CN212623951U

CN212623951U - Heat radiator for electronic equipment

Info

Publication number: CN212623951U
Application number: CN202021421886.4U
Authority: CN
Inventors: 李勃轶
Original assignee: Chengdu Songyuan Electronic Technology Co ltd
Current assignee: Chengdu Songyuan Electronic Technology Co ltd
Priority date: 2020-07-17
Filing date: 2020-07-17
Publication date: 2021-02-26
Anticipated expiration: 2030-07-17

Abstract

The utility model discloses an electronic equipment's heat abstractor, a serial communication port, including absorber plate (1), first heat dissipation chamber, liquid condenser pipe (6), second heat dissipation chamber, heat radiation pressing plate (3), radiator fan (4), liquid reserve tank (9) and suction pump (10). The utility model discloses an in the liquid condenser pipe embedding absorber plate that will be used for cooling the absorber plate, make the liquid condenser pipe can obtain the temperature of quick absorption absorber plate, make the absorber plate obtain quick cooling, thereby the utility model discloses the unsatisfactory problem of radiating effect of the processing chip among the solution prior art among the electronic equipment that can be fine.

Description

Heat radiator for electronic equipment

Technical Field

The utility model relates to a heat abstractor, specific heat abstractor of electronic equipment that says so.

Background

With the continuous development and progress of the development technology of electronic devices, in the development of electronic devices, the demand of processing chips with high operation frequency is more and more increased, but in use, the processing chips with high operation frequency generate heat rapidly due to the high use frequency, so that in use, the processing chips with high operation frequency need a separate heat dissipation device for heat dissipation.

However, the heat dissipation device used for the high-operation-frequency processing chip in each electronic device in the related art is not satisfactory in heat dissipation effect, and cannot effectively dissipate heat from the high-operation-frequency processing chip in the electronic device. For example, the utility model with patent number CN201720074389.3 discloses a water-cooled computer radiator, and this patent sets up the radiator as a closed cooling bin, and this very big reduction self radiating effect, also made the heat of computer difficult give off, so this patent number is the structure of a water-cooled computer radiator that CN201720074389.3 disclosed has the defect, and its radiating effect is not ideal.

Therefore, it is urgent to provide a heat dissipation device for electronic equipment with better heat dissipation effect.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to overcome the above-mentioned defect that the heat abstractor of above-mentioned current electronic equipment exists, provide a better electronic equipment's of radiating effect heat abstractor.

In order to realize the purpose, the utility model discloses a technical scheme as follows:

a heat dissipation device of electronic equipment comprises a heat absorption plate, two first heat dissipation cavities symmetrically arranged at two ends of the heat absorption plate, a liquid condensation pipe embedded in the heat absorption plate and positioned between the two first heat dissipation cavities, a plurality of second heat dissipation cavities arranged on the heat absorption plate and positioned between the two first heat dissipation cavities, heat dissipation pressing plates arranged on the first heat dissipation cavities and the second heat dissipation cavities, heat dissipation fans arranged on the heat dissipation pressing plates, a liquid storage tank communicated with the liquid condensation pipe, and a water suction pump arranged on the liquid storage tank and provided with a water inlet communicated with the liquid condensation pipe; and a liquid outlet of the water suction pump is communicated with a liquid inlet of the liquid storage tank.

Preferably, the liquid condensation pipe consists of a plurality of U-shaped metal pipes which are communicated with each other; the plurality of second heat dissipation cavities are distributed in each U-shaped opening of the liquid condensation pipe.

The heat absorption plate is provided with a first heat dissipation cavity installation cavity and a second heat dissipation cavity installation cavity, and through holes penetrating through the heat absorption plate are formed in the first heat dissipation cavity installation cavity and the second heat dissipation cavity installation cavity; the heat absorption plate is also provided with a groove which is consistent with the liquid condensation pipe in shape, the bottom of the groove is arc-shaped, and the caliber of the groove is slightly larger than the pipe diameter of the liquid condensation pipe.

Preferably, the heat dissipation pressure plate is provided with two strip-shaped through holes matched with the first heat dissipation cavity mounting cavity, and the heat dissipation pressure plate is also provided with a plurality of strip-shaped openings matched with the second heat dissipation cavity mounting cavity; the heat dissipation pressing plate is further provided with a plurality of air passing through holes, and the air passing through holes are evenly distributed on the heat dissipation pressing plate.

The first heat dissipation cavity comprises a first cavity body and a plurality of first heat dissipation fins sleeved on the first cavity body; gaps exist between two adjacent first cooling fins in the plurality of first cooling fins; one end of the first cavity body is installed in the first heat dissipation cavity installation cavity, and the other end of the first cavity body is installed in the strip-shaped through hole.

The second heat dissipation cavity comprises a second cavity body and a plurality of second heat dissipation fins sleeved on the second cavity body; gaps exist between two adjacent second cooling fins in the plurality of second cooling fins; one end of the second cavity body is installed in the second heat dissipation cavity installation cavity, and the other end of the second cavity body is installed in the strip-shaped opening.

Preferably, a plurality of staples are arranged on the heat absorbing plate and distributed around the bottom surface of the heat absorbing plate; the heat radiation fan is connected with the heat absorption plate through a fixing bolt.

Compared with the prior art, the utility model, following advantage and beneficial effect have:

(1) the utility model discloses an in the liquid condenser pipe embedding absorber plate that will be used for cooling the absorber plate, make the liquid condenser pipe can obtain the temperature of quick absorption absorber plate, make the absorber plate obtain quick cooling, thereby the utility model discloses the unsatisfactory problem of radiating effect of the processing chip among the solution prior art among the electronic equipment that can be fine.

(2) The utility model can quickly release part of the temperature of the chip of the electronic device by arranging the through holes on the heat absorbing plate; through set up first heat dissipation chamber and second heat dissipation chamber on the through-hole at the absorber plate, can prevent the heat lateral diffusion of through-hole release, also can carry out the preliminary heat dissipation processing to the heat through the through-hole release, reduction equipment internal temperature that can be fine, alright further improvement is to the radiating effect of the processing chip in the equipment.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention.

FIG. 2 is a schematic view of the whole structure of the heat absorbing plate of the present invention

Fig. 3 is a schematic structural view of the heat dissipating pressing plate of the present invention.

Fig. 4 is a schematic structural view of the liquid condenser tube of the present invention.

Fig. 5 is a schematic structural view of the first heat dissipation chamber of the present invention.

Fig. 6 is a schematic structural view of the second heat dissipation chamber of the present invention.

In the drawings, the names corresponding to the reference numbers are:

1-absorber plate, 101-first heat dissipation chamber installation cavity, 102-through-hole, 103-recess, 104-second heat dissipation chamber installation cavity, 2-the first cavity body, 3 heat-radiating pressing plate, 301-bar through-hole, 302-bar opening, 303-air passing through-hole, 4 radiator fan, 5-fixing bolt, 6-liquid condenser pipe, 7-the first fin, 8-bail, 9-liquid reserve tank, 10-suction pump, 11-the second cavity body, 12-the second fin.

Detailed Description

The present invention will be described in further detail with reference to examples and drawings, but the present invention is not limited thereto.

Examples

As shown in fig. 1 to 6, a heat dissipation device for an electronic device includes a heat absorbing plate 1, a first heat dissipation chamber, a liquid condensation pipe 6, a second heat dissipation chamber, a heat dissipation pressing plate 3, a heat dissipation fan 4, a liquid storage tank 9, and a water pump 10.

Specifically, the number of the first heat dissipation cavities is two, and the two first heat dissipation cavities are symmetrically arranged at two ends of the heat absorption plate 1. The second heat dissipation cavities are arranged on the heat absorption plate 1 and located between the two first heat dissipation cavities, and the number of the second heat dissipation cavities is multiple. The liquid condensation pipe 6 is embedded in the heat absorption plate 1 and positioned between the two first heat dissipation cavities. As shown in fig. 4, the liquid condensation duct 6 is composed of a plurality of U-shaped metal tubes communicating with each other in this embodiment. The plurality of second heat dissipation chambers are distributed in each U-shaped opening of the liquid condensation duct 6. By embedding the liquid condensation tube 6 for cooling the absorber plate 1 in the absorber plate 1, the liquid condensation tube 6 can rapidly absorb the temperature of the absorber plate, so that the absorber plate 1 can be rapidly cooled. Thereby the utility model discloses the unsatisfactory problem of radiating effect of the processing chip among the electronic equipment among the solution prior art that can be fine.

The heat dissipation pressing plate 3 is arranged on the first heat dissipation cavity and the second heat dissipation cavity. The heat radiation fan 4 is arranged on the heat radiation pressure plate 3, and the heat radiation fan 4 is fixedly connected with the heat absorption plate 1 through a fixing bolt. The liquid storage tank 9 is communicated with the liquid condensation pipe 6, namely, the liquid outlet of the liquid storage tank 9 is communicated with the liquid inlet of the liquid condensation pipe 6. When mounted, the liquid storage tank 9 is mounted on the housing of the electronic device, and the mounting position is higher than the chip mounting position. The water pump 10 is fixed on the liquid storage tank 9 through screws, a water inlet of the water pump 10 is communicated with the liquid condensation pipe 6, and a liquid outlet of the water pump 10 is communicated with a liquid inlet of the liquid storage tank 9. Wherein, the body in the liquid reserve tank 9 also can be water, coolant liquid or other liquid that have the cooling effect, and the automobile coolant liquid is adopted as liquid reserve tank 9 filling liquid preferentially in this embodiment.

In specific implementation, the heat absorbing plate 1 is preferably implemented by using an aluminum plate with a good heat absorbing effect in this embodiment, as shown in fig. 2, a first heat dissipation cavity mounting cavity 101 for mounting a first heat dissipation cavity and a second heat dissipation cavity mounting cavity 104 for mounting a second heat dissipation cavity are arranged on the heat absorbing plate 1. Through holes 102 penetrating through the heat absorbing plate 1 are formed in the first heat dissipation cavity mounting cavity 101 and the second heat dissipation cavity mounting cavity 104, and partial heat of a processing chip in the equipment can be quickly released through the through holes 102. Through the first heat dissipation cavity and the second heat dissipation cavity arranged on the through hole 102 of the heat absorbing plate 1, the heat released by the through hole can be prevented from being diffused transversely, the heat released by the through hole 102 can be subjected to pre-heat dissipation treatment by the first heat dissipation cavity and the second heat dissipation cavity, the internal temperature of the equipment can be well reduced, and the heat dissipation effect of a processing chip in the equipment can be further improved.

Furthermore, the heat absorbing plate 1 is also provided with a groove 103 which is consistent with the shape of the liquid condensation pipe 6, and the bottom of the groove 103 is arc-shaped, so that the liquid condensation pipe 6 is tightly attached to the groove 103, and the cooling effect of the liquid condensation pipe 6 is ensured. The caliber of the groove 103 is slightly larger than the caliber of the liquid condensation pipe 6, the caliber of the groove 103 is not too large easily, and the caliber of the groove 103 is suitable for enabling the liquid condensation pipe 6 to be embedded right, so that the contact tightness between the liquid condensation pipe 6 and the inner wall of the groove 103 is ensured, and the heat dissipation of the heat absorption plate 1 is faster.

In order to fix the first and second heat dissipation chambers well and ensure that the heat released by the heat absorbing plate 1 can be effectively exhausted. As shown in fig. 3, the heat dissipation pressing plate 3 is provided with two strip-shaped through holes 301 matched with the first heat dissipation cavity mounting cavity 101, and the strip-shaped through holes 301 are matched with the first heat dissipation cavity mounting cavity 101 to fix the first heat dissipation cavity and ensure that hot air entering the first heat dissipation cavity is effectively discharged. The heat dissipation pressure plate 3 is further provided with a plurality of strip-shaped openings 302 matched with the second heat dissipation cavity mounting cavity 104. The strip-shaped opening 302 is matched with the second heat dissipation cavity mounting cavity 104 to fix the second heat dissipation cavity, and hot air entering the second heat dissipation cavity can be effectively discharged. The heat dissipation pressing plate 3 is further provided with the plurality of air passing through holes 303, the plurality of air passing through holes 303 are uniformly distributed on the heat dissipation pressing plate 3, the air passing through holes 303 can better ensure that hot air of the heat absorption plate 1 can be rapidly discharged under the action of the heat dissipation fan 4, and the heat dissipation effect on the processing chip in the equipment is improved.

Still further, as shown in fig. 5, the first heat dissipation cavity includes a first cavity 2, and a plurality of first heat dissipation fins 7 sleeved on the first cavity 2. Specifically, a gap exists between two adjacent first heat dissipation fins 7 of the plurality of first heat dissipation fins 7, so as to ensure the heat dissipation effect of the first heat dissipation fins 7. The first heat sink 7 is fixed by welding or fixing. One end of the first cavity body 2 is inserted into the first heat dissipation cavity installation cavity 101, and the other end is inserted into the strip-shaped through hole 301. Meanwhile, as shown in fig. 6, the second heat dissipation chamber includes a second cavity body 11, and a plurality of second heat dissipation fins 12 sleeved on the second cavity body 11. Specifically, a gap exists between two adjacent second heat dissipation fins 12 of the plurality of second heat dissipation fins 12, so as to ensure the heat dissipation effect of the second heat dissipation fins 12. One end of the second cavity body 11 is inserted into the second heat dissipation cavity installation cavity 104, and the other end is inserted into the strip-shaped opening 302.

In order to fix the heat absorbing plate 1 in the device well and to make the heat absorbing plate 1 and the processing chip contact sufficiently, as shown in fig. 1, a plurality of staples 8 are provided on the heat absorbing plate 1, and the plurality of staples 8 are distributed around the bottom surface of the heat absorbing plate 1. Specifically, in the present embodiment, the number of the staples 8 is set to four, and the four staples 8 are respectively mounted in mounting holes preset at four corners of the heat absorbing plate 1.

In specific implementation, the staple 8 is inserted into the jacks preset on the electronic device substrate around the chip, so that the heat absorbing plate 1 is in full contact with the chip needing heat dissipation. When the chip works, heat generated by the chip is absorbed by the heat absorbing plate 1, and the heat absorption capacity of the heat absorbing plate 1 is increased through the liquid condensing pipe 6 embedded into the heat absorbing plate 1, namely, the heat absorption capacity of the heat absorbing plate 1 is increased, so that the heat release of the chip is accelerated. The cooling liquid in the liquid condensation pipe 6 returns to the liquid storage tank 9 through the water suction pump 10 to be cooled and then enters the liquid condensation pipe 6 again, and therefore the cooling liquid in the liquid condensation pipe 6 can be guaranteed to be lower than the temperature of the heat absorption plate 1 all the time. Meanwhile, through the through hole 102 formed in the heat absorbing plate 1, a part of the temperature of the chip of the electronic device can be quickly released to the first heat dissipation cavity and the second heat dissipation cavity through the through hole 102. The first cavity body 2 in first heat dissipation chamber and the second cavity body 11 in second heat dissipation chamber can prevent the heat lateral diffusion of through-hole 102 release, and the first fin 7 of the first cavity body 2 and the second fin 12 of the second cavity body 11 can carry out the preliminary heat dissipation processing to the heat of through-hole 102 release, the inside temperature of reduction equipment that can be fine, alright further improvement to the radiating effect of the processing chip in the equipment, thereby the utility model discloses the unsatisfactory problem of radiating effect of the processing chip among the solution electronic equipment among the prior art that can be fine.

According to above-mentioned embodiment, realization that can be fine the utility model discloses.

Claims

1. A heat dissipation device of electronic equipment is characterized by comprising a heat absorption plate (1), two first heat dissipation cavities symmetrically arranged at two ends of the heat absorption plate (1), a liquid condensation pipe (6) embedded in the heat absorption plate (1) and positioned between the two first heat dissipation cavities, a plurality of second heat dissipation cavities arranged on the heat absorption plate (1) and positioned between the two first heat dissipation cavities, a heat dissipation pressing plate (3) arranged on the first heat dissipation cavities and the second heat dissipation cavities, a heat dissipation fan (4) arranged on the heat dissipation pressing plate (3), a liquid storage tank (9) communicated with the liquid condensation pipe (6), and a water suction pump (10) arranged on the liquid storage tank (9) and provided with a water inlet communicated with the liquid condensation pipe (6); and a liquid outlet of the water suction pump (10) is communicated with a liquid inlet of the liquid storage tank (9).

2. The heat dissipating device of an electronic apparatus according to claim 1, wherein: the liquid condensation pipe (6) consists of a plurality of mutually communicated U-shaped metal pipes; the plurality of second heat dissipation cavities are distributed in each U-shaped opening of the liquid condensation pipe (6).

3. The heat dissipating device of an electronic apparatus according to claim 2, wherein: a first heat dissipation cavity mounting cavity (101) and a second heat dissipation cavity mounting cavity (104) are arranged on the heat absorption plate (1), and through holes (102) penetrating through the heat absorption plate (1) are formed in the first heat dissipation cavity mounting cavity (101) and the second heat dissipation cavity mounting cavity (104); the heat absorption plate (1) is further provided with a groove (103) which is consistent with the liquid condensation pipe (6) in shape, the bottom of the groove (103) is arc-shaped, and the caliber of the groove (103) is slightly larger than the pipe diameter of the liquid condensation pipe (6).

4. The heat dissipating device of an electronic apparatus according to claim 3, wherein: two strip-shaped through holes (301) matched with the first heat dissipation cavity mounting cavity (101) are formed in the heat dissipation pressing plate (3), and a plurality of strip-shaped openings (302) matched with the second heat dissipation cavity mounting cavity (104) are formed in the heat dissipation pressing plate (3); the heat dissipation pressing plate (3) is further provided with a plurality of air passing through holes (303), and the air passing through holes (303) are evenly distributed on the heat dissipation pressing plate (3).

5. The heat dissipating device of an electronic apparatus according to claim 4, wherein: the first heat dissipation cavity comprises a first cavity body (2) and a plurality of first heat dissipation fins (7) sleeved on the first cavity body (2); gaps exist between two adjacent first cooling fins (7) in the plurality of first cooling fins (7); one end of the first cavity body (2) is installed in the first heat dissipation cavity installation cavity (101), and the other end of the first cavity body is installed in the strip-shaped through hole (301).

6. The heat dissipating device of an electronic apparatus according to claim 5, wherein: the second heat dissipation cavity comprises a second cavity body (11) and a plurality of second heat dissipation fins (12) sleeved on the second cavity body (11); gaps exist between two adjacent second cooling fins (12) in the plurality of second cooling fins (12); one end of the second cavity body (11) is installed in the second heat dissipation cavity installation cavity (104), and the other end of the second cavity body is installed in the strip-shaped opening (302).

7. The heat dissipating device of an electronic apparatus according to claim 6, wherein: a plurality of staple bolts (8) are arranged on the heat absorbing plate (1), and the staple bolts (8) are distributed around the bottom surface of the heat absorbing plate (1); the heat radiation fan (4) is connected with the heat absorption plate (1) through a fixing bolt (5).