CN114942091A - Ceramic capacitance pressure sensor and preparation method thereof - Google Patents
Ceramic capacitance pressure sensor and preparation method thereof Download PDFInfo
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- CN114942091A CN114942091A CN202210879125.0A CN202210879125A CN114942091A CN 114942091 A CN114942091 A CN 114942091A CN 202210879125 A CN202210879125 A CN 202210879125A CN 114942091 A CN114942091 A CN 114942091A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/14—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
- G01L1/142—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators using capacitors
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/003—Joining burned ceramic articles with other burned ceramic articles or other articles by heating by means of an interlayer consisting of a combination of materials selected from glass, or ceramic material with metals, metal oxides or metal salts
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
- C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
- C04B41/5122—Pd or Pt
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
- C04B41/81—Coating or impregnation
- C04B41/85—Coating or impregnation with inorganic materials
- C04B41/88—Metals
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/12—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in capacitance, i.e. electric circuits therefor
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
- C04B2237/10—Glass interlayers, e.g. frit or flux
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- Structural Engineering (AREA)
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- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
The invention discloses a ceramic capacitance pressure sensor and a preparation method thereof, wherein the preparation method comprises the following steps: forming a first porcelain plate; forming a first capacitance electrode on the surface of the first ceramic plate; sintering the first ceramic plate and the first capacitor electrode to form a first substrate; forming a second green ceramic plate; forming a second capacitance electrode on the surface of the second green ceramic plate; sintering the second green ceramic plate and the second capacitance electrode to form a second substrate; the first substrate and the second substrate are connected by adopting glass slurry in a sintering mode, a closed cavity is formed in the first substrate and the second substrate, the first capacitor electrode and the second capacitor electrode are located in the closed cavity, and the first capacitor electrode and the second capacitor electrode are arranged oppositely. According to the preparation method of the ceramic capacitor pressure sensor, at least two times of high-temperature sintering can be reduced, the process is simple, and energy waste can be reduced.
Description
Technical Field
The invention relates to the technical field of pressure sensors, in particular to a ceramic capacitor pressure sensor and a preparation method thereof.
Background
In traditional ceramic capacitor pressure sensor's preparation process, need set up the metal level on the ceramic plate, then carry out the high temperature sintering, and the ceramic plate generally is ripe pottery, form metal material like this and carry out high temperature sintering once more on ripe ceramic plate and prepare pressure diaphragm, and ceramic pressure sensor needs two pressure diaphragms at least, then need carry out many times high temperature sintering like this when the ceramic pressure sensor is prepared to the shape, lead to the production process too loaded down with trivial details, extravagant energy.
Disclosure of Invention
The invention aims to provide a preparation method of a ceramic capacitance pressure sensor, which can reduce at least two times of high-temperature sintering, has a simple process and can reduce energy waste.
The preparation method of the ceramic capacitance pressure sensor comprises the following steps: forming a first ceramic plate; forming a first capacitance electrode on the surface of the first ceramic plate; sintering the first green ceramic plate and the first capacitor electrode to form a first substrate; forming a second green ceramic plate; forming a second capacitance electrode on the surface of the second green ceramic plate; sintering the second green ceramic plate and the second capacitance electrode to form a second substrate; the first substrate and the second substrate are connected through glass slurry in a sintering mode, a closed cavity is formed in the first substrate and the second substrate, the first capacitor electrode and the second capacitor electrode are located in the closed cavity, and the first capacitor electrode and the second capacitor electrode are arranged oppositely.
According to some embodiments of the invention, the step of forming the first green ceramic sheet comprises: mixing glass ceramic powder and an organic adhesive to form slurry; pouring the slurry on a moving carrier tape, and performing tape casting to form a green ceramic tape; and punching and cutting the green porcelain strip to prepare and form the first green porcelain plate.
According to some embodiments of the invention, the first capacitive electrode and the second capacitive electrode are formed using screen printing.
According to some embodiments of the invention, the screen printing is performed using a 325 mesh screen.
According to some embodiments of the invention, the first capacitive electrode and the second capacitive electrode are platinum-gold material.
According to some embodiments of the invention, the step of joining the first substrate and the second substrate using glass frit sintering comprises: printing the glass slurry on the surface of the first substrate surrounding the first capacitor electrode by adopting screen printing, and heating and drying; printing the glass slurry on the surface of the second substrate surrounding the second capacitor electrode by adopting screen printing, and heating and drying; and pressing and sintering the first substrate and the second substrate by adopting a jig.
According to some embodiments of the invention, the glass paste has glass micro-pillars mixed therein.
According to some embodiments of the invention, the glass paste is screen printed with 165 mesh.
The invention also provides a ceramic capacitor pressure sensor.
The ceramic capacitive pressure sensor according to the embodiment of the invention is manufactured by the method for manufacturing the ceramic capacitive pressure sensor according to any one of the embodiments, and the ceramic capacitive pressure sensor includes: a first substrate including a first base and a first capacitor electrode; the first substrate and the second substrate are connected in a bonding mode through glass substrates to define a closed cavity, and the first capacitor electrode and the second capacitor electrode are located in the closed cavity and are arranged oppositely.
According to the ceramic capacitance pressure sensor and the preparation method thereof provided by the embodiment of the invention, the first capacitance electrode is formed on the first green ceramic plate, the second capacitance electrode is formed on the second green ceramic plate, and then high-temperature sintering is carried out, so that sintering with a metal material after firing the green ceramic into the calcined ceramic is not required, at least two sintering processes can be saved, not only is the cost of twice sintering saved and the waste of energy consumption saved, but also the preparation method is simpler, and the connection structure of the first capacitance electrode of the first substrate and the second capacitance electrode of the second substrate is more stable.
Drawings
FIG. 1 is a flow chart of a method of making a ceramic capacitive pressure sensor according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a ceramic capacitive pressure sensor according to an embodiment of the present invention;
reference numerals:
100: a ceramic capacitive pressure sensor;
1: first substrate, 11: a first substrate: 12: a first capacitance electrode;
2: second substrate, 21: a second substrate: 22: a second capacitance electrode;
3: a closed cavity;
4: a glass substrate.
Detailed Description
The ceramic capacitive pressure sensor 100 and the method for manufacturing the same according to the present invention will be described in detail with reference to the accompanying drawings and the detailed description.
A method of manufacturing the ceramic capacitive pressure sensor 100 according to the embodiment of the present invention is described below with reference to the accompanying drawings.
As shown in fig. 1, a method of manufacturing a ceramic capacitive pressure sensor 100 according to an embodiment of the present invention includes: step S1: forming a first ceramic plate; step S2: forming a first capacitance electrode 12 on the surface of the first ceramic plate; step S3: sintering the first capacitor electrode 12 and the first green ceramic plate to form a first substrate 1; step S4: forming a second green ceramic plate; step S5: forming a second capacitance electrode 22 on the surface of the second green ceramic plate; step S6: sintering the second capacitor electrode 22 and the second green ceramic plate to form a second substrate 2; step S7: the first substrate 1 and the second substrate 2 are connected by adopting glass slurry in a sintering mode, a closed cavity 3 is formed in the first substrate 1 and the second substrate 2, the first capacitor electrode 12 and the second capacitor electrode 22 are located in the closed cavity 3, and the first capacitor electrode 12 and the second capacitor electrode 22 are arranged oppositely.
Specifically, the first green porcelain plate and the second green porcelain plate may be formed from unfired ceramic green bodies, alternatively, the first green porcelain plate and the second green porcelain plate may be alumina ceramics, zirconia ceramics, or the like, it is understood that the first green porcelain plate and the second green porcelain plate may also be other types of ceramics, specifically, they may be selected according to actual needs, the first green porcelain plate and the second green porcelain plate may be different types of ceramics, and may also be the same type of ceramics, preferably, the first green porcelain plate and the second green porcelain plate may be the same type of ceramics, such as alumina ceramics, so as to facilitate subsequent sintering and subsequent bonding of the first green porcelain plate and the second green porcelain plate.
In some examples of the invention, the step of forming the first green sheet may include: mixing glass ceramic powder and an organic adhesive to form slurry; pouring the slurry on a moving carrier tape, and performing tape casting to form a green ceramic tape; and punching and cutting the green porcelain strip to prepare and form the first green porcelain plate. Specifically, the first green ceramic plate may be formed by a co-fired ceramic technology, glass ceramic powder and an organic binder are mixed and pulped according to a certain ratio to form slurry, then the slurry is cast on a moving carrier tape by a tape casting technology, optionally, the slurry is cast and formed by a double-edge technology, so that a dense green ceramic tape with uniform thickness and sufficient strength can be formed, then the green ceramic tape can be dried, and finally, the green ceramic tape is punched and cut by a blanking process and a relevant die to prepare the first green ceramic plate with a required shape, wherein, a cutting machine, a laser or a punch press and the like can be used for cutting.
The second green porcelain plate may be formed by the same process as the first green porcelain plate, for example, the step of forming the second green porcelain plate may include forming a slurry by mixing glass ceramic powder and an organic binder; pouring the slurry on a moving carrier tape, and performing tape casting to form a green ceramic tape; and punching and cutting the green porcelain strip to prepare and form the second green porcelain plate.
As shown in fig. 1, step S2: form first capacitance electrode 12 on first ceramic plate surface, specifically, first ceramic plate can be used to bear the pressure, carries on first capacitance electrode 12, and first capacitance electrode 12 can adopt metal material to form, specifically, can adopt screen printing technique with the metal thick liquids printing on first ceramic plate, and the metal thick liquids shape that screen printing and sintering are better to can form the better first capacitance electrode 12 of appearance. Then, step S3 is executed: the first green ceramic plate and the first capacitor electrode 12 are sintered to form the first substrate 1, specifically, the first green ceramic plate printed with the first capacitor electrode 12 is placed in a sintering furnace to be sintered at a high temperature, and specifically, the first green ceramic plate can be heated and fired according to a set temperature curve, so that the binder in the first green ceramic plate can be gasified or burned out, and simultaneously, the organic binder in the metal slurry is gasified or burned out, so that the first green ceramic plate is sintered to form a fired ceramic plate, and the first capacitor electrode 12 and the fired ceramic plate are connected together by sintering to form the first substrate 1.
Step S4: forming a second green ceramic plate, which may be formed by the same process as the first green ceramic plate, step S5: the second capacitor electrode 22 is formed on the second green ceramic plate, and the second capacitor electrode 22 can be formed in the same manner as the first capacitor electrode 12, for example, the second capacitor electrode 22 can be formed by using a metal material, a metal paste can be printed on the second green ceramic plate by using a screen printing technique, and the shape of the metal paste which is screen printed and sintered is better, so that the second capacitor electrode 22 with better appearance can be formed. The second green ceramic plate and the second capacitor electrode 22 are then sintered to form the second substrate 2. Both the first and second capacitor electrodes 12 and 22 can be formed by screen printing, and alternatively, the first and second capacitor electrodes 12 and 22 can be formed by screen printing using a 325-mesh screen. Thereby enabling the formation of a better first capacitive electrode 12 and second capacitive electrode 22.
In some embodiments, the first capacitive electrode 12 and the second capacitive electrode 22 may be made of platinum materials, a sintering temperature of the platinum materials is relatively close to a sintering temperature of the green ceramic plate, and a temperature rise curve during high-temperature sintering may be consistent, so as to facilitate high-temperature sintering to form the first substrate 1 and the second substrate 2, specifically, the sintering temperature of the platinum materials is substantially 800-1200 ℃, and a high-temperature sintering temperature of the green ceramic in the low-temperature co-firing technology is substantially 850-875 ℃, and temperature ranges of the two temperatures are highly overlapped, so that high-temperature sintering of the first capacitive electrode 12 and the first green ceramic plate, and high-temperature sintering of the second capacitive electrode 22 and the second green ceramic plate are more easily achieved.
Then, step S7 is executed to bond the first substrate 1 and the second substrate 2, for example, the first substrate 1 and the second substrate 2 may be sintered and bonded by using glass paste, specifically, the first capacitor electrode 12 is located on a side of the first substrate 1 facing the second substrate 2, the first capacitor electrode 12 covers a part of the first green ceramic plate, the glass paste may be printed on a part of the surface of the first substrate 1 surrounding the first capacitor electrode 12 according to a certain pattern, and then heating and drying are performed to fix the glass paste and the first substrate 1; the second capacitor electrode 22 is located on one side of the second substrate 2 facing the first substrate 1 and covers a part of the surface of the second green ceramic plate, the glass paste can be printed on a part of the surface of the second substrate 2 surrounding the second capacitor electrode 22 according to a certain pattern, then heating and drying are performed to fix the glass paste and the second substrate 2, and then the first substrate 1 printed with the first capacitor electrode 12 and the second substrate 2 printed with the second capacitor electrode 22 are combined by a jig and sintered to bond the two substrates together, thereby forming the ceramic capacitor pressure sensor 100. Thus, a closed cavity 3 is formed between the first substrate 1 and the second substrate 2, and the first capacitor electrode 12 and the second capacitor electrode 22 are both located in the closed cavity 3 and are arranged oppositely, so that the interference of the external environment can be avoided.
Therefore, according to the manufacturing method of the ceramic capacitive pressure sensor 100 of the embodiment of the invention, the first capacitive electrode 12 is formed on the first green ceramic plate, the second capacitive electrode 22 is formed on the second green ceramic plate, and then high-temperature sintering is performed, without sintering the green ceramic into the calcined ceramic and then sintering the calcined ceramic with the metal material, so that at least two sintering processes can be saved, not only is the cost of two sintering processes saved and the waste of energy consumption saved, but also the manufacturing method is simpler, and the connection structure of the first capacitive electrode 12 of the first substrate 1 and the second capacitive electrode 22 of the second substrate 2 can be more stable.
In some embodiments, glass pillars, that is, glass particles having a certain volume shape, may be mixed in the glass paste for pressing and sintering the first substrate 1 and the second substrate 2, and the glass pillars may be glass particles having an irregular shape or glass particles having a regular shape, for example, glass pillars having a cylindrical shape, a square shape, or a rectangular parallelepiped shape, and the invention is not limited thereto, as long as the glass pillars have a certain volume and can play a supporting role. Therefore, glass particles can be mixed in the glass paste, so that when the first substrate 1 and the second substrate 2 are pressed, the glass particles can play a role in supporting and limiting, a certain thickness is defined between the first substrate 1 and the second substrate 2, the cavity 3 can be sealed, the first capacitor electrode 12 and the second capacitor electrode 22 can be separated by a certain distance, and the first substrate 1 and the second substrate 2 are prevented from being too close to each other when being pressed.
In some examples, 165-mesh screen printing may be used when printing the glass paste on the first and second substrates 1 and 2 to facilitate printing the release paste on the first and second substrates 1 and 2 in a predetermined pattern using a screen printing technique.
The invention further provides a ceramic capacitive pressure sensor 100, and the ceramic capacitive pressure sensor 100 can be prepared by the preparation method of the ceramic capacitive pressure sensor 100 of the embodiment.
As shown in fig. 2, a ceramic capacitive pressure sensor 100 according to an embodiment of the present invention may include: a first substrate 1 and a second substrate 2, the first substrate 1 including a first base 11 and a first capacitor electrode 12; the second substrate 2 comprises a second substrate 21 and a second capacitance electrode 22, the first substrate 11 and the second substrate 21 are bonded and connected by adopting a glass substrate 4 to define a closed cavity 3, and the first capacitance electrode 12 and the second capacitance electrode 22 are both located in the closed cavity 3 and are oppositely arranged.
The ceramic capacitive pressure sensor 100 according to the embodiment of the invention has simple preparation and low energy consumption, and the first substrate 11 and the first capacitive electrode 12 and the second substrate 21 and the second capacitive electrode 22 are connected more tightly and firmly.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (9)
1. A method for preparing a ceramic capacitive pressure sensor, comprising:
forming a first ceramic plate;
forming a first capacitance electrode on the surface of the first ceramic plate;
sintering the first green ceramic plate and the first capacitor electrode to form a first substrate;
forming a second green ceramic plate;
forming a second capacitance electrode on the surface of the second green ceramic plate;
sintering the second green ceramic plate and the second capacitance electrode to form a second substrate;
the first substrate and the second substrate are connected through glass slurry in a sintering mode, a closed cavity is formed in the first substrate and the second substrate, the first capacitor electrode and the second capacitor electrode are located in the closed cavity, and the first capacitor electrode and the second capacitor electrode are arranged oppositely.
2. The method of making a ceramic capacitive pressure sensor of claim 1, wherein the step of forming the first ceramic plate comprises:
mixing glass ceramic powder and an organic adhesive to form slurry;
pouring the slurry on a moving carrier tape, and performing tape casting to form a green ceramic tape;
and punching and cutting the green porcelain strip to prepare and form the first green porcelain plate.
3. The method of manufacturing a ceramic capacitive pressure sensor according to claim 1, wherein the first capacitive electrode and the second capacitive electrode are formed by screen printing.
4. The method of claim 3, wherein the screen printing is performed with a 325 mesh screen.
5. The method of claim 1, wherein the first capacitive electrode and the second capacitive electrode are made of platinum alloy.
6. The method of claim 1, wherein the step of joining the first substrate to the second substrate using a glass paste frit connection comprises:
printing the glass slurry on the surface of the first substrate surrounding the first capacitor electrode by adopting screen printing, and heating and drying;
printing the glass slurry on the surface of the second substrate surrounding the second capacitor electrode by adopting screen printing, and heating and drying;
and pressing and sintering the first substrate and the second substrate by adopting a jig.
7. The method of claim 6, wherein the glass pillars are mixed in the glass paste.
8. The method of claim 6, wherein the glass paste is screen printed with 165 mesh.
9. A ceramic capacitive pressure sensor prepared by the method of any one of claims 1 to 8, the ceramic capacitive pressure sensor comprising:
a first substrate including a first base and a first capacitor electrode;
the first substrate and the second substrate are connected in a bonding mode through glass substrates to define a closed cavity, and the first capacitor electrode and the second capacitor electrode are located in the closed cavity and are arranged oppositely.
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| CN202210879125.0A CN114942091A (en) | 2022-07-25 | 2022-07-25 | Ceramic capacitance pressure sensor and preparation method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115165163A (en) * | 2022-09-06 | 2022-10-11 | 昆山灵科传感技术有限公司 | Pressure sensing structure and manufacturing method thereof, pressure sensor and manufacturing method thereof |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107316744A (en) * | 2017-07-13 | 2017-11-03 | 中国振华集团云科电子有限公司 | A kind of chip multilayer gold electrode chip capacitor and preparation method thereof |
| CN108507621A (en) * | 2018-05-18 | 2018-09-07 | 中国科学院上海硅酸盐研究所 | Passive and wireless pressure, temperature integrated sensor based on LTCC and preparation method thereof |
| CN108922779A (en) * | 2018-07-12 | 2018-11-30 | 中国振华集团云科电子有限公司 | A kind of chip through-hole gold electrode chip capacitor and preparation method thereof |
| CN109297621A (en) * | 2018-07-19 | 2019-02-01 | 深圳振华富电子有限公司 | Wireless and passive LC pressure sensor and manufacturing method |
| CN111664968A (en) * | 2020-07-15 | 2020-09-15 | 襄阳臻芯传感科技有限公司 | Method for manufacturing ceramic capacitive pressure sensor |
| CN111693186A (en) * | 2020-05-12 | 2020-09-22 | 江苏大学 | Preparation method of ceramic capacitive pressure sensor electrode |
| CN112834084A (en) * | 2020-12-29 | 2021-05-25 | 襄阳臻芯传感科技有限公司 | Ceramic capacitive pressure sensor core and manufacturing method thereof |
-
2022
- 2022-07-25 CN CN202210879125.0A patent/CN114942091A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107316744A (en) * | 2017-07-13 | 2017-11-03 | 中国振华集团云科电子有限公司 | A kind of chip multilayer gold electrode chip capacitor and preparation method thereof |
| CN108507621A (en) * | 2018-05-18 | 2018-09-07 | 中国科学院上海硅酸盐研究所 | Passive and wireless pressure, temperature integrated sensor based on LTCC and preparation method thereof |
| CN108922779A (en) * | 2018-07-12 | 2018-11-30 | 中国振华集团云科电子有限公司 | A kind of chip through-hole gold electrode chip capacitor and preparation method thereof |
| CN109297621A (en) * | 2018-07-19 | 2019-02-01 | 深圳振华富电子有限公司 | Wireless and passive LC pressure sensor and manufacturing method |
| CN111693186A (en) * | 2020-05-12 | 2020-09-22 | 江苏大学 | Preparation method of ceramic capacitive pressure sensor electrode |
| CN111664968A (en) * | 2020-07-15 | 2020-09-15 | 襄阳臻芯传感科技有限公司 | Method for manufacturing ceramic capacitive pressure sensor |
| CN112834084A (en) * | 2020-12-29 | 2021-05-25 | 襄阳臻芯传感科技有限公司 | Ceramic capacitive pressure sensor core and manufacturing method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115165163A (en) * | 2022-09-06 | 2022-10-11 | 昆山灵科传感技术有限公司 | Pressure sensing structure and manufacturing method thereof, pressure sensor and manufacturing method thereof |
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Application publication date: 20220826 |