CN110085556A - A kind of pressure core using boss structure sintering pedestal - Google Patents
A kind of pressure core using boss structure sintering pedestal Download PDFInfo
- Publication number
- CN110085556A CN110085556A CN201810099309.9A CN201810099309A CN110085556A CN 110085556 A CN110085556 A CN 110085556A CN 201810099309 A CN201810099309 A CN 201810099309A CN 110085556 A CN110085556 A CN 110085556A
- Authority
- CN
- China
- Prior art keywords
- chip
- pedestal
- boss
- sintering
- sintering pedestal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
The invention discloses a kind of pressure cores using boss structure sintering pedestal, belong to sensitive components technical field.The present invention includes chip, is sintered pedestal, pressure ring, diaphragm, ceramic blanket, O-ring, glass insulator, the sintering pedestal is equipped with oil-filled hole, filling oil can be poured into the cavity of core by oil-filled hole, the pressure ring, and diaphragm is by being welded to connect on sintering pedestal, the sintering pedestal has boss structure, and the base area difference of the boss base area and the chip is in ± 8mm2Interior, the chip is fixed on boss by way of viscose glue.Relative to the pressure core using ordinary sinter pedestal, 1. the present invention, which solves the below technical problem that, to be fixed on chip on sintering pedestal by way of viscose glue, is avoided extra glue from spilling into chip surrounding, is improved chip performance；2. making chip uniform force, sensor output accuracy is improved.
Description
Technical field
The present invention relates to sensitive components technical field, specially a kind of pressure core using boss structure sintering pedestal
Body.
Background technique
In encapsulation process, core component pressure chip is mainly fixed on by way of viscose glue existing pressure core
It is sintered on pedestal, in actual operation, since gluing is excessive, extra glue spills into chip surrounding, influences the property of pressure chip
Energy.For this problem, my company develops a kind of sintering pedestal of boss structure.
Summary of the invention
For disadvantages mentioned above existing in the prior art, the present invention is directed to propose a kind of be sintered pedestal using boss structure
Pressure core is designing one cylindrical body/cuboid boss, cylindrical body/cuboid boss in sintering pedestal central location
Base area is close with the base area of chip.Chip is fixed on cylindrical body/cuboid boss by viscose glue mode, even if going out
Existing extra glue does not overflow chip surrounding, effective protection chip, while the structure and makes chip receiving pressure uniform, mentions
The output accuracy of high core.
To achieve the goals above, present invention employs following technical solutions:
A kind of pressure core using boss structure sintering pedestal, including chip, are sintered pedestal, pressure ring, diaphragm, ceramics
Pad, O-ring, glass insulator, the sintering pedestal are equipped with oil-filled hole, and filling oil can pour into the cavity of core by oil-filled hole
Interior, the pressure ring, for diaphragm by being welded to connect on sintering pedestal, the sintering pedestal has boss structure, the boss bottom
The base area difference of face area and the chip is in ± 8mm2Interior, the chip passes through in chip glue fixing lug boss.
Preferably, the boss is located at sintering pedestal center.
Preferably, the boss is cylindrical body.
Preferably, the bottom surface circular diameter of the cylindrical body is 0.8mm-4.0mm, the cylinder height is 0.1mm-
0.5mm。
Preferably, the boss is rectangular cube.
Preferably, the bottom surface that the cuboid is contacted with chip is preferably square, square side length is preferably
0.5mm-4.0mm, the highly preferred cuboid is 0.1mm-0.5mm.
Preferably, the chip glue is flexible glue or ebonite.
Compared with prior art, the beneficial effects of the present invention are: 1. chip by viscose glue mode is fixed on sintering pedestal
On boss, even if there is extra glue, chip surrounding, effective protection chip are not overflowed.2. the sintering with boss structure
Pedestal makes chip receiving pressure more uniform, improves the output accuracy of core.
Detailed description of the invention
Fig. 1 is that the present invention proposes a kind of structural schematic diagram that bed pressure core is sintered using boss structure.
Fig. 2 is the partial enlarged view of boss (boss base area is greater than die bottom surface area).
Fig. 3 is the partial enlarged view of boss (boss base area is less than die bottom surface area).
In figure: 1- chip, 2- are sintered pedestal, 3- pressure ring, 4- diaphragm, 5- ceramic blanket, 6-O type circle, 7- glass insulator, 8-
Oil-filled hole, 9- fill oil, 10- boss, 11- chip glue.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.
Referring to Fig.1, a kind of pressure core using boss structure sintering pedestal, including chip (1), are sintered pedestal (2), pressure
Ring (3), diaphragm (4), ceramic blanket (5), O-ring (6), glass insulator (7), the sintering pedestal (2) are equipped with oil-filled hole
(8), filling oily (9) can be poured into the cavity of core by oil-filled hole (8), and the pressure ring (3), diaphragm (4) passes through welded connecting
In sintering pedestal (2), the sintering pedestal (2) has boss (10) structure, boss (10) base area and the core
The base area difference of piece (1) is in ± 8mm2It is interior, it is located at sintering pedestal (2) center, the chip (1) is solid by chip glue (11)
It is scheduled on boss (10), the chip glue (11) is flexible glue or ebonite.
The boss (10) is preferably cylindrical body, and the bottom surface circular diameter of the cylindrical body is preferably 0.8mm-4.0mm, described
Cylinder height is preferably 0.1mm-0.5mm.
The boss (10) is preferably cuboid, and the bottom surface that the cuboid is contacted with chip is preferably square, square
The side length of shape is preferably 0.5mm-4.0mm, and the highly preferred square is 0.1mm-0.5mm.
The foregoing is only a preferred embodiment of the present invention, but scope of protection of the present invention is not limited thereto,
Anyone skilled in the art in the technical scope disclosed by the present invention, according to the technique and scheme of the present invention and its
Inventive concept is subject to equivalent substitution or change, should be covered by the protection scope of the present invention.
Claims (7)
1. a kind of pressure core using boss structure sintering pedestal, including chip (1), are sintered pedestal (2), pressure ring (3), diaphragm
(4), ceramic blanket (5), O-ring (6), glass insulator (7), the sintering pedestal (2) are equipped with oil-filled hole (8), fill oily (9)
It can be poured into the cavity of core by oil-filled hole (8), the pressure ring (3), diaphragm (4) is by being welded to connect in sintering pedestal (2)
On, it is characterised in that: the sintering pedestal (2) has boss (10) structure, boss (10) base area and the chip
(1) base area difference is in -8mm2~+8mm2Interior, the chip (1) is fixed on boss (10) by chip glue (11).
2. the pressure core according to claim 1 using boss structure sintering pedestal, which is characterized in that the boss
(10) it is located at sintering pedestal (2) center.
3. the pressure core according to claim 1 using boss structure sintering pedestal, which is characterized in that the boss
It (10) is preferably cylindrical body.
4. the pressure core according to claim 3 using boss structure sintering pedestal, which is characterized in that the cylindrical body
Bottom surface circular diameter be preferably 0.8mm-4.0mm, the cylinder height is preferably 0.1mm-0.5mm.
5. the pressure core according to claim 1 using boss structure sintering pedestal, which is characterized in that the boss
It (10) is preferably cuboid.
6. the pressure core according to claim 5 using boss structure sintering pedestal, which is characterized in that the cuboid
The bottom surface contacted with chip is preferably square, and square side length is preferably 0.5mm-4.0mm, and the cuboid is highly preferred to be
0.1mm-0.5mm。
7. the pressure core according to claim 1 using boss structure sintering pedestal, which is characterized in that the chip glue
It (11) is flexible glue or ebonite.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810099309.9A CN110085556A (en) | 2018-01-26 | 2018-01-26 | A kind of pressure core using boss structure sintering pedestal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810099309.9A CN110085556A (en) | 2018-01-26 | 2018-01-26 | A kind of pressure core using boss structure sintering pedestal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110085556A true CN110085556A (en) | 2019-08-02 |
Family
ID=67412711
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810099309.9A Pending CN110085556A (en) | 2018-01-26 | 2018-01-26 | A kind of pressure core using boss structure sintering pedestal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110085556A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113579085A (en) * | 2021-07-16 | 2021-11-02 | 杭州科岛微电子有限公司 | Manufacturing method of oil-filled core packaging structure of diffused silicon pressure sensor |
-
2018
- 2018-01-26 CN CN201810099309.9A patent/CN110085556A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113579085A (en) * | 2021-07-16 | 2021-11-02 | 杭州科岛微电子有限公司 | Manufacturing method of oil-filled core packaging structure of diffused silicon pressure sensor |
| CN113579085B (en) * | 2021-07-16 | 2023-03-31 | 杭州科岛微电子有限公司 | Manufacturing method of oil-filled core packaging structure of diffused silicon pressure sensor |
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| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |