CN112834084A - Ceramic capacitive pressure sensor core and manufacturing method thereof - Google Patents
Ceramic capacitive pressure sensor core and manufacturing method thereof Download PDFInfo
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- CN112834084A CN112834084A CN202011586941.XA CN202011586941A CN112834084A CN 112834084 A CN112834084 A CN 112834084A CN 202011586941 A CN202011586941 A CN 202011586941A CN 112834084 A CN112834084 A CN 112834084A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/14—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
- G01L1/142—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators using capacitors
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/12—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in capacitance, i.e. electric circuits therefor
Abstract
The invention discloses a ceramic capacitance type pressure sensor core body, which comprises: the circuit board comprises a first substrate, a second substrate, a first electrode, a second electrode, a barrier, a first lead hole, a second lead hole and a third lead hole, wherein the first electrode is printed on the front surface of the first substrate, the second electrode is printed on the front surface of the second substrate, the front surface of the first substrate and the front surface of the second substrate are oppositely arranged, the barrier is arranged between the front surfaces of the first substrate and the second substrate, one side of the barrier is fixedly connected with the first electrode, and the other side of the barrier is fixedly connected with the second substrate; the second base plate is provided with a first lead hole, a second lead hole and a third lead hole in a penetrating mode, the bottom end of the first lead hole is the isolation pier, and the bottom ends of the second lead hole and the third lead hole are the second electrode. The invention has the characteristics of simple structure, convenient and efficient production, high reliability, strong sensor medium compatibility and the like.
Description
Technical Field
The invention belongs to the field of pressure sensors, and particularly relates to a ceramic capacitive pressure sensor core and a manufacturing method thereof.
Background
At present, the core body of the ceramic capacitive pressure sensor is usually designed in a circular manner, electrodes are arranged on two opposite surfaces of two thick and thin ceramic substrates, and a distance between the electrodes is controlled by using a separation pier and the like as a spacer to form a capacitor with a specified initial capacitance value. When the thin ceramic substrate is subjected to external pressure, the thin substrate is deformed, so that the capacitance value is increased, and the external pressure born by the substrate can be detected according to the change value of the capacitance.
The basic process of the ceramic capacitive pressure sensor core body comprises the following steps: laser cutting a thin substrate, dry pressing and forming the thick substrate, arranging electrodes on the thin substrate and the thick substrate, sintering the electrodes (electrode patterns set by a printing process), arranging isolation piers, integrating the thin substrate and the thick substrate into a whole by pressing and sintering, dispensing silver paste, leading out internal electrodes from upper leads, and curing. The ceramic capacitive pressure sensor core manufactured by the process has low production efficiency, the reliability of the lead-in mode on the point silver colloid is low, and the compatibility of the pressure sensor medium manufactured by the ceramic capacitive pressure sensor core is poor.
Disclosure of Invention
Aiming at the problems, the invention provides the ceramic capacitive pressure sensor core and the manufacturing method thereof, which are convenient for high-efficiency production and simplify the manufacturing process flow; meanwhile, the sensor has the characteristics of high reliability, strong sensor medium compatibility and the like.
In order to achieve the purpose, the invention adopts the technical scheme that:
a ceramic capacitive pressure sensor core, comprising: the circuit board comprises a first substrate, a second substrate, a first electrode, a second electrode, a barrier, a first lead hole, a second lead hole and a third lead hole, wherein the first electrode is printed on the front surface of the first substrate, the second electrode is printed on the front surface of the second substrate, the front surface of the first substrate and the front surface of the second substrate are oppositely arranged, the barrier is arranged between the front surfaces of the first substrate and the second substrate, one side of the barrier is fixedly connected with the first electrode, and the other side of the barrier is fixedly connected with the second substrate; run through on the second base plate and be equipped with first pin hole, second pin hole and third pin hole, first pin hole bottom does the hard shoulder, second pin hole and third pin hole bottom do the second electrode, first pin hole, second pin hole and third pin hole intussuseption are filled with conductive metal.
Preferably, the first substrate is a circular sheet structure, the first electrode printing covers the front surface of the first substrate, and the thickness of the first electrode is 5-8 um.
Preferably, the second substrate is a circular sheet structure, the thickness of the second substrate is greater than that of the first substrate, the second electrode includes a main electrode and a reference electrode, the main electrode is connected to the second lead hole, and the reference electrode is connected to the third lead hole.
More preferably, the main electrode is a circular metal electrode, the reference electrode is an annular metal electrode, and the printing thickness of the main electrode and the reference electrode is 5-8 um.
More preferably, the second and third lead holes are provided with recessed cups on the electrode printing surface of the second substrate, respectively.
More preferably, the hard shoulder is printed at the edge of the first electrode with a thickness of 30-50 um.
A manufacturing method of a ceramic capacitive pressure sensor core body is characterized by comprising the following steps:
s1: cutting the aluminum oxide or zirconium oxide thin substrate which is subjected to tape casting molding and sintering into wafers serving as a first substrate;
s2: manufacturing a metal electrode of the first substrate as a first electrode by a printing mode;
s3: manufacturing a second substrate in a dry pressing forming mode, and arranging a first lead hole, a second lead hole and a third lead hole on the second substrate;
s4: manufacturing a main electrode and a reference electrode of the second substrate in a printing mode;
s5: the first lead hole, the second lead hole and the third lead hole are filled with LTCC (low temperature co-fired ceramic) sintered non-shrinkage filling silver paste, and after filling, concave cups are respectively arranged on the electrode printing surface of the second substrate for the second lead hole and the third lead hole, so that the silver paste is prevented from being connected with the first electrode;
s6: carrying out electrode sintering on the printed first electrode, the printed second electrode, the first lead hole, the printed second lead hole and the printed third lead hole lead-out electrode in a tunnel sintering furnace;
s7: manufacturing a barrier pier slurry, and printing the barrier pier slurry on the edge of the first electrode;
s8: discharging the glue of the first substrate printed with the isolation pier slurry by using a tunnel sintering furnace;
s9: the first substrate fired in step S8 and the second substrate fired in step S6 were placed in a tunnel furnace and pressure-fired into the entire ceramic capacitive pressure sensor core.
Preferably, in the step S7, the step of making the pier slurry comprises:
s71: by weight, obtaining 20-40 parts of flake silver powder, 20-40 parts of spherical silver powder, 5-15 parts of low-temperature glass powder, 5-10 parts of polyvinyl acetal, 0.5-1.5 parts of flatting agent, 0.5-1.5 parts of coupling agent and 5-10 parts of solvent;
s72: and rolling the materials by a three-roll mill, and filtering by a 200-mesh filter screen and a 400-mesh filter screen to prepare the pier slurry.
Preferably, the printing thickness of the first electrode, the main electrode and the reference electrode is 5-8um, and the printing thickness of the hard shoulder paste is 30-50 um.
Preferably, in the step S5, the sintering temperature of the LTCC sintering shrinkage-free pore-filling silver paste is 800-; in the step S6, the sintering temperature of the tunnel sintering furnace is 800-; in the step S8, the glue discharging temperature is 300-400 ℃, and the heat preservation time is 30-60 minutes; in the step S9, the pressure sintering temperature is 550-610 ℃, and the heat preservation time is 10-30 minutes.
Compared with the prior art, the invention has the beneficial effects that:
compared with the traditional ceramic capacitive pressure sensor, the ceramic capacitive pressure sensor core disclosed by the invention has the advantages that the traditional printing process or sputtering process is adopted for manufacturing a bonding pad and an electrode pattern which are slightly larger than a conductive hole by a first substrate electrode, the printing process or sputtering process is also adopted for manufacturing two bonding pads and electrode patterns which are slightly larger than the conductive hole by a second substrate electrode, after accurate positioning is needed, sealing glass slurry is used for bonding the two bonding pads and the electrode patterns into a whole, silver colloid is dotted into the conductive hole, and pins are inserted and cured to form the ceramic pressure sensor core. The production efficiency of the process flow is low, and the reliability of the lead wire mode on the point silver paste is low. The ceramic capacitive pressure sensor core body is simple in structure, convenient for efficient production and simplified in manufacturing process flow; meanwhile, the sensor has the characteristics of high reliability, strong sensor medium compatibility and the like.
Drawings
Fig. 1 is a schematic structural diagram of a core of a ceramic capacitive pressure sensor according to the present invention.
Fig. 2 is a schematic front view of a first substrate according to the present invention.
Fig. 3 is a schematic front view of a second substrate according to the present invention.
Fig. 4 is a side cross-sectional view of a second substrate according to the present invention.
Fig. 5 is a schematic view of the printing front of the hard shoulder according to the invention.
The manufacturing method comprises the following steps of 1, a first substrate; 2. a second substrate; 3. a first electrode; 4. a second electrode, 41, a main electrode, 42, a reference electrode; 5. a hard shoulder; 6. a first lead hole; 7. a second lead hole; 8. a third lead hole; 9. a concave cup.
Detailed Description
For a better understanding of the present invention, the contents of the present invention will be further explained below with reference to the drawings and examples, but the present invention is not limited to the following examples.
Example one
A manufacturing method of a ceramic capacitive pressure sensor core body comprises the following steps:
s1: cutting the aluminum oxide or zirconium oxide thin substrate subjected to tape casting molding and sintering into a wafer as a first substrate 1, wherein a laser cutting mode can be adopted;
s2: manufacturing a metal electrode of the first substrate 1 as a first electrode 3 by a printing mode, wherein the printing thickness of the first electrode 3 is 5 um;
s3: manufacturing a second substrate 2 by adopting a dry pressing forming mode, and arranging a first lead hole 6, a second lead hole 7 and a third lead hole 8 on the second substrate 2;
s4: manufacturing a main electrode 41 and a reference electrode 42 of the second substrate 2 by a printing mode, and printing the thickness of 5 um;
s5: the first lead hole 6, the second lead hole 7 and the third lead hole 8 are filled with LTCC (low temperature co-fired ceramic) sintered non-shrinkage filling silver paste, after filling, the second lead hole 7 and the third lead hole 8 are respectively provided with concave cups 9 on the electrode printing surface of the second substrate 2, so that the connection between the silver paste and the first electrode 3 is avoided, and the leading-out electrode connected with the first substrate 1 through the first lead hole 6 after filling does not need to be processed; sintering the LTCC shrinkage-free pore filling silver paste at the sintering temperature of 800 ℃, and preserving heat for 15 minutes;
s6: the printed first electrode 3, the printed second electrode 4, the printed first lead hole 6, the printed second lead hole 7 and the printed third lead hole 8 are led out of the electrodes and sintered in a tunnel sintering furnace, the sintering temperature is 800 ℃, and the temperature is kept for 15 minutes;
s7: manufacturing a barrier pier 5 slurry, and printing the barrier pier 5 slurry with the thickness of 30 mu m on the edge of the first electrode 3;
s8: removing glue from the first substrate 1 printed with the isolation pier 5 by using a tunnel sintering furnace, wherein the glue removing temperature is 300 ℃, and the heat preservation time is 60 minutes;
s9: and (3) putting the first substrate 1 sintered in the step (S8) and the second substrate 2 sintered in the step (S6) into a tunnel furnace, and pressing and sintering the substrates into the whole ceramic capacitor type pressure sensor core body, wherein the pressing and sintering temperature is 610 ℃, and the heat preservation time is 30 minutes.
In step S7, the step of producing the pier 5 slurry includes:
s71: in this example, 20 parts by weight of flake silver powder, 20 parts by weight of spherical silver powder, 5 parts by weight of low-temperature glass powder, 5 parts by weight of polyvinyl acetal, 0.5 part by weight of a leveling agent, 0.5 part by weight of a coupling agent, and 5 parts by weight of a solvent are obtained, wherein the leveling agent is ethylene glycol monomethyl ether, the coupling agent is a silane coupling agent KH550, and the solvent is terpineol.
S72: and rolling the materials by a three-roll mill, and filtering by a 200-mesh and 400-mesh filter screen to prepare the slurry of the hard shoulder 5.
With reference to fig. 1 to 5, the ceramic capacitive pressure sensor core manufactured by the method includes: the device comprises a first substrate 1, a second substrate 2, a first electrode 3, a second electrode 4, a barrier pillar 5, a first lead hole 6, a second lead hole 7 and a third lead hole 8, wherein the first electrode 3 is printed on the front surface of the first substrate 1, the second electrode 4 is printed on the front surface of the second substrate 2, the front surface of the first substrate 1 and the front surface of the second substrate 2 are oppositely arranged, the barrier pillar 5 is arranged between the front surfaces of the first substrate 1 and the second substrate 2, one side of the barrier pillar 5 is fixedly connected with the first electrode 3, and the other side of the barrier pillar is fixedly connected with the second substrate 2; the second substrate 2 is provided with a first lead hole 6, a second lead hole 7 and a third lead hole 8 in a penetrating manner, the bottom end of the first lead hole 6 is provided with a barrier 5, the bottom ends of the second lead hole 7 and the third lead hole 8 are provided with a second electrode 4, and the first lead hole 6, the second lead hole 7 and the third lead hole 8 are filled with conductive metal, such as silver.
In this embodiment, the first substrate 1 is a circular sheet structure, the first electrode 3 is printed to cover the front surface of the first substrate 1, and the thickness of the first electrode 3 is 5 um. The second substrate 2 has a circular sheet structure, the thickness of the second substrate 2 is greater than that of the first substrate 1, the second electrode 4 includes a main electrode 41 and a reference electrode 42, the main electrode 41 is connected to the second lead hole 7, and the reference electrode 42 is connected to the third lead hole 8.
The main electrode 41 is a circular metal electrode, the reference electrode 42 is an annular metal electrode, and the printing thickness of the main electrode 41 and the reference electrode 42 is 5 um.
The second lead hole 7 and the third lead hole 8 are respectively provided with a concave cup 9 on the electrode printing surface of the second substrate 2, and the concave cup 9 can be formed by adopting a tool to drill, so that the connection between silver paste and the first electrode 3 is avoided.
The isolation pier 5 is printed at the edge of the first electrode 3, the printing thickness is 30um, and the gap between the isolation pier 5 and the annular isolation pier 5 has the functions of electric conduction and sealing.
Example two
A manufacturing method of a ceramic capacitive pressure sensor core body comprises the following steps:
s1: cutting the aluminum oxide or zirconium oxide thin substrate subjected to tape casting molding and sintering into a wafer as a first substrate 1, wherein a laser cutting mode can be adopted;
s2: manufacturing a metal electrode of the first substrate 1 as a first electrode 3 by a printing mode, wherein the printing thickness of the first electrode 3 is 6.5 um;
s3: manufacturing a second substrate 2 by adopting a dry pressing forming mode, and arranging a first lead hole 6, a second lead hole 7 and a third lead hole 8 on the second substrate 2;
s4: manufacturing a main electrode 41 and a reference electrode 42 of the second substrate 2 by a printing mode, and printing the thickness of 6.5 um;
s5: the first lead hole 6, the second lead hole 7 and the third lead hole 8 are filled with LTCC (low temperature co-fired ceramic) sintered non-shrinkage filling silver paste, after filling, the second lead hole 7 and the third lead hole 8 are respectively provided with concave cups 9 on the electrode printing surface of the second substrate 2, so that the connection between the silver paste and the first electrode 3 is avoided, and the leading-out electrode connected with the first substrate 1 through the first lead hole 6 after filling does not need to be processed; sintering the LTCC shrinkage-free pore filling silver paste at 825 ℃ and keeping the temperature for 12 minutes;
s6: leading out the printed first electrode 3, the second electrode 4, the first lead hole 6, the second lead hole 7 and the third lead hole 8 from the electrodes in a tunnel sintering furnace to be sintered at 825 ℃ for 12 minutes;
s7: manufacturing a barrier pier 5 slurry, and printing the barrier pier 5 slurry with the thickness of 40um on the edge of the first electrode 3;
s8: removing glue from the first substrate 1 printed with the isolation pier 5 by using a tunnel sintering furnace, wherein the glue removing temperature is 350 ℃, and the heat preservation time is 45 minutes;
s9: and (3) putting the first substrate 1 sintered in the step (S8) and the second substrate 2 sintered in the step (S6) into a tunnel furnace, and pressing and sintering the substrates into the whole ceramic capacitor type pressure sensor core body, wherein the pressing and sintering temperature is 600 ℃, and the heat preservation time is 20 minutes.
In step S7, the step of producing the pier 5 slurry includes:
s71: in this example, 30 parts by weight of flake silver powder, 30 parts by weight of spherical silver powder, 10 parts by weight of low-temperature glass powder, 8 parts by weight of polyvinyl acetal, 1 part by weight of a leveling agent, 1 part by weight of a coupling agent, and 8 parts by weight of a solvent are obtained, wherein the leveling agent is ethylene glycol monomethyl ether, the coupling agent is a silane coupling agent KH550, and the solvent is terpineol.
S72: and rolling the materials by a three-roll mill, and filtering by a 200-mesh and 400-mesh filter screen to prepare the slurry of the hard shoulder 5.
With reference to fig. 1 to 5, the ceramic capacitive pressure sensor core manufactured by the method includes: the device comprises a first substrate 1, a second substrate 2, a first electrode 3, a second electrode 4, a barrier pillar 5, a first lead hole 6, a second lead hole 7 and a third lead hole 8, wherein the first electrode 3 is printed on the front surface of the first substrate 1, the second electrode 4 is printed on the front surface of the second substrate 2, the front surface of the first substrate 1 and the front surface of the second substrate 2 are oppositely arranged, the barrier pillar 5 is arranged between the front surfaces of the first substrate 1 and the second substrate 2, one side of the barrier pillar 5 is fixedly connected with the first electrode 3, and the other side of the barrier pillar is fixedly connected with the second substrate 2; the second substrate 2 is provided with a first lead hole 6, a second lead hole 7 and a third lead hole 8 in a penetrating manner, the bottom end of the first lead hole 6 is provided with a barrier 5, the bottom ends of the second lead hole 7 and the third lead hole 8 are provided with a second electrode 4, and the first lead hole 6, the second lead hole 7 and the third lead hole 8 are filled with conductive metal, such as silver.
In this embodiment, the first substrate 1 is a circular sheet structure, the first electrode 3 is printed to cover the front surface of the first substrate 1, and the thickness of the first electrode 3 is 6.5 um. The second substrate 2 has a circular sheet structure, the thickness of the second substrate 2 is greater than that of the first substrate 1, the second electrode 4 includes a main electrode 41 and a reference electrode 42, the main electrode 41 is connected to the second lead hole 7, and the reference electrode 42 is connected to the third lead hole 8.
The main electrode 41 is a circular metal electrode, the reference electrode 42 is an annular metal electrode, and the printing thickness of the main electrode 41 and the reference electrode 42 is 6.5 um.
The second lead hole 7 and the third lead hole 8 are respectively provided with a concave cup 9 on the electrode printing surface of the second substrate 2, and the concave cup 9 can be formed by adopting a tool to drill, so that the connection between silver paste and the first electrode 3 is avoided.
The isolation pier 5 is printed at the edge of the first electrode 3, the printing thickness is 40um, and the gap between the isolation pier 5 and the inner part of the annular isolation pier 5 has the functions of electric conduction and sealing.
EXAMPLE III
A manufacturing method of a ceramic capacitive pressure sensor core body comprises the following steps:
s1: cutting the aluminum oxide or zirconium oxide thin substrate subjected to tape casting molding and sintering into a wafer as a first substrate 1, wherein a laser cutting mode can be adopted;
s2: manufacturing a metal electrode of the first substrate 1 as a first electrode 3 by a printing mode, wherein the printing thickness of the first electrode 3 is 8 um;
s3: manufacturing a second substrate 2 by adopting a dry pressing forming mode, and arranging a first lead hole 6, a second lead hole 7 and a third lead hole 8 on the second substrate 2;
s4: manufacturing a main electrode 41 and a reference electrode 42 of the second substrate 2 by a printing mode, and printing the thickness of 8 um;
s5: the first lead hole 6, the second lead hole 7 and the third lead hole 8 are filled with LTCC (low temperature co-fired ceramic) sintered non-shrinkage filling silver paste, after filling, the second lead hole 7 and the third lead hole 8 are respectively provided with concave cups 9 on the electrode printing surface of the second substrate 2, so that the connection between the silver paste and the first electrode 3 is avoided, and the leading-out electrode connected with the first substrate 1 through the first lead hole 6 after filling does not need to be processed; sintering the LTCC shrinkage-free pore filling silver paste at the sintering temperature of 850 ℃ and keeping the temperature for 10 minutes;
s6: leading out the printed first electrode 3, the second electrode 4, the first lead hole 6, the second lead hole 7 and the third lead hole 8 from the electrodes in a tunnel sintering furnace to be sintered at 850 ℃ for 10 minutes;
s7: manufacturing a barrier pier 5 slurry, and printing the barrier pier 5 slurry with the thickness of 50um on the edge of the first electrode 3;
s8: removing glue from the first substrate 1 printed with the isolation pier 5 by using a tunnel sintering furnace, wherein the glue removing temperature is 400 ℃, and the heat preservation time is 30 minutes;
s9: and (3) putting the first substrate 1 sintered in the step (S8) and the second substrate 2 sintered in the step (S6) into a tunnel furnace, and pressing and sintering the substrates into the whole ceramic capacitor type pressure sensor core body, wherein the pressing and sintering temperature is 610 ℃, and the heat preservation time is 10 minutes.
In step S7, the step of producing the pier 5 slurry includes:
s71: in this example, 40 parts by weight of flake silver powder, 40 parts by weight of spherical silver powder, 15 parts by weight of low-temperature glass powder, 10 parts by weight of polyvinyl acetal, 1.5 parts by weight of a leveling agent, 1.5 parts by weight of a coupling agent, and 10 parts by weight of a solvent are obtained, wherein the leveling agent is ethylene glycol monomethyl ether, the coupling agent is a silane coupling agent KH550, and the solvent is terpineol.
S72: and rolling the materials by a three-roll mill, and filtering by a 200-mesh and 400-mesh filter screen to prepare the slurry of the hard shoulder 5.
With reference to fig. 1 to 5, the ceramic capacitive pressure sensor core manufactured by the method includes: the device comprises a first substrate 1, a second substrate 2, a first electrode 3, a second electrode 4, a barrier pillar 5, a first lead hole 6, a second lead hole 7 and a third lead hole 8, wherein the first electrode 3 is printed on the front surface of the first substrate 1, the second electrode 4 is printed on the front surface of the second substrate 2, the front surface of the first substrate 1 and the front surface of the second substrate 2 are oppositely arranged, the barrier pillar 5 is arranged between the front surfaces of the first substrate 1 and the second substrate 2, one side of the barrier pillar 5 is fixedly connected with the first electrode 3, and the other side of the barrier pillar is fixedly connected with the second substrate 2; the second substrate 2 is provided with a first lead hole 6, a second lead hole 7 and a third lead hole 8 in a penetrating manner, the bottom end of the first lead hole 6 is provided with a barrier 5, the bottom ends of the second lead hole 7 and the third lead hole 8 are provided with a second electrode 4, and the first lead hole 6, the second lead hole 7 and the third lead hole 8 are filled with conductive metal, such as silver.
In this embodiment, the first substrate 1 is a circular sheet structure, the first electrode 3 is printed to cover the front surface of the first substrate 1, and the thickness of the first electrode 3 is 8 um. The second substrate 2 has a circular sheet structure, the thickness of the second substrate 2 is greater than that of the first substrate 1, the second electrode 4 includes a main electrode 41 and a reference electrode 42, the main electrode 41 is connected to the second lead hole 7, and the reference electrode 42 is connected to the third lead hole 8.
The main electrode 41 is a circular metal electrode, the reference electrode 42 is an annular metal electrode, and the printing thickness of the main electrode 41 and the reference electrode 42 is 8 um.
The second lead hole 7 and the third lead hole 8 are respectively provided with a concave cup 9 on the electrode printing surface of the second substrate 2, and the concave cup 9 can be formed by adopting a tool to drill, so that the connection between silver paste and the first electrode 3 is avoided.
The isolation pier 5 is printed at the edge of the first electrode 3, the printing thickness is 50um, and the gap between the isolation pier 5 and the inner part of the annular isolation pier 5 has the functions of electric conduction and sealing.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Claims (10)
1. A ceramic capacitive pressure sensor core, comprising: the circuit board comprises a first substrate, a second substrate, a first electrode, a second electrode, a barrier, a first lead hole, a second lead hole and a third lead hole, wherein the first electrode is printed on the front surface of the first substrate, the second electrode is printed on the front surface of the second substrate, the front surface of the first substrate and the front surface of the second substrate are oppositely arranged, the barrier is arranged between the front surfaces of the first substrate and the second substrate, one side of the barrier is fixedly connected with the first electrode, and the other side of the barrier is fixedly connected with the second substrate; run through on the second base plate and be equipped with first pin hole, second pin hole and third pin hole, first pin hole bottom does the hard shoulder, second pin hole and third pin hole bottom do the second electrode, first pin hole, second pin hole and third pin hole intussuseption are filled with conductive metal.
2. The ceramic capacitive pressure sensor core according to claim 1, wherein the first substrate is a circular sheet structure, the first electrode is printed to cover the front surface of the first substrate, and the thickness of the first electrode is 5-8 um.
3. The ceramic capacitive pressure sensor core as recited in claim 1, wherein said second substrate is a circular sheet structure, said second substrate has a thickness greater than a thickness of said first substrate, said second electrode comprises a main electrode and a reference electrode, said main electrode is connected to said second feedthrough, and said reference electrode is connected to said third feedthrough.
4. A ceramic capacitive pressure sensor core according to claim 3, wherein the main electrode is a circular metal electrode, the reference electrode is an annular metal electrode, and the printing thickness of the main electrode and the reference electrode is 5-8 um.
5. The ceramic capacitive pressure sensor core according to claim 3, wherein the second and third lead holes are respectively provided with recessed cups on the electrode printing surface of the second substrate.
6. A ceramic capacitive pressure sensor core according to claim 3, wherein the isolation piers are printed at the edge of the first electrode with a thickness of 30-50 um.
7. A manufacturing method of a ceramic capacitive pressure sensor core body is characterized by comprising the following steps:
s1: cutting the aluminum oxide or zirconium oxide thin substrate which is subjected to tape casting molding and sintering into wafers serving as a first substrate;
s2: manufacturing a metal electrode of the first substrate as a first electrode by a printing mode;
s3: manufacturing a second substrate in a dry pressing forming mode, and arranging a first lead hole, a second lead hole and a third lead hole on the second substrate;
s4: manufacturing a main electrode and a reference electrode of the second substrate in a printing mode;
s5: the first lead hole, the second lead hole and the third lead hole are filled with LTCC (low temperature co-fired ceramic) sintered non-shrinkage filling silver paste, and after filling, concave cups are respectively arranged on the electrode printing surface of the second substrate for the second lead hole and the third lead hole, so that the silver paste is prevented from being connected with the first electrode;
s6: carrying out electrode sintering on the printed first electrode, the printed second electrode, the first lead hole, the printed second lead hole and the printed third lead hole lead-out electrode in a tunnel sintering furnace;
s7: manufacturing a barrier pier slurry, and printing the barrier pier slurry on the edge of the first electrode;
s8: discharging the glue of the first substrate printed with the isolation pier slurry by using a tunnel sintering furnace;
s9: the first substrate fired in step S8 and the second substrate fired in step S6 were placed in a tunnel furnace and pressure-fired into the entire ceramic capacitive pressure sensor core.
8. The method of claim 7, wherein the step of forming a spacer pier slurry in step S7 comprises:
s71: by weight, obtaining 20-40 parts of flake silver powder, 20-40 parts of spherical silver powder, 5-15 parts of low-temperature glass powder, 5-10 parts of polyvinyl acetal, 0.5-1.5 parts of flatting agent, 0.5-1.5 parts of coupling agent and 5-10 parts of solvent;
s72: and rolling the materials by a three-roll mill, and filtering by a 200-mesh filter screen and a 400-mesh filter screen to prepare the pier slurry.
9. The method of claim 7, wherein the first electrode, the master electrode and the reference electrode are printed to a thickness of 5-8um, and the spacer paste is printed to a thickness of 30-50 um.
10. The method as claimed in claim 7, wherein in step S5, the sintering temperature of the LTCC sintered silver paste without shrinkage filling hole is 800-; in the step S6, the sintering temperature of the tunnel sintering furnace is 800-; in the step S8, the glue discharging temperature is 300-400 ℃, and the heat preservation time is 30-60 minutes; in the step S9, the pressure sintering temperature is 550-610 ℃, and the heat preservation time is 10-30 minutes.
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| CN114942091A (en) * | 2022-07-25 | 2022-08-26 | 昆山灵科传感技术有限公司 | Ceramic capacitance pressure sensor and preparation method thereof |
| CN115165163A (en) * | 2022-09-06 | 2022-10-11 | 昆山灵科传感技术有限公司 | Pressure sensing structure and manufacturing method thereof, pressure sensor and manufacturing method thereof |
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