CN102338502A - Cold and hot fluid supply mechanism - Google Patents
Cold and hot fluid supply mechanism Download PDFInfo
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- CN102338502A CN102338502A CN2010102397120A CN201010239712A CN102338502A CN 102338502 A CN102338502 A CN 102338502A CN 2010102397120 A CN2010102397120 A CN 2010102397120A CN 201010239712 A CN201010239712 A CN 201010239712A CN 102338502 A CN102338502 A CN 102338502A
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Abstract
The invention discloses a cold and hot fluid supply mechanism, which has a plurality of semiconductor cold and hot sheets, wherein the plurality of semiconductor cold and hot sheets are energized by direct currents and fixed between a first insulating heat-conducting base and a second insulating heat-conducting base; a first heat guide pipe and a second heat guide pipe are respectively fixed on the first insulating heat-conducting base and the second insulating heat-conducting base and tightly contacted with the first insulating heat-conducting base and the second insulating heat-conducting base; one end of the first heat guide pipe is a first fluid inlet, and the other end of the first heat guide pipe is a hot fluid outlet; one end of the second heat guide pipe is a second fluid inlet, and the other end of the second heat guide pipe is a cold fluid outlet; after one of the semiconductor cold and hot sheets is energized by a direct current power supply, a cold source and a hot source can be immediately generated on two faces of the semiconductor cold and hot sheet; the hot source and the cold source are respectively transferred to the first heat guide pipe and the second heat guide pipe through the first insulating heat-conducting base and the second insulating heat-conducting base to make the first heat guide pipe generate a hot fluid and make the second heat guide pipe generate a cold fluid; and the cold fluid and the hot fluid are respectively output through the cold fluid outlet and the hot fluid outlet and used for cooling or heating a target body.
Description
Technical field
The present invention relates to a kind of device that possesses refrigeration simultaneously and heat effect, specifically a kind of mechanism that cold and hot fluid is provided for the container that relies on fluid to cool off or heat.
Background technology
Concerning mould for plastics and other rely on fluid to cool off and the container that heat, all need heat and feed cold fluid at different stage feeding hot fluids and cool off with the form of heat exchange.Therefore be necessary to needs rely on fluid come the container of heating and cooling provide a kind of safe and reliable, energy consumption is low and free of contamination cold fluid and hot fluid supply equipment.
The semiconductor cold-hot sheet also is thermoelectric module; Utilize the Peltier effect (paltie effect) of semi-conducting material, when galvanic couple that direct current is connected into through two kinds of different semi-conducting materials, can absorb heat at the two ends of galvanic couple respectively and emit heat; Can realize the purpose that the end refrigeration and the other end heat; Be characterized in movement-less part, reliability is also than higher, and no cold-producing medium pollutes.
Summary of the invention
In order to address the above problem; The invention provides a kind of cold fluid and hot fluid organization of supply; This cold fluid and hot fluid organization of supply can rely on fluid to cool off and the container that heats provides cold and hot fluid to mould for plastics and other, and volume is little, energy consumption is low, safety non-pollution.
The present invention for the technical scheme that solves its technical problem and adopt is:
A kind of cold fluid and hot fluid organization of supply; Has cold and hot of several semiconductor; Cold and hot of several semiconductor connects direct current; Cold and hot of several semiconductor is fixed between first and second insulating heat-conductive pedestal, is fixed with first and second heat pipe respectively on said first and second insulating heat-conductive pedestal, and first and second heat pipe closely contacts with first and second insulating heat-conductive pedestal respectively; Said first heat pipe, one end is that the first fluid import and the other end are the hot fluid outlet, and said second heat pipe, one end is that second fluid inlet and the other end are the cold fluid outlet.After the semiconductor cold-hot sheet is connected dc source; Can produce low-temperature receiver and thermal source separately on its two sides at once, thermal source and low-temperature receiver are passed to first and second heat pipe through first and second insulating heat-conductive pedestal respectively, make the fluid that is in environment temperature that gets into first and second heat pipe produce variations in temperature; Make the fluid temperature (F.T.) that gets into first heat pipe raise; Promptly produce hot fluid, and get into the fluid temperature (F.T.) reduction of second heat pipe, promptly produce cold fluid; Cold fluid and hot fluid are exported through cold fluid outlet and hot fluid outlet respectively, and are used for cooling or heating objective body.
Further technical scheme of the present invention is:
Be provided with first and second heat-insulating shield that is used for heat-insulation and heat-preservation, said first heat pipe is positioned between said first heat-insulating shield and the said first insulating heat-conductive pedestal, and said second heat pipe is positioned between said second heat-insulating shield and the said second insulating heat-conductive pedestal.First and second heat-insulating shield is used to lower external environment condition convection cell Influence of Temperature.
Said first and second heat pipe is all copper pipe.
Said first and second heat pipe all is the bending that crawls.First and second heat pipe is designed to the intensive bending that crawls can improve pipe range on unit are, promptly improved heat exchange area, can improve heat exchanger effectiveness.
Offer the groove that is complementary with first and second heat pipe respectively on said first and second insulating heat-conductive pedestal, said first and second heat pipe is stuck in respectively in the groove on first and second insulating heat-conductive pedestal.Can not only play positioning action like this to first and second heat pipe, can also increase first and second heat pipe respectively with the contact area of first and second insulating heat-conductive pedestal, improve pyroconductivity.
The invention has the beneficial effects as follows: cold fluid and hot fluid organization of supply of the present invention has utilized the paltie effect of semi-conducting material and has designed; The semiconductor cold-hot sheet can produce low-temperature receiver and thermal source on its two sides after connecting dc source at once separately, and thermal source and low-temperature receiver are passed to first and second heat pipe through first and second insulating heat-conductive pedestal respectively; Make the fluid that is in environment temperature that gets into first and second heat pipe produce variations in temperature; Make the fluid temperature (F.T.) that gets into first heat pipe raise, promptly produce hot fluid, and get into the fluid temperature (F.T.) reduction of second heat pipe; Promptly produce cold fluid; Cold fluid and hot fluid are exported through cold fluid outlet and hot fluid outlet respectively, and are used for cooling or heating objective body, and cold fluid and hot fluid organization of supply collection supply cold fluid therefore of the present invention and supply hot fluid are one; Can rely on fluid to cool off and the container that heats provides cold fluid and hot fluid to mould for plastics and other, and volume be little, energy consumption is low, safety non-pollution.
Description of drawings
Fig. 1 is a decomposition texture sketch map of the present invention;
Fig. 2 is an overall structure sketch map of the present invention.
The specific embodiment
Embodiment: a kind of cold fluid and hot fluid organization of supply; Has several semiconductor cold and hot 1; Cold and hot of several semiconductor connects direct current; Cold and hot of several semiconductor is fixed in 2,3 of first and second insulating heat-conductive pedestals, be fixed with first and second heat pipe 4,5 on said first and second insulating heat-conductive pedestal respectively, and first and second heat pipe contacts closely with first and second insulating heat-conductive pedestal respectively; Said first heat pipe, 4 one ends are that the first fluid import 41 and the other end are hot fluid outlet 42, and said second heat pipe, 5 one ends are that second fluid inlet 51 and the other end are cold fluid outlet 52.After the semiconductor cold-hot sheet is connected dc source; Can produce low-temperature receiver and thermal source separately on its two sides at once, thermal source and low-temperature receiver are passed to first and second heat pipe through first and second insulating heat-conductive pedestal respectively, make the fluid that is in environment temperature that gets into first and second heat pipe produce variations in temperature; Make the fluid temperature (F.T.) that gets into first heat pipe raise; Promptly produce hot fluid, and get into the fluid temperature (F.T.) reduction of second heat pipe, promptly produce cold fluid; Cold fluid and hot fluid are exported through cold fluid outlet and hot fluid outlet respectively, and are used for cooling or heating objective body.
Be provided with first and second heat-insulating shield 6,7 that is used for heat-insulation and heat-preservation, said first heat pipe 4 is positioned at 2 of said first heat-insulating shield 6 and the said first insulating heat-conductive pedestals, and said second heat pipe 5 is positioned at 3 of said second heat-insulating shield 7 and the said second insulating heat-conductive pedestals.First and second heat-insulating shield is used to lower external environment condition convection cell Influence of Temperature.
Said first and second heat pipe 4,5 is all copper pipe.
Said first and second heat pipe 4,5 all is the bending that crawls.First and second heat pipe is designed to the intensive bending that crawls can improve pipe range on unit are, promptly improved heat exchange area, can improve heat exchanger effectiveness.
Offer the groove that is complementary with first and second heat pipe respectively on said first and second insulating heat-conductive pedestal, said first and second heat pipe is stuck in respectively in the groove on first and second insulating heat-conductive pedestal.Can not only play positioning action like this to first and second heat pipe, can also increase first and second heat pipe respectively with the contact area of first and second insulating heat-conductive pedestal, improve pyroconductivity.
Use of the present invention is following:
After the semiconductor cold-hot sheet is connected dc source; Can produce low-temperature receiver and thermal source separately on its two sides at once, thermal source and low-temperature receiver are passed to first and second heat pipe through first and second insulating heat-conductive pedestal respectively, make the fluid that is in environment temperature that gets into first and second heat pipe produce variations in temperature; Make the fluid temperature (F.T.) that gets into first heat pipe raise; Promptly produce hot fluid, and get into the fluid temperature (F.T.) reduction of second heat pipe, promptly produce cold fluid; Cold fluid and hot fluid are exported through cold fluid outlet and hot fluid outlet respectively, and are used for cooling or heating objective body.
Claims (5)
1. cold fluid and hot fluid organization of supply; It is characterized in that: have cold and hot of several semiconductor (1); Cold and hot of several semiconductor connects direct current; Cold and hot of several semiconductor is fixed between first and second insulating heat-conductive pedestal (2,3), is fixed with first and second heat pipe (4,5) on said first and second insulating heat-conductive pedestal respectively, and first and second heat pipe closely contacts with first and second insulating heat-conductive pedestal respectively; Said first heat pipe (4) one ends are that the first fluid import (41) and the other end are hot fluid outlet (42), and said second heat pipe (5) one ends are that second fluid inlet (51) and the other end are cold fluid outlet (52).
2. cold fluid and hot fluid organization of supply according to claim 1; It is characterized in that: be provided with first and second heat-insulating shield (6,7) that is used for heat-insulation and heat-preservation; Said first heat pipe (4) is positioned between said first heat-insulating shield (6) and the said first insulating heat-conductive pedestal (2), and said second heat pipe (5) is positioned between said second heat-insulating shield (7) and the said second insulating heat-conductive pedestal (3).
3. cold fluid and hot fluid organization of supply according to claim 1 is characterized in that: said first and second heat pipe (4,5) is all copper pipe.
4. cold fluid and hot fluid organization of supply according to claim 1 is characterized in that: said first and second heat pipe (4,5) all is the bending that crawls.
5. cold fluid and hot fluid organization of supply according to claim 4; It is characterized in that: offer the groove that is complementary with first and second heat pipe respectively on said first and second insulating heat-conductive pedestal, said first and second heat pipe is stuck in respectively in the groove on first and second insulating heat-conductive pedestal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102397120A CN102338502A (en) | 2010-07-28 | 2010-07-28 | Cold and hot fluid supply mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102397120A CN102338502A (en) | 2010-07-28 | 2010-07-28 | Cold and hot fluid supply mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102338502A true CN102338502A (en) | 2012-02-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010102397120A Pending CN102338502A (en) | 2010-07-28 | 2010-07-28 | Cold and hot fluid supply mechanism |
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| CN (1) | CN102338502A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105109028A (en) * | 2015-09-01 | 2015-12-02 | 河北科技师范学院 | One-way heat transfer laminated electric heater for hot press |
| CN108802034A (en) * | 2016-08-10 | 2018-11-13 | 李忠 | The working method of micro-fluid experiment device based on remote data acquisition |
| CN110849027A (en) * | 2019-11-08 | 2020-02-28 | 江苏科技大学 | Thermoelectric cooling device combining flexible flat heat pipe and flowing working medium in pipe |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5899077A (en) * | 1997-12-02 | 1999-05-04 | Solid State Cooling Systems, Inc. | Thermoelectric cooling/heating system for high purity or corrosive liquids |
| CN2681057Y (en) * | 2003-12-10 | 2005-02-23 | 来学恩 | Heat pipe radiating micro electronic refrigerator |
| CN201015121Y (en) * | 2007-02-05 | 2008-01-30 | 黄龙 | Water-cooling heat radiator of semiconductor refrigeration system |
| CN201152650Y (en) * | 2007-12-18 | 2008-11-19 | 华南理工大学 | Cold-hot transformation apparatus having solid multi-lattice |
| CN201724467U (en) * | 2010-07-28 | 2011-01-26 | 日进教学器材(昆山)有限公司 | Cold-heat fluid supply mechanism |
-
2010
- 2010-07-28 CN CN2010102397120A patent/CN102338502A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5899077A (en) * | 1997-12-02 | 1999-05-04 | Solid State Cooling Systems, Inc. | Thermoelectric cooling/heating system for high purity or corrosive liquids |
| CN2681057Y (en) * | 2003-12-10 | 2005-02-23 | 来学恩 | Heat pipe radiating micro electronic refrigerator |
| CN201015121Y (en) * | 2007-02-05 | 2008-01-30 | 黄龙 | Water-cooling heat radiator of semiconductor refrigeration system |
| CN201152650Y (en) * | 2007-12-18 | 2008-11-19 | 华南理工大学 | Cold-hot transformation apparatus having solid multi-lattice |
| CN201724467U (en) * | 2010-07-28 | 2011-01-26 | 日进教学器材(昆山)有限公司 | Cold-heat fluid supply mechanism |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105109028A (en) * | 2015-09-01 | 2015-12-02 | 河北科技师范学院 | One-way heat transfer laminated electric heater for hot press |
| CN108802034A (en) * | 2016-08-10 | 2018-11-13 | 李忠 | The working method of micro-fluid experiment device based on remote data acquisition |
| CN108802034B (en) * | 2016-08-10 | 2021-08-10 | 李忠 | Working method of micro-fluid experimental device based on remote data acquisition |
| CN110849027A (en) * | 2019-11-08 | 2020-02-28 | 江苏科技大学 | Thermoelectric cooling device combining flexible flat heat pipe and flowing working medium in pipe |
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Application publication date: 20120201 |