CN104535228B - A kind of LC wireless and passive pressure transducer of supreme lower interconnection electrode - Google Patents
A kind of LC wireless and passive pressure transducer of supreme lower interconnection electrode Download PDFInfo
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- CN104535228B CN104535228B CN201510043292.1A CN201510043292A CN104535228B CN 104535228 B CN104535228 B CN 104535228B CN 201510043292 A CN201510043292 A CN 201510043292A CN 104535228 B CN104535228 B CN 104535228B
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Abstract
A kind of LC wireless and passive pressure transducer of supreme lower interconnection electrode, is related to a kind of pressure transducer.It is provided with upper substrate and infrabasal plate, upper substrate lower surface is provided with upper groove, infrabasal plate upper surface is provided with low groove, between upper groove and low groove, form cavity；Metal level and lower metal layer on being provided with from top to bottom in cavity, described upper metal level is provided with plane inductive coil, variable capacitance top crown, fixed capacity top crown, variable capacitance top crown is located in the middle of plane inductive coil, and fixed capacity top crown is located at outside plane inductive coil；The inner side union joint of described plane inductive coil is connected with variable capacitance top crown, and the outside union joint of plane inductive coil is connected with fixed capacity top crown；Described lower metal layer is provided with variable capacitance bottom crown, the interconnection line of fixed capacity bottom crown, connection variable capacitance bottom crown and fixed capacity bottom crown.Preparation process is simple, good seal performance, low production cost.
Description
Technical field
The present invention relates to a kind of pressure transducer, especially relate to the supreme lower interconnection electrode of one kind based on LC resonance circuit
LC wireless and passive pressure transducer.
Background technology
Pressure transducer is using most branches in sensor family, and most of pressure transducer is supplied using battery
Electricity, and be connected with signal handling equipment by wire, seriously limit applied environment and the service life of pressure transducer.Wirelessly
Passive pressure sensor probe itself does not need power supply, and no wire is drawn, in some High Temperature High Pressure, inflammable and explosive, dynamic rotation
Part etc. does not allow, in the detection environment set up the wired connection of sensor and its test circuit, to have a wide range of applications market.
The LC resonance type wireless passive pressure sensor being made using MEMS technology, has small volume, lightweight, sensitivity is high, be easy to
The features such as integrated, low price, be the study hotspot of various countries in recent years.
LC resonance type wireless passive pressure sensor is generally made up of an inductance coil and a presser sensor electric capacity.Its
Ultimate principle is that, when pressure changes, electric capacity changes therewith, and then affects the resonant frequency in LC loop, external read electricity
The transmission of energy and capacitance change signal and sensor between is realized on road by way of inductive, thus realizing to pressure
Measurement.The LC wireless and passive pressure transducer that MEMS makes needs to solve two big technological difficulties：Capacitor plate lead and cavity are close
Envelope problem.For capacitor plate pin problem, existing sensor is using two-layer or three layers of underlying structure, its inductance coil at present
It is located at upper strata substrate with electric capacity top crown, electric capacity bottom crown is located at lower substrate, utilize between inductance coil and electric capacity bottom crown
Through-hole interconnection, and be packaged using lamination or bonding technology.Sensors with auxiliary electrode is due to through-hole interconnection complex process, and electricity
Sense coil and electric capacity top crown are exposed in atmosphere, need to carry out next step and encapsulate to improve performance, integrated artistic flow process is more multiple
Miscellaneous, preparation cost is high.Additionally, there being operative sensor to adopt two layers of substrate, its inductance coil and electric capacity top crown are located at upper strata base
Bottom surface to the side of electric capacity bottom crown, with electric capacity bottom crown with being placed in airtight cavity, inductance coil and electric capacity bottom crown
Connect and carry out with sensor packaging technology simultaneously.Sensors with auxiliary electrode is in order to realize effectively connecting of inductance coil and electric capacity bottom crown
Connect, in packaging technology, positioning accuracy request is high, simultaneously because the interconnection line of inductance capacitance extends to the encapsulation of sensor base
On interface, to constitute interconnection point, the requirement to packaging technology improves, and preparation cost is corresponding to need splash-proofing sputtering metal in package interface
Increase.
Chinese patent CN101322020 discloses a kind of pressure sensor systems, comprises integrated pressure sensing in the substrate
Capacitor and inducer.Described pressure sensing capacitances comprise conductive diaphragm for detecting pressure differential and by being formed at substrate
In the electrode separated with barrier film of predetermined gap.Described inducer and pressure sensing capacitances form passive electrical perception-electric capacity
Property (LC) oscillating circuit.Be can be used for the remote inquiry circuit that induction mode is coupled to described pressure transducer inductor coil
The change of the resonant frequency of radio detection LC oscillating circuit.Manufacture the pressure sensing of described over all Integration using successively process technology
Device structure.
Chinese patent CN103698060A discloses a kind of wireless and passive high-temp pressure sensor, including the first ceramic chips,
Two ceramic chips, the 3rd ceramic chips, the 4th ceramic chips, the 5th ceramic chips；It is flat that the upper surface left part of the first ceramic chips is disposed with first
The bottom crown of plate capacitor；The upper surface right part of the first ceramic chips is disposed with the bottom crown of the second plate condenser；First inductance
Coil and the first plate condenser collectively form temperature-compensating sensitive LC loop；Second inductance coil and the second plate condenser are altogether
With the main sensitive LC loop of composition.
Content of the invention
It is an object of the invention to provide the double capacitance structures using 4 chip capacitor pole plates, it is possible to resolve wireless pressure passes at present
By capacitor plate lead and cavity the led to complicated process of preparation of sealing in sensor, the problems such as production cost is high a kind of no
The LC wireless and passive pressure transducer of interconnection electrode up and down.
The present invention is provided with upper substrate and infrabasal plate, and upper substrate lower surface is provided with upper groove, and infrabasal plate upper surface is provided with recessed
Groove, forms cavity between upper groove and low groove；Metal level and lower metal layer on being provided with from top to bottom in cavity, described upper gold
Belong to layer and be provided with plane inductive coil, variable capacitance top crown, fixed capacity top crown, variable capacitance top crown is located at planar inductor
In the middle of coil, fixed capacity top crown is located at outside plane inductive coil；The inner side union joint of described plane inductive coil with can
Become electric capacity top crown to connect, the outside union joint of plane inductive coil is connected with fixed capacity top crown；Described lower metal layer sets
There are variable capacitance bottom crown, the interconnection line of fixed capacity bottom crown, connection variable capacitance bottom crown and fixed capacity bottom crown.
The area of described upper substrate and infrabasal plate is preferably identical, to be connected and sealed.
Described variable capacitance top crown is equivalently-sized with variable capacitance bottom crown and position is relative, constitutes variable capacitance；Institute
State that fixed capacity top crown is equivalently-sized with fixed capacity bottom crown and position is relative, constitute fixed capacity.
The capacitance of described fixed capacity big twice at least than the capacitance of variable capacitance, to improve the measurement essence of the present invention
Degree.
Compared with existing wireless and passive pressure transducer, it is an advantage of the current invention that：Double electricity using 4 chip capacitor pole plates
Hold structure, wherein fixed capacity two-plate is located on the interconnection line of inductance coil and variable capacitance bottom crown, that is, inductance coil and
No directly it is electrically connected between variable capacitance bottom crown, it is to avoid using interconnection line, alignment precision during encapsulation is required relatively to drop
Low, only need to consider corresponding capacitance pole plate and the respective alignment issues of upper and lower base plate.Due to other classes not being existed on package interface
Like the material of contact conductor, that is, package interface does not have the introducing of other materials, thus before bonding, substrate need not carry out extra throwing
Optical processing.The unicity of material and planarization all serves good guaranteeing role to the encapsulation of sensor so that pressure sensing
The overall preparation technology of device is more simple, and more preferably, production cost is lower for sealing property.
Brief description
Fig. 1 is the transverse sectional view (up orientation substrate is seen) of the embodiment of the present invention.
Fig. 2 is the transverse sectional view (down orientation substrate is seen) of the embodiment of the present invention.
Fig. 3 is the longitudinal sectional view of the embodiment of the present invention.
Fig. 4 is the exploded view of the embodiment of the present invention.
Fig. 5 is the LC resonant tank equivalent circuit diagram of the embodiment of the present invention.
Fig. 6 measures operating diagram during pressure for the embodiment of the present invention.
Specific embodiment
The invention will be further described with reference to the accompanying drawings and examples.
As shown in figures 1-4, the embodiment of the present invention is provided with upper substrate 1 and infrabasal plate 4, and upper substrate 1 lower surface is provided with fovea superior
Groove, infrabasal plate 4 upper surface is provided with low groove, forms cavity 5 between upper groove and low groove；It is provided with from top to bottom in cavity 5
Upper metal level 2 and lower metal layer 3, described upper metal level 2 be provided with plane inductive coil 6, be located in the middle of plane inductive coil 6 can
Become electric capacity top crown 7, be located at plane inductive coil outside fixed capacity top crown 8, the inner side of described plane inductive coil 6 connects
Joint 9 is connected with variable capacitance top crown 7, and the outside union joint 10 of plane inductive coil 6 is connected with fixed capacity top crown 8；
Described lower metal layer 3 is provided with variable capacitance bottom crown 11, fixed capacity bottom crown 12, connects variable capacitance bottom crown 11 and fix
The interconnection line 13 of electric capacity bottom crown 12.
Described variable capacitance top crown 7 is equivalently-sized with variable capacitance bottom crown 11 and position is relative, constitutes variable capacitance；
Described fixed capacity top crown 8 is equivalently-sized with fixed capacity bottom crown 12 and position is relative, constitutes fixed capacity.
The capacitance of described fixed capacity big twice at least than the capacitance of variable capacitance, to improve the measurement essence of the present invention
Degree.
Described upper substrate can be made using high resistant silicon materials, and wherein the doping content of metal can adjust.Described infrabasal plate
Can be made using high silica glass material, such as Pyrex 7740.Cavity covers what capacitor plate and plane inductive coil were located
Region.Consider inductance value and the quality factor q of plane inductive coil, plane inductive coil typically adopts hollow structure.Will
Plane capacitance is placed in this hollow region, can reduce the overall dimensions of sensor.But between plane capacitance and plane inductive coil
There is electrical connection, increased manufacture difficulty.Therefore, on the basis of sacrificing size sensor, new using 4 chip capacitor pole plates
Structure, solves a difficult problem for electrical connection.Upper metal level 2 includes plane inductive coil 6, variable capacitance top crown 7 and fixed capacity
Top crown 8.Variable capacitance top crown 7 is located at the centre of plane inductive coil, and fixed capacity top crown 8 is located at plane inductive coil
Outside.Plane inductive coil 6 is provided with inner side union joint 9 and outside union joint 10.The inner side union joint of plane inductive coil 6
9 are connected with variable capacitance top crown 7.The outside union joint 10 of plane inductive coil 6 is connected with fixed capacity top crown 8.Lower gold
Belong to layer 3 and include variable capacitance bottom crown 11, fixed capacity bottom crown 12 and interconnection line 13.Variable capacitance bottom crown 11 with can power transformation
Hold top crown 7 equivalently-sized, position is relatively.Fixed capacity bottom crown 12 is equivalently-sized with fixed capacity top crown 8, position phase
Right.One end of interconnection line 13 is connected with variable capacitance bottom crown 11, and the other end is connected with fixed capacity bottom crown 12.
Described upper substrate 1 and infrabasal plate 4 have identical area, are easy to be aligned, are conducive to subsequent encapsulating process.
Described cavity 5 is made up of the groove of upper substrate 1 and infrabasal plate 4；Upper substrate 1 and infrabasal plate 4 pass through wet etching work
Skill, forms groove.
Described upper substrate 1 passes through wet corrosion technique, forms pressure sensitive film 14 in the back side local reduction of upper substrate 1,
This pressure sensitive film and the area equation of variable capacitance top crown 7, position is relatively.
In the wireless and passive pressure transducer of said structure, fixed capacity top crown 8 and fixed capacity bottom crown 12 are constituted
Fixed capacity.Upper substrate 1, infrabasal plate 4, variable capacitance top crown 7 and variable capacitance bottom crown 11 constitute variable capacitance.Fixing
Electric capacity and variable capacitance are connected in series to, and are fixed into presser sensor variable capacitance, as the pressure sensor of sensor
Part.In order to reduce impact to variable capacitance after the two series connection, the value of fixed capacity at least than variable capacitance exceed twice with
On, the capacitor plate area of therefore fixed capacity is more relatively large than the polar plate area of variable capacitance.Presser sensor variable capacitance and
Plane inductive coil 6 together constitutes the main part of pressure transducer.The inner side union joint 9 of plane inductive coil 6 with variable
Electric capacity top crown 7 connects, and the outside union joint 10 of plane inductive coil 6 is connected with fixed capacity top crown 8, and the one of interconnection line 13
End be connected with variable capacitance bottom crown 11, the other end is connected with fixed capacity bottom crown 12, variable capacitance bottom crown 11 with variable
Electric capacity top crown 7 is equivalently-sized and position relatively, fixed capacity bottom crown 12 is equivalently-sized with fixed capacity top crown 8 and position
Relatively, that is, presser sensor variable capacitance and plane inductive coil two ends interconnect, and form LC resonant tank, its equivalent circuit is such as
Shown in Fig. 5.Pressure sensitive film 14 directly contact in variable capacitance top crown 7 and upper substrate 1.In the presence of ambient pressure,
Pressure sensitive film 14 can deform upon.
The manufacturing process of the present invention is as follows：Choose silicon chip and sheet glass first, respectively as upper substrate 1 and infrabasal plate 4.Connect
And process above-mentioned cavity 5 and pressure sensitive film 14 using wet etching.Then sputter in upper substrate 1 and infrabasal plate 4
4 above-mentioned chip capacitor pole plates.Pass through electroforming process again, prepare plane inductive coil 6, and interconnection line 13.Finally using bonding
Technique does overall package.
As shown in fig. 6, when being measured using the present invention, needing using external read coil 15 and external read system
16.External read coil 15 connects external read system 16, when external read coil 15 is near pressure transducer, with plane electricity
Sense coil 6 forms inductive, similar to transformator.
The work process of the present invention given below：
When ambient pressure changes, the pressure sensitive film 14 positioned at upper substrate 1 deforms upon, thus leading to pressure quick
The polar plate spacing of sense variable capacitance and capacitance change, and then cause the resonant frequency of lc circuit to change.Outside is read
The alternation swept-frequency signal of read apparatus 16 is radiate in the form of electromagnetic field by external read coil 15, is coupled to sensor
On plane inductive coil 6.When the resonant frequency of lc circuit is identical with the frequency swept signal of external read system 16, can cause
Sensor resonant.Due to there is Mutual Inductance Coupling between external read coil 15 and plane inductive coil 6, during resonance, external read
Obvious change point in the parameters such as the input impedance of coil 15, impedance phase angle and output voltage.Using external read system
The changing value of system 16 these parameters of reading, analyzes and determines the resonant frequency of pressure transducer, be converted into corresponding pressure value, from
And realize the measurement to pressure.
Claims (3)
1. a kind of LC wireless and passive pressure transducer of supreme lower interconnection electrode is it is characterised in that be provided with upper substrate and infrabasal plate,
Upper substrate lower surface is provided with upper groove, and infrabasal plate upper surface is provided with low groove, forms cavity between upper groove and low groove；In sky
Intracavity is provided with metal level and lower metal layer from top to bottom, and described upper metal level is provided with plane inductive coil, pole on variable capacitance
Plate, fixed capacity top crown, variable capacitance top crown is located in the middle of plane inductive coil, and fixed capacity top crown is located at plane electricity
Sense coil outer；The inner side union joint of described plane inductive coil is connected with variable capacitance top crown, outside plane inductive coil
Side union joint is connected with fixed capacity top crown；Described lower metal layer is provided with variable capacitance bottom crown, fixed capacity bottom crown, connects
Connect variable capacitance bottom crown and the interconnection line of fixed capacity bottom crown；
Described variable capacitance top crown is equivalently-sized with variable capacitance bottom crown and position is relative, constitutes variable capacitance；Described solid
Determine that electric capacity top crown is equivalently-sized with fixed capacity bottom crown and position is relative, constitute fixed capacity.
2. as claimed in claim 1 a kind of LC wireless and passive pressure transducer of supreme lower interconnection electrode it is characterised in that described
Upper substrate is identical with the area of infrabasal plate.
3. as claimed in claim 1 a kind of LC wireless and passive pressure transducer of supreme lower interconnection electrode it is characterised in that described
The capacitance of fixed capacity big twice than the capacitance of variable capacitance.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510043292.1A CN104535228B (en) | 2015-01-28 | 2015-01-28 | A kind of LC wireless and passive pressure transducer of supreme lower interconnection electrode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510043292.1A CN104535228B (en) | 2015-01-28 | 2015-01-28 | A kind of LC wireless and passive pressure transducer of supreme lower interconnection electrode |
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| Publication Number | Publication Date |
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| CN104535228A CN104535228A (en) | 2015-04-22 |
| CN104535228B true CN104535228B (en) | 2017-03-01 |
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Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105203251B (en) * | 2015-10-16 | 2018-06-08 | 武汉工程大学 | Pressure sensing chip and its processing method |
| CN106409808B (en) * | 2016-11-23 | 2019-04-16 | 厦门云天半导体科技有限公司 | Three-dimensional spiral inductance |
| CN107144378B (en) * | 2017-06-07 | 2023-05-05 | 深圳信息职业技术学院 | MEMS pressure sensor |
| CN108362406A (en) * | 2017-06-08 | 2018-08-03 | 深圳信息职业技术学院 | Inductance pressure transducer and pressure measurement circuitry |
| CN108132280B (en) * | 2017-12-25 | 2020-11-17 | 嘉兴巨腾信息科技有限公司 | Flexible substrate for mounting gas sensor |
| CN109297621B (en) * | 2018-07-19 | 2021-07-30 | 深圳振华富电子有限公司 | Wireless passive LC pressure sensor and manufacturing method |
| CN109238313B (en) * | 2018-09-18 | 2020-12-01 | 东南大学 | Multi-parameter LC sensor for monitoring state of rotating structure |
| CN112146793B (en) * | 2020-11-26 | 2021-04-02 | 南京高华科技股份有限公司 | LC composite MEMS tactile pressure sensor and preparation method thereof |
| CN112683428B (en) * | 2020-11-26 | 2022-07-01 | 南京高华科技股份有限公司 | MEMS inductive pressure sensor and preparation method thereof |
| CN114858339B (en) * | 2022-04-08 | 2023-01-03 | 武汉大学 | Flexible array type humidity pressure sensor and preparation process thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US7677107B2 (en) * | 2007-07-03 | 2010-03-16 | Endotronix, Inc. | Wireless pressure sensor and method for fabricating wireless pressure sensor for integration with an implantable device |
| US8926524B2 (en) * | 2008-06-02 | 2015-01-06 | California Institute Of Technology | System, apparatus and method for biomedical wireless pressure sensing |
| CN103296782A (en) * | 2012-02-29 | 2013-09-11 | 朱斯忠 | Resonance derivative ring |
| CN103115704B (en) * | 2013-01-25 | 2015-01-28 | 中北大学 | Production method of kigh-temperature pressure sensor |
| CN103148977B (en) * | 2013-02-27 | 2016-01-20 | 东南大学 | Based on the passive and wireless pressure transducer had from encapsulation function of flexible base, board |
| CN103293337B (en) * | 2013-05-15 | 2015-07-29 | 中北大学 | Wireless and passive capacitive accelerometer |
| CN103926026A (en) * | 2014-05-04 | 2014-07-16 | 厦门大学 | Built-in high-temperature wireless pressure sensor |
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