CN111664968A - Method for manufacturing ceramic capacitive pressure sensor - Google Patents
Method for manufacturing ceramic capacitive pressure sensor Download PDFInfo
- Publication number
- CN111664968A CN111664968A CN202010678119.XA CN202010678119A CN111664968A CN 111664968 A CN111664968 A CN 111664968A CN 202010678119 A CN202010678119 A CN 202010678119A CN 111664968 A CN111664968 A CN 111664968A
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- China
- Prior art keywords
- pressure sensor
- electrode
- capacitive pressure
- substrate
- ceramic capacitive
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/14—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
- G01L1/142—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators using capacitors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/12—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in capacitance, i.e. electric circuits therefor
Abstract
The invention relates to a method for manufacturing a ceramic capacitive pressure sensor, which is used for polishing the surface of an electrode formed on a substrate in the manufacturing process of the ceramic capacitive pressure sensor so as to flatten the surface of the electrode. According to the manufacturing method of the ceramic capacitive pressure sensor, the surface of the electrode of the substrate of the ceramic capacitive pressure sensor is ground and polished, so that the surface of the electrode is fine and smooth; thereby ensuring the qualification rate of the ceramic capacitive pressure sensor and improving the reliability of the product.
Description
Technical Field
The invention relates to the technical field of pressure sensors, in particular to a manufacturing method of a ceramic capacitive pressure sensor.
Background
At present, the electrodes are arranged on each opposite surface of two thick and thin ceramic substrates of the ceramic capacitive pressure sensor, conductive slurry such as gold paste, silver paste, copper paste and the like is usually adopted for electrode slurry, the conductive slurry is printed on the surfaces of the two thick and thin ceramic substrates in a screen printing mode, and sealing materials (such as glass) are added into ceramic beads or resin beads to serve as spacers to control the distance between the electrodes, so that a capacitor with a specified initial capacitance value is formed. When the ceramic substrate is subjected to external pressure, the thin substrate is deformed, so that the capacitance value is changed, and the external pressure born by the substrate can be detected according to the change value of the capacitance. The two ceramic substrate electrodes of the ceramic capacitive pressure sensor are formed by printing conductive paste, then sintering the conductive paste, and sintering and bonding the conductive paste through a sealing material (such as glass), and the two ceramic substrate electrodes are combined together in appearance. Because the distance between the electrode surfaces of the two thick and thin ceramic substrates is too close, the sizes of conductive particles in the conductive slurry are different, the conductive slurry is agglomerated, the process impurity pollution and the like can cause small bulges 6 (shown in figure 4) on the electrode surface, and the small bulges can lead the output of the ceramic capacitive pressure sensor to be cut off in advance, thereby greatly influencing the qualification rate and the reliability.
Disclosure of Invention
In order to solve the technical problems, the invention provides a manufacturing method of a ceramic capacitive pressure sensor, which is used for carrying out grinding and polishing treatment on the surface of a substrate electrode of the ceramic capacitive pressure sensor so as to ensure the qualification rate of the ceramic capacitive pressure sensor and improve the reliability of a product.
The technical scheme adopted by the invention for solving the technical problems is as follows: in the manufacturing process of the ceramic capacitive pressure sensor, the surface of an electrode formed on a substrate is ground and polished to flatten the surface of the electrode.
Further, a grinding and polishing head is adopted to grind and polish the surface of the electrode.
Further, the polishing head includes, but is not limited to, plastic brushes, bristle brushes.
Further, in the grinding and polishing process, electrode grinding and polishing liquid is added, and the grinding and polishing time is 2-15 seconds; the electrode polishing solution is a solvent which does not corrode metal.
Further, the electrode formed on the substrate is formed by printing electrode slurry on the substrate and then sintering; wherein the electrode slurry is prepared from conductive powder, and the granularity D50 of the conductive powder is not more than 1 μm.
Further, the conductive powder includes, but is not limited to, gold, silver, and copper.
Further, the electrode paste is printed on the substrate in a screen printing mode under the environment condition of thousands of levels of dust-free at constant temperature and humidity.
Further, the thickness of the electrode formed on the substrate is not more than 1 μm.
Furthermore, the ceramic capacitive pressure sensor comprises a thin substrate with an electrode and a thick substrate with an electrode, wherein after the electrodes of the thin substrate and the thick substrate are polished, sealing slurry is printed between the edges of the thin substrate and the thick substrate, and then the sealing slurry is sintered to form the ceramic capacitive pressure sensor.
The invention has the advantages that: according to the manufacturing method of the ceramic capacitive pressure sensor, the surface of the electrode of the substrate of the ceramic capacitive pressure sensor is ground and polished, so that the surface of the electrode is fine and smooth; thereby ensuring the qualification rate of the ceramic capacitive pressure sensor and improving the reliability of the product.
Drawings
FIG. 1 is a schematic diagram of a ceramic capacitive pressure sensor fabricated by a method of fabricating a ceramic capacitive pressure sensor according to an embodiment;
FIG. 2 is a schematic diagram of a thin substrate with electrodes in a ceramic capacitive pressure sensor manufactured by a method for manufacturing a ceramic capacitive pressure sensor according to an embodiment;
FIG. 3 is a schematic diagram of a thick substrate with electrodes of a ceramic capacitive pressure sensor manufactured by a method for manufacturing a ceramic capacitive pressure sensor according to an embodiment;
fig. 4 is a schematic illustration of a thin substrate with electrodes in a prior art ceramic capacitive pressure sensor.
Detailed Description
For the purpose of enhancing the understanding of the present invention, the present invention will be described in further detail with reference to the accompanying drawings and examples, which are provided for the purpose of illustration only and are not intended to limit the scope of the present invention.
Examples
The embodiment provides a manufacturing method of a ceramic capacitive pressure sensor, which comprises the following steps:
firstly, preparing electrode slurry: firstly, slowly grinding the electrode slurry to be used in a slow grinding frame at a slow grinding speed of 1 r/min for 12-24 hours for later use, so that the granularity D50 of the conductive powder in the electrode slurry is not more than 1 micron;
secondly, printing: printing the electrode slurry on a clean thick substrate and a clean thin substrate to form electrode patterns; the process needs to be in a thousand-level purification ring, so that no impurities exist in the electrode;
thirdly, drying: drying the electrode slurry at the drying temperature of 100-;
fourthly, electrode sintering: the sintering temperature is 750-950 ℃, the temperature is kept for 10-15 minutes, and a tunnel sintering furnace can be adopted for electrode sintering, so that the conductive slurry of the thick substrate and the thin substrate printed with the electrodes is firmly combined with the substrate;
fifthly, electrode grinding and polishing treatment: placing a plastic brush or bristle brush on a thin substrate electrode and a thick substrate electrode to be polished, adding a solvent (such as water) which does not corrode metal, and polishing for 2-10 seconds to make the surfaces of the electrodes fine and smooth;
sixthly, electrode cleaning: putting the polished thin substrate with the electrode and the polished thick substrate with the electrode into an ultrasonic cleaning machine for cleaning, and drying after ultrasonic cleaning;
seventhly, sealing: printing sealing slurry 3 on the edge of the thick substrate 2 with the electrode 5 or the thin substrate 1 with the electrode 5, drying and sintering to seal the electrodes of the thick substrate with the electrode and the thin substrate with the electrode into an integral capacitor;
and eighthly, pouring silver adhesive into corresponding electrode lead-out holes on the thick substrate and the thin substrate, inserting a lead-out wire 4, and curing to obtain the ceramic capacitive pressure sensor (shown in figure 1).
In the method for manufacturing a ceramic capacitive pressure sensor according to this embodiment, the thin substrate and the thick substrate refer to relative thicknesses, and generally, the thick substrate is used as a support, the thin substrate is used as a pressure-receiving body, and the thin substrate with the electrodes deforms after being pressed, so that the distance between the two electrodes changes, and further the capacitance changes accordingly.
For the substrate with the electrode prepared by the existing method, the non-polished electrode surface is observed by a microscope, and is rough and uneven, and foreign particle pollution exists (as shown in figure 4); in a pressurizing capacity output cut-off test after the ceramic capacitive pressure sensor is assembled, the reject ratio of a product with output cut-off in advance is two thousandth under the condition of two-bit full-scale pressure; for the substrate with the electrode prepared by the method of the embodiment, the polished electrode surface is fine and smooth and has no foreign matter pollution (as shown in fig. 2 and 3) by observing through a microscope; in a pressurization capacity output cut-off test after the ceramic capacitance type pressure sensor is assembled, under the condition of two-bit full-scale pressure, the reject ratio of a product with output cut-off in advance is only zero five of ten thousandths.
The above embodiments should not limit the present invention in any way, and all technical solutions obtained by using equivalent alternatives or equivalent transformations fall within the protection scope of the present invention.
Claims (9)
1. A manufacturing method of a ceramic capacitive pressure sensor is characterized by comprising the following steps: in the manufacturing process of the ceramic capacitive pressure sensor, the surface of the electrode formed on the substrate is ground and polished to flatten the surface of the electrode.
2. The method of claim 1, wherein the step of forming the ceramic capacitive pressure sensor comprises: and grinding and polishing the surface of the electrode by using a grinding and polishing head.
3. The method of claim 2, wherein the step of forming the ceramic capacitive pressure sensor comprises: polishing heads include, but are not limited to, plastic brushes, bristle brushes.
4. The method of claim 2, wherein the step of forming the ceramic capacitive pressure sensor comprises: adding electrode polishing liquid in the polishing process, wherein the polishing time is 2-15 seconds; the electrode polishing solution is a solvent which does not corrode metal.
5. The method of claim 1, wherein the step of forming the ceramic capacitive pressure sensor comprises: the electrode formed on the substrate is formed by printing electrode slurry on the substrate and then sintering; wherein the electrode slurry is prepared from conductive powder, and the granularity D50 of the conductive powder is not more than 1 μm.
6. The method of claim 5, wherein the step of forming the ceramic capacitive pressure sensor comprises: the conductive powder comprises the components of, but not limited to, gold, silver and copper.
7. The method of claim 6, wherein the step of forming the ceramic capacitive pressure sensor comprises: the electrode paste is printed on a substrate in a screen printing mode under the environment condition of constant temperature and humidity and thousands of levels of dust-free.
8. The method of any one of claims 1-7, wherein: the thickness of the electrode formed on the substrate is not more than 1 μm.
9. The method of claim 8, wherein the step of forming a ceramic capacitive pressure sensor comprises: the ceramic capacitive pressure sensor comprises a thin substrate with an electrode and a thick substrate with an electrode, wherein the electrodes of the thin substrate and the thick substrate are polished, sealing slurry is printed between the edges of the thin substrate and the thick substrate, and then sintering is carried out, so that the ceramic capacitive pressure sensor is formed.
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| CN202010678119.XA CN111664968A (en) | 2020-07-15 | 2020-07-15 | Method for manufacturing ceramic capacitive pressure sensor |
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| CN202010678119.XA CN111664968A (en) | 2020-07-15 | 2020-07-15 | Method for manufacturing ceramic capacitive pressure sensor |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112834084A (en) * | 2020-12-29 | 2021-05-25 | 襄阳臻芯传感科技有限公司 | Ceramic capacitive pressure sensor core and manufacturing method thereof |
| CN113884225A (en) * | 2021-10-09 | 2022-01-04 | 广州九思科技有限公司 | Transient response ceramic capacitance pressure sensor and manufacturing method thereof |
| CN114942091A (en) * | 2022-07-25 | 2022-08-26 | 昆山灵科传感技术有限公司 | Ceramic capacitance pressure sensor and preparation method thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112834084A (en) * | 2020-12-29 | 2021-05-25 | 襄阳臻芯传感科技有限公司 | Ceramic capacitive pressure sensor core and manufacturing method thereof |
| CN113884225A (en) * | 2021-10-09 | 2022-01-04 | 广州九思科技有限公司 | Transient response ceramic capacitance pressure sensor and manufacturing method thereof |
| CN114942091A (en) * | 2022-07-25 | 2022-08-26 | 昆山灵科传感技术有限公司 | Ceramic capacitance pressure sensor and preparation method thereof |
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Application publication date: 20200915 |