CN207937953U - A computer high-performance radiator - Google Patents

Abstract

The utility model discloses a high-performance radiator for computers in the technical field of radiators. A support net, a support plate and a heat insulation plate are sequentially installed in the installation groove from top to bottom, and the top of the support plate is evenly screwed with a Four sets of heat dissipation fan assemblies, four sets of semiconductor coolers are evenly screwed on the top of the heat insulation board, heat insulation pads are pasted on the top and bottom of the four sets of semiconductor coolers, and the four sets of semiconductor coolers The top and bottom of the radiator are screwed with fins, the right wall of the radiator shell has an air inlet, the left wall, the bottom wall and the lower part of the front wall of the radiator shell are all provided with a heat dissipation port, the heat dissipation The four corners of the bottom end of the device shell are fixedly installed with support legs. The device has simple structure, long service life, low working noise and high reliability.

Description

A computer high-performance radiator

technical field

The utility model discloses a high-performance radiator for a computer, in particular to the technical field of radiators.

Background technique

Along with the development and progress of society, computer (notebook type) has become the necessity in the life. Regardless of work and life, you can see the shadow of computers everywhere. The core components in a computer usually include multiple heat-generating components such as a CPU, a power supply, and a hard disk. When people use computers to operate some large-scale programs or play some large-scale games, the computer will generate a lot of heat due to the increase in the amount of calculations. At this time, the cooling system of the computer is required to discharge the heat. Running slowly, crashing, and even burning important components, most of the existing computer radiators mainly reduce the external temperature of the computer by strengthening the air flow velocity of the bottom plastic shell, and the internal heat of the computer mainly relies on the CPU fan to force convection to take it out , The computer radiator relays the heat away to complete the cooling, so the pure external heat dissipation effect cannot reach our ideal state.

Utility model content

The purpose of this utility model is to provide a high-performance radiator for computers to solve the problem that most of the existing computer radiators proposed in the background technology mainly reduce the external temperature of the computer by increasing the air flow velocity of the bottom shell of the computer, and cannot bring out the internal heat. cooling problem.

In order to achieve the above purpose, the utility model provides the following technical solutions: a computer high-performance radiator, including a radiator shell, the top of the radiator shell is provided with a mounting groove, and the mounting groove is sequentially installed with supports The top of the support plate is evenly screwed with four groups of cooling fan assemblies, the top of the heat insulation plate is evenly screwed with four groups of semiconductor refrigerators, and the four groups of semiconductor refrigerators are respectively Located at the lower part of the four groups of heat dissipation fan assemblies, the top and bottom ends of the four groups of semiconductor refrigerators are pasted with heat insulation pads, and the top and bottom ends of the four groups of semiconductor refrigerators are screwed with fins. The fin roots of the fins are located in the inner cavity of the heat insulation pad, and the right wall of the radiator housing has an air inlet, and the air inlet is located between the support plate and the heat insulation board, and the left wall of the radiator housing is , The bottom wall and the lower part of the front wall are provided with cooling ports, the cooling ports on the left wall and the lower part of the front wall are located between the heat shield and the bottom plate of the radiator shell, and the cooling ports on the bottom wall are respectively located in the four groups of semiconductor coolers In the lower part, support legs are fixedly installed at the four corners of the bottom end of the radiator shell.

Preferably, non-slip rubber pads are installed on the bottom ends of the four sets of supporting legs.

Preferably, the inner cavity of the air inlet is provided with a dustproof cover.

Preferably, a heat-conducting silicone grease layer is applied to the joints of the two groups of fins and semiconductor refrigerators.

Compared with the prior art, the beneficial effect of the utility model is that the device utilizes the semiconductor cooler to reduce the temperature at one end to exchange heat with the air, and uses the heat dissipation fan assembly to blow the air with a lower temperature into the air inlet of the computer, so that the computer The internal heat is reduced and the computer is effectively dissipated. The device has the advantages of simple structure, long service life, low working noise and high reliability.

Description of drawings

Fig. 1 is the structural representation of the utility model;

Fig. 2 is a top view of the utility model support net;

Fig. 3 is a top view of the cooling fan assembly of the present invention;

Fig. 4 is a front sectional view of the semiconductor refrigerator of the present invention.

In the figure: 1 radiator shell, 2 support net, 3 support plate, 4 heat insulation plate, 5 heat dissipation fan assembly, 6 semiconductor refrigerator, 7 heat insulation pad, 8 fin parts, 9 air inlet, 10 heat dissipation outlet, 11 Support the legs.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. example. Based on the embodiments of the present utility model, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of the present utility model.

Please refer to Figures 1-4, the utility model provides a technical solution: a high-performance computer radiator, including a radiator shell 1, the top of the radiator shell 1 has a mounting groove, and the installation groove is from top to bottom The support net 2, the support plate 3 and the heat insulation plate 4 are installed in sequence, the top of the support plate 3 is uniformly screwed with four sets of cooling fan assemblies 5, and the top of the heat insulation plate 4 is evenly screwed with four sets of semiconductor Refrigerator 6, the semiconductor refrigerators 6 of the four groups are respectively located at the lower part of the cooling fan assembly 5 of the four groups, and the top and bottom ends of the semiconductor refrigerators 6 of the four groups are all pasted with heat insulation pads 7, and the semiconductor refrigerators of the four groups are The top and bottom ends of the refrigerator 6 are screwed with fins 8, the fin roots of the fins 8 are located in the inner cavity of the heat insulation pad 7, and the right wall of the radiator shell 1 has an air inlet 9, The air inlet 9 is located between the support plate 3 and the heat insulation plate 4, and the left wall, the bottom wall and the lower part of the front wall of the radiator shell 1 are provided with a heat dissipation port 10, and the left wall and the lower part of the front wall are provided with a heat dissipation port 10. 10 are all located between the heat shield 4 and the bottom plate of the radiator shell 1, and the heat dissipation ports 10 on the bottom wall are respectively located at the bottom of the four groups of semiconductor refrigerators 6, and the four corners of the bottom end of the radiator shell 1 are fixedly installed with supporting legs 11.

Wherein, the bottom ends of four groups of supporting legs 11 are equipped with non-slip rubber pads to improve friction and improve the stability of the device. The inner chamber of the air inlet 9 is provided with a dust cover to prevent dust from being sucked into the device and enter the computer. Inside, the joints between the two sets of fins 8 and the semiconductor refrigerator 6 are coated with a heat-conducting silicone grease layer to improve heat exchange efficiency and improve the sealing performance of the semiconductor refrigerator 6 .

Working principle: place the computer on the support net 2, so that the air inlet of the computer contacts the support net 2, the air outlet of the computer is in the same direction as the heat dissipation vent 10 of the device, the computer is turned on, the CPU starts to work, and heat is generated inside the computer. The device is connected to a power supply, and the semiconductor cooler 6 is energized. Using the thermoelectric effect, one end of the semiconductor cooler 6 facing the cooling fan assembly 5 begins to absorb heat and becomes a cold end, and the other end of the semiconductor cooler 6 releases heat and becomes a hot end. , the cold end exchanges heat with the air between the support plate 3 and the heat shield plate 4, the air temperature decreases, and is blown into the air inlet of the computer through the heat dissipation fan assembly 5, the cooled air makes the temperature inside the computer decrease, and the external air passes through the air inlet of the device The air inlet 9 enters between the support plate 3 and the heat insulation plate 4, and continues to exchange heat with the cold end. The heat produced by the hot end is discharged to the outside through the multiple groups of heat dissipation holes 10 opened on the radiator shell 1. The direction of the heat dissipation holes 10 is consistent with the direction of the inlet The directions of the tuyeres 9 are all different, so as to ensure that the heat discharged from the hot end will not be inhaled by the air inlets 9 .

Although the embodiments of the present invention have been shown and described, those skilled in the art can understand that various changes and modifications can be made to these embodiments without departing from the principle and spirit of the present invention , replacements and modifications, the scope of the present utility model is defined by the appended claims and their equivalents.

Claims (4)

1. a kind of computer radiator with high performance, including radiator shell (1), it is characterised in that：The radiator shell (1) Top is provided with mounting groove, and is sequentially installed with supporting network (2), support plate (3) and thermal insulation board (4), institute in mounting groove from top to bottom The top for stating support plate (3) is uniformly bolted with four groups of radiator fan components (5), and the top of the thermal insulation board (4) is uniformly bolted with Four groups of semiconductor coolers (6), semiconductor cooler (6) described in four groups are located at the lower part of four groups of radiator fan components (5), The top and bottom end of semiconductor cooler (6) described in four groups are adhesive with heat insulating mattress (7), semiconductor cooler (6) described in four groups Top and bottom end be bolted with fin part (8), the fin root of the fin part (8) is located at the inner cavity of heat insulating mattress (7), the heat dissipation The right wall of device shell (1) is provided with air inlet (9), and the air inlet (9) is located between support plate (3) and thermal insulation board (4), described to dissipate Left wall, bottom wall and the antetheca lower part of hot device shell (1) are provided with thermovent (10), thermovent (10) described in left wall and antetheca lower part It is respectively positioned between thermal insulation board (4) and radiator shell (1) bottom plate, thermovent described in bottom wall (10) is located at four groups of semiconductor systems The bottom end quadrangle of the lower part of cooler (6), the radiator shell (1) is installed with support leg (11).

2. a kind of computer radiator with high performance according to claim 1, it is characterised in that：Support leg (11) described in four groups Bottom end be mounted on anti-skid rubber cushion.

3. a kind of computer radiator with high performance according to claim 1, it is characterised in that：The air inlet (9) it is interior Chamber is provided with dust cover.

4. a kind of computer radiator with high performance according to claim 1, it is characterised in that：Fin part (8) described in two groups It is coated with thermal grease layer with the junction of semiconductor cooler (6).