circulation pump 8 A pipeline 9 is provided between the circulating pump 8 and the outlet 7, and a heat dissipation pipeline 10 is connected between the inlet 6 and the outlet 7. The heat dissipation pipeline 10 is arranged in a spiral, and the heat dissipation pipeline 10 passes through several fixing parts 11 is fixed on the outer wall of the heat storage tank 2. The fixing member 11 includes a “U”-shaped fixing ring 15 and fixing members 16 located on both sides of the fixing ring 15. The depth of the fixing ring 15 is the same as the diameter of the heat dissipation pipe 10 Same, the bottom of the fixed ring 15 is semicircular, and the diameter of the bottom of the fixed ring 15 is the same as that of the heat dissipation pipe 10, and the fixed piece 16 is fixed on the outer wall of the heat storage box 2 by screws 17;

In the present invention, the control system 3 includes a control box 12, an inner mounting plate 13 and an outer mounting plate 14, the control box 12 is fixed on the upper end surface of the heat storage tank 2, and the inner mounting plate 13 is fixed In the heat storage box 2, and the installation plate 13 inside the box extends into the heat storage material 4, the outside installation plate 14 is fixed on the outer wall of the heat storage box 2, and the STC89C51 single-chip circuit board is arranged in the control box 12 18. The STC89C51 single-chip circuit board 18 is connected with a solenoid valve 19 and a temperature sensor 20, and the STC89C51 single-chip circuit board 18 is connected with the circulating pump 8. There are two solenoid valves 19, two solenoid valves 19 They are respectively arranged in the inlet 6 and the outlet 7, and there are two temperature sensors 20, and the two temperature sensors 20 are installed on the inner mounting plate 13 and the outer mounting plate 14 of the box respectively.

In summary, the main features of the present invention are:

(1) The present invention; the heat on the CPU is transferred to the heat-conducting sheet through the heat-absorbing sheet 1, and then transferred to the heat-storage material 4 in the heat-storage box 2 through the heat-sink 5, and the circulation pump 8 stores the heat in the heat-storage box 2 The substance 4 is pumped into the heat dissipation pipe 10, so that the heat is transferred to the outside, so that the CPU can realize heat dissipation, the structure is simple, the cost is low, and by setting the heat storage box 2, the heat storage capacity of this solution is strong, thereby improving the heat dissipation effect;

(2) The present invention passes the temperature of CPU and thermal storage material to STC89C51 single-chip circuit board by setting control system, temperature sensor, and STC89C51 single-chip circuit board controls the opening of two solenoid valves 19 and circulating pump 8, so that thermal storage material 4 can Circulating into the heat dissipation pipe 10, so that the heat in the heat storage tank 2 is transferred to the outside world, avoiding the problem of shortened service life caused by the continuous operation of the circulation pump 8, so that the present invention can run for a long time.

It will be apparent to those skilled in the art that the invention is not limited to the details of the above-described exemplary embodiments, but that the invention can be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Accordingly, the embodiments should be regarded in all points of view as exemplary and not restrictive, the scope of the invention being defined by the appended claims rather than the foregoing description, and it is therefore intended that the scope of the invention be defined by the appended claims rather than by the foregoing description. All changes within the meaning and range of equivalents of the elements are embraced in the present invention. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims (8)

1. A kind of 1. regenerative apparatus for computer CPU radiating, it is characterised in that：Including heat absorbing sheet (1), heat storage tank (2) and control System (3) processed, the lower end of the heat absorbing sheet (1) contact with CPU, and position vacuum structure in the tank wall of the heat storage tank (2) is described Heat storage material (4) is full of in heat storage tank (2), the heat absorbing sheet (1) is connected with thermally conductive sheet (5), and the thermally conductive sheet (5) passes through accumulation of heat Case (2) contacts with heat storage material (4), and the heat storage tank (2) is provided with entrance (6) and outlet (7), is provided with the heat storage tank (2) Circulating pump (8), pipeline (9) is provided between the circulating pump (8) and outlet (7), is connected between the entrance (6) and outlet (7) There is hot channel (10), the hot channel (10) is fixed on the outer wall of heat storage tank (2) by some fixtures (11)；

   The control system (3) includes installing plate (13) in control box (12), case and the outer installing plate (14) of case, the control box (12) upper surface of heat storage tank (2) is fixed on, installing plate (13) is fixed in heat storage tank (2) in the case, and installing plate in case (13) stretch into heat storage material (4), the outer installing plate (14) of the case is fixed on the outer wall of heat storage tank (2).
2. A kind of 2. regenerative apparatus for computer CPU radiating according to claim 1, it is characterised in that：The accumulation of heat Material (4) is water.
3. A kind of 3. regenerative apparatus for computer CPU radiating according to claim 1, it is characterised in that：The radiating Pipeline (10) is helically arranged.
4. A kind of 4. regenerative apparatus for computer CPU radiating according to claim 1, it is characterised in that：The fixation Part (11) includes the retainer ring (15) of " u "-shaped and the fixture (16) positioned at retainer ring (15) both sides, and the stator (16) is logical Screw (17) is crossed to be fixed on the outer wall of heat storage tank (2).
5. A kind of 5. regenerative apparatus for computer CPU radiating according to claim 4, it is characterised in that：The fixation The depth of ring (15) is identical with the diameter of hot channel (10), and the bottom of the retainer ring (15) is semicircle, and retainer ring (15) base diameter is identical with hot channel (10) diameter.
6. A kind of 6. regenerative apparatus for computer CPU radiating according to claim 1, it is characterised in that：The control STC89C51 single chip microcomputer circuit boards (18) are provided with box (12), the STC89C51 single chip microcomputer circuit boards (18) are connected with magnetic valve (19), temperature sensor (20), the STC89C51 single chip microcomputer circuit boards (18) are connected with circulating pump (8).
7. A kind of 7. regenerative apparatus for computer CPU radiating according to claim 1, it is characterised in that：The electromagnetism Valve (19) has two, and the magnetic valve (19) described in two is separately positioned in entrance (6) and outlet (7).
8. A kind of 8. regenerative apparatus for computer CPU radiating according to claim 1, it is characterised in that：The temperature Sensor (20) has two, and the temperature sensor (20) described in two is separately mounted to installing plate in case (13) and the outer installing plate of case (14) on.