CN104535228A - LC (inductance-capacitance) wireless and passive pressure sensor without up-down interconnected electrodes - Google Patents
LC (inductance-capacitance) wireless and passive pressure sensor without up-down interconnected electrodes Download PDFInfo
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- CN104535228A CN104535228A CN201510043292.1A CN201510043292A CN104535228A CN 104535228 A CN104535228 A CN 104535228A CN 201510043292 A CN201510043292 A CN 201510043292A CN 104535228 A CN104535228 A CN 104535228A
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- 238000007789 sealing Methods 0.000 abstract description 3
- 239000003990 capacitor Substances 0.000 description 9
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- 238000010168 coupling process Methods 0.000 description 3
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- 238000005538 encapsulation Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
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Abstract
The invention provides an LC (inductance-capacitance) wireless and passive pressure sensor without up-down interconnected electrodes, relating to a pressure sensor. The LC wireless and passive pressure sensor is provided with an upper base plate and a lower base plate, wherein an upper groove is formed on the lower surface of the upper base plate, a lower groove is formed on the upper surface of the lower base plate, and a cavity is formed between the upper groove and the lower groove; an upper metal layer and a lower metal layer are arranged in the cavity from top to bottom, the upper metal layer is provided with a planar inductance coil, a variable-capacitance upper pole plate and a fixed-capacitance upper pole plate, the variable-capacitance upper pole plate is arranged in the middle of the planar inductance coil, and the fixed-capacitance upper pole plate is arranged outside the planar inductance coil; the inner side connector of the planar inductance coil is connected with the variable-capacitance upper pole plate, and the outer side connector of the planar inductance coil is connected with the fixed-capacitance upper pole plate; and the lower metal layer is provided with a variable-capacitance lower pole plate, a fixed-capacitance lower pole plate and an interconnecting wire for connecting the variable-capacitance lower pole plate and the fixed-capacitance lower pole plate. The fabrication process is simple, the sealing property is good and the production cost is low.
Description
Technical field
The present invention relates to a kind of pressure transducer, especially relate to the LC wireless and passive pressure transducer of a kind of supreme lower interconnect electrode based on LC resonant circuit.
Background technology
Pressure transducer uses maximum branches in sensor family, and most of pressure transducer uses powered battery, and is connected with signal handling equipment by wire, seriously limits applied environment and the serviceable life of pressure transducer.Wireless and passive pressure transducer probe itself does not need power supply, draws without wire, does not allow in the testing environment of the wired connection setting up sensor and test circuit thereof, have a wide range of applications market at some High Temperature High Pressure, inflammable and explosive, dynamic rotation parts etc.The LC resonance type wireless passive pressure sensor utilizing MEMS technology to make, have volume little, lightweight, highly sensitive, be convenient to the features such as integrated, low price, be the study hotspot of various countries in recent years.
LC resonance type wireless passive pressure sensor is made up of a telefault and a presser sensor electric capacity usually.Its ultimate principle is, when pressure changes, electric capacity changes thereupon, and then affects the resonance frequency in LC loop, external read circuit realizes the transmission of energy and capacitance change signal between sensor by the mode of inductive coupling, thus realizes the measurement to pressure.The LC wireless and passive pressure transducer that MEMS makes needs the large technological difficulties of solution two: capacitor plate lead-in wire and cavity sealing problem.For capacitor plate pin problem, current existing sensor adopts two-layer or three layers of underlying structure, its telefault and electric capacity top crown are positioned at upper strata substrate, electric capacity bottom crown is positioned at lower floor's substrate, utilize through-hole interconnection between telefault and electric capacity bottom crown, and use lamination or bonding technology to encapsulate.Sensors with auxiliary electrode due to through-hole interconnection complex process, and telefault and electric capacity top crown in atmosphere exposed, need carry out next step encapsulation to improve performance, integrated artistic flow process is comparatively complicated, and preparation cost is high.In addition, operative sensor is had to adopt two layers of substrate, its telefault and electric capacity top crown are positioned at the side of upper strata basal surface to electric capacity bottom crown, and with electric capacity bottom crown with being placed in airtight cavity, connection and the sensor package technique of telefault and electric capacity bottom crown are carried out simultaneously.Sensors with auxiliary electrode is in order to realize effective connection of telefault and electric capacity bottom crown, in packaging technology, positioning accuracy request is high, simultaneously because the interconnection line of inductance capacitance extends in the package interface of sensor base, need in package interface splash-proofing sputtering metal to form interconnection point, the requirement of packaging technology is improved, the corresponding increase of preparation cost.
Chinese patent CN101322020 discloses a kind of pressure sensor systems, comprises integrated pressure sensing capacitances in the substrate and inductor.Described pressure sensing capacitances comprises for the conductive diaphragm of detected pressures difference with by forming the electrode that predetermined gap in the substrate and membrane separation are opened.Described inductor and pressure sensing capacitances form passive electrical perception-capacitive character (LC) oscillatory circuit.The remote inquiry circuit being coupled to described pressure transducer inductor coil with induction mode may be used for the change of the resonance frequency of radio detection LC oscillatory circuit.Successively process technology is used to manufacture the pressure sensor structure of described over all Integration.
Chinese patent CN103698060A discloses a kind of wireless and passive high-temp pressure sensor, comprises the first ceramic chips, the second ceramic chips, the 3rd ceramic chips, the 4th ceramic chips, the 5th ceramic chips; The upper surface left part of the first ceramic chips is furnished with the bottom crown of the first plate condenser; The upper surface right part of the first ceramic chips is furnished with the bottom crown of the second plate condenser; First telefault and the first plate condenser form temperature compensation sensitive LC loop jointly; Second telefault and the second plate condenser form main sensitive LC loop jointly.
Summary of the invention
The object of the present invention is to provide two capacitance structures of employing 4 chip capacitor pole plate, can solve because capacitor plate lead-in wire and cavity seal the complicated process of preparation caused in current wireless pressure sensor, the LC wireless and passive pressure transducer of a kind of supreme lower interconnect electrode of the problems such as production cost is high.
The present invention is provided with upper substrate and infrabasal plate, and upper substrate lower surface is provided with upper groove, and infrabasal plate upper surface is provided with low groove, forms cavity between upper groove and low groove; Metal level and lower metal layer on being provided with from top to bottom in cavity, described upper metal level is provided with plane inductive coil, variable capacitance top crown, fixed capacity top crown, variable capacitance top crown is positioned in the middle of plane inductive coil, and fixed capacity top crown is positioned at plane inductive coil outside; The inner side connector of described plane inductive coil is connected with variable capacitance top crown, and the outside connector of plane inductive coil is connected with fixed capacity top crown; Described lower metal layer is provided with the interconnection line of variable capacitance bottom crown, fixed capacity bottom crown, connection variable capacitance bottom crown and fixed capacity bottom crown.
Described upper substrate is preferably identical with the area of infrabasal plate, to be connected and sealed.
Described variable capacitance top crown, with variable capacitance bottom crown is measure-alike and position is relative, forms variable capacitance; Described fixed capacity top crown, with fixed capacity bottom crown is measure-alike and position is relative, forms fixed capacity.
At least large than the capacitance of the variable capacitance twice of capacitance of described fixed capacity, to improve measuring accuracy of the present invention.
Compared with existing wireless and passive pressure transducer, the invention has the advantages that: the two capacitance structures adopting 4 chip capacitor pole plates, wherein fixed capacity two-plate is positioned on the interconnection line of telefault and variable capacitance bottom crown, namely between telefault and variable capacitance bottom crown, nothing is directly electrically connected, avoid using interconnection line, require relatively to reduce to alignment precision during encapsulation, only need consider corresponding capacitance pole plate and upper and lower base plate alignment issues separately.Owing to there is not the material of other similar contact conductors in package interface, namely package interface does not have the introducing of other materials, thus before bonding substrate without the need to carrying out extra polishing.The unicity of material and planarization all serve good guaranteeing role to the encapsulation of sensor, make the overall preparation technology of pressure transducer more simple, and sealing property is better, and production cost is lower.
Accompanying drawing explanation
Fig. 1 is the transverse sectional view (up orientation substrate is seen) of the embodiment of the present invention.
Fig. 2 is the transverse sectional view (down orientation substrate is seen) of the embodiment of the present invention.
Fig. 3 is the longitudinal sectional view of the embodiment of the present invention.
Fig. 4 is the exploded view of the embodiment of the present invention.
Fig. 5 is the LC resonant tank equivalent circuit diagram of the embodiment of the present invention.
Operating diagram when Fig. 6 is embodiment of the present invention measurement pressure.
Embodiment
Below in conjunction with drawings and Examples, the invention will be further described.
As shown in figures 1-4, the embodiment of the present invention is provided with upper substrate 1 and infrabasal plate 4, and upper substrate 1 lower surface is provided with upper groove, and infrabasal plate 4 upper surface is provided with low groove, forms cavity 5 between upper groove and low groove; Metal level 2 and lower metal layer 3 on being provided with from top to bottom in cavity 5, the fixed capacity top crown 8 that described upper metal level 2 is provided with plane inductive coil 6, is positioned at the middle variable capacitance top crown 7 of plane inductive coil 6, is positioned at plane inductive coil outside, the inner side connector 9 of described plane inductive coil 6 is connected with variable capacitance top crown 7, and the outside connector 10 of plane inductive coil 6 is connected with fixed capacity top crown 8; Described lower metal layer 3 is provided with the interconnection line 13 of variable capacitance bottom crown 11, fixed capacity bottom crown 12, connection variable capacitance bottom crown 11 and fixed capacity bottom crown 12.
Described variable capacitance top crown 7, with variable capacitance bottom crown 11 is measure-alike and position is relative, forms variable capacitance; Described fixed capacity top crown 8, with fixed capacity bottom crown 12 is measure-alike and position is relative, forms fixed capacity.
At least large than the capacitance of the variable capacitance twice of capacitance of described fixed capacity, to improve measuring accuracy of the present invention.
Described upper substrate can adopt High Resistivity Si material to make, and wherein the doping content of metal can adjust.Described infrabasal plate can adopt high silica glass material to make, such as Pyrex 7740.Cavity covers the region at capacitor plate and plane inductive coil place.Consider inductance value and the quality factor q of plane inductive coil, plane inductive coil generally adopts hollow structure.Plane capacitance is placed in this hollow region, the overall dimensions of sensor can be reduced.But there is electrical connection between plane capacitance and plane inductive coil, add manufacture difficulty.Therefore, on the basis of sacrificing size sensor, adopt the new construction of 4 chip capacitor pole plates, solve a difficult problem for electrical connection.Upper metal level 2 comprises plane inductive coil 6, variable capacitance top crown 7 and fixed capacity top crown 8.Variable capacitance top crown 7 is positioned at the centre of plane inductive coil, and fixed capacity top crown 8 is positioned at the outside of plane inductive coil.Plane inductive coil 6 is provided with inner side connector 9 and outside connector 10.The inner side connector 9 of plane inductive coil 6 is connected with variable capacitance top crown 7.The outside connector 10 of plane inductive coil 6 is connected with fixed capacity top crown 8.Lower metal layer 3 comprises variable capacitance bottom crown 11, fixed capacity bottom crown 12 and interconnection line 13.Variable capacitance bottom crown 11 is measure-alike with variable capacitance top crown 7, and position is relative.Fixed capacity bottom crown 12 is measure-alike with fixed capacity top crown 8, and position is relative.One end of interconnection line 13 is connected with variable capacitance bottom crown 11, and the other end is connected with fixed capacity bottom crown 12.
Described upper substrate 1 and infrabasal plate 4 have identical area, are convenient to aim at, and are conducive to subsequent encapsulating process.
Described cavity 5 is made up of the groove of upper substrate 1 and infrabasal plate 4; Upper substrate 1 and infrabasal plate 4, by wet corrosion technique, form groove.
Described upper substrate 1 is by wet corrosion technique, and in the back side local reduction mineralization pressure sensitive membrane 14 of upper substrate 1, the area equation of this pressure sensitive film and variable capacitance top crown 7, position is relative.
In the wireless and passive pressure transducer of said structure, fixed capacity top crown 8 and fixed capacity bottom crown 12 form fixed capacity.Upper substrate 1, infrabasal plate 4, variable capacitance top crown 7 and variable capacitance bottom crown 11 constitute variable capacitance.Fixed capacity is connected in the mode of series connection with variable capacitance, is fixed into presser sensor variable capacitance, as the pressure-sensitive component of sensor.In order to reduce impact on variable capacitance after the two series connection, the value of fixed capacity at least exceeds more than twice than variable capacitance, and therefore the polar plate area of the capacitor plate area ratio variable capacitance of fixed capacity is relatively large.Presser sensor variable capacitance and plane inductive coil 6 together constitute the main part of pressure transducer.The inner side connector 9 of plane inductive coil 6 is connected with variable capacitance top crown 7, the outside connector 10 of plane inductive coil 6 is connected with fixed capacity top crown 8, one end of interconnection line 13 is connected with variable capacitance bottom crown 11, the other end is connected with fixed capacity bottom crown 12, variable capacitance bottom crown 11 is with variable capacitance top crown 7 is measure-alike and position is relative, fixed capacity bottom crown 12 is with fixed capacity top crown 8 is measure-alike and position is relative, namely presser sensor variable capacitance and plane inductive coil two ends are connected to each other, form LC resonant tank, its equivalent electrical circuit as shown in Figure 5.Variable capacitance top crown 7 directly contacts with the pressure sensitive film 14 in upper substrate 1.Under the effect of ambient pressure, can there is deformation in pressure sensitive film 14.
Manufacturing process of the present invention is as follows: first choose silicon chip and glass sheet, respectively as upper substrate 1 and infrabasal plate 4.Then wet etching is utilized to process above-mentioned cavity 5 and pressure sensitive film 14.Then in upper substrate 1 and infrabasal plate 4,4 above-mentioned chip capacitor pole plates are sputtered.Again by electroforming process, prepare plane inductive coil 6, and interconnection line 13.Bonding technology is finally adopted to do overall package.
As shown in Figure 6, when using the present invention to measure, need to utilize external read coil 15 and external read system 16.External read coil 15 connects external read system 16, when external read coil 15 is near pressure transducer, forms inductive coupling, be similar to transformer with plane inductive coil 6.
Below provide the course of work of the present invention:
When ambient pressure changes, there is deformation in the pressure sensitive film 14 being positioned at upper substrate 1, thus cause the polar plate spacing of presser sensor variable capacitance and capacitance to change, and then cause the resonance frequency of lc circuit to change.The alternation swept-frequency signal of external read system 16 is radiate with the form of electromagnetic field by external read coil 15, is coupled on the plane inductive coil 6 of sensor.When the resonance frequency of lc circuit is identical with the frequency swept signal of external read system 16, sensor resonant can be caused.Owing to there is Mutual Inductance Coupling between external read coil 15 and plane inductive coil 6, during resonance, there is obvious change point in input impedance, the parameter such as impedance phase angle and output voltage of external read coil 15.Utilize external read system 16 to read the changing value of these parameters, analyze and determine the resonance frequency of pressure transducer, being converted into corresponding force value, thus realizing the measurement to pressure.
Claims (4)
1. a LC wireless and passive pressure transducer for supreme lower interconnect electrode, it is characterized in that being provided with upper substrate and infrabasal plate, upper substrate lower surface is provided with upper groove, and infrabasal plate upper surface is provided with low groove, forms cavity between upper groove and low groove; Metal level and lower metal layer on being provided with from top to bottom in cavity, described upper metal level is provided with plane inductive coil, variable capacitance top crown, fixed capacity top crown, variable capacitance top crown is positioned in the middle of plane inductive coil, and fixed capacity top crown is positioned at plane inductive coil outside; The inner side connector of described plane inductive coil is connected with variable capacitance top crown, and the outside connector of plane inductive coil is connected with fixed capacity top crown; Described lower metal layer is provided with the interconnection line of variable capacitance bottom crown, fixed capacity bottom crown, connection variable capacitance bottom crown and fixed capacity bottom crown.
2. the LC wireless and passive pressure transducer of a kind of supreme lower interconnect electrode as claimed in claim 1, is characterized in that described upper substrate is identical with the area of infrabasal plate.
3. the LC wireless and passive pressure transducer of a kind of supreme lower interconnect electrode as claimed in claim 1, is characterized in that described variable capacitance top crown and variable capacitance bottom crown is measure-alike and position is relative, forms variable capacitance; Described fixed capacity top crown, with fixed capacity bottom crown is measure-alike and position is relative, forms fixed capacity.
4. the LC wireless and passive pressure transducer of a kind of supreme lower interconnect electrode as claimed in claim 1, is characterized in that at least large than the capacitance of the variable capacitance twice of the capacitance of described fixed capacity.
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Cited By (10)
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| CN105203251A (en) * | 2015-10-16 | 2015-12-30 | 武汉工程大学 | Pressure sensing chip and processing method thereof |
| CN106409808A (en) * | 2016-11-23 | 2017-02-15 | 无锡吉迈微电子有限公司 | Three-dimensional spiral inductor |
| CN107144378A (en) * | 2017-06-07 | 2017-09-08 | 深圳信息职业技术学院 | Mems pressure sensor |
| CN108132280A (en) * | 2017-12-25 | 2018-06-08 | 佛山市车品匠汽车用品有限公司 | A kind of flexible substrate for being used to install gas sensor |
| CN108362406A (en) * | 2017-06-08 | 2018-08-03 | 深圳信息职业技术学院 | Inductance pressure transducer and pressure measurement circuitry |
| CN109238313A (en) * | 2018-09-18 | 2019-01-18 | 东南大学 | A kind of multi-parameter LC sensor for rotational structure status monitoring |
| CN109297621A (en) * | 2018-07-19 | 2019-02-01 | 深圳振华富电子有限公司 | Wireless and passive LC pressure sensor and manufacturing method |
| CN112146793A (en) * | 2020-11-26 | 2020-12-29 | 南京高华科技股份有限公司 | LC composite MEMS tactile pressure sensor and preparation method thereof |
| CN112683428A (en) * | 2020-11-26 | 2021-04-20 | 南京高华科技股份有限公司 | MEMS inductive pressure sensor and preparation method thereof |
| CN114858339A (en) * | 2022-04-08 | 2022-08-05 | 武汉大学 | Flexible array type humidity pressure sensor and preparation process thereof |
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| CN109238313A (en) * | 2018-09-18 | 2019-01-18 | 东南大学 | A kind of multi-parameter LC sensor for rotational structure status monitoring |
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| CN112146793B (en) * | 2020-11-26 | 2021-04-02 | 南京高华科技股份有限公司 | LC composite MEMS tactile pressure sensor and preparation method thereof |
| CN112683428A (en) * | 2020-11-26 | 2021-04-20 | 南京高华科技股份有限公司 | MEMS inductive pressure sensor and preparation method thereof |
| CN112683428B (en) * | 2020-11-26 | 2022-07-01 | 南京高华科技股份有限公司 | MEMS inductive pressure sensor and preparation method thereof |
| CN114858339A (en) * | 2022-04-08 | 2022-08-05 | 武汉大学 | Flexible array type humidity pressure sensor and preparation process thereof |
| CN114858339B (en) * | 2022-04-08 | 2023-01-03 | 武汉大学 | Flexible array type humidity pressure sensor and preparation process thereof |
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| CN104535228B (en) | 2017-03-01 |
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