CN110094898A - A kind of small-sized quick semiconductor cooling device - Google Patents
A kind of small-sized quick semiconductor cooling device Download PDFInfo
- Publication number
- CN110094898A CN110094898A CN201910379704.7A CN201910379704A CN110094898A CN 110094898 A CN110094898 A CN 110094898A CN 201910379704 A CN201910379704 A CN 201910379704A CN 110094898 A CN110094898 A CN 110094898A
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- Prior art keywords
- cabinet
- small
- heat dissipation
- cooling device
- power supply
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
Abstract
The present invention provides a kind of small-sized quick semiconductor cooling device.The small-sized quick semiconductor cooling device, comprising: cabinet；Power supply, the power supply are set to the left side at the inner wall back side of the cabinet；Motor-mount pump is recycled, the circulation motor-mount pump is fixedly installed in the right side at the inner wall back side of the cabinet；Cooling system, the cooling system are set to the back side of the inner wall of the cabinet and are located at the lower section of the power supply；Semiconductor chilling plate group, the semiconductor chilling plate group are set to the back side of the inner wall of the cabinet and are located at the right side of the cooling system；Water inlet pipe, the water inlet pipe are connected to the input terminal of the circulation motor-mount pump；Connecting conduit, the connecting conduit are connected to the output end of the circulation motor-mount pump.Small-sized quick semiconductor cooling device provided by the invention has and can be rapidly performed by refrigeration, and small in size, low noise more easily can be used effectively on laboratory and other places.
Description
Technical field
The present invention relates to the fields of refrigeration equipment, more particularly to a kind of small-sized quick semiconductor cooling device.
Background technique
In some Life Science Experiments, medical research experiment, water body constant temperature, Physical Experiment, chemical experiment and similar operations
Quick uniform cooling requirement, temperature on this generic operation influence it is very big, sometimes become experiment success or failure most important factor.
That there are volumes is big for existing refrigeration equipment, inconvenient benefit or cooling velocity are not enough to reach demand, some experiments
Scheme provides the method that ice cube is laid with around device to obtain a relatively low temperature, although simple easy to operate,
It is that this method inhomogeneous cooling is even, speed also brings certain obstacle to experiment slowly, and perfect refrigeration equipment is excessively huge because of its volume
Greatly, refrigerating speed is slowly also seldom in such experiment.
Therefore, it is necessary to provide a kind of small-sized quick semiconductor cooling device solution above-mentioned technical problem.
Summary of the invention
The present invention provides a kind of small-sized quick semiconductor cooling device, solves that existing refrigeration equipment volume is big, system
The slow problem of speed of cooling.
In order to solve the above technical problems, small-sized quick semiconductor cooling device provided by the invention, comprising: cabinet；
Power supply, the power supply are set to the left side at the inner wall back side of the cabinet；
Motor-mount pump is recycled, the circulation motor-mount pump is fixedly installed in the right side at the inner wall back side of the cabinet；
Cooling system, the cooling system are set to the back side of the inner wall of the cabinet and are located at the lower section of the power supply；
Semiconductor chilling plate group, the semiconductor chilling plate group are set to the back side of the inner wall of the cabinet and are located at described
The right side of cooling system；
Water inlet pipe, the water inlet pipe are connected to the input terminal of the circulation motor-mount pump；
Connecting conduit, the connecting conduit are connected to the output end of the circulation motor-mount pump；
Outlet pipe, the outlet pipe are connected to the output end of the semiconductor chilling plate group.
Preferably, the input terminal of the semiconductor chilling plate group is connected to one end of the connecting conduit, the cabinet top
Control panel is provided on the left of portion, the top on the left of the cabinet is provided with device receptacle.
Preferably, the output end of the power supply passes through the first conducting wire, the second conducting wire and privates and the circulation respectively
The input terminal of motor-mount pump, control panel and cooling system is electrically connected, the input terminal of the power supply by privates with it is described
The output end of device receptacle is electrically connected.
Preferably, the right end of the water inlet pipe and outlet pipe runs through the cabinet and extends to the outside of the cabinet.
Preferably, the bottom of the inner arm of the cabinet is provided with radiating subassembly, and the radiating subassembly includes heat dissipation tank, described
Through slot is offered on the left of heat dissipation tank, the inside of the through slot is fixedly installed with fan, the right side point of the heat dissipation tank and cabinet
Multiple first ventilation slots and the second ventilation slot are not offered.
Preferably, the surface of the semiconductor chilling plate group is provided with heat dissipation copper pipe, the left and right ends of the heat dissipation copper pipe
It has been respectively communicated with inlet tube and outlet tube.
Preferably, the right end of the inlet tube sequentially passes through the heat dissipation tank and the cabinet and extends to the cabinet
Outside, the left end of the outlet tube sequentially pass through the heat dissipation tank and the cabinet and the outside for extending to the cabinet.
Compared with the relevant technologies, small-sized quick semiconductor cooling device provided by the invention has following beneficial to effect
Fruit:
The present invention provides a kind of small-sized quick semiconductor cooling device, makes power supply and external power supply by device receptacle
It is connected, power supply provides electric power for circulation motor-mount pump, semiconductor chilling plate group, cooling system, and three starts simultaneously at work, wherein
Semiconductor chilling plate group and cooling system select high-power small size low noise original part to constitute, and cooling piece refrigeration work consumption can reach
To 500-1000W, perfect cooling system facilitates semiconductor chilling plate group and plays maximum refrigerating efficiency, and cooling system is then more
The more copper pipe radiators of group and mute heat dissipation fan composition, are close to semiconductor chilling plate group, can be 500W-1000W equipment into
The effective heat dissipation of row, cooling system are connected with semiconductor chilling plate group by high-efficiency heat conduction silicone grease or thermal conductivity graphene, energy
There is provided effective heat dissipation for corresponding cooling piece, this system allowed to be in maximum refrigerating efficiency, circulation motor-mount pump select it is small-sized every
Membrane pump or peristaltic pump make entire liquid fluid system stable and uniform, and semiconductor chilling plate group starts to freeze, will by circulation motor-mount pump
Flowing refrigerant or direct refrigerant are transported at semiconductor chilling plate group by water inlet pipe and connecting conduit carries out heat friendship
Change, cooling system is that whole device is effectively radiated, by this system, refrigeration can be rapidly performed by, and it is small in size, make an uproar
Sound is low more easily effectively to be used on laboratory and other places.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the first embodiment of small-sized quick semiconductor cooling device provided by the invention；
Fig. 2 is the structural schematic diagram of the second embodiment of small-sized quick semiconductor cooling device provided by the invention.
Figure label: 1, cabinet, 2, power supply, 3, circulation motor-mount pump, 4, cooling system, 5, semiconductor chilling plate group, 6, into
Water pipe, 7, connecting conduit, 8, outlet pipe, 9, control panel, 10, device receptacle, the 11, first conducting wire, the 12, second conducting wire, 13,
Three wires, 14, privates, 15, radiating subassembly, 151, heat dissipation tank, 152, through slot, 153, fan, 154, heat dissipation copper pipe, 155,
Thermally conductive item, 156, inlet tube, 157, outlet tube, the 158, first ventilation slot, the 159, second ventilation slot.
Specific embodiment
First embodiment
The invention will be further described with embodiment with reference to the accompanying drawing.
Please refer to Fig. 1, wherein Fig. 1 is the first of small-sized quick semiconductor cooling device provided by the invention
The structural schematic diagram of embodiment.Small-sized quick semiconductor cooling device, comprising: cabinet 1；
Power supply 2, the power supply 2 are set to the left side at the inner wall back side of the cabinet 1；
Motor-mount pump 3 is recycled, the circulation motor-mount pump 3 is fixedly installed in the right side at the inner wall back side of the cabinet 1, recycles horse
Microdiaphragm pump or peristaltic pump are selected up to pump 3, makes entire liquid fluid system stable and uniform；
Cooling system 4, the cooling system 4 are set to the back side of the inner wall of the cabinet 1 and are located under the power supply 2
Side；
Semiconductor chilling plate group 5, the semiconductor chilling plate group 5 are set to the back side of the inner wall of the cabinet 1 and are located at
The right side of the cooling system 4, semiconductor chilling plate group 5 and cooling system 4 select high-power small size low noise original part structure
At cooling piece refrigeration work consumption can achieve 500-1000W, and perfect cooling system 4 facilitates semiconductor chilling plate group 5 and plays most
Big refrigerating efficiency, cooling system 4 is then the more copper pipe radiators of multiple groups and mute heat dissipation fan composition, with semiconductor chilling plate group 5
It is close to, can be effectively radiated for 500W-1000W equipment, cooling system 4 is with semiconductor chilling plate group 5 by efficiently leading
Hot silicone grease or thermal conductivity graphene are connected, and can provide effective heat dissipation for corresponding cooling piece, and this system is allowed to be in maximum
Refrigerating efficiency；
Water inlet pipe 6, the water inlet pipe 6 are connected to the input terminal of the circulation motor-mount pump 3；
Connecting conduit 7, the connecting conduit 7 are connected to the output end of the circulation motor-mount pump 3；
Outlet pipe 8, the outlet pipe 8 are connected to the output end of the semiconductor chilling plate group 5.
The input terminal of the semiconductor chilling plate group 5 is connected to one end of the connecting conduit 7,1 top of cabinet
Left side is provided with control panel 9, and the top in 1 left side of cabinet is provided with device receptacle 10, the top of cabinet 1 and left side difference
Slot compatible with control panel 9 and device receptacle 10 is offered, control panel 9 and device receptacle 10 are fixedly installed in slot
Portion.
The output end of the power supply 2 passes through the first conducting wire 11, the second conducting wire 12 and privates 13 and the circulation respectively
The input terminal of motor-mount pump 3, control panel 9 and cooling system 4 is electrically connected, and the input terminal of the power supply 2 passes through privates 14
It is electrically connected with the output end of described device socket 10.
The right end of the water inlet pipe 6 and outlet pipe 8 runs through the cabinet 1 and extends to the outside of the cabinet 1.
The working principle of small-sized quick semiconductor cooling device provided by the invention is as follows:
Power supply is set to be connected with external power supply by device receptacle 10, power supply is circulation motor-mount pump 3, semiconductor chilling plate group
5, cooling system 4 provides electric power, and three starts simultaneously at work, and semiconductor chilling plate group 5 starts to freeze, by recycling motor-mount pump 3
Flowing refrigerant or direct refrigerant are transported at semiconductor chilling plate group 5 by water inlet pipe 6 and connecting conduit 7 and carry out heat
Amount exchange, cooling system 4 are that whole device is effectively radiated, and by this system, can be rapidly performed by refrigeration, volume
Small, low noise more easily can be used effectively on laboratory and other places.
Compared with the relevant technologies, small-sized quick semiconductor cooling device provided by the invention has as follows
The utility model has the advantages that
The present invention provides a kind of small-sized quick semiconductor cooling device, makes power supply and external confession by device receptacle 10
It is electrically connected and connects, power supply is to recycle motor-mount pump 3, semiconductor chilling plate group 5, cooling system 4 to provide electric power, and three starts simultaneously at work
Make, wherein semiconductor chilling plate group 5 and cooling system 4 select high-power small size low noise original part to constitute, cooling piece refrigeration
Power can achieve 500-1000W, and perfect cooling system 4 facilitates semiconductor chilling plate group 5 and plays maximum refrigerating efficiency, dissipate
Hot systems are then the more copper pipe radiators of multiple groups and mute heat dissipation fan composition, are close to semiconductor chilling plate group 5, Ke Yiwei
500W-1000W equipment is effectively radiated, and cooling system 4 by high-efficiency heat conduction silicone grease or is led with semiconductor chilling plate group 5
Hot graphene is connected, and can provide effective heat dissipation for corresponding cooling piece, and this system is allowed to be in maximum refrigerating efficiency, circulation
Motor-mount pump 3 selects microdiaphragm pump or peristaltic pump, makes entire liquid fluid system stable and uniform semiconductor, cooling piece group 5 starts to make
It is cold, refrigerant or direct refrigerant will be flowed by circulation motor-mount pump 3 and are transported to and partly lead by water inlet pipe 6 and connecting conduit 7
Heat exchange is carried out at body cooling piece group 5, cooling system 4 is that whole device is effectively radiated, can be fast by this system
Speed freeze, and small in size, low noise more easily can be used effectively on laboratory and other places.
Second embodiment
The invention will be further described with embodiment with reference to the accompanying drawing.
Fig. 2 is please referred to, Fig. 2 is the second embodiment of small-sized quick semiconductor cooling device provided by the invention
Structural schematic diagram.
The bottom of the inner arm of the cabinet 1 is provided with radiating subassembly 15, and the radiating subassembly 15 includes heat dissipation tank 151, institute
The left side for stating heat dissipation tank 151 offers through slot 152, and the inside of the through slot 152 is fixedly installed with fan 153, and fan 153 is quiet
The right side of sound radiator fan, the heat dissipation tank 151 and cabinet 1 offers multiple first ventilation slots 158 and the second ventilation slot respectively
159。
The surface of the semiconductor chilling plate group 5 is provided with heat dissipation copper pipe 154, and the cross section of heat dissipation copper pipe 154 is semicircle
Shape, and the side contacted with semiconductor chilling plate group 5 is plane, can increase the contact area with semiconductor chilling plate group 5, institute
The left and right ends for stating heat dissipation copper pipe 154 have been respectively communicated with inlet tube 156 and outlet tube 157, and inlet tube 156 and outlet tube 157 are equal
For hose.
The right end of the inlet tube 156 sequentially passes through the heat dissipation tank 151 and the cabinet 1 and extends to the cabinet 1
Outside, the left end of the outlet tube 157 sequentially passes through the heat dissipation tank 151 and the cabinet 1 and extends to the cabinet 1
It is external.
The side close to semiconductor chilling plate group 5 of cooling system in first embodiment, to dissipating for semiconductor chilling plate group 5
Hot rate is slow, and by the way that heat dissipation copper pipe 154 is arranged on the surface of semiconductor chilling plate group 5, and the cross section of heat dissipation copper pipe 154 is half
Circle, the side contacted with semiconductor chilling plate group 5 are plane, can increase the contact area with semiconductor chilling plate group 5, are dissipated
The both ends of hot copper pipe 154 have been respectively communicated with inlet tube 156 and outlet tube 157, can be water by inlet tube 156 by coolant liquid,
Being passed into heat dissipation copper pipe 154 can be exported rapidly the heat that semiconductor chilling plate group 5 generates by heat dissipation copper pipe 154, and
And water cooling is carried out by coolant liquid, after a period of time, the coolant liquid being heated can be discharged to container by outlet tube 157
In, the coolant liquid being heated can recycle, wherein it is provided with valve on outlet tube 157, while can be with by fan 153,
Heat derived from 154 surface of heat dissipation copper pipe can be imported into air rapidly, and pass through the first ventilation slot 158 and the second ventilation
Slot 159 is scattered to the outside of cabinet 1, and the bottom of semiconductor chilling plate group 5 passes through multiple thermally conductive items 155 and 151 inner wall of heat dissipation tank
Bottom be fixedly connected, multiple thermally conductive items 155 can increase the circulation of air, while can carry out thermally conductive, pass through heat dissipation copper pipe
154 cooperation water coolings and its air-cooled effect for making heat dissipation are more preferable.
The above description is only an embodiment of the present invention, is not intended to limit the scope of the invention, all to utilize this hair
Equivalent structure or equivalent flow shift made by bright specification and accompanying drawing content is applied directly or indirectly in other relevant skills
Art field, is included within the scope of the present invention.
Claims (7)
1. a kind of small-sized quick semiconductor cooling device characterized by comprising cabinet；
Power supply, the power supply are set to the left side at the inner wall back side of the cabinet；
Motor-mount pump is recycled, the circulation motor-mount pump is fixedly installed in the right side at the inner wall back side of the cabinet；
Cooling system, the cooling system are set to the back side of the inner wall of the cabinet and are located at the lower section of the power supply；
Semiconductor chilling plate group, the semiconductor chilling plate group are set to the back side of the inner wall of the cabinet and are located at the heat dissipation
The right side of system；
Water inlet pipe, the water inlet pipe are connected to the input terminal of the circulation motor-mount pump；
Connecting conduit, the connecting conduit are connected to the output end of the circulation motor-mount pump；
Outlet pipe, the outlet pipe are connected to the output end of the semiconductor chilling plate group.
2. small-sized quick semiconductor cooling device according to claim 1, which is characterized in that the semiconductor refrigerating
The input terminal of piece group is connected to one end of the connecting conduit, and control panel, the machine are provided on the left of the enclosure top
Top on the left of case is provided with device receptacle.
3. small-sized quick semiconductor cooling device according to claim 1, which is characterized in that the output of the power supply
End recycles the defeated of motor-mount pump, control panel and cooling system with described by the first conducting wire, the second conducting wire and privates respectively
Enter end to be electrically connected, the input terminal of the power supply is electrically connected by the output end of privates and described device socket.
4. small-sized quick semiconductor cooling device according to claim 1, which is characterized in that the water inlet pipe and go out
The right end of water pipe runs through the cabinet and extends to the outside of the cabinet.
5. small-sized quick semiconductor cooling device according to claim 1, which is characterized in that the inner arm of the cabinet
Bottom be provided with radiating subassembly, the radiating subassembly includes heat dissipation tank, offers through slot on the left of the heat dissipation tank, described logical
The inside of slot is fixedly installed with fan, and the right side of the heat dissipation tank and cabinet offers multiple first ventilation slots and second logical respectively
Wind groove.
6. small-sized quick semiconductor cooling device according to claim 1, which is characterized in that the semiconductor refrigerating
The surface of piece group is provided with heat dissipation copper pipe, and the left and right ends of the heat dissipation copper pipe have been respectively communicated with inlet tube and outlet tube.
7. small-sized quick semiconductor cooling device according to claim 6, which is characterized in that the right side of the inlet tube
End sequentially passes through the heat dissipation tank and the cabinet and the outside for extending to the cabinet, and the left end of the outlet tube sequentially passes through
The heat dissipation tank and the cabinet and the outside for extending to the cabinet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910379704.7A CN110094898A (en) | 2019-05-08 | 2019-05-08 | A kind of small-sized quick semiconductor cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910379704.7A CN110094898A (en) | 2019-05-08 | 2019-05-08 | A kind of small-sized quick semiconductor cooling device |
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| Publication Number | Publication Date |
|---|---|
| CN110094898A true CN110094898A (en) | 2019-08-06 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910379704.7A Pending CN110094898A (en) | 2019-05-08 | 2019-05-08 | A kind of small-sized quick semiconductor cooling device |
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| CN205641667U (en) * | 2016-04-18 | 2016-10-12 | 东莞市迅阳实业有限公司 | Semiconductor condenser |
| CN205686617U (en) * | 2016-06-25 | 2016-11-16 | 漯河职业技术学院 | A kind of novel unmanned plane heat abstractor |
| CN205847064U (en) * | 2016-07-05 | 2016-12-28 | 天津九天电气有限公司 | A kind of new and effective current transformer chiller |
| CN206363240U (en) * | 2016-07-13 | 2017-07-28 | 王宇博 | A kind of notebook computer water circulation radiator |
| CN207677037U (en) * | 2017-12-22 | 2018-07-31 | 云南聚诚科技有限公司 | A kind of high-power lithium battery pack heat dissipation device |
| CN210197772U (en) * | 2019-05-08 | 2020-03-27 | 洪诗婷 | Miniature quick semiconductor refrigerating plant |
-
2019
- 2019-05-08 CN CN201910379704.7A patent/CN110094898A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205641667U (en) * | 2016-04-18 | 2016-10-12 | 东莞市迅阳实业有限公司 | Semiconductor condenser |
| CN205686617U (en) * | 2016-06-25 | 2016-11-16 | 漯河职业技术学院 | A kind of novel unmanned plane heat abstractor |
| CN205847064U (en) * | 2016-07-05 | 2016-12-28 | 天津九天电气有限公司 | A kind of new and effective current transformer chiller |
| CN206363240U (en) * | 2016-07-13 | 2017-07-28 | 王宇博 | A kind of notebook computer water circulation radiator |
| CN207677037U (en) * | 2017-12-22 | 2018-07-31 | 云南聚诚科技有限公司 | A kind of high-power lithium battery pack heat dissipation device |
| CN210197772U (en) * | 2019-05-08 | 2020-03-27 | 洪诗婷 | Miniature quick semiconductor refrigerating plant |
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