CN207115307U - A kind of cabinet dustproof heat radiator - Google Patents

A kind of cabinet dustproof heat radiator Download PDF

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Publication number
CN207115307U
CN207115307U CN201720696406.7U CN201720696406U CN207115307U CN 207115307 U CN207115307 U CN 207115307U CN 201720696406 U CN201720696406 U CN 201720696406U CN 207115307 U CN207115307 U CN 207115307U
Authority
CN
China
Prior art keywords
dust
case
type semiconductor
heat sink
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201720696406.7U
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Chinese (zh)
Inventor
李三妹
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dongguan Shiying Hardware And Electrical Co Ltd
Original Assignee
Dongguan Shiying Hardware And Electrical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dongguan Shiying Hardware And Electrical Co Ltd filed Critical Dongguan Shiying Hardware And Electrical Co Ltd
Priority to CN201720696406.7U priority Critical patent/CN207115307U/en
Application granted granted Critical
Publication of CN207115307U publication Critical patent/CN207115307U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a kind of cabinet dustproof heat radiator,Including mainframe box,Mainboard placed cavity is disposed with inside mainframe box from top to bottom,Component is equipped with case and dust collecting bin,And component is equipped between case and dust collecting bin and is provided with steel dividing plate,The inside bottom side of dust collecting bin is provided with dust absorption fan,The dorsal part of mainframe box is provided with back shroud,The side-lower of back shroud is provided with dust-proof hole,The side that case is equipped with mainboard placed cavity and component is provided with heat sink,Capillary thermal-collecting tube is provided with heat sink,Refrigerant circulation case is installed with respectively at capillary thermal-collecting tube both ends,The mainboard placed cavity of the cabinet inside utilizes the pump heat effect of cooling agent and capillary thermal-arrest and semiconductor refrigerating,Realize that closure radiates,And the inside circulation air is not direct and contacting external air,So as to prevent harm of the dust to wherein electronic component,Also the electromagnetic radiation of its internal electronic component is shielded completely simultaneously.

Description

A kind of cabinet dustproof heat radiator
Technical field
Cabinet dust-proof radiating applied technical field is the utility model is related to, specially a kind of cabinet dustproof heat radiator.
Background technology
Harm of the dust to computer should all be had an intimate knowledge, and the aggregation of dust not only influences the attractive in appearance of electronic component, And influence the service life of electronic component.Present domestic Duo Jia cabinets producer is all proposed dustproof case:As dynamical train is exhausted Dirt is chivalrous etc..But existing dustproof case is all to install anti-dust filter mesh additional in case air inlet, such dust-proof effect is not thorough, And but have impact on intake after installing screen pack additional and reduce the radiating effect of cabinet, how to realize excellent dust-proof and scattered of cabinet It is that we focus on the thing of consideration that both hot propertys, which have both,.Therefore, we can carry out certain Optimal improvements to existing product To solve problem above.
Utility model content
To achieve the above object, the utility model provides following technical scheme:A kind of cabinet dustproof heat radiator, including master Cabinet, mainboard placed cavity is disposed with inside the mainframe box, component is equipped with case and dust collecting bin from top to bottom, and component It is equipped between case and dust collecting bin and steel dividing plate is installed, the inside bottom side of the dust collecting bin is provided with dust absorption fan, The dorsal part of the mainframe box is provided with back shroud, the side-lower of back shroud is provided with dust-proof hole, in mainboard placed cavity and component The side for being equipped with case is provided with heat sink, capillary thermal-collecting tube is provided with the heat sink, the capillary thermal-collecting tube is in wavy friendship It is woven between heat sink, and is installed with refrigerant circulation case, the refrigerant circulation case respectively at capillary thermal-collecting tube both ends It is respectively provided at the top and bottom of heat sink;
Semiconductor chilling plate is also installed between heat sink, the semiconductor chilling plate includes two panels insulating ceramics Piece, connected with P-type semiconductor by N-type semiconductor between the insulating ceramic film, and partly led in N-type semiconductor and p-type respectively Be provided with independent metal conductor between body and insulating ceramic film, the independent metal conductor respectively with DC power anode and direct current Source negative pole connects to form closed-loop path.
As a kind of preferable technical scheme of the utility model, the steel dividing plate is provided with several mesh holes, described Mesh hole is equidistantly evenly distributed on steel dividing plate, and the diameter in mesh hole is equal.
As a kind of preferable technical scheme of the utility model, the dust-proof hole uses arc structure, and dust-proof hole is opened Mouth is directed downward, and screening dust hood is also installed with above the dust-proof hole, and the screening dust hood is also covered on dust-proof hole in arcuation Side.
As a kind of preferable technical scheme of the utility model, the capillary thermal-collecting tube be arranged on heat sink groove it Between.
As a kind of preferable technical scheme of the utility model, the mainboard placed cavity and component are equipped with the volume between case Than being arranged to 1:2.
As a kind of preferable technical scheme of the utility model, the N-type semiconductor and P-type semiconductor distinguish alternate row Row, and adjacent one group of N-type semiconductor and P-type semiconductor form one group and are fixedly mounted on same independent metal conductor.
Compared with prior art, the beneficial effects of the utility model are:The cabinet dustproof heat radiator, by setting mainboard Placed cavity, the more tight enclosed construction of use, the dust accretions being effectively reduced inside mainboard placed cavity, extends mainboard The service life of precision circuit in placed cavity, is provided with capillary thermal-collecting tube on heat sink, passes through the collection heat energy of capillary thermal-collecting tube Power and the cooling agent ringing of inside, enhance inside mainframe box the particularly heat dispersion of mainboard placed cavity, further By the semiconductor chilling plate added, the heat pump of inside to outside is realized scattering and disappearing for heat, passed through by heat pump principle The dust-proof hole of dust absorption fan and special construction is set, the dust accretions that component is equipped with case can be reduced, maintained inside mainframe box Cleaning.
Brief description of the drawings
Fig. 1 is the utility model structure diagram;
Fig. 2 is the utility model internal structure schematic diagram;
Fig. 3 is the utility model rear cover plate structure schematic diagram;
Fig. 4 is the utility model semiconductor chilling plate structural representation.
In figure:1- mainframe boxes;2- mainboard placed cavities;3- components are equipped with case;4- dust collecting bins;5- steel dividing plates;6- dissipates Hot plate;7- capillary thermal-collecting tubes;8- refrigerant circulation casees;9- semiconductor chilling plates;10- insulating ceramic films;11- dust absorption fans;12- Back shroud;The dust-proof holes of 13-;14-N type semiconductors;15-P type semiconductors;16- independent metal conductors;17- mesh hole;18- hides dirt Cover.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the embodiment of the utility model is carried out Clearly and completely describing, it is clear that described embodiment is only the utility model part of the embodiment, rather than whole Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made The every other embodiment obtained, belong to the scope of the utility model protection.
Embodiment:
Fig. 1, Fig. 2 and Fig. 3 are referred to, the utility model provides a kind of technical scheme:A kind of cabinet dustproof heat radiator, bag Mainframe box 1 is included, is disposed with mainboard placed cavity 2 inside the mainframe box 1 from top to bottom, component is equipped with case 3 and dust is collected Case 4, and component is equipped between case 3 and dust collecting bin 4 and is provided with steel dividing plate 5, the inside bottom side peace of the dust collecting bin 4 Equipped with dust absorption fan 11, the dorsal part of the mainframe box 1 is provided with back shroud 12, and the side-lower of back shroud 12 is provided with dust-proof hole 13, the side that case 3 is equipped with mainboard placed cavity 2 and component is provided with heat sink 6, and capillary thermal-collecting tube is provided with the heat sink 6 7, the capillary thermal-collecting tube 7 is installed with respectively in wavy intertexture between heat sink 6, and at the both ends of capillary thermal-collecting tube 7 Refrigerant circulation case 8, the refrigerant circulation case 8 are respectively provided at the top and bottom of heat sink 6;
As shown in Figure 2 and Figure 4, semiconductor chilling plate 9, the semiconductor refrigerating are also installed between heat sink 6 Piece 9 includes two panels insulating ceramic film 10, passes through N-type semiconductor 14 and P-type semiconductor 15 respectively between the insulating ceramic film 10 Connection, and independent metal conductor 16 is provided between N-type semiconductor 14 and P-type semiconductor 15 and insulating ceramic film 10, it is described only Vertical metallic conductor 16 is connected to form closed-loop path with DC power anode and DC power cathode respectively, the N-type semiconductor 14 Distinguish with P-type semiconductor 15 spaced, and adjacent one group of N-type semiconductor 14 and P-type semiconductor 15 form one group of fixed installation On same independent metal conductor 16.
Preferably, the steel dividing plate 5 is provided with several mesh holes 17, and the mesh hole 17 is equidistantly uniformly distributed On steel dividing plate 5, and the diameter in mesh hole 17 is equal;The dust-proof hole 13 uses arc structure, and dust-proof hole 13 is opened Mouth is directed downward, and the dust-proof top of hole 13, which is also installed with, hides dust hood 18, and the screening dust hood 18 is also covered in anti-in arcuation The top of dirt hole 13;The capillary thermal-collecting tube 7 is arranged between the groove on heat sink 6;The mainboard placed cavity 2 and component are equipped with Volumetric ratio between case 3 is arranged to 1:2;.
, it is necessary to which what is be further illustrated is in the utility model:The semiconductor chilling plate 9, is also thermoelectric cooling Piece, be a kind of heat pump, it the advantages of be no slide unit, apply and be restricted in some spaces, reliability requirement is high, no system The occasion of cryogen pollution, using the Peltier effects of semi-conducting material, when direct current is connected by two kinds of different semi-conducting materials Into galvanic couple when, heat can be absorbed respectively at the both ends of galvanic couple and release heat, it is possible to achieve the purpose of refrigeration, it is a kind of The Refrigeration Technique of negative thermal resistance is produced, is characterized in movement-less part, reliability is also higher, in the utility model, its heat End and cold end are respectively provided at the both sides of heat sink 6, reach the purpose for heat " pump ".
Specifically used mode and advantage:The cabinet dustproof heat radiator, by setting mainboard placed cavity 2 and component to be equipped with case 3 separate structure, the electromagnetic radiation of the electronic component inside mainboard placed cavity 2 is shielded completely, wherein mainboard placed cavity 2 uses More tight enclosed construction, the dust accretions being effectively reduced inside mainboard placed cavity 2, extend in mainboard placed cavity 2 The service life of precision circuit, capillary thermal-collecting tube 7 is provided with heat sink 6, by capillary collection heat effect, and passes through cooling The ringing of agent internally conducts heat, takes away caused most heats in mainframe box 1, further passes through Add semiconductor chilling plate 9 and heat is pumped out into inner side, form good heat transfer potential, this series of operation greatly strengthen The particularly heat dispersion of mainboard placed cavity 2 inside mainframe box 1, by setting dust absorption fan 11, the pumping components of dust absorption fan 11 The dust accumulated in case 3 is equipped with, dust falls into dust collecting bin 4 by steel dividing plate 5, and dust-proof hole 13 is special on back shroud 12 in addition It is different towards structure, blocked exhausted most dust and be equipped with case 3 into component, can so reduce the dust that component is equipped with case 3 Accumulation, maintains the cleaning inside mainframe box 1.
It is obvious to a person skilled in the art that the utility model is not limited to the details of above-mentioned one exemplary embodiment, and And in the case of without departing substantially from spirit or essential attributes of the present utility model, it can realize that this practicality is new in other specific forms Type.Therefore, no matter from the point of view of which point, embodiment all should be regarded as exemplary, and is nonrestrictive, this practicality is new The scope of type limits by appended claims rather than described above, it is intended that the equivalency fallen in claim is contained All changes in justice and scope are included in the utility model.Any reference in claim should not be considered as limitation Involved claim.

Claims (6)

1. a kind of cabinet dustproof heat radiator, including mainframe box(1), the mainframe box(1)Inside is disposed with from top to bottom Mainboard placed cavity(2), component be equipped with case(3)And dust collecting bin(4), and component is equipped with case(3)And dust collecting bin(4)Between Steel dividing plate is installed(5), it is characterised in that:The dust collecting bin(4)Inside bottom side dust absorption fan is installed(11), institute State mainframe box(1)Dorsal part back shroud is installed(12), in back shroud(12)Side-lower be provided with dust-proof hole(13), in mainboard Placed cavity(2)Case is equipped with component(3)Side be provided with heat sink(6), the heat sink(6)On be provided with capillary thermal-collecting tube (7), the capillary thermal-collecting tube(7)In wavy intertexture in heat sink(6)Between, and in capillary thermal-collecting tube(7)Both ends are solid respectively Dingan County is equipped with refrigerant circulation case(8), the refrigerant circulation case(8)It is respectively provided at heat sink(6)Top and bottom;
In heat sink(6)Between be also installed with semiconductor chilling plate(9), the semiconductor chilling plate(9)It is exhausted including two panels Edge potsherd(10), the insulating ceramic film(10)Between pass through N-type semiconductor respectively(14)And P-type semiconductor(15)Connection, And in N-type semiconductor(14)And P-type semiconductor(15)With insulating ceramic film(10)Between be provided with independent metal conductor(16), it is described Independent metal conductor(16)It is connected to form closed-loop path with DC power anode and DC power cathode respectively.
A kind of 2. cabinet dustproof heat radiator according to claim 1, it is characterised in that:The steel dividing plate(5)On set There are several mesh holes(17), the mesh hole(17)Equidistantly it is evenly distributed on steel dividing plate(5)On, and mesh hole(17)'s Diameter is equal.
A kind of 3. cabinet dustproof heat radiator according to claim 1, it is characterised in that:The dust-proof hole(13)Using arc Shape structure, and dust-proof hole(13)Opening direction down, the dust-proof hole(13)Top is also installed with screening dust hood(18), institute State screening dust hood(18)Also it is covered in dust-proof hole in arcuation(13)Top.
A kind of 4. cabinet dustproof heat radiator according to claim 1, it is characterised in that:The capillary thermal-collecting tube(7)If Put in heat sink(6)Groove between.
A kind of 5. cabinet dustproof heat radiator according to claim 1, it is characterised in that:The mainboard placed cavity(2)With Component is equipped with case(3)Between volumetric ratio be arranged to 1:2.
A kind of 6. cabinet dustproof heat radiator according to claim 1, it is characterised in that:The N-type semiconductor(14)And P Type semiconductor(15)It is spaced respectively, and adjacent one group of N-type semiconductor(14)And P-type semiconductor(15)Form one group of fixation peace Mounted in same independent metal conductor(16)On.
CN201720696406.7U 2017-06-15 2017-06-15 A kind of cabinet dustproof heat radiator Expired - Fee Related CN207115307U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201720696406.7U CN207115307U (en) 2017-06-15 2017-06-15 A kind of cabinet dustproof heat radiator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201720696406.7U CN207115307U (en) 2017-06-15 2017-06-15 A kind of cabinet dustproof heat radiator

Publications (1)

Publication Number Publication Date
CN207115307U true CN207115307U (en) 2018-03-16

Family

ID=61593489

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201720696406.7U Expired - Fee Related CN207115307U (en) 2017-06-15 2017-06-15 A kind of cabinet dustproof heat radiator

Country Status (1)

Country Link
CN (1) CN207115307U (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110147151A (en) * 2019-05-27 2019-08-20 运城学院 A kind of computer host radiator
CN111447809A (en) * 2020-05-13 2020-07-24 珠海格力电器股份有限公司 Photovoltaic air conditioner, cooling assembly and control method of cooling assembly
CN111465271A (en) * 2020-04-18 2020-07-28 福州金浩洋电力设备有限公司 Ventilation structure based on high-power conversion device of heat pipe radiator
CN112121553A (en) * 2020-09-03 2020-12-25 刘思达 High-efficiency environment-friendly coal-fired power generation device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110147151A (en) * 2019-05-27 2019-08-20 运城学院 A kind of computer host radiator
CN111465271A (en) * 2020-04-18 2020-07-28 福州金浩洋电力设备有限公司 Ventilation structure based on high-power conversion device of heat pipe radiator
CN111447809A (en) * 2020-05-13 2020-07-24 珠海格力电器股份有限公司 Photovoltaic air conditioner, cooling assembly and control method of cooling assembly
CN111447809B (en) * 2020-05-13 2023-10-24 珠海格力电器股份有限公司 Photovoltaic air conditioner, cooling assembly and control method of cooling assembly
CN112121553A (en) * 2020-09-03 2020-12-25 刘思达 High-efficiency environment-friendly coal-fired power generation device

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CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20180316

Termination date: 20190615