CN214096435U - Square ceramic resistance type pressure sensor - Google Patents
Square ceramic resistance type pressure sensor Download PDFInfo
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- CN214096435U CN214096435U CN202022596076.9U CN202022596076U CN214096435U CN 214096435 U CN214096435 U CN 214096435U CN 202022596076 U CN202022596076 U CN 202022596076U CN 214096435 U CN214096435 U CN 214096435U
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Abstract
The utility model discloses a square ceramic resistance-type pressure sensor, include: the square ceramic elastic diaphragm is bonded below the square ceramic substrate, and a cavity is formed between the square ceramic substrate and the square ceramic elastic diaphragm; the bottom end of the square ceramic elastic diaphragm is provided with a ceramic elastic diaphragm conductor circuit, the top end of the square ceramic substrate is provided with a ceramic substrate conductor circuit, and the ceramic elastic diaphragm conductor circuit is electrically connected with the ceramic substrate conductor circuit through an upper conducting electrode and a lower conducting electrode. The utility model discloses a square structure has reduced the material waste in the production process, and the size is littleer, and the reliability is better to two kinds of different application environment of absolute pressure/gauge pressure have been realized.
Description
Technical Field
The utility model belongs to the technical field of pressure sensor, more specifically the utility model relates to a square ceramic resistance formula pressure sensor that says so.
Background
Along with the rapid development of new-generation intelligent automobiles and industrial automation, a pressure sensor is one of important technologies of modern measurement and automation systems, from automobile control to industrial automation and from production process control to medical monitoring, almost every technology can not be used for the pressure sensor, and a ceramic resistance type pressure sensor is widely applied to pressure detection of various media such as water, gas and liquid according to the advantages of corrosion resistance, impact resistance, no hysteresis, strong medium compatibility and the like of ceramics.
The conventional ceramic resistance type pressure sensor is generally characterized in that a thick-film Wheatstone resistor bridge is printed on the back surface of an elastic diaphragm of a ceramic substrate with a circular notch, and the resistor bridge can be bent and deformed after the diaphragm is stressed to generate resistance change, so that the resistance change is subjected to signal conditioning and conversion to obtain voltage or current signal linear output.
However, the existing piezoresistive pressure sensors are large in size, most of the existing piezoresistive pressure sensors are in gauge pressure forms, and due to the structural relationship, when pressure is overloaded, diaphragm breakage and leakage are easy to occur, and the existing piezoresistive pressure sensors cannot meet higher market requirements.
Therefore, how to provide a square ceramic resistive pressure sensor is a problem that needs to be solved by those skilled in the art.
SUMMERY OF THE UTILITY MODEL
In view of this, the utility model provides a square ceramic resistance-type pressure sensor adopts square structure to reduce the material waste in the production process, and the size is littleer, and the reliability is better to two kinds of different application environment of absolute pressure/gauge pressure have been realized.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a square ceramic resistive pressure sensor, comprising: the square ceramic elastic diaphragm is bonded below the square ceramic substrate, and a cavity is formed between the square ceramic substrate and the square ceramic elastic diaphragm; the square elastic ceramic diaphragm is characterized in that a conductor circuit of the elastic ceramic diaphragm is arranged at the bottom end of the square elastic ceramic diaphragm, a conductor circuit of the ceramic matrix is arranged at the top end of the square ceramic matrix, and the conductor circuit of the elastic ceramic diaphragm is electrically connected with the conductor circuit of the ceramic matrix through an up-down conduction electrode.
Preferably, the bottom end of the square ceramic elastic membrane is printed with a thick film resistor.
Preferably, the top end of the square ceramic substrate is printed with sealing glass, and the sealing glass is pre-sintered and molded at 450-550 ℃ to form a glass sealing layer.
Preferably, the top end of the square ceramic substrate is printed with a conductor pad.
Preferably, 95% -99% of Al is adopted for the square ceramic elastic membrane2O3/ZrO2The ceramic is made, and the thickness is 0.1-0.5 mm.
Preferably, the square ceramic matrix adopts 95-99% of Al2O3/ZrO2The ceramic is made, and the thickness is 2.0-3.0 mm.
Preferably, the ceramic substrate conductor circuit and the ceramic elastic diaphragm conductor circuit are both made of metal electronic paste, dried at 100-150 ℃, and sintered and molded at 800-900 ℃ to form the conductive circuit.
Preferably, the thick film resistor is made of high-temperature thick film resistor paste, dried at 100-150 ℃ and sintered and formed at 800-900 ℃ to form the thick film resistor bridge.
Preferably, the square ceramic substrate and the square ceramic elastic membrane are sintered at 550-650 ℃ in an air atmosphere/vacuum environment and are bonded together to form a sealing structure.
The beneficial effects of the utility model reside in that:
the utility model provides a square ceramic resistance type pressure sensor, which adopts a square structure to reduce the material waste in the production process, and has smaller size and better reliability; a sealed cavity is formed between the square ceramic base body and the square ceramic elastic diaphragm, different pressure reference modes can be realized by the cavity in different sintering and sealing environments, and different application requirements of absolute pressure and gauge pressure are met.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is a schematic structural diagram of the square ceramic sensor of the present invention.
Fig. 2 is a schematic structural diagram of the square ceramic substrate of the present invention.
Fig. 3 is a schematic structural diagram of the square ceramic elastic membrane of the present invention.
Fig. 4 is a schematic structural diagram of the conductor circuit of the ceramic elastic diaphragm of the present invention.
Fig. 5 is a schematic structural diagram of the conductor pad and the upper and lower conducting electrodes according to the present invention.
Fig. 6 is a schematic structural diagram of the sealing glass of the present invention.
Fig. 7 is a schematic structural diagram of the ceramic substrate conductor circuit according to the present invention.
Fig. 8 is a schematic structural diagram of the thick film resistor of the present invention.
Fig. 9 is a schematic structural diagram of a square ceramic elastic diaphragm printed with a ceramic elastic diaphragm conductor circuit and a thick film resistor according to the present invention.
Fig. 10 is a schematic structural diagram of a square ceramic sensor printed with ceramic substrate conductor lines, conductor pads, and upper and lower conducting electrode sealing glass according to the present invention.
Wherein, in the figure,
1-a square ceramic substrate; 2-square ceramic elastic membrane; 3-ceramic elastic diaphragm conductor circuit; 4-upper and lower conducting electrodes; 5-sealing glass; 6-ceramic substrate conductor lines; 7-thick film resistor; 8-a cavity; 9-conductor pad.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-10, the present invention provides a square ceramic resistance type pressure sensor, including: the square ceramic elastic diaphragm comprises a square ceramic matrix 1 and a square ceramic elastic diaphragm 2, wherein the square ceramic matrix 1 is bonded below the square ceramic elastic diaphragm 2, and a cavity 8 is arranged between the square ceramic matrix 1 and the square ceramic elastic diaphragm 2; the bottom end of the square ceramic elastic diaphragm 2 is provided with a ceramic elastic diaphragm conductor circuit 3, the top end of the square ceramic substrate 1 is provided with a ceramic substrate conductor circuit 6, and the ceramic elastic diaphragm conductor circuit 3 is electrically connected with the ceramic substrate conductor circuit 6 through an upper conducting electrode 4 and a lower conducting electrode 4.
In this embodiment, the bottom end of the square ceramic elastic membrane 2 is printed with a thick film resistor 7.
In the implementation, the top end of the square ceramic substrate 1 is printed with the sealing glass 5, the sealing glass 5 is pre-sintered and molded at 450-550 ℃ to form a glass sealing layer, and the glass sealing layer can keep a certain distance between the square ceramic substrate 1 and the square ceramic elastic membrane 2.
In this embodiment, a conductor pad 9 is printed on the top of the square ceramic substrate 1.
In the implementation, the square ceramic elastic membrane 2 adopts 95 to 99 percent of Al2O3/ZrO2The ceramic is made, and the thickness is 0.1-0.5 mm.
In this embodiment, 95% -99% Al is used for the square ceramic substrate 12O3/ZrO2The ceramic is made, and the thickness is 2.0-3.0 mm.
In the implementation, the ceramic substrate conductor line 6 and the ceramic elastic diaphragm conductor line 3 are both made of metal electronic paste, dried at 100-150 ℃, and sintered and molded at 800-900 ℃ to form the conductive circuit.
In the implementation, the thick film resistor 7 is made of high-temperature thick film resistor 7 slurry, dried at 100-150 ℃, and sintered and formed at 800-900 ℃ to form the thick film resistor 7 bridge.
In this embodiment, the square ceramic substrate 1 and the square ceramic elastic membrane 2 are sintered and bonded together in an air atmosphere/vacuum environment at 550 to 650 ℃ to form a sealing structure.
The utility model discloses at first utilize thick film printing technique with ceramic base conductor circuit, conductor pad and lead from top to bottomThe electrified electrodes are sequentially printed on the upper surface of a square ceramic matrix, and the square ceramic matrix adopts 95-99% of Al2O3/ZrO2Ceramic with the thickness of 2.0-3.0 mm, wherein the conductor circuit is formed by drying metal electronic paste such as Ag/Pt, Ag, Ag/Pd, Au and the like at 100-150 ℃ and sintering at 800-900 ℃ to form a conductive circuit; then printing the sealing glass on the upper surface of the square ceramic substrate, and presintering and forming at 450-550 ℃ to form a glass sealing layer with certain strength; then, the conductor circuit and the thick film resistor of the ceramic elastic diaphragm are printed on the lower surface of the square ceramic elastic diaphragm by using a thick film printing technology, and the square ceramic elastic diaphragm adopts 95-99% of Al2O3/ZrO2The thickness of the ceramic is 0.1-0.5 mm, metal electronic paste such as Ag/Pt, Ag, Ag/Pd, Au and the like is used for the conductor line of the ceramic elastic diaphragm, high-temperature thick-film resistor paste is used for the thick-film resistor, the thick-film resistor is dried at 100-150 ℃, and is sintered and molded at 800-900 ℃ to form a conductive circuit and a thick-film resistor bridge, and the thick-film resistor is used for eliminating zero offset by zeroing; and finally, oppositely combining the square ceramic substrate printed with the ceramic substrate conductor circuit, the conductor pad, the upper and lower conducting electrodes and the sealing glass with one side of the square ceramic elastic diaphragm printed with the ceramic elastic diaphragm conductor circuit and the thick film resistor, sintering at 550-650 ℃ in an air atmosphere/vacuum environment, and bonding together to form a sealing structure and a cavity, thereby completing the manufacture of the square ceramic resistance type pressure sensor.
The utility model provides a square ceramic resistance type pressure sensor, which utilizes ceramic material, thick film printing and glass sealing technology to form a sealed cavity between a square ceramic substrate and a square ceramic elastic diaphragm, the cavity can realize different pressure reference modes under different sintering and sealing environments, and the application requirements of different absolute pressure and gauge pressure are really met; due to the structural characteristics of the square ceramic elastic diaphragm, when the sensor is in overpressure, the square ceramic elastic diaphragm can be propped by the square ceramic substrate below the square ceramic elastic diaphragm, and the square ceramic elastic diaphragm cannot limit deformation amount under stress to cause fracture and leakage like a round notch type ceramic substrate; the square ceramic structure can meet the requirement of smaller size, save more materials and reduce the manufacturing cost; by adopting the sealing structure, a hole does not need to be formed in the square ceramic substrate to lead out a signal, the risk of opening a circuit due to pore conduction is reduced, the risk of uneven stress of the square ceramic elastic membrane due to the hole is reduced, and the reliability of the product is improved. The square structure reduces material waste in the production process, the size is smaller, the reliability is better, two different application environments of absolute pressure/gauge pressure are realized, the production process is more suitable for batch production, and the cost is greatly reduced. The thick film Wheatstone resistor bridge printed on the back of the elastic diaphragm of the ceramic substrate with the circular notch is mostly adopted in the conventional ceramic resistance type pressure sensor structure, so that the following problems caused by the thick film Wheatstone resistor bridge are solved: when the elastic membrane at the notch is overloaded, the membrane is easy to break to cause leakage; the gauge pressure application environment can be met, and the gauge pressure application environment cannot be used or the use precision is poor in most absolute pressure environments; the structure size is larger, and the packaging cost is higher; when the signal circuit is connected with the outside, a through hole needs to be formed in the substrate, so that the membrane is stressed unevenly, output nonlinearity is generated, and obstacles are generated to the design of an electrode circuit.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (7)
1. A square ceramic resistive pressure sensor, comprising: the square ceramic elastic diaphragm is bonded below the square ceramic substrate, and a cavity is formed between the square ceramic substrate and the square ceramic elastic diaphragm; the square elastic ceramic diaphragm is characterized in that a conductor circuit of the elastic ceramic diaphragm is arranged at the bottom end of the square elastic ceramic diaphragm, a conductor circuit of the ceramic matrix is arranged at the top end of the square ceramic matrix, and the conductor circuit of the elastic ceramic diaphragm is electrically connected with the conductor circuit of the ceramic matrix through an up-down conduction electrode.
2. The square ceramic resistive pressure sensor of claim 1, wherein the bottom end of the square ceramic elastic diaphragm is printed with a thick film resistor.
3. The square ceramic resistance pressure sensor according to claim 1, wherein a sealing glass is printed on the top of the square ceramic substrate, and the sealing glass is pre-sintered and molded at 450-550 ℃ to form a glass sealing layer.
4. The square ceramic resistive pressure sensor of claim 1, wherein the top of the square ceramic substrate is printed with conductor pads.
5. The square ceramic resistive pressure sensor of claim 1, wherein the square ceramic elastic diaphragm is 95% -99% Al2O3/ZrO2The ceramic is made, and the thickness is 0.1-0.5 mm.
6. The square ceramic resistive pressure sensor of claim 1, wherein the square ceramic substrate is 95-99% Al2O3/ZrO2The ceramic is made, and the thickness is 2.0-3.0 mm.
7. The square ceramic resistive pressure sensor of claim 1, wherein the ceramic substrate conductor traces and the ceramic elastic diaphragm conductor traces are both metal electronic paste.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022596076.9U CN214096435U (en) | 2020-11-11 | 2020-11-11 | Square ceramic resistance type pressure sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022596076.9U CN214096435U (en) | 2020-11-11 | 2020-11-11 | Square ceramic resistance type pressure sensor |
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| Publication Number | Publication Date |
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| CN214096435U true CN214096435U (en) | 2021-08-31 |
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| CN202022596076.9U Active CN214096435U (en) | 2020-11-11 | 2020-11-11 | Square ceramic resistance type pressure sensor |
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| CN (1) | CN214096435U (en) |
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