JP2000150303A - Manufacture of solid-state composite part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To realize a manufacturing method of a small-sized solid-state composite part excellent in dimensional precision and reliability. SOLUTION: A first unbaked ceramic substrate and a second unbaked ceramic substrate are baked, and a first ceramic substrate 1 and a second ceramic substrate 4 are formed. An inductor electrode 2 as an inductor conductor pattern layer is formed on the first substrate 1. A ferrite layer 3 as a magnetic paste layer is formed on the electrode 2, and an inductor layer is formed. A capacitor layer composed of a capacitor lower electrode 5, a capacitor upper electrode 7 and a dielectric layer 6 is formed as a capacitor conductor pattern layer on the second substrate 4. An adhesive glass layer 8 as a glass paste layer is spread on at least one out of the first and second ceramic substrates. The substrates are laminated and a Iaminate is formed. A baked body is formed by baking the laminate, and outer electrodes are formed on the baked body.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a chip-type solid composite component in which an inductor, a capacitor and the like are composited.

[0002]

2. Description of the Related Art In recent years, semiconductor LSIs and chip parts have been reduced in size and weight, and there has been a demand for miniaturization of high-frequency related magnetic devices. There is a growing demand for miniaturization, and a method of integrating a dielectric and an inductor into one device to reduce the size has been developed.

[0003] In a capacitor forming method for miniaturization,
In Japanese Patent Publication No. 2-54647, a non-magnetic insulator layer and a capacitor electrode conductor are alternately laminated, and a non-magnetic insulator layer of the same material and a coil conductor are alternately laminated thereon, and these are integrated. A method of firing and combining an inductor and a capacitor to reduce the size is introduced. As a simpler method for manufacturing a solid composite part, Japanese Patent Application Laid-Open No.
As disclosed in Japanese Patent No. 93019, there is introduced a method in which a magnetic material sheet and a dielectric sheet are baked and bonded together with an intermediate layer.

[0004]

In the above conventional method,
In order to integrally fire the inductor and the capacitor, it is necessary to use a low-temperature sintering material for both the magnetic sheet and the dielectric sheet, and it is difficult to improve the characteristics. In addition, due to the difference in the thermal expansion coefficient between the magnetic sheet and the dielectric sheet, there is a problem that the shrinkage differs during firing, and it is difficult to improve the dimensional accuracy.

An object of the present invention is to solve the above problems and to provide a method for manufacturing a solid composite component with improved characteristics and improved dimensional accuracy.

[0006]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention provides a method of forming an inductor conductor pattern layer on one surface of a first ceramic substrate, and forming a magnetic paste layer on the inductor conductor pattern layer. Forming a first substrate having an inductor layer; and
A second step of forming a capacitor conductor pattern layer having a dielectric layer interposed on one surface of a second ceramic substrate to form a second substrate having a capacitor layer; A glass paste layer is formed on at least one of the first substrate and the first substrate.
A third step of bonding the first substrate and the second substrate to each other via the glass paste layer to form a bonded body; a fourth step of firing the bonded body to form a fired body; And forming a first ceramic substrate and a second ceramic substrate by firing the first unfired ceramic substrate and the second unfired ceramic substrate before the first step. This is a manufacturing method including a step of forming a substrate.

According to the above manufacturing method, the inductor layer and the capacitor layer are formed on the ceramic substrate, so that the characteristics can be improved.

Further, the first ceramic substrate and the second ceramic substrate
Is formed by firing the first unfired ceramic substrate and the second unfired ceramic substrate, which are unfired ceramic substrates, so that when the bonded body is fired to form a fired body, , The first ceramic substrate and the second ceramic substrate are not thermally shrunk as a whole. Accordingly, the inductor layer and the capacitor layer formed on the first and second ceramic substrates do not shrink in accordance with the shrinkage of the first and second ceramic substrates, and the dimensional accuracy is improved. Can be done,
It is not necessary to adjust the dimensions in the post-process or the like, and the manufacturing process can be simplified.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION
A first step of forming an inductor conductor pattern layer on one surface of a first ceramic substrate and forming a magnetic paste layer on the inductor conductor pattern layer to form a first substrate having an inductor layer; A second step of forming a capacitor conductor pattern layer with a dielectric layer on one surface of a second ceramic substrate to form a second substrate having a capacitor layer; and a first surface of the first substrate. Alternatively, a glass paste layer is formed on at least one side of one surface of the second substrate, and the first substrate and the second substrate are bonded to each other via the glass paste layer to form a bonded body. A third step of firing the bonded body to form a fired body; and a fifth step of forming an external electrode on the fired body, wherein a first unfired step is performed before the first step. Ceramic by firing the substrate and the second green ceramic substrate, a manufacturing method in which a step of forming a first ceramic substrate and the second ceramic substrate.

According to the above manufacturing method, the inductor layer and the capacitor layer are formed on the ceramic substrate, so that the characteristics can be improved.

Further, the first ceramic substrate and the second ceramic substrate
Is formed by firing the first unfired ceramic substrate and the second unfired ceramic substrate, which are unfired ceramic substrates, so that when the bonded body is fired to form a fired body, , The first ceramic substrate and the second ceramic substrate are not thermally shrunk as a whole. Accordingly, the inductor layer and the capacitor layer formed on the first and second ceramic substrates do not shrink in accordance with the shrinkage of the first and second ceramic substrates, and the dimensional accuracy is improved. Can be done,
It is not necessary to adjust the dimensions in the post-process or the like, and the manufacturing process can be simplified.

The second aspect of the present invention is the first aspect of the present invention.
In the invention described in a first step, the inductor conductor pattern layer is a step of filling a pattern groove provided on the surface of an intaglio made of a flexible resin substrate with a conductive paste and drying, and the step of: Laminating one surface of the ceramic substrate while heating and pressurizing, and peeling the intaglio from the first ceramic substrate, and transferring the conductive paste onto the first ceramic substrate;
Baking the first ceramic substrate.

According to the above manufacturing method, it is possible to form an inductor conductor pattern layer having a good pattern shape, fine wiring and a large film thickness.

The third aspect of the present invention is the first aspect of the present invention.
A second aspect of the present invention is a manufacturing method, further comprising the step of forming an intermediate layer of a glass paste layer between the second ceramic substrate and the capacitor layer.

According to the above-described manufacturing method, since the intermediate layer of the glass paste layer is formed between the second ceramic substrate and the capacitor layer, the influence of the second substrate on the capacitor layer can be suppressed. .

The invention according to claim 4 of the present invention is the invention according to claim 3.
In the invention described, the material of the glass paste layer was borosilicate, lead borosilicate, calcium borosilicate, aluminum borosilicate, any one of titanium borosilicate, or a mixture thereof, or a glass frit made of the compound thereof. This is a manufacturing method using materials.

According to the above-described manufacturing method, the influence of the second ceramic substrate on the capacitor layer can be suppressed.

The fifth aspect of the present invention is the first aspect of the present invention.
2. The method according to claim 1, further comprising a step of removing the binder after forming the glass paste layer in the third step.

According to the above-described manufacturing method, a step of removing the binder after forming the glass paste layer is provided.
No voids are generated, and the reliability can be improved.

The invention according to claim 6 of the present invention is the invention according to claim 1.
In the invention described above, a plurality of through holes are formed in the second ceramic substrate before the fourth step, and a step of forming a silver electrode in the through hole is provided. So that the silver electrode is exposed on the side,
A step of forming a fired piece is provided, and in the fifth step,
This is a manufacturing method including a step of forming an external electrode using the silver electrode.

Since the through holes are formed in the second ceramic substrate by the above manufacturing method, the gas generated from the intermediate layer of the glass paste layer escapes from the through holes during firing of the bonded body, so that no fine voids are generated. , Reliability can be greatly improved.

The invention according to claim 7 of the present invention is the invention according to claim 1.
In the invention described in the above, it is a manufacturing method provided with a step of dividing the fired body into individual pieces and forming a fired individual body after the fourth step.

According to the above manufacturing method, mass production can be efficiently performed. According to an eighth aspect of the present invention, in the first aspect of the invention, after the fourth step, at least one of the first ceramic substrate and the second ceramic substrate is ground, and the first ceramic substrate or the second ceramic substrate is ground. And a step of reducing the thickness of at least one of the ceramic substrates.

According to the above manufacturing method, the thickness can be reduced. A ninth aspect of the present invention is the manufacturing method according to the first aspect, wherein the first ceramic substrate and the second ceramic substrate have the same thermal expansion coefficient.

Since the thermal expansion coefficients of the first ceramic substrate and the second ceramic substrate are made equal to each other by the above-mentioned manufacturing method, the first and second ceramic substrates are fired at the time of firing.
Since the expansion coefficients of the ceramic substrates are equal, distortion and the like do not occur, and dimensional accuracy can be improved.

According to a tenth aspect of the present invention, in the ninth aspect of the present invention, the material of the first ceramic substrate is a material having ferrite, and the material of the second ceramic substrate is forsterite. This is a manufacturing method using materials.

Good performance can be obtained by the above manufacturing method. An eleventh aspect of the present invention is the manufacturing method according to the first aspect, wherein the area of the capacitor conductor pattern layer is larger than the area of the dielectric layer.

According to the above manufacturing method, the influence of the second ceramic substrate and the intermediate layer of the glass paste layer on the capacitor layer can be suppressed.

According to a twelfth aspect of the present invention, in the first aspect, the material of the capacitor conductor pattern layer is any one of borosilicate, lead borosilicate, calcium borosilicate, aluminum borosilicate, and titanium borosilicate. One,
Or a mixture thereof, or a material having a glass frit made of the compound.

According to the above manufacturing method, the effect of the capacitor conductor pattern layer on the dielectric can be suppressed.

A thirteenth aspect of the present invention is the manufacturing method according to the first aspect, further comprising a step of forming a plurality of inductor conductor pattern layers.

According to the above manufacturing method, a good inductor layer can be formed. According to a fourteenth aspect of the present invention, in the first aspect of the present invention, the inductor conductor pattern layer has a spiral conductor in which a linear conductor is spirally wound, and the linear conductor of the spiral conductor is formed in a spiral shape. The conductor is a manufacturing method in which the ratio of the conductor thickness to the conductor width exceeds 0.3.

According to the above manufacturing method, since the thickness of the spiral conductor is increased, the inductor performance can be improved.

According to a fifteenth aspect of the present invention, in the first aspect, the inductor conductor pattern layer comprises:
A manufacturing method comprising: at least two spiral-shaped conductor portions each having a spiral-shaped linear conductor; and a step of forming a nonmagnetic material on a line between adjacent spiral-shaped conductor portions.

According to the above manufacturing method, the performance of the inductor can be improved. According to a sixteenth aspect of the present invention, in the first aspect of the invention, the inductor conductor pattern layer has at least two spiral conductor portions each having a spiral shape formed of a linear conductor, and the adjacent spiral conductor has Forming a non-magnetic material on the interline, forming a groove in the first ceramic substrate on the spiral conductor line, and forming the nonmagnetic material in the groove; is there.

According to the above manufacturing method, the performance of the inductor can be improved. According to a seventeenth aspect of the present invention, in the first aspect of the present invention, the inductor conductor pattern layer includes a spiral conductor portion in which a linear conductor is spirally wound;
A ring-shaped conductor having a ring-shaped linear conductor, and a step of forming the ring-shaped conductor outside the spiral conductor.

According to the above-described manufacturing method, a reverse magnetic field is generated in the inductance of the spiral conductor, thereby extending the frequency characteristics and obtaining a good attenuation even in a high frequency region.

According to an eighteenth aspect of the present invention, in the first aspect of the present invention, the inductor conductor pattern layer comprises:
A spiral conductor having a spiral shape of a linear conductor, and a ring-shaped conductor having a ring-shaped linear conductor, wherein the ring-shaped conductor is formed outside the spiral-shaped conductor; This is a manufacturing method including a step of forming a ring-shaped conductor portion in a magnetic paste layer.

Since the ring-shaped conductor is formed in the magnetic paste layer by the above-mentioned manufacturing method, a reverse magnetic field is generated on the inductance of the spiral conductor to further enhance the frequency characteristics, and the inductance is excellent even in a high-frequency region. The amount of attenuation can be obtained.

According to a nineteenth aspect of the present invention, there is provided a manufacturing method according to the seventeenth aspect, further comprising a step of grounding the ring-shaped conductor.

According to the above manufacturing method, a good attenuation can be obtained in a high frequency range. According to a twentieth aspect of the present invention, there is provided the manufacturing method according to the seventeenth aspect, further comprising the step of simultaneously forming the spiral conductor and the ring-shaped conductor on the same plane.

According to the above manufacturing method, the manufacturing process can be simplified. (Embodiment 1) A method of manufacturing a solid composite part according to an embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a structural view of the solid composite component. FIG. 1A is a sectional view of a first ceramic substrate. (B) is a plan view of an inductor electrode which is a spiral conductor pattern when individual pieces are formed. (C) shows a sectional view of the second ceramic substrate. (D) is a cross-sectional view when the first and second ceramic substrates are bonded together. (E)
2 shows a sectional view of a divided ceramic substrate.

The first ceramic substrate and the second ceramic substrate are fired to form the first ceramic substrate 1 and the second ceramic substrate 4. On the first ceramic substrate 1, an inductor electrode 2 is formed as an inductor conductor pattern layer, and a ferrite layer 3 is formed thereon as a magnetic paste layer to provide an inductor layer. On the second ceramic substrate 4, a capacitor lower electrode 5,
A capacitor layer composed of a capacitor upper electrode 7 and a dielectric layer 6 is provided, and an adhesive glass layer 8 is applied as a glass paste layer to at least one of the first and second ceramic substrates 1 and 4 and bonded to each other. Is formed, and the bonded body is fired to form a fired body, and an external electrode is formed on the fired body.

The inductor electrode 2 is formed of a spiral conductor in which a linear conductor is spirally formed.

The manufacturing method will be described below. A pattern of the inductor electrode 2 is formed on the ceramic substrate 1 by intaglio transfer using silver paste, and the substrate on which the pattern is formed is baked at a peak temperature of 850 ° C. for 10 minutes,
An inductor electrode 2 was formed. At this time, the inductor electrode 2
The ratio of the film thickness to the line width was 0.4. A pattern of the ferrite layer 3 was formed on the inductor electrode 2 by screen printing using a ferrite paste, and the substrate on which the pattern was formed was fired at 930 ° C. for 2 hours to form the ferrite layer 3. Next, on a second ceramic substrate 4 having substantially the same coefficient of thermal expansion as the first ceramic substrate 1,
A pattern of the capacitor lower electrode 5 is formed by screen printing using an Ag paste to which glass frit made of lead borosilicate is added, and a pattern of the dielectric layer 6 is screen-printed on the capacitor lower electrode 5 using a dielectric paste.
The pattern of the capacitor upper electrode 7 is formed on the dielectric layer 6 by screen printing using the Ag paste used for the lower electrode. The substrate is baked at a peak temperature of 900 ° C. for 10 minutes to form a capacitor. At this time, the pattern of the capacitor lower electrode 5 and the capacitor upper electrode 7 is formed in a pattern that is not smaller than the dielectric layer 6, and the film thickness is 1
The thickness was 5 μm. Next, a pattern of an adhesive glass layer 8 is formed on the surface of the first ceramic substrate 1 on which the inductor electrode 2 is formed by screen printing using a glass paste.
The binder was removed at 30 ° C. for 30 minutes. Then, the first ceramic substrate 1 and the second ceramic substrate 4 are adhered to each other with the adhesive glass layer 8 interposed therebetween.
The firing is performed by holding for 0 minute, and the first ceramic substrate 1 and the second
Is bonded. The second ceramic substrate 4 has the capacitor forming surface facing the glass layer side.
After the firing, the substrate is cut into individual pieces and external electrodes (not shown) are formed on the side surfaces to form a solid composite component.
By using the first and second ceramic substrates 1 and 4, the characteristics are good, and since the ceramic substrates 1 and 4 have the same thermal expansion coefficient, the dimensional accuracy is good and the manufacturing process is short. In addition, since the thickness of the inductor electrode 2 is greater than 0.3 with respect to the line width, the performance of the inductor can be improved. Also the second
The thickness of the capacitor conductor sandwiching the dielectric layer 6 of the ceramic substrate 4 at least after firing is at least 10 μm,
Forming a size not smaller than the pattern size of the dielectric layer 6 and adding a glass frit made of lead borosilicate can suppress the influence of the substrate, the glass layer, and the electrode itself on the dielectric layer 6. Becomes In addition, since the bonding glass layer 8 for bonding the first ceramic substrate 1 and the second ceramic substrate 4 removes the binder before bonding, voids are hardly generated. As described above, it is possible to provide a highly reliable method of manufacturing a solid composite component.

(Embodiment 2) Hereinafter, a method for manufacturing a solid composite component as an example of a method for manufacturing an electronic component according to the present invention will be described with reference to the drawings.

FIG. 2 shows a structural view of the solid composite component. FIG. 2A shows a cross-sectional view of a ferrite substrate. (B)
FIG. 2 shows a plan view of an inductor electrode which is a spiral conductor pattern when individual pieces are formed. (C) is a plan view of the ring-shaped electrode on the ferrite layer when the individual pieces are separated. (D) shows a cross-sectional view of the forsterite substrate. (E) shows a cross-sectional view when a ferrite substrate and a forsterite substrate are bonded together. (F) shows a sectional view of the divided substrate. First, an inductor electrode 12 is formed on a ferrite substrate 11,
A ferrite layer 13 is formed thereon, and a ring-shaped electrode 14 is formed thereon. On a forsterite substrate 15, a glass layer 16, a capacitor lower electrode 17, a dielectric layer 18,
Forming a capacitor comprising a capacitor upper electrode 19;
The ferrite substrate 11 and the forsterite substrate 15 are bonded together with the bonding glass layer 20 interposed therebetween, and then cut into individual pieces.

Hereinafter, the manufacturing method will be described. A pattern of the inductor electrode 12 is formed on the ferrite substrate 11 by intaglio transfer using a silver / palladium paste, and the substrate on which the pattern has been formed is baked at a peak temperature of 850 ° C. for 10 minutes. No. 12 was formed. At this time, the ratio of the film thickness to the line width of the inductor electrode 12 is 0.8
And After the inductor electrode 12 is formed, a pattern of the ferrite layer 13 is formed by screen printing using a ferrite paste, and baked at 950 ° C. for 3 hours to form the ferrite layer 13. A pattern of the ring-shaped electrode 14 is formed on the ferrite layer 13 by screen printing using a paste of silver / palladium, and the substrate on which the pattern is formed is baked at a peak temperature of 850 ° C. for 10 minutes, and the ring is fired. An electrode 14 was formed. Next, a pattern of a glass layer 16 is formed on a forsterite substrate 15 having substantially the same thermal expansion coefficient as that of the ferrite substrate 11 by screen printing using a glass paste made of titanium borosilicate. The glass layer 16 is formed by baking with minute keeping. Then, a pattern of the capacitor lower electrode 17 is formed by screen printing using a silver / palladium paste to which a glass frit made of aluminum borosilicate is added on the glass layer 16, and a dielectric layer is formed on the capacitor lower electrode 17 using a dielectric paste. The pattern 18 is formed by screen printing, and the pattern of the capacitor upper electrode 19 is formed on the dielectric layer 18 by the silver / palladium paste used for the lower electrode by screen printing. The substrate is fired at a peak temperature of 850 ° C. for 10 minutes to form a capacitor. At this time, the pattern of the capacitor lower electrode 17 and the capacitor upper electrode 19 was formed in a pattern not smaller than the dielectric layer 18, and the film thickness was set to 20 μm. Next, the ferrite substrate 11
The pattern of the adhesive glass layer 20 was formed by screen printing using a glass paste on the surface on which the inductor electrode 12 was formed and the surface of the forsterite substrate 15 on which the capacitor was formed, and the binder was removed at 500 ° C. for 30 minutes. Then, the ferrite substrate 11 and the forsterite substrate 15 are bonded together with the adhesive glass layer 20 interposed therebetween.
The ferrite substrate 1 was baked at 100 ° C. for 10 minutes.
1. The forsterite substrate 15 is bonded. After the firing is completed, the substrate is cut into individual pieces, and external electrodes (not shown) are formed on the side surfaces to form a solid composite component.
15 has good dimensional accuracy because the thermal expansion coefficient is matched. In addition, the ratio of the film thickness to the line width of the inductor electrode 12 exceeds 0.3, the film thickness is increased, a non-magnetic material is formed between the patterns, and the ring-shaped electrode 14 is formed on the inductor electrode 12. Even if a plurality of inductor electrodes 14 are formed in one component, the performance of the inductor can be improved. Further, a glass layer 16 made of titanium borosilicate is formed under the capacitor, and a capacitor conductor sandwiching the dielectric layer 18 is formed to have a film thickness of 10 μm or more and a size not smaller than the pattern size of the dielectric layer 18, By adding the glass frit made of aluminum borosilicate, the influence of the substrate, the glass layer, and the electrode itself on the dielectric layer 18 can be suppressed. In addition, since the glass layer 16 for bonding the ferrite substrate 11 and the forsterite substrate 15 removes the binder before bonding, voids are not easily generated. As described above, it is possible to provide a highly reliable method for manufacturing a solid composite component.

Embodiment 3 Hereinafter, a method for manufacturing a solid composite component as an example of a method for manufacturing an electronic component according to the present invention will be described with reference to the drawings.

FIG. 3 shows a structural view of the solid composite component. FIG. 3A shows a cross-sectional view of a ferrite substrate. (B)
FIG. 2 shows a plan view of an inductor electrode which is a spiral conductor pattern when individual pieces are formed. (C) is a plan view of the forsterite substrate in which the through holes are formed. (D) shows a cross-sectional view of the forsterite substrate. (E) shows a cross-sectional view when a ferrite substrate and a forsterite substrate are bonded together. (F) shows a sectional view of the divided substrate. First, a nonmagnetic glass layer 22 and an inductor electrode 23 are formed on a ferrite substrate 21, and a ferrite layer 24 is formed thereon. After a through hole 26 is formed in the forsterite substrate 25, a capacitor lower electrode 27, a dielectric layer 28, and a capacitor upper electrode 29 are formed on the forsterite substrate 25.
Is formed, and the ferrite substrate 21 and the forsterite substrate 25 are bonded to each other with the bonding glass layer 30 interposed therebetween, and cut into individual pieces.

The manufacturing method will be described below. A groove is formed on the ferrite substrate 21, a pattern of the nonmagnetic glass layer 22 is formed by screen printing using a glass paste in the groove, and baked at a peak temperature of 900 ° C. for 10 minutes to form the glass layer 22. A pattern of the inductor electrode 23 is formed by intaglio transfer using a silver / palladium paste, and the substrate on which the pattern has been formed is baked at a peak temperature of 850 ° C. for 10 minutes, thereby obtaining the inductor electrode 2.
3 was formed. At this time, the ratio of the film thickness to the line width of the inductor electrode 23 was 1.5. After forming the inductor electrode 23, a pattern of the ferrite layer 24 is formed by screen printing using a ferrite paste.
Firing is performed for 3 hours to form a ferrite layer 24. Next, a pattern of the capacitor lower electrode 27 is formed on a forsterite substrate 25 having a through-hole 26 having substantially the same thermal expansion coefficient as that of the ferrite substrate 21 with a silver / platinum paste to which a glass frit made of calcium borosilicate is added. Formed by screen printing, capacitor lower electrode 2
The pattern of the dielectric layer 28 is formed by screen printing using a dielectric paste on 7, and the pattern of the capacitor upper electrode 29 is screen-printed on the dielectric layer 28 by the silver / platinum paste used for the capacitor lower electrode 27. Formed. The substrate is baked at a peak temperature of 900 ° C. for 10 minutes to form a capacitor. At this time, the pattern of the capacitor lower electrode 27 and the capacitor upper electrode 29 was formed in a pattern not smaller than the dielectric layer 28, and the film thickness was 13 μm. Next, a pattern of an adhesive glass layer 30 is formed by screen printing using a glass paste on the surface of the ferrite substrate 21 on which the inductor electrode 23 is formed and the surface of the forsterite substrate 25 on which the capacitor is formed.
The binder was removed at 00 ° C. for 30 minutes. Then, the ferrite substrate 21 and the forsterite substrate 25 are bonded together with the adhesive glass layer 30 interposed therebetween.
The ferrite substrate 1 and the forsterite substrate 25 are bonded by firing for 10 minutes. After the firing, the substrate is cut into individual pieces, and external electrodes (not shown) are formed on the side surfaces to form a solid composite component. The ferrite substrate 21 and the forsterite substrate 25 have the same thermal expansion coefficient, and therefore have dimensions. The accuracy is good. In addition, the inductor electrode 23
The ratio of the film thickness to the line width exceeds 0.3, the film thickness is increased, and a glass layer of a non-magnetic material is formed in the groove between the patterns, so that a plurality of inductor electrodes 23 are formed in one component. Even if formed, the performance of the inductor can be improved. Further, the capacitor conductor sandwiching the dielectric layer 28 is formed to have a thickness of 10 μm or more, not to be smaller than the pattern size of the dielectric layer 28, and to add a glass frit made of calcium borosilicate, so that the substrate , The glass layer and the electrode itself can be suppressed from affecting the dielectric layer 28. The ferrite substrate 2
The bonding glass layer 30 for bonding the forsterite substrate 1 to the forsterite substrate 25 has a through-hole 26 formed in the forsterite substrate 25 in advance. Fine voids are not generated, and higher reliability can be obtained. As described above, it is possible to provide a highly reliable method for manufacturing a solid composite component.

(Embodiment 4) A method of manufacturing a solid composite component as an example of a method of manufacturing an electronic component according to the present invention will be described below with reference to the drawings.

FIG. 4 shows a structural view of the solid composite part. FIG. 4A shows a cross-sectional view of a ferrite substrate. (B)
FIG. 2 shows a plan view of an inductor electrode which is a spiral conductor pattern when individual pieces are formed. (C) shows a cross-sectional view of the forsterite substrate. (D) shows a cross-sectional view when a ferrite substrate and a forsterite substrate are bonded together. (E)
Shows a cross-sectional view of a divided substrate. First, an inductor electrode 32, a ring-shaped electrode 33, and a non-magnetic glass layer 34 are formed on a ferrite substrate 31, and a ferrite layer 3
5 is formed. A glass layer 37 is formed on a forsterite substrate 36, a capacitor including a capacitor lower electrode 38, a dielectric layer 39, and a capacitor upper electrode 40 is formed on the glass layer 37, and the ferrite substrate 31 and the forsterite substrate 36 are bonded. Glue across the glass layer 41,
It is cut into pieces.

The manufacturing method will be described below. A pattern of an inductor electrode 32 and a ring-shaped electrode 33 is formed on a ferrite substrate 31 by intaglio transfer using silver paste, and the pattern-formed substrate is heated to a peak temperature of 900 ° C.
Baking was performed for 10 minutes to form an inductor electrode 32 and a ring-shaped electrode 33. At this time, the ratio of the film thickness to the line width of the inductor electrode 32 was 1.5. The ring-shaped electrodes 33 are connected by vias (not shown).
A pattern of the nonmagnetic glass layer 34 is formed on the substrate on which the electrodes are formed by screen printing using a glass paste, and baked at a peak temperature of 900 ° C. for 10 minutes to form the glass layer 34. After forming the inductor electrode 32, a pattern of the ferrite layer 35 is formed by screen printing using a ferrite paste, and baked at 970 ° C. for 3 hours to form the ferrite layer 35. Next, a pattern of a glass layer 37 is formed by screen printing using a paste of borosilicate glass on a forsterite substrate 36 having substantially the same thermal expansion coefficient as the ferrite substrate 31, and a peak temperature of 900 ° C. is maintained for 10 minutes. And a glass layer 37 is formed. Then, a pattern of the capacitor lower electrode 38 is formed by screen printing using a silver / platinum paste to which glass frit made of titanium borosilicate is added on the glass layer 37, and a dielectric layer is formed on the capacitor lower electrode 38 by using a dielectric paste. A pattern 39 is formed by screen printing, and a pattern of the capacitor upper electrode 40 is formed on the dielectric layer 39 by the silver / platinum paste used for the capacitor lower electrode 38 by screen printing. The substrate is baked at a peak temperature of 900 ° C. for 10 minutes to form a capacitor. At this time, the capacitor lower electrode 38,
The pattern of the capacitor upper electrode 40 is formed so as not to be smaller than the dielectric layer 39 and has a thickness of 13 μm.
And Next, the inductor electrode 3 on the ferrite substrate 31
2 and the surface of the forsterite substrate 36 on which the capacitors were formed, using an adhesive glass layer 41 with a glass paste.
Is formed by screen printing at 500 ° C. and 30 ° C.
Debinding was performed in minutes. Then, the ferrite substrate 31 and the forsterite substrate 36 are bonded together with the adhesive glass layer 41 interposed therebetween, and the substrate is baked at a peak temperature of 730 ° C. for 10 minutes to bond the ferrite substrate 31 and the forsterite substrate 36. After the completion of the firing, the substrate is cut into individual pieces, and external electrodes (not shown) are formed on the side surfaces to form a solid composite component.

Since the substrates 31 and 36 have the same thermal expansion coefficient, they have good dimensional accuracy. The thickness ratio of the inductor electrode 32 to the line width exceeds 0.3, the thickness is increased, a glass layer of a non-magnetic material is formed between the patterns, and a ring-shaped electrode 33 is formed around the inductor electrode 32. Thus, even when a plurality of inductor electrodes 32 are formed in one component, the performance of the inductor can be improved. Further, a borosilicate glass layer 37 is formed under the capacitor, and a capacitor conductor sandwiching the dielectric layer 39 is formed to have a film thickness of 10 μm or more and a size not smaller than the pattern size of the dielectric layer 39. By adding a glass frit consisting of
The influence of the substrate, the glass layer, and the electrode itself on the dielectric layer 39 can be suppressed. From the above, high reliability,
A method for manufacturing a solid composite part can be provided.

In the above description, four embodiments have been described. However, the present invention can be similarly applied to a wiring board that requires electrode wiring having substantially the same thermal expansion coefficient. Furthermore, in the above-described embodiment, the spiral conductor pattern has a single-layer structure, but a similar solid composite component can be obtained even if the spiral conductor pattern is formed in a plurality of layers. The spiral conductor pattern can be similarly implemented as long as it is a wiring electrode pattern configured to be usable as an inductor electrode.

Further, even if the first and second ceramic substrates are joined by an adhesive layer and at least one of the substrates is ground to reduce the thickness of the substrate, a similar solid composite component can be obtained.
The glass frit used for the capacitor conductor is described as four types, but any one of borosilicate, lead borosilicate, calcium borosilicate, aluminum borosilicate, titanium borosilicate, or a mixture or compound If so, a similar effect can be obtained. The glass layer formed under the capacitor is described as two types, but is made of borosilicate, lead borosilicate, calcium borosilicate, aluminum borosilicate, titanium borosilicate, or a mixture or compound. A similar effect can be obtained with glass frit.

[0059]

As described above, according to the present invention, since the inductor layer and the capacitor layer are formed on the ceramic substrate, the characteristics can be improved.

Further, the first ceramic substrate and the second
Is formed by firing the first unfired ceramic substrate and the second unfired ceramic substrate, which are unfired ceramic substrates, so that when the bonded body is fired to form a fired body, , The first ceramic substrate and the second ceramic substrate are not thermally shrunk as a whole. Accordingly, the inductor layer and the capacitor layer formed on the first and second ceramic substrates do not shrink in accordance with the shrinkage of the first and second ceramic substrates, and the dimensional accuracy is improved. Can be done,
It is not necessary to adjust the dimensions in the post-process or the like, and the manufacturing process can be simplified.

As a result, it is possible to provide a method of manufacturing a solid composite part with improved characteristics and improved dimensional accuracy.

[Brief description of the drawings]

FIG. 1A is a cross-sectional view illustrating a structure of a first ceramic substrate in a method for manufacturing a solid composite component according to an embodiment of the present invention; FIG. 1B is a sectional view of the first ceramic substrate; (C) is a cross-sectional view showing the structure of the second ceramic substrate, and (d) is a diagram in which the first ceramic substrate and the second ceramic substrate are integrated via an adhesive layer. (E) is a cross-sectional view when the solid composite part is cut.

FIG. 2A is a cross-sectional view illustrating a structure of a ferrite substrate in a method for manufacturing a solid composite component according to another embodiment of the present invention. FIG. 2B is an inductor electrode pattern when individualized on the ferrite substrate. (C) is a plan view of a ring-shaped electrode pattern in the form of a ferrite layer of the ferrite substrate. (D) is a cross-sectional view showing the structure of the forsterite substrate. (F) is a cross-sectional view when the solid composite part is cut.

FIG. 3A is a cross-sectional view showing a structure of a ferrite substrate in a method of manufacturing a solid composite component according to still another embodiment of the present invention. FIG. 3B is an inductor electrode when the ferrite substrate is separated into individual pieces. The plan view of the pattern (c) is a plan view of the forsterite substrate in which the through hole is formed, (d) is a cross-sectional view showing the structure of the forsterite substrate, and (e) is a structure in which the ferrite substrate and the forsterite substrate are interposed via an adhesive layer. (F) is a cross-sectional view when the solid composite part is cut.

FIG. 4A is a cross-sectional view illustrating a structure of a ferrite substrate in a method of manufacturing a solid composite component according to an embodiment of the present invention. FIG. 4B is a sectional view of an inductor electrode pattern when the ferrite substrate is separated into individual pieces. (C) is a cross-sectional view showing the structure of the forsterite substrate. (D) is a cross-sectional view when the ferrite substrate and forsterite substrate are integrated via an adhesive layer. (E) is a cut of the solid composite part. Sectional view

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 first ceramic substrate 2 inductor electrode 3 ferrite layer 4 second ceramic substrate 5 capacitor lower electrode 6 dielectric layer 7 capacitor upper electrode 8 adhesive glass layer 11 ferrite substrate 12 inductor electrode 13 ferrite layer 14 ring electrode 15 forsterite Substrate 16 Glass layer 17 Capacitor lower electrode 18 Dielectric layer 19 Capacitor upper electrode 20 Adhesive glass layer 21 Ferrite substrate 22 Nonmagnetic glass layer 23 Inductor electrode 24 Ferrite layer 25 Forsterite substrate 26 Through hole 27 Capacitor lower electrode 28 Dielectric layer 29 Capacitor upper electrode 30 Adhesive glass layer 31 Ferrite substrate 32 Inductor electrode 33 Ring-shaped electrode 34 Nonmagnetic glass layer 35 Ferrite layer 36 Forsterite substrate 37 Glass layer 38 Capacitor lower electrode 39 dielectric layer 40 capacitor upper electrode 41 adhesive glass layer

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Masaaki Hayama 1006 Kazuma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. 72) Inventor Kazuhiro Miura 1006 Kazuma Kadoma, Osaka Pref. Matsushita Electric Industrial Co., Ltd. (72) Inventor Terumitsu Yamada 1006 Odaka Kazuma Kadoma, Osaka Pref. AA05 AB02 BA11 CA16 CB03 CB08 CB12 CB13 CB17 CC01 DA15 EA01 EB01 EB03 5E082 AB03 BC40 DD08 DD09 EE04 EE23 EE35 FG04 FG46 FG54 GG10 GG11 GG28 HH26 HH43 JJ03 JJ12 JJ15 LL23 LL01

Claims (20)

[Claims] An inductor conductor pattern layer is formed on one surface of a first ceramic substrate, and a magnetic paste layer is formed on the inductor conductor pattern layer to form a first substrate having an inductor layer. One step and the second
Forming a capacitor conductor pattern layer with a dielectric layer interposed on one surface of the ceramic substrate to form a second substrate having a capacitor layer; and one surface side of the first substrate or the second substrate. On at least one side of one side of the substrate,
A third step of forming a glass paste layer, bonding the first substrate and the second substrate to each other via the glass paste layer to form a bonded body, and firing the bonded body to form a fired body. Forming a fourth step of forming an external electrode on the fired body;
A method for manufacturing a solid composite component, comprising a step of forming a first ceramic substrate and a second ceramic substrate by firing a first green ceramic substrate and a second green ceramic substrate before the process. 2. A step of filling a conductive paste into a pattern groove provided on a surface of an intaglio made of a flexible resin substrate and drying the inductor conductor pattern layer in a first step; Bonding a surface of the substrate while applying heat and pressure; and peeling the intaglio plate from the first ceramic substrate to apply the conductive paste to the first ceramic substrate.
2. The method for manufacturing a solid composite component according to claim 1, further comprising the steps of: transferring onto a ceramic substrate; and baking the first ceramic substrate. 3. The method according to claim 1, further comprising the step of forming an intermediate layer of a glass paste layer between the second ceramic substrate and the capacitor layer in the second step. 4. The material of the glass paste layer is borosilicate,
4. The method for manufacturing a solid composite part according to claim 3, wherein the material has a glass frit made of any one of lead borosilicate, calcium borosilicate, aluminum borosilicate, and titanium borosilicate, or a mixture thereof, or a compound thereof. 5. The method for manufacturing a solid composite component according to claim 1, further comprising the step of removing the binder after forming the glass paste layer in the third step. 6. A step of forming a plurality of through holes in the second ceramic substrate and forming silver electrodes in the through holes before the fourth step, and after the fourth step, the fired body is divided into individual pieces. 2. The solid composite component according to claim 1, further comprising: a step of forming a fired piece so that the silver electrode is exposed on a side surface, and a step of forming the silver electrode on an external electrode in a fifth step. Production method. 7. The method according to claim 1, further comprising the step of dividing the fired body into individual pieces after the fourth step to form a fired individual body. 8. After the fourth step, at least one of the first ceramic substrate and the second ceramic substrate is ground,
2. The method according to claim 1, further comprising the step of reducing the thickness of at least one of the first ceramic substrate and the second ceramic substrate.
A method for producing the solid composite part according to the above. 9. The first ceramic substrate and the second ceramic substrate have thermal expansion coefficients equal to each other.
A method for producing the solid composite part according to the above. 10. The method according to claim 9, wherein the material of the first ceramic substrate is a material having ferrite, and the material of the second ceramic substrate is a material having forsterite. 11. The method according to claim 1, wherein the area of the capacitor conductor pattern layer is larger than the area of the dielectric layer. 12. The material of the capacitor conductor pattern layer is:
The solid composite part according to claim 1, wherein the material is a material having a glass frit made of any one of borosilicate, lead borosilicate, calcium borosilicate, aluminum borosilicate, and titanium borosilicate, or a mixture thereof, or a compound thereof. Production method. 13. The method according to claim 1, further comprising the step of forming a plurality of inductor conductor pattern layers. 14. The inductor conductor pattern layer has a spiral conductor portion formed by spiraling a linear conductor, and the linear conductor of the spiral conductor portion has a conductor thickness ratio to a conductor width of 0.3.
The method for producing a solid composite part according to claim 1, wherein 15. The inductor conductor pattern layer has at least two spiral conductor portions formed by spiraling a linear conductor,
2. The method for manufacturing a solid composite part according to claim 1, further comprising the step of forming a non-magnetic material on a line between the adjacent spiral conductors. 16. The inductor conductor pattern layer has at least two spiral conductor portions formed by spiraling a linear conductor,
Forming a non-magnetic material on the adjacent spiral conductor line, forming a groove in the first ceramic substrate on the spiral conductor line, and forming the non-magnetic material also on the groove; The method for producing a solid composite part according to claim 1, further comprising: 17. The inductor conductor pattern layer has a spiral conductor in which a linear conductor is formed in a spiral shape, and a ring-shaped conductor portion in which the linear conductor is formed in a ring shape. The method for manufacturing a solid composite component according to claim 1, further comprising a step of forming the ring-shaped conductor. 18. The inductor conductor pattern layer includes a spiral conductor in which a linear conductor is formed in a spiral shape, and a ring-shaped conductor portion in which the linear conductor is formed in a ring shape. 2. The method for manufacturing a solid composite component according to claim 1, further comprising a step of forming the ring-shaped conductor and forming the ring-shaped conductor in a magnetic paste layer. 19. The method according to claim 17, further comprising the step of connecting the ring-shaped conductor to ground. 20. The method for manufacturing a solid composite part according to claim 17, further comprising the step of simultaneously forming the spiral conductor and the ring conductor on the same plane.