CN113884225A - Transient response ceramic capacitance pressure sensor and manufacturing method thereof - Google Patents
Transient response ceramic capacitance pressure sensor and manufacturing method thereof Download PDFInfo
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- 239000000919 ceramic Substances 0.000 title claims abstract description 130
- 230000004044 response Effects 0.000 title claims abstract description 22
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 230000001052 transient effect Effects 0.000 title claims description 8
- 238000002955 isolation Methods 0.000 claims abstract description 24
- 239000004020 conductor Substances 0.000 claims abstract description 22
- 238000005516 engineering process Methods 0.000 claims abstract description 16
- 239000003985 ceramic capacitor Substances 0.000 claims abstract description 5
- 238000005245 sintering Methods 0.000 claims description 37
- 238000001035 drying Methods 0.000 claims description 34
- 239000000758 substrate Substances 0.000 claims description 22
- 239000011265 semifinished product Substances 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 17
- 239000000047 product Substances 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 15
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- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 12
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 12
- 239000002002 slurry Substances 0.000 claims description 11
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 10
- 229910000510 noble metal Inorganic materials 0.000 claims description 10
- 229910052709 silver Inorganic materials 0.000 claims description 10
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- 239000010935 stainless steel Substances 0.000 claims 1
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- 230000008569 process Effects 0.000 description 5
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/14—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
- G01L1/142—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators using capacitors
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/12—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in capacitance, i.e. electric circuits therefor
Abstract
The invention relates to the technical field of sensors, in particular to a ceramic capacitance pressure sensor with instant response and a manufacturing method thereof. The ceramic capacitor pressure sensor comprises a lower ceramic base, wherein a lower electrode plate is arranged on the upper portion of the lower ceramic base and comprises a lower electrode pad, the lower electrode pad is arranged at one end of the lower electrode plate, a ceramic isolation layer is arranged on the upper portion of the lower electrode plate, an upper electrode plate is arranged on the upper portion of the ceramic isolation layer, a connecting conductor is further arranged on the upper portion of the lower ceramic base, and the lower electrode pad is electrically connected with the upper electrode plate through the connecting conductor. The linearity and the response speed of the ceramic capacitance pressure sensor are improved by the manufacturing method, and the instant response time is reduced; through the manufacturing of the precise silk-screen technology, the yield of products is improved, and the production cost of the products is reduced.
Description
Technical Field
The invention relates to the technical field of sensors, in particular to a ceramic capacitance pressure sensor with instant response and a manufacturing method thereof.
Background
The pressure sensor is widely applied in the fields of automobiles, air conditioners, Internet of things and the like, most of the existing ceramic pressure capacitance sensors in the market at present are composed of an upper ceramic electrode plate, a glass bead layer and a lower ceramic electrode plate, as shown in figure 1, the upper ceramic electrode plate and the lower ceramic electrode plate of the technical scheme control the distance between the two electrode plates through glass beads so as to control the size of an initial capacitance value, the glass bead layer is the most important technical link of the sensor, but the processing precision of the glass beads is not high, the size precision range of the glass beads is commonly 10+/-0.2um, the precision error is larger, the consistency and the linearity of the initial capacitance value of a product are seriously influenced, the processing technology of using the glass beads as the isolating layers of the upper ceramic electrode plate and the lower ceramic electrode plate is complex, and the yield of the ceramic capacitance pressure sensors is low, the product cost is high.
Disclosure of Invention
The invention aims to provide a ceramic capacitance pressure sensor with instant response and a manufacturing method thereof, which aim to solve the existing problems: the existing ceramic pressure capacitance sensor has low processing precision of glass beads, so that the precision error is large, and the consistency and the linearity of the initial capacitance value of a product are seriously influenced.
In order to achieve the purpose, the invention adopts the following technical scheme:
the utility model provides a ceramic capacitor pressure sensor of transient response, includes lower part ceramic substrate, the upper portion of lower part ceramic substrate is provided with the lower part plate electrode, the lower part plate electrode includes lower part electrode pad, the lower part electrode pad sets up the one end of lower part plate electrode, the upper portion of lower part plate electrode is provided with the ceramic isolation layer, the upper portion of ceramic isolation layer is provided with the upper portion plate electrode, the upper portion of lower part ceramic substrate still is provided with connecting conductor, the lower part electrode pad passes through connecting conductor and upper portion plate electrode electric connection, the upper portion of lower part ceramic substrate and the top that is located the upper portion plate electrode are provided with upper portion forced induction pottery.
Preferably, the thickness of the lower ceramic base is 0.635mm to 1mm, the thickness of the ceramic isolation layer is 19.9 μm to 20.1 μm, and the thickness of the upper pressure sensing ceramic is 0.1mm to 0.25 mm.
A method for manufacturing an instant response ceramic capacitive pressure sensor is used for the instant response ceramic capacitive pressure sensor, and comprises the following steps:
the method comprises the following steps: preparing an upper electrode plate, and selecting upper pressure induction ceramics with transverse and longitudinal scribing grooves;
step two: printing an upper electrode plate film layer on each unit of the upper pressure sensing ceramic with a scribing groove surface by using a noble metal conductor slurry by using a thick film forming technology, and drying the upper electrode plate film layer printed by the printing to form a drying film;
step three: sintering the upper electrode plate film layer prepared in the second step to form the upper electrode plate film layer with good conductivity and strong adhesive force;
step four: dividing the whole spliced plate product into single pieces according to the existing scribing grooves to form a semi-finished product of the single piece of the upper electrode plate for the later process;
step five: preparing a lower electrode plate and a lower electrode pad, and selecting a lower ceramic base with transverse and longitudinal scribing grooves;
step six: printing a lower electrode plate and a lower electrode pad film layer on each unit of the lower ceramic base with a scribing groove surface by using a thick film forming technology and noble metal conductor slurry, and drying the lower electrode plate and the lower electrode pad film layer to form a drying film;
step seven: sintering the lower electrode plate and the lower electrode pad film layer which are prepared in the sixth step to form the lower electrode plate and the lower electrode pad film layer which have good conductivity and strong adhesive force;
step eight: preparing a ceramic isolation layer, namely preparing a ceramic isolation layer film layer on the lower electrode plate and the lower electrode pad film layer prepared in the seventh step by using an insulating ceramic slurry through a precision screen printing technology;
step nine: preparing a connecting conductor, injecting conductive silver adhesive at the position of the lower electrode pad corresponding to the pad connected with the lower electrode plate on the basis of the ceramic isolating layer film prepared in the step eight by using a precise dispensing technology and using the conductive silver adhesive;
step ten: mounting the upper electrode plate and the lower electrode plate, mounting the single-piece semi-finished product of the upper electrode plate prepared in the first step to the fourth step to the upper part of the lower electrode plate prepared in the fifth step to the ninth step, and drying the mounted semi-finished product to finish the drying and curing of the ceramic isolating layer film and the connecting conductor film;
step eleven: attaching the semi-finished product to the upper electrode plate and the lower electrode plate which are dried and cured in the step ten, and sintering to form a semi-finished product;
step twelve: dividing the whole semi-finished product into single pieces according to the existing scribing grooves to form a single piece finished product;
step thirteen: and performing performance test, appearance inspection, packaging and warehousing on the single-chip finished product obtained in the step twelve.
Preferably, the thickness of the upper pressure sensing ceramic is 0.1mm-0.25mm, the material of the upper pressure sensing ceramic is a 96% alumina ceramic substrate, the material of the upper pressure sensing ceramic is also a 99% alumina ceramic substrate, and the material of the upper pressure sensing ceramic is also a 99% zirconia ceramic substrate.
Preferably, the drying temperature in the second step is 120-200 ℃, the drying time in the second step is 10-15 minutes, and the thickness of the dried film in the second step is 5-10 μm.
Preferably, the sintering temperature in the third step is 840-900 ℃, the sintering peak temperature in the third step is 850 ℃, and the sintering time in the third step is 30-60 minutes.
Preferably, the thickness of the lower ceramic base is 0.635mm-1.0mm, the material of the lower ceramic base is 96% of alumina ceramic substrate, the material of the lower ceramic base is 99% of alumina ceramic substrate, and the material of the upper pressure sensing ceramic is also 99% of zirconia ceramic substrate.
Preferably, the drying temperature in the sixth step is 120-200 ℃, the drying time in the sixth step is 10-15 minutes, the drying film thickness in the sixth step is 9-11 μm, the drying temperature in the tenth step is 120-200 ℃, and the drying time in the sixth step is 10-15 minutes.
Preferably, the sintering temperature in the seventh step is 840-900 ℃, the sintering peak temperature in the seventh step is 850 ℃, the sintering time in the seventh step is 30-60 minutes, the sintering temperature in the eleventh step is 600-900 ℃, the sintering peak temperature in the eleventh step is 600 ℃, and the sintering time in the eleventh step is 30-60 minutes.
Preferably, in the step eight, the wire mesh used is a precision stainless steel wire mesh, the mesh number of the wire mesh is 400 meshes, the wire diameter is 0.1 μm, and the thickness of the ceramic isolation layer film is 19.9 μm-20.1 μm.
Step thirteen: the single-chip finished product obtained in the step twelve is subjected to performance test, appearance inspection, packaging and warehousing
The invention has at least the following beneficial effects:
1. the invention improves the linearity and response speed of the ceramic capacitance pressure sensor by the manufacturing method and reduces the instant response time.
2. The invention improves the yield of products and reduces the production cost of the products by the manufacturing of the precise silk-screen technology.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic diagram of the overall structure of a conventional ceramic capacitive pressure sensor;
FIG. 2 is a schematic view of the overall structure of the present invention;
fig. 3 is an exploded view of the present invention.
In the figure: 1. a lower ceramic base; 2. a lower electrode plate; 3. a lower electrode pad; 4. a ceramic isolation layer; 5. a connecting conductor; 6. an upper electrode plate; 7. an upper pressure sensitive ceramic.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Example 1:
referring to fig. 1-3, an instantaneous response ceramic capacitor pressure sensor comprises a lower ceramic base 1, wherein the lower ceramic base 1 has a thickness of 0.635mm-1mm, a lower electrode plate 2 is arranged on the upper portion of the lower ceramic base 1, the lower electrode plate 2 comprises a lower electrode pad 3, the lower electrode pad 3 is arranged at one end of the lower electrode plate 2, a ceramic isolation layer 4 is arranged on the upper portion of the lower electrode plate 2, the thickness of the ceramic isolation layer 4 is 19.9 μm-20.1 μm, an upper electrode plate 6 is arranged on the upper portion of the ceramic isolation layer 4, a connecting conductor 5 is further arranged on the upper portion of the lower ceramic base 1, the lower electrode pad 3 is electrically connected with the upper electrode plate 6 through the connecting conductor 5, an upper pressure sensing ceramic 7 is arranged on the upper portion of the lower ceramic base 1 and above the upper electrode plate 6, and the thickness of the upper pressure sensing ceramic 7 is 0.1mm-0.25 mm;
in summary, when pressure is applied to the upper surface of the upper pressure sensing ceramic 7 of the sensor, the upper pressure sensing ceramic 7 serves as a pressure sensing area, and the upper pressure sensing ceramic 7 has a relatively small ceramic thickness and a relatively precise electrode plate spacing, so that the upper pressure sensing ceramic 7 and the lower ceramic base 1 are slightly deformed, and a change in capacitance value is detected in the lower electrode pad 3, thereby rapidly converting a change in pressure into a change in capacitance value, improving linearity and response speed of the ceramic capacitive pressure sensor, and reducing transient response time.
Example 2:
on the basis of the above example 1, a manufacturing method thereof is disclosed:
the method comprises the following steps: preparing an upper electrode plate 6, selecting upper pressure sensing ceramics 7 with transverse and longitudinal scribing grooves, wherein the transverse and longitudinal scribing grooves are beneficial to the subsequent process to divide the upper pressure sensing ceramics 7 into small rectangular units, the thickness of the upper pressure sensing ceramics 7 is 0.1-0.25 mm, the material of the upper pressure sensing ceramics 7 is an alumina ceramic substrate with the concentration of 96%, the material of the upper pressure sensing ceramics 7 is an alumina ceramic substrate with the concentration of 99%, and the material of the upper pressure sensing ceramics 7 is a zirconia ceramic substrate with the concentration of 99%;
step two: applying a thick film forming technology, printing an upper electrode plate 6 film layer on each unit of the upper pressure induction ceramic 7 with a scribing groove surface by using noble metal conductor slurry or alloy metal thereof, wherein the noble metal conductor slurry is made of silver, palladium, platinum, gold and other noble metals, and the upper electrode plate 6 film layer is printed and dried at the drying temperature of 120-200 ℃ for 10-15 minutes to form a drying film, and the thickness of the drying film is 5-10 mu m;
step three: sintering the upper electrode plate 6 film layer prepared in the second step, wherein the sintering temperature is 840-900 ℃, the sintering peak temperature is 850 ℃, and the sintering time is 30-60 minutes, so as to form the upper electrode plate 6 film layer with good conductivity and strong adhesive force;
step four: dividing the whole spliced plate product into single pieces according to the existing scribing grooves of the upper electrode plate 6 which is sintered in the third step to form a semi-finished product of the single piece of the upper electrode plate 6 for the later process;
step five: preparing a lower electrode plate 2 and a lower electrode pad 3, selecting a lower ceramic base 1 with transverse and longitudinal scribing grooves which are beneficial to being divided into small rectangular units in the following process, wherein the thickness of the lower ceramic base 1 is 0.635-1.0 mm, the lower ceramic base 1 is made of an alumina ceramic substrate with the material content of 96%, the lower ceramic base 1 is also made of an alumina ceramic substrate with the material content of 99%, and the upper pressure induction ceramic 7 is also made of a zirconia ceramic substrate with the material content of 99%;
step six: printing a lower electrode plate 2 and a lower electrode pad 3 film layer on each unit of a lower ceramic base 1 with a scribing groove surface by using a noble metal conductor slurry which is composed of noble metals such as silver, palladium, platinum, gold and the like or alloy metals thereof by using a thick film forming technology, drying the lower electrode plate 2 and the lower electrode pad 3 film layer at the drying temperature of 120-200 ℃ for 10-15 minutes to form a dried film, wherein the thickness of the dried film is 9-11 mu m;
step seven: sintering the lower electrode plate 2 and the lower electrode pad 3 film layer prepared in the sixth step, wherein the sintering temperature is 840-900 ℃, the sintering peak temperature is 850 ℃, and the sintering time is 30-60 minutes, so as to form the lower electrode plate 2 and the lower electrode pad 3 film layer with good conductivity and strong adhesive force;
step eight: preparing a ceramic isolation layer 4, applying a precision screen printing technology, using insulating ceramic slurry, wherein the insulating ceramic slurry is composed of oxides or titanate compounds of boron, silicon and barium, preparing a membrane layer of the ceramic isolation layer 4 on the membrane layers of the lower electrode plate 2 and the lower electrode pad 3 which are prepared in the seventh step, the thickness of the membrane layer of the ceramic isolation layer 4 is 19.9-20.1 mu m, the ceramic isolation layer 4 is provided with a window to avoid the lower electrode plate 2 and the lower electrode pad 3, and the silk screen used in the process is a precision stainless steel wire screen, the mesh number of the silk screen is 400 meshes, and the silk diameter is 0.1 mu m;
step nine: preparing a connecting conductor 5, using conductive silver adhesive by using a precise dispensing technology, wherein the conductive silver adhesive is composed of noble metals such as silver, palladium and the like or alloy metals thereof, and injecting the conductive silver adhesive into the position of the lower electrode pad 3 corresponding to the pad connected with the lower electrode plate 2 on the basis of the ceramic isolating layer 4 film prepared in the step eight;
step ten: mounting the upper electrode plate 6 and the lower electrode plate 2, mounting the single-piece semi-finished product of the upper electrode plate 6 prepared in the first step to the fourth step on the upper part of the lower electrode plate 2 prepared in the fifth step to the ninth step, and drying the mounted semi-finished product at the drying temperature of 120-200 ℃ for 10-15 minutes to finish the drying and curing of the ceramic isolation layer 4 film and the connecting conductor 5 film;
step eleven: mounting the semi-finished product on the upper electrode plate 6 and the lower electrode plate 2 which are dried and cured in the step ten, and sintering at the sintering temperature of 600-900 ℃, the sintering peak temperature of 600 ℃ and the sintering time of 30-60 minutes to form the semi-finished product;
step twelve: dividing the whole semi-finished product into single pieces according to the existing scribing grooves to form a single piece finished product;
step thirteen: carrying out performance test, appearance inspection, packaging and warehousing on the single-chip finished product obtained in the step twelve;
in conclusion, the linearity and the response speed of the ceramic capacitor pressure sensor are improved through the matching of all the steps, the instant response time is shortened, the yield of the product is improved through the manufacturing of the precise silk-screen technology, and the production cost of the product is reduced.
The foregoing shows and describes the general principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are merely illustrative of the principles of the invention, but that various changes and modifications may be made without departing from the spirit and scope of the invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (10)
1. A transient response ceramic capacitive pressure sensor, characterized in that it comprises a lower ceramic base (1), a lower electrode plate (2) is arranged on the upper part of the lower ceramic base (1), the lower electrode plate (2) comprises a lower electrode pad (3), the lower electrode pad (3) is arranged at one end of the lower electrode plate (2), the upper part of the lower electrode plate (2) is provided with a ceramic isolation layer (4), an upper electrode plate (6) is arranged at the upper part of the ceramic isolation layer (4), the upper part of the lower ceramic base (1) is also provided with a connecting conductor (5), the lower electrode pad (3) is electrically connected with the upper electrode plate (6) through a connecting conductor (5), and an upper pressure induction ceramic (7) is arranged on the upper part of the lower ceramic base (1) and above the upper electrode plate (6).
2. A transient response ceramic capacitive pressure sensor as claimed in claim 1, wherein said lower ceramic base (1) has a thickness of 0.635mm to 1mm, said ceramic isolation layer (4) has a thickness of 19.9 μm to 20.1 μm, and said upper pressure sensitive ceramic (7) has a thickness of 0.1mm to 0.25 mm.
3. A method of making a transient response ceramic capacitive pressure sensor for use in a transient response ceramic capacitive pressure sensor as claimed in any one of claims 1 to 2, comprising the steps of:
the method comprises the following steps: preparing an upper electrode plate (6), and selecting upper pressure induction ceramics (7) with transverse and longitudinal scribing grooves;
step two: printing an upper electrode plate (6) film layer on each unit of the upper pressure sensing ceramic (7) with a scribing groove surface by using a noble metal conductor slurry by using a thick film forming technology, and drying the upper electrode plate (6) film layer printed by the printing to form a drying film;
step three: sintering the upper electrode plate (6) film layer manufactured in the second step to form the upper electrode plate (6) film layer with good conductivity and strong adhesive force;
step four: dividing the whole spliced plate product into single pieces according to the existing scribing grooves of the upper electrode plate (6) manufactured by sintering in the third step to form a single-piece semi-finished product of the upper electrode plate (6) for later working procedures;
step five: preparing a lower electrode plate (2) and a lower electrode pad (3), and selecting a lower ceramic base (1) with transverse and longitudinal scribing grooves;
step six: printing and manufacturing a lower electrode plate (2) and a lower electrode pad (3) film layer on each unit with a scribing groove surface of the lower ceramic base (1) by using a thick film forming technology and using noble metal conductor slurry, and drying the lower electrode plate (2) and the lower electrode pad (3) film layer to form a drying film;
step seven: sintering the lower electrode plate (2) and the lower electrode pad (3) film layer which are prepared in the sixth step to form the lower electrode plate (2) and the lower electrode pad (3) film layer which have good conductivity and strong adhesive force;
step eight: preparing a ceramic isolation layer (4), and preparing a ceramic isolation layer (4) film layer on the lower electrode plate (2) and the lower electrode pad (3) film layer which are prepared in the seventh step by using insulating ceramic slurry through a precision screen printing technology;
step nine: preparing a connecting conductor (5), injecting conductive silver adhesive at the position of the lower electrode pad (3) corresponding to the pad connected with the lower electrode plate (2) on the basis of the ceramic isolating layer (4) film prepared in the step eight by using a precise dispensing technology and using the conductive silver adhesive;
step ten: mounting an upper electrode plate (6) and a lower electrode plate (2), mounting the single-piece semi-finished product of the upper electrode plate (6) prepared in the first step to the fourth step on the upper part of the lower electrode plate (2) prepared in the fifth step to the ninth step, and drying the mounted semi-finished product to finish the drying and curing of the ceramic isolation layer (4) film and the connecting conductor (5) film;
step eleven: attaching the semi-finished product to the upper electrode plate (6) and the lower electrode plate (2) which are dried and cured in the step ten, and sintering to form a semi-finished product;
step twelve: dividing the whole semi-finished product into single pieces according to the existing scribing grooves to form a single piece finished product;
step thirteen: and performing performance test, appearance inspection, packaging and warehousing on the single-chip finished product obtained in the step twelve.
4. The method of claim 3, wherein the upper pressure-sensitive ceramic (7) has a thickness of 0.1mm to 0.25mm, the upper pressure-sensitive ceramic (7) is a 96% alumina ceramic substrate, the upper pressure-sensitive ceramic (7) is a 99% alumina ceramic substrate, and the upper pressure-sensitive ceramic (7) is a 99% zirconia ceramic substrate.
5. The method of claim 3, wherein the drying temperature in the second step is 120-200 ℃, the drying time in the second step is 10-15 minutes, and the thickness of the dried film in the second step is 5-10 μm.
6. The method of claim 3, wherein the sintering temperature in the third step is 840-900 ℃, the sintering peak temperature in the third step is 850 ℃, and the sintering time in the third step is 30-60 minutes.
7. The method of claim 3, wherein the thickness of the lower ceramic base (1) is 0.635mm to 1.0mm, the material of the lower ceramic base (1) is 96% alumina ceramic substrate, the material of the lower ceramic base (1) is 99% alumina ceramic substrate, and the material of the upper pressure sensing ceramic (7) is also 99% zirconia ceramic substrate.
8. The method of claim 3, wherein the temperature of the drying in the sixth step is 120-200 ℃, the drying time in the sixth step is 10-15 minutes, the thickness of the drying film in the sixth step is 9-11 μm, the temperature of the drying in the tenth step is 120-200 ℃, and the drying time in the sixth step is 10-15 minutes.
9. The method of claim 3, wherein the sintering temperature in the seventh step is 840-900 ℃, the sintering peak temperature in the seventh step is 850 ℃, the sintering time in the seventh step is 30-60 minutes, the sintering temperature in the eleventh step is 600-900 ℃, the sintering peak temperature in the eleventh step is 600 ℃, and the sintering time in the eleventh step is 30-60 minutes.
10. The method for manufacturing an instantaneous response ceramic capacitor pressure sensor according to claim 3, wherein the mesh used in step eight is a precision stainless steel mesh, the mesh number of the mesh is 400 meshes, the diameter of the mesh is 0.1 μm, and the film thickness of the ceramic isolation layer (4) is 19.9 μm-20.1 μm.
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