US20030150770A1 - Chip clamshell packaging - Google Patents

Chip clamshell packaging Download PDF

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Publication number
US20030150770A1
US20030150770A1 US10075941 US7594102A US2003150770A1 US 20030150770 A1 US20030150770 A1 US 20030150770A1 US 10075941 US10075941 US 10075941 US 7594102 A US7594102 A US 7594102A US 2003150770 A1 US2003150770 A1 US 2003150770A1
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Patent type
Prior art keywords
electronic component
package
bottom
lower cover
adapted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
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US10075941
Inventor
Joe Campbell
Jon Kaniewski
Steven Milburn
Joseph Toma
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Packaging Plus LLC
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Berkley Ind LLC
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D77/00Packages formed by enclosing articles or materials in preformed containers, e.g. boxes, cartons, sacks or bags
    • B65D77/04Articles or materials enclosed in two or more containers disposed one within another
    • B65D77/0446Articles or materials enclosed in two or more containers disposed one within another the inner and outer containers being rigid or semi-rigid and the outer container being of polygonal cross-section not formed by folding or erecting one or more blanks
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D43/00Lids or covers for rigid or semi-rigid containers
    • B65D43/14Non-removable lids or covers
    • B65D43/16Non-removable lids or covers hinged for upward or downward movement
    • B65D43/162Non-removable lids or covers hinged for upward or downward movement the container, the lid and the hinge being made of one piece
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0084Containers and magazines for components, e.g. tube-like magazines
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D2213/00Safety means
    • B65D2213/02Means for preventing buil-up of electrostatic charges
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D2585/00Containers, packaging elements or packages specially adapted for particular articles or materials
    • B65D2585/68Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form
    • B65D2585/86Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form for electrical components

Abstract

A protective plastic package for storage, transportation and display of electronic components, particularly integrated circuits. The package has a top and bottom cover, is slightly larger than the electronic component, and centers the electronic component within it to prevent damage. The package is also has anti-static properties to prevent static electricity damage. The electronic component is retained within the package when open, and may be ejected from the package without touching the electronic component. The protective plastic package may also be used within larger display packaging to provide an added level of protection against damage and theft. If individualized identification tags are placed on individual items within transparent display packaging, they can be individually read without opening the package or placing corresponding tags on the package exterior.

Description

    FIELD OF THE INVENTION
  • The field of the present invention is protective packaging for individual electronic components and display packaging for retail merchandise. [0001]
  • BACKGROUND OF THE INVENTION
  • A pin grid array (PGA) integrated circuit (IC) component typically has a thin planar housing of a ceramic or other material for containing a semiconductor substrate and related circuitry. Typically, terminal pins extend perpendicularly from the bottom planar surface of the housing, with the center portion of that bottom planar surface having no pins. The top planar surface of the housing usually has an IC chip, often a microprocessor, which may have some smaller chips around it. If a heat sink is required to cool the microprocessor during operation, the top planar surface of the housing with the microprocessor may have several mounting cushions near the housing's edges to support and stabilize the heat sink. [0002]
  • When microprocessors or ICs are shipped in bulk, particularly PGA ICs, they are typically shipped in stackable plastic trays, such as those described in U.S. Pat. No. 5,746,319 (Murphy) and U.S. Pat. No. 5,103,976 (Murphy). These trays typically hold 10 PGA ICs, and once removed from the tray, an individual PGA IC has no protection from physical or electrical damage. Therefore, it is inconvenient to handle or ship individual PGA IC's or similar electronic components. [0003]
  • Additionally, most PGA ICs that contain modern microprocessors must use a heat sink and fan that is specially designed to fit the individual IC. As a result, packaged replacement or upgrade microprocessors are often sold with a suitable heat sink/fan. It is desirable to be able to view the IC and heat sink and fan without opening the package, yet most of these combination packages use a sealed cardboard exterior shell, which prevents any such viewing. The cardboard box packaging also requires any individual identification numbers marked on either the IC or the heat sink/fan to be affixed to the outside of the box in order to track these components using the identification numbers. [0004]
  • Clear plastic bulk display packaging is well known in the retail industry, and warehouse retailers are the primary users of such packaging. This type of packaging has several features. First, it is often significantly larger than the merchandise, and is difficult to open, which deters theft. Second, the packages are often designed to stand up within a large shipping carton, such that removal of the carton reveals a preassembled display of product. Third, the packaging tends to be sturdy and fairly rigid, protecting the contents from damage. Fourth, some packaging provides structural support for the shipping container. Examples of this type of packaging can be found in U.S. Design Pat. No. D412,631, Green; U.S. Pat. No. 5,979,662, Green; U.S. Pat. No. 6,050,420, Green; and U.S. Pat. No. 6,152,305, Green. [0005]
  • Display packages are made difficult to open by sealing them. Sealing is typically accomplished by heating selected points of the front and rear portions of the package material to their melting point, which joins the halves together. Sealing is done either at specific spots “spot-sealing,” or along the outer perimeter of the package. Packages can also be sealed using a combination of spot-sealing and perimeter sealing. A common technique to heat the plastic to its melting point uses radio frequency waves, called RF sealing. Adhesives can also be used to seal packages, including adhesives cured by exposure to external energy, such as heat or light. For example, a common method of sealing packages is with UV light curing adhesives. [0006]
  • Typically, this type of display packaging surrounds the merchandise with a single layer of plastic. When used for packaging sensitive electronic components, such as microprocessors or integrated circuits, this single layer construction requires that an anti-static coating be used for the entire package to avoid static buildup and discharge that could damage the delicate electronic components. Once the package has been opened, the single layer construction typically does not allow individual items within the package to be pulled from the package yet remain in a protective plastic covering to prevent damage or contamination prior to use. By design, display packaging is difficult to open, and a sensitive electronic component in a single layer package may tend to fall out of the package and be damaged as the consumer is struggling to open it. [0007]
  • SUMMARY OF THE INVENTION
  • The present invention provides an individual plastic package for sensitive electronic components such as PGA ICs, which protects the component from physical and electrical damage until it can be installed in the intended electronic device. The present invention provides a display packaging assembly that allows a consumer to view electronic components within plastic packaging, with any identification numbers clearly visible for tracking purposes. The present invention also provides a separate protective package for electronic components in display packaging to protect the electronic components after they have been removed from the display packaging. The present invention also has a variety of retail display options; it can be placed upright in a self-contained “club store” pallet pack, it is self-standing so it can be placed individually on a shelf, and it has a top hole for pegboarding. [0008]
  • In a first separate aspect of the present invention, a protective plastic clamshell package comprised of a lower cover and an upper cover encloses a sensitive electronic component that allows the individual component to be handled and shipped without damage. Individual components can be easily and safely shipped in a low cost, disposable package. [0009]
  • In a second separate aspect of the present invention, the protective plastic clamshell package has anti-static properties, which prevents electrical damage to the electronic component from static discharge. [0010]
  • In a third separate aspect of the present invention, the protective plastic clamshell package holds the electronic component in place even when the clamshell is opened. Additional protection from accidental damage due to dropping the electronic component out of the package is achieved. [0011]
  • In a fourth separate aspect of the present invention, the protective plastic package is designed so that the electronic component can be ejected from the package with even force and without having to touch it. Damage to the electronic component during removal from the protective package is prevented. [0012]
  • In a fifth separate aspect of the present invention, the protective plastic clamshell package has a structure that retains and supports the electronic component within the center of the protective plastic clamshell, with sufficient space between the electronic component and the outer surfaces of the clamshell to prevent physical damage. Further protection of the electronic component is achieved. [0013]
  • In a sixth separate aspect of the present invention, the upper and lower covers of the protective plastic clamshell package remain in the closed position without sealing. Easy access to the electronic component is retained, while the additional protection provided by the top cover is maintained. [0014]
  • In a seventh separate aspect of the invention, the protective plastic clamshell package is placed in a larger display package for retail sale. Additional protection from damage is achieved, as well as theft and tamper resistance. [0015]
  • In an eighth separate aspect of the present invention, an integrated circuit in the protective plastic clamshell package is placed in a display package with a matched heat sink and fan. Consumers can view the product without removing it from the package and be assured they are getting the product they are expecting. [0016]
  • In a ninth separate aspect of the invention, individual items with individual optically readable tags are placed within display packaging such that the optically readable tags are visible. Inventory tracking of individual items in the package can be achieved by reading the tags with optical tag reading equipment. Cost savings can be achieved by eliminating separate serial number tags or optically readable tags placed on the outside of the package.[0017]
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a plan view of a chip clamshell in the closed position. [0018]
  • FIG. 2A is a plan view of a chip clamshell in the open position. [0019]
  • FIG. 2B is a plan view of a chip clamshell in the open position, with an integrated circuit placed in the chip clamshell for reference. [0020]
  • FIG. 2C is a bottom view of a chip clamshell in the open position, with an integrated circuit placed in the chip clamshell for reference and visible through the bottom of the lower cover. [0021]
  • FIG. 3A is a side view of a chip clamshell in the open position. [0022]
  • FIG. 3B is a side view of a chip clamshell in the open position with an integrated circuit floating above it for reference. [0023]
  • FIG. 3C is a side view of the lower portion of a chip clamshell in the open position with an integrated circuit placed into it for reference. [0024]
  • FIG. 4 is an oblique view of a chip clamshell in the closed position. [0025]
  • FIG. 5A is an oblique view of a chip clamshell in the open position. [0026]
  • FIG. 5B is an oblique view of a chip clamshell in the open position with an integrated circuit placed into it for reference. [0027]
  • FIG. 6 is an exploded perspective view of a display package containing a chip clamshell and a heat sink/fan.[0028]
  • DETAILED DESCRIPTION OF A PREFERRED EMBODIMENT
  • A typical “clamshell” package is one that is typically made of one piece of plastic, with a plastic “hinge” that connects the front portion and the rear portion of the package, and the package is flexed at the hinge to close the clamshell over the product. In a preferred embodiment, the clamshell packaging is slightly larger than the electronic component it is designed to contain, and is typically fabricated with thermoformed plastic. The plastic used may be comprised mainly of polyvinyl chloride (PVC) or polyethylene terephthalate (PET). Packages may also be comprised mainly of polyethylene terephthalate glycol (PETG), which can enhance recycling potential. Other suitable plastics may also be used, including combinations of the plastics listed above. As is well known in the art, plastic may be coated with an anti-static material, or may be entirely or partially comprised of an anti-static material, such as that described in U.S. Pat. No. 6,194,497, which also provides a general summary of anti-static coatings. [0029]
  • As used in the claims, a “chip clamshell” is simply a protective package for an individual electronic component such as a PGA IC, comprising an upper cover and a lower cover, with the upper cover and lower cover being slightly larger than the electronic component and having a substantially rigid structure to prevent crushing, and having anti-static properties. FIG. 1 shows a plan view of a chip clamshell [0030] 1 in the closed position.
  • FIG. 2 shows a plan view of a chip clamshell [0031] 1 in the open position, and FIG. 2B shows the same view but with an IC placed into the chip clamshell 1 for reference. FIG. 2C is a bottom view of the chip clamshell 1 in the open position, with an IC placed into the chip clamshell 1 for reference, and the bottom of the IC is visible through the lower cover 11. FIG. 3A is a side view of a chip clamshell 1 in the open position, and FIG. 3B shows the same view but with an IC placed into the chip clamshell 1 for reference. FIG. 3C is a closeup side view of the lower cover, with an IC placed into it to show how it “floats” within the center of the chip clamshell 1, with protective spacing around the IC. FIG. 4 is an oblique view of a chip clamshell 1 in the closed position, which provides some detail as to the exterior shape. FIG. 5 is an oblique view of a chip clamshell 1 in the open position, and shows the most detail as to the structure, discussed below, and FIG. 5B is same view, with an IC placed into the chip clamshell 1 for reference.
  • As shown in FIGS. 2B, 2C, [0032] 3B, and 3C, a typical PGA IC may have a top planar surface 100, a bottom planar surface 102, a central chip 104, and subsidiary chips 106, with terminal pins 108 extending perpendicularly from the bottom planar surface 102. As shown in FIG. 2C, the center portion 110 of the IC's bottom planar surface 102 may have an absence of terminal pins 108.
  • The chip clamshell [0033] 1 is sufficiently strong and resilient to resist significant deformation under normal handling stress. As shown in the closed position in FIG. 4, the upper cover 3 of the chip clamshell 1 may be designed with top center portion 2 that sits some distance above the IC's top planar surface 100, with recessed annulus 4 that may conform to and touch the periphery of the IC's top planar surface 100, and top outer portion 6 distal to recessed annulus 4 that is raised relative to recessed annulus 4, and beyond top outer portion 2, a recessed perimeter wall 8 may be adapted to fit snugly against a raised perimeter wall 26 on the lower cover 11 of the chip clamshell 1. At the outer edge of the upper cover 3, connected with the recessed perimeter wall 8, there may be a top joining plane 10, a substantially planar portion adapted to fit against the bottom joining plane 28 when in the closed position, and may act as a gripping surface to open the chip clamshell 1. The joining planes may also be used as an area to seal the chip clamshell 1 if desired, using either a sealant, heat sealing (RF sealing), or some other suitable sealing method, discussed below.
  • Viewing the chip clamshell in the open position as depicted in FIG. 5, the lower cover [0034] 11 of the chip clamshell 1 may be designed with a bottom center portion 12 that is recessed some distance from the IC's bottom planar surface 102, and a raised annulus 14 that may conform to the inside perimeter of the IC's terminal pins 108 and may touch the IC's bottom planar surface 102. The bottom center portion 12, which may be substantially planar, and the raised annulus 14, form a “button” that aids in the removal of the IC from the lower portion 11 of the clamshell, discussed below.
  • Distal to the raised annulus [0035] 14, the lower cover 11 may further have a pin protection plane 16 that may be substantially planar and recessed relative to the raised annulus 14, and when the IC is placed into the lower cover 11, the pin protection plane 16 may be some distance below the terminal pins 108 to provide protection, as shown in FIG. 3C. Distal to the pin protection plane 16 may be a containment wall 18, which is raised relative to the pin protection plane 16 and is shaped with contact points 19 to contact the outer perimeter of the IC's planar housing at several points, and may be shaped with various folds to provide additional rigidity to the structure. In addition, the containment wall 18 may be fitted with one or more detents 20 that fit atop the outer perimeter of the IC's top planar surface 100, and retain the IC in the chip clamshell 1 even when in the open position. The detents 20 could be the small raised structures as shown in FIG. 5, or a groove in the containment wall 18, or any other suitable structure to retain the IC. Rather than detents 20, the containment wall 18 could also be constructed to secure the IC with a friction fit, or a combination of detents and friction fit. The containment wall 18 may also be shaped to provide recesses 22 that may allow the IC to be mechanically loaded into the lower portion 11 by robotic methods. The recesses 22 may also act as finger wells for removing an IC from the lower cover 11, but a preferred method of removing an IC without using the recesses 22 is described below. Distal to the containment wall 18 may be a bottom outer portion 24, a raised perimeter wall 26, and a bottom joining plane 28. When the chip clamshell 1 is in the closed position, the bottom outer portion 24 may contact the top outer portion 6, the raised perimeter wall 26 may snugly fit the recessed perimeter wall 8 to provide a friction fit to keep the chip clamshell 1 in the closed position without sealing. Alternatively, one of the covers could be fitted with one or more detents and the other cover with corresponding recesses to act as a “latch” to hold the covers together in the closed position, or any other suitable mechanism.
  • Connecting the upper cover [0036] 3 and lower cover 11 may be a simple plastic hinge 30. The hinge 30 could be a square channel design as shown in the open position of FIG. 4, forming a triangle when closed as shown in FIG. 5, to ensure that the joining planes 10, 28 may remain parallel at all points. Alternatively, the hinge 30 could be a simple fold, or any other suitable design. Alternatively, the chip clamshell 1 could be made in two separate pieces, without being connected by a hinge.
  • “The button” formed by the bottom center portion [0037] 12 and the raised annulus 14 of the lower cover 11 can assist the end user in removing the IC from the package without damage. For example, if the IC is removed from the lower cover 11 with a thumb and finger inserted into the recesses 22, uneven forces could be placed on the IC's planar housing, and damage could result. Damage could also result if the thumb or finger contacts and bends the pins while removing the IC, or the user loses control of the IC as it pops out during removal and drops it. By using the “button” to remove the IC, however, the IC is protected from damage by using the following procedure. The chip clamshell 1 is opened and turned over so the bottom of the lower cover 11 is facing up and the bottom outer portion 24 is facing down, and the open chip clamshell 1 is placed face down on a surface, preferably a padded surface, and thumb or finger pressure is placed on the bottom center portion 12 (and partially on the pin protection plane 16), which causes the raised annulus 14 to press on the IC's center portion 110 of the IC's bottom planar surface 102. By using the “button,” the force is evenly spread out on the IC's bottom planar surface 102, and with enough pressure the IC is pushed past the detents 20 and gently ejected from the lower cover 11, without the user's fingers ever touching the IC. This protects the IC and the delicate terminal pins 108 during ejection. Alternatively, a user could grasp the outer portion of the lower cover 11 with his or her fingers or thumbs, and then push on the “button” to eject the IC.
  • The “button” described above is an ejection structure in protective packaging for an electronic component, and different electronic components may require a different structure to eject them from a chip clamshell, yet use the same general principles described herein. This general principle may be described as a structure that is located some distance from the electronic component (“button top”) yet connected with a structure that is close to or in contact with the electronic component (“button bottom”), such that exerting force on the button top will cause the button bottom to exert force on the electronic component, thus forcing the electronic component out of any restraints in the protective package. The button bottom may preferably be shaped to spread such force over a relatively large area of the electronic component to prevent damage from highly localized forces. The button bottom and the button top may preferably be shaped so that the button top never contacts the electronic component during ejection, and acts to define a protective space around the electronic component during transport or display. [0038]
  • The plastic used for the chip clamshell [0039] 1 has some flexibility that allows the “button” to function, yet retains sufficient rigidity to retain the chip clamshell's 1 structural integrity to protect the IC. If desired, the plastic used on the lower cover 11 (or a portion thereof) could be of a different flexibility than the rest of the chip clamshell 1 to enhance the “button's” function. This difference in flexibility could be achieved by using different plastic compositions, different thermoforming techniques on portions of the chip clamshell 1, or other suitable techniques.
  • The majority of the chip clamshell surfaces are some distance from the IC. The only part of the chip clamshell [0040] 1 touching the IC, the recessed annulus 4, the raised annulus 14, and the contact points 19 of the containment wall 18, are all recessed relative to the chip clamshell's 1 broad outer surfaces. Therefore, the chip clamshell 1 centers the IC within a larger package and provides a protective container for an individual IC. Different designs for the chip clamshell 1 could be used to fit different shapes of electronic components, while retaining the inventive concepts disclosed herein.
  • The chip clamshell [0041] 1 may be used alone, or in conjunction with a larger packaging system, such as display packaging. In contrast to the chip clamshell 1, display packaging may be substantially larger than the product, and is typically fabricated with thermoformed plastic. The large size of the packaging provides a pleasing display, and the large size combined with its tamper-resistant qualities deters theft. Display packaging can be constructed in a variety of methods, such as a clamshell, a tri-fold, book-fold, or multiple-piece units, all of which are well-known in the packaging art.
  • In a preferred embodiment, the display packaging containing the chip clamshell [0042] 1 may also contain a matching heat sink and fan 60. In other embodiments, the chip clamshell 1 could be the only item in the display packaging, or multiple chip clamshells could be placed in a single display package, or chip clamshell(s) could be packaged with other items.
  • As shown in FIG. 6, a preferred embodiment may be a multi-piece display package, with a front member [0043] 40, a middle member 42, and a back member 44 through which the package contents are visible. The front member 40 has large planar areas, with only a few features. These features may include a recessed top section 46 with a hole 48 for mounting on a peg-board, feet 50 that allow the package to be free-standing, and a perimeter channel 52 into which the perimeter section 54 of the back member 44 mates. The large planar frontal area and side areas of the front piece may allow for the optional placement of a product insert card 56 and/or instruction manuals 58 within the display package. Alternatively, the display package could be constructed such that product insert card 56 could be placed between the middle member 42 and the rear member 44, with the product being visible though the front member 40. The perimeter channel 52 may be used not only for sealing, but also as a flange so that the package can be held upright in a tray with slots for the flange, similar to what is shown in U.S. Pat. No. D412,631.
  • The middle member [0044] 42 may be designed to fit snugly between the front member 40 and back member 44 when mated, and may contain cavities 70 for the chip clamshell 1 and the heat sink and fan 60, or other items within the display package. In other embodiments, the middle member 42 could be eliminated if the front member 40, or back member 44, or both were shaped to contain such cavities 70.
  • In a preferred embodiment, when the middle member [0045] 42 is placed into the front member 40, and the items to be packaged (1, 60) are placed into the middle member 42 cavities 70, the back member 44 may be mated to the front member 40. The back member 44, when viewed from the rear of the package as in FIG. 6, may contain recesses 72 that are shaped to securely retain the chip clamshell 1 and heat sink and fan 60, or other items within the package. When the entire display package is assembled, the front member and rear member may be sealed at the perimeter (52, 54) to prevent tampering.
  • The multi-piece package of the preferred embodiment is designed to securely hold and provide a high level of protection for an IC or other electronic component within the package. An IC in a chip clamshell [0046] 1 inside the display package enjoys multiple layers of protection, and resists tampering and theft. Utilizing a chip clamshell 1 with anti-static properties for a sensitive electronic component may allow the display package to be constructed of non-anti-static materials, resulting in cost savings over a design where the entire display package has to be constructed with anti-static materials. Packaging an IC with a matched heat sink and fan 60 may assure that consumers do not choose incompatible heat sinks and fans 60 for their IC. Additionally, consumers could see the electronic components without actually touching them, thereby assuring themselves that they are buying the proper component and reducing any risk of pre-sale damage by inspecting unprotected components.
  • ICs are often imprinted with an individual serial number and/or an optically readable tag, such as a bar code. Other items in the display packaging may also have individual serial numbers and/or tags. If the chip clamshell [0047] 1 and display packaging are constructed of transparent materials, or at least have transparent portions, these serial numbers could be read either manually or using an optical tag reader. Such numbers could be used to track inventory or individual components. If multiple items are in a package, each item could be tracked individually.
  • If optically readable tags are imprinted on the components, such tags could contain a variety of information, including serial number, date and location of manufacture, etc. In an ordinary cardboard box package, the serial numbers or optically readable tags would have to be affixed to the box exterior to track the components, and thus the transparent display packaging saves additional costs. [0048]
  • Individual items having individual optically readable tags within display packaging could be individually tracked by positioning the optically readable tags so they can be viewed through a transparent portion of the display packaging, and using optical tag reading equipment to read the tag and extract the information from it. If multiple items in a single display package have individually identifiable optically readable tags, the individual items could be identified and tracked independently, if desired. [0049]
  • Accordingly, an improved individual electronic component package is disclosed, as well as an improved display package assembly for such components. Although embodiments and applications of this invention have been shown, it would be apparent to those skilled in the art that many more modifications are possible without departing from the inventive concepts herein. The invention, therefore, is not to be restricted except in the spirit of the appended claims. [0050]

Claims (25)

    What is claimed is:
  1. 1. A plastic protective package for an individual electronic component, comprising
    an upper cover; and
    a lower cover, the lower cover adapted to fit an electronic component, the upper cover adapted to mate with the lower cover and simultaneously fit the electronic component, the upper cover and lower cover being slightly larger than the electronic component and having a substantially rigid structure to prevent crushing, and the upper cover and lower cover having anti-static properties.
  2. 2. The protective package of claim 1, wherein the electronic component is an integrated circuit with a top planar surface, a bottom planar surface, and an outer perimeter of the planar surface, with terminal pins on the bottom planar surface and an absence of pins in the center portion of that bottom planar surface, with the lower cover having
    a raised annulus on which the center portion of the bottom planar surface rests;
    a pin protection plane distal to the raised annulus, said pin protection plane positioned some distance from the terminal pins; and
    a containment wall distal to the pin protection plane, said containment wall providing contact points that contact the outer perimeter of the integrated circuit's planar surface;
    a bottom outer portion distal to the containment wall; and
    a raised perimeter wall distal to the bottom outer portion.
  3. 3. The protective package of claim 2, wherein the lower cover further comprises:
    at least one detent on the containment wall to retain the integrated circuit in the lower cover.
  4. 4. The protective package of claim 3, further comprising a bottom center portion inside the raised annulus of the lower cover, said bottom center portion being substantially planar and approximately the same elevation as the pin protection plane, wherein the bottom center portion can be pushed to cause the raised annulus to exert force on the center portion of the bottom planar surface of the integrated circuit, sufficient to push the integrated circuit past the at least one detent on the containment wall.
  5. 5. The protective package of claim 2, with the upper cover having
    a top center portion positioned some distance above the top planar surface of the integrated circuit;
    a recessed annulus distal to the top center portion, said recessed annulus adapted to contact the top planar surface of the integrated circuit;
    a top outer portion distal to the recessed annulus, said top outer portion adapted to contact the bottom outer portion when the upper cover and lower cover are mated; and
    a recessed perimeter wall distal to the top outer portion, said recessed perimeter wall adapted to contact the raised perimeter wall when the upper cover and lower cover are mated.
  6. 6. The protective package of claim 5, further comprising
    a lower joining plane distal to the raised perimeter wall of the lower cover;
    an upper joining plane distal to the recessed perimeter wall of the upper cover;
    wherein the lower joining plane and upper joining plane are adapted to contact each other when the top cover and lower cover are mated.
  7. 7. The protective package of claim 5, further comprising
    a hinge connecting the upper cover and lower cover.
  8. 8. The protective package of claim 5, wherein the upper cover and lower cover are adapted to remain mated in the closed position without sealing.
  9. 9. The protective package of claim 8, wherein the upper and lower cover remain mated when in the closed position due to a friction fit between the raised perimeter wall of the lower cover and the recessed perimeter wall of the upper cover.
  10. 10. A method of removing an electronic component restrained in a plastic protective package by detents, comprising
    using a plastic protective package with an annulus that is in contact with the electronic component, and the annulus is raised relative to connected substantially planar surfaces on either side of the annulus,
    pushing on the substantially planar surfaces, causing the annulus to push against the electronic component and force the electronic component past the detents.
  11. 11. An ejection structure in a protective package for an electronic component that is held in place by restraints in the protective package, comprising
    a button top that is located some distance from the electronic component,
    a button bottom that is located close to the electronic component, where the button top is connected with the button bottom, and placing pressure on the button top will in turn cause the button bottom to exert force on the electronic component sufficient to force the electronic component out of the restraints.
  12. 12. The ejection structure of claim 11, wherein the button bottom is shaped to spread the force exerted on the electronic component over a wide area.
  13. 13. The ejection structure of claim 11, wherein the button top is shaped to define a protective space between it and the electronic component, and so that the button top never contacts the electronic component before or during ejection of the electronic component.
  14. 14. The ejection structure of claim 11, wherein the button bottom is a raised annulus and the button top is a bottom center portion of the protective package.
  15. 15. A display package for displaying at least one electronic component, comprising
    a front member with a substantially planar portion;
    a rear member with a substantially planar portion and adapted to mate with the front member; and
    a chip clamshell, wherein the front member and rear member are adapted to closely fit around the chip clamshell.
  16. 16. The display package of claim 15, wherein the first front member and first rear member are sealed to prevent easy removal of the chip clamshell.
  17. 17. The display package of claim 15, wherein the front member and rear member are adapted to closely fit at least one additional item of retail merchandise.
  18. 18. A display package for displaying at least one electronic component, comprising
    a front member with a substantially planar portion;
    a rear member with a substantially planar portion and adapted to mate with the front member;
    a middle member adapted to fit securely within the first members;
    a chip clamshell, wherein the middle member is adapted to closely fit the chip clamshell,
    and the front member and rear member are adapted to securely hold the chip clamshell and the middle member.
  19. 19. The display package of claim 18, wherein the front member and rear member are sealed to prevent easy removal of the chip clamshell.
  20. 20. The display package of claim 18, wherein the middle member and rear member are adapted to closely fit at least one additional item of retail merchandise.
  21. 21. The display package of claim 18, further comprising a product insert card between the front member and the middle member.
  22. 22. The display package of claim 18, further comprising a product insert card between the rear member and the middle member.
  23. 23. A method of tracking an individual item within display packaging comprising
    placing an optically readable tag on the individual item;
    placing the individual item within display packaging that contains a transparent portion so that the optically readable tag is visible;
    reading the optically readable tag with optical tag reading equipment.
  24. 24. The method of claim 23, wherein the optically readable tag contains a variety of information related to the individual item, including a serial number.
  25. 25. The method of claim 23, further comprising
    placing an individualized optically readable tag on at least one additional merchandise item;
    placing the at least one additional merchandise item in the display packaging that contains a transparent portion so that the optically readable tag on the at least one additional merchandise item is visible; and
    using the optical tag reading equipment to individually read the optically readable tags on the individual item and the at least one additional merchandise item.
US10075941 2002-02-13 2002-02-13 Chip clamshell packaging Abandoned US20030150770A1 (en)

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US10075941 US20030150770A1 (en) 2002-02-13 2002-02-13 Chip clamshell packaging

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US10075941 Abandoned US20030150770A1 (en) 2002-02-13 2002-02-13 Chip clamshell packaging

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Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050180115A1 (en) * 2004-02-18 2005-08-18 Chi-Lin Chang Protection structure for thermal conducting medium of heat dissipation device
US20060213800A1 (en) * 2005-03-24 2006-09-28 Lance Ballard Memory module clamshell package
US20060232936A1 (en) * 2005-04-15 2006-10-19 Chung Wu Protective cover for heat-conductive material of heat sink
WO2007011895A1 (en) * 2005-07-18 2007-01-25 Avery Dennison Corporation Plastic case for an eas tag
EP1777172A2 (en) 2005-10-19 2007-04-25 Manfred Jacob Kunststofftechnik GmbH Container for electronic components and use thereof
EP1816087A1 (en) * 2006-02-07 2007-08-08 Pierre Meulders Packaging for a sectional gate
US20070267276A1 (en) * 2004-03-28 2007-11-22 Heiner Kudrus Drawing Machine and Method of Drawing a Workpiece
US20080121559A1 (en) * 2006-11-07 2008-05-29 Hannes Friedrich Packaging for electronic components, especially for tape-n-reels
US20080185310A1 (en) * 2004-05-18 2008-08-07 Anthony Trajkovich Heat Sealable Laminating Film
US20090059529A1 (en) * 2007-08-31 2009-03-05 International Business Machines Corporation Electronic module packaging
US20130062344A1 (en) * 2011-09-08 2013-03-14 Samsung Electronics Co., Ltd. Packaging box and method for fabricating the same
US8596456B2 (en) 2010-11-19 2013-12-03 Apple Inc. Display apparatus

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7068514B2 (en) * 2004-02-18 2006-06-27 Cpumate Inc. Protection structure for thermal conducting medium of heat dissipation device
US20050180115A1 (en) * 2004-02-18 2005-08-18 Chi-Lin Chang Protection structure for thermal conducting medium of heat dissipation device
US7743911B2 (en) 2004-03-28 2010-06-29 Sms Schumag Gmbh & Co. Kg Drawing machine and method of drawing a workpiece
US20070267276A1 (en) * 2004-03-28 2007-11-22 Heiner Kudrus Drawing Machine and Method of Drawing a Workpiece
US20080185310A1 (en) * 2004-05-18 2008-08-07 Anthony Trajkovich Heat Sealable Laminating Film
US8079470B2 (en) 2004-05-18 2011-12-20 Anthony Trajkovich Heat sealable laminating film
US20060213800A1 (en) * 2005-03-24 2006-09-28 Lance Ballard Memory module clamshell package
US20060232936A1 (en) * 2005-04-15 2006-10-19 Chung Wu Protective cover for heat-conductive material of heat sink
US7441593B2 (en) * 2005-04-15 2008-10-28 Chaun-Choung Technology Corp. Protective cover for heat-conductive material of heat sink
WO2007011895A1 (en) * 2005-07-18 2007-01-25 Avery Dennison Corporation Plastic case for an eas tag
EP1777172A2 (en) 2005-10-19 2007-04-25 Manfred Jacob Kunststofftechnik GmbH Container for electronic components and use thereof
EP1777172A3 (en) * 2005-10-19 2007-06-27 Manfred Jacob Kunststofftechnik GmbH Container for electronic components and use thereof
EP1816087A1 (en) * 2006-02-07 2007-08-08 Pierre Meulders Packaging for a sectional gate
US20080121559A1 (en) * 2006-11-07 2008-05-29 Hannes Friedrich Packaging for electronic components, especially for tape-n-reels
US7646605B2 (en) * 2007-08-31 2010-01-12 International Business Machines Corporation Electronic module packaging
US20090059529A1 (en) * 2007-08-31 2009-03-05 International Business Machines Corporation Electronic module packaging
US8596456B2 (en) 2010-11-19 2013-12-03 Apple Inc. Display apparatus
US20130062344A1 (en) * 2011-09-08 2013-03-14 Samsung Electronics Co., Ltd. Packaging box and method for fabricating the same

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