CN110098141B - 电子元件盒的制造方法 - Google Patents

电子元件盒的制造方法 Download PDF

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Publication number
CN110098141B
CN110098141B CN201810392443.8A CN201810392443A CN110098141B CN 110098141 B CN110098141 B CN 110098141B CN 201810392443 A CN201810392443 A CN 201810392443A CN 110098141 B CN110098141 B CN 110098141B
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China
Prior art keywords
electronic component
conductive
layer
unit electronic
receiving grooves
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CN201810392443.8A
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English (en)
Chinese (zh)
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CN110098141A (zh
Inventor
尹势元
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Individual
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Individual
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Priority claimed from KR1020180010885A external-priority patent/KR102072286B1/ko
Priority claimed from KR1020180015100A external-priority patent/KR102186468B1/ko
Priority claimed from KR1020180026654A external-priority patent/KR102154895B1/ko
Application filed by Individual filed Critical Individual
Publication of CN110098141A publication Critical patent/CN110098141A/zh
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Publication of CN110098141B publication Critical patent/CN110098141B/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333—Trays for chips
    • H01L21/67336—Trays for chips characterized by a material, a roughness, a coating or the like
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0067—Devices for protecting against damage from electrostatic discharge

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Elimination Of Static Electricity (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
CN201810392443.8A 2018-01-29 2018-04-27 电子元件盒的制造方法 Active CN110098141B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
KR10-2018-0010885 2018-01-29
KR1020180010885A KR102072286B1 (ko) 2018-01-29 2018-01-29 전자부품 용기의 제조방법
KR10-2018-0015100 2018-02-07
KR1020180015100A KR102186468B1 (ko) 2018-02-07 2018-02-07 전자부품 용기의 제조방법
KR10-2018-0026654 2018-03-07
KR1020180026654A KR102154895B1 (ko) 2018-03-07 2018-03-07 전자부품 용기의 제조방법

Publications (2)

Publication Number Publication Date
CN110098141A CN110098141A (zh) 2019-08-06
CN110098141B true CN110098141B (zh) 2023-06-16

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ID=67443504

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810392443.8A Active CN110098141B (zh) 2018-01-29 2018-04-27 电子元件盒的制造方法

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JP (1) JP6578033B2 (ja)
CN (1) CN110098141B (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111010788A (zh) * 2019-12-17 2020-04-14 深圳市麦捷微电子科技股份有限公司 一种消除声表面波滤波器静电吸附的方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1224445A (en) * 1982-08-26 1987-07-21 Gerald E. Mueller Transparent container for electrostatic sensitive electronic components
KR20000063759A (ko) * 2000-08-02 2000-11-06 윤덕용 비솔더 플립 칩 본딩용 고신뢰성 비전도성 접착제 및 이를이용한 플립 칩 본딩 방법
JP2002347831A (ja) * 2001-05-28 2002-12-04 Denki Kagaku Kogyo Kk キャリアテープ体
WO2002096773A1 (fr) * 2001-05-28 2002-12-05 Denki Kagaku Kogyo Kabushiki Kaisha Contenant de composants electroniques
WO2003034508A1 (en) * 2001-10-12 2003-04-24 Nichia Corporation Light emitting device and method for manufacture thereof

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6059077A (ja) * 1983-09-12 1985-04-05 Aronshiya:Kk プレス加工における抜きバリを除去する方法
JP2003094382A (ja) * 2001-09-27 2003-04-03 Mitsui Mining & Smelting Co Ltd 金属箔のスリット方法および金属箔のスリッター
KR20040062966A (ko) * 2001-11-27 2004-07-09 엔테그리스, 아이엔씨. 정전기 소산 필름을 갖는 반도체 구성요소 취급 장치
US20030150770A1 (en) * 2002-02-13 2003-08-14 Berkley Industries Llc Chip clamshell packaging
JP2010158795A (ja) * 2009-01-06 2010-07-22 Regulus Co Ltd 電子部品の収納容器および帯電防止樹脂シート
US20150083641A1 (en) * 2013-09-25 2015-03-26 Texas Instruments Incorporated Selective heat seal wafer cover tape (has tape)
KR101773530B1 (ko) * 2016-09-13 2017-08-31 윤세원 재귀반사시트 및 그의 제조방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1224445A (en) * 1982-08-26 1987-07-21 Gerald E. Mueller Transparent container for electrostatic sensitive electronic components
KR20000063759A (ko) * 2000-08-02 2000-11-06 윤덕용 비솔더 플립 칩 본딩용 고신뢰성 비전도성 접착제 및 이를이용한 플립 칩 본딩 방법
JP2002347831A (ja) * 2001-05-28 2002-12-04 Denki Kagaku Kogyo Kk キャリアテープ体
WO2002096773A1 (fr) * 2001-05-28 2002-12-05 Denki Kagaku Kogyo Kabushiki Kaisha Contenant de composants electroniques
WO2003034508A1 (en) * 2001-10-12 2003-04-24 Nichia Corporation Light emitting device and method for manufacture thereof

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Publication number Publication date
JP6578033B2 (ja) 2019-09-18
CN110098141A (zh) 2019-08-06
JP2019131286A (ja) 2019-08-08

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