CN209310957U - Pressure/capacitance type ceramic pressure sensor with printed wiring board - Google Patents
Pressure/capacitance type ceramic pressure sensor with printed wiring board Download PDFInfo
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- CN209310957U CN209310957U CN201920019023.5U CN201920019023U CN209310957U CN 209310957 U CN209310957 U CN 209310957U CN 201920019023 U CN201920019023 U CN 201920019023U CN 209310957 U CN209310957 U CN 209310957U
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- wiring board
- thick film
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- pedestal
- pressure
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Abstract
The utility model relates to the pressure/capacitance type ceramic pressure sensors with printed wiring board, it include pedestal, pedestal one end is connected with dynamic diaphragm, moving electrode is equipped in the middle part of dynamic diaphragm one end, it is characterized by: the other end of the opposite connection dynamic diaphragm of the pedestal is printed with thick film wiring board, at least three one end are offered on the thick film wiring board to be connected with moving electrode the connecting hole being connected outside the other end and thick film wiring board, conductive structure is provided in the connecting hole, the utility model has the following beneficial effects: saving the cost that product is PCB, reduce influence of the dielectric constant to properties of product of PCB itself, since product circuit and pressure sensor are done on the same vector, reduce the temperature drift coefficient of product, reduce production technology complexity, improve homogeneity of product, extend product service life.
Description
Technical field
The utility model relates to art of pressure sensors, and in particular to the pressure/capacitance type ceramic pressure with printed wiring board passes
Sensor.
Background technique
Ceramic pressure sensor is that electricity is printed on ceramic matrix elastomer (thin slice) and ceramic matrix supporter (sheet)
Sub- slurry becomes capacitive balance bridge (C-reference and C- Δ) through sintering.Since pressure makes the micro deformation of ceramic matrix
Pass through output by the ratio variation of two capacitor's capacities of measurement to realize pressure measurement at the variation of presser sensor capacitor
The amplitude direct proportion of capacitance ratio is in pressure value, so being referred to as ceramic pressure/capacitance type pressure sensor.
Traditional ceramic pressure sensor will use ceramic thick film wiring board, FPC due to its pressure signal process circuit plate
(flexible circuit board) or PCB(copper-clad plate wiring board) on, then by signal processing circuit plate in conjunction with pedestal, form ceramic pressure
Sensor, and the printed wiring board of traditional ceramic pressure sensor is by spot welding or the external C- of other modes
Three reference, C- Δ, ground wire lines, cause that ceramic pressure sensor volume is thicker, structure is complicated, and cost is higher, process
Cumbersome, temperature distributing disproportionation and three solder joints of spot welding on the base are easy to fall off causes the problem that service life is short.
Utility model content
The technical problem to be solved by the utility model is in view of the above shortcomings of the prior art,
The pressure/capacitance type ceramic pressure sensor for having printed wiring board is provided.
To achieve the above object, the utility model provides following technical solution: the pressure/capacitance type with printed wiring board is made pottery
Porcelain pressure sensor, includes pedestal, and pedestal one end is connected with dynamic diaphragm, is equipped with moving electrode, feature in the middle part of dynamic diaphragm one end
Be: the other end of the opposite connection dynamic diaphragm of the pedestal is printed with thick film wiring board, offered on the thick film wiring board to
Few three one end are connected the connecting hole being connected outside the other end and thick film wiring board with moving electrode, and the connecting hole is interior to be arranged
There is conductive structure.
By adopting the above technical scheme, pedestal one end is provided with dynamic diaphragm, is equipped with moving electrode, pedestal phase in the middle part of dynamic diaphragm one end
Thick film wiring board is printed with to the other end of connection dynamic diaphragm, at least three one end and metal layer phase are offered on thick film wiring board
The connecting hole being connected outside the connection other end and thick film wiring board, connecting hole are used to connect C-reference, C- Δ, ground wire,
C-reference, C- Δ, ground wire can be through by the conductive structure being arranged in connecting hole be fixedly connected in connecting hole after by leading
Electric structure is conducted with metal layer.
The above-mentioned pressure/capacitance type ceramic pressure sensor with printed wiring board can be further arranged to: the conductive structure
To be set to the equally distributed metal conducting layer of connecting hole inner wall, metal conducting layer one end is connected with the moving electrode on dynamic diaphragm,
The other end is connected with thick film wiring board.
By adopting the above technical scheme, the uniformly distributed metal conducting layer in connecting hole inner wall is set by conductive structure, gold
Belong to conductive layer one end to be in contact with moving electrode, lead is directly perfused by modes such as encapsulatings and is connected in connecting hole, due to even
It connects and is provided with metal conducting layer inside hole, therefore, it is phase that C-reference, C- Δ, ground wire, which are with the moving electrode of sensor chip,
Conducting, the mode of connection for not only reducing the thickness of ceramic pressure sensor and C-reference, C- Δ, ground wire becomes more
Add solid and reliable, greatly improves the service life of ceramic pressure sensor.
The utility model has the following beneficial effects: saving the cost that product is PCB, reduce the dielectric constant of PCB itself
Influence to properties of product reduces the temperature drift of product since product circuit and pressure sensor are done on the same vector
Coefficient reduces production technology complexity, improves homogeneity of product, extends product service life.
The utility model is described in further detail with reference to the accompanying drawings and examples.
Detailed description of the invention
Fig. 1 is the stereoscopic schematic diagram of the utility model embodiment.
Fig. 2 is the configuration schematic diagram of the utility model embodiment.
Fig. 3 is the schematic diagram of the section structure of the utility model embodiment.
Specific embodiment
Shown in referring to figures 1-3: the pressure/capacitance type ceramic pressure sensor with printed wiring board, includes pedestal 1, pedestal
1 one end is connected with dynamic diaphragm 2, is equipped with moving electrode 21 in the middle part of 2 one end of dynamic diaphragm, and outside is then the sealing layer 22 being connected with pedestal 1,
The other end of the opposite connection dynamic diaphragm 2 of pedestal 1 is printed with thick film wiring board 11, offers at least three 1 on thick film wiring board 11
The connecting hole 3 being connected outside be connected with moving electrode 21 other end and thick film wiring board 11 is held, is provided with conduction in connecting hole 3
Structure, conductive structure are to be set to the equally distributed metal conducting layer 31 of 3 inner wall of connecting hole, 31 one end of metal conducting layer and dynamic film
Moving electrode 21 on piece 2 is connected, and the other end is connected with thick film wiring board 11.
Claims (2)
1. the pressure/capacitance type ceramic pressure sensor with printed wiring board, includes pedestal, pedestal one end is connected with dynamic diaphragm, moves
Moving electrode is equipped in the middle part of diaphragm one end, it is characterised in that: the other end of the opposite connection dynamic diaphragm of the pedestal is printed with thick film line
Road plate offers at least three one end on the thick film wiring board and is connected with moving electrode phase outside the other end and thick film wiring board
The connecting hole of connection is provided with conductive structure in the connecting hole.
2. the pressure/capacitance type ceramic pressure sensor according to claim 1 with printed wiring board, it is characterised in that: described
Conductive structure is to be set to the equally distributed metal conducting layer of connecting hole inner wall, the dynamic electricity on metal conducting layer one end and dynamic diaphragm
Extremely it is connected, the other end is connected with thick film wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920019023.5U CN209310957U (en) | 2019-01-07 | 2019-01-07 | Pressure/capacitance type ceramic pressure sensor with printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920019023.5U CN209310957U (en) | 2019-01-07 | 2019-01-07 | Pressure/capacitance type ceramic pressure sensor with printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209310957U true CN209310957U (en) | 2019-08-27 |
Family
ID=67680545
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920019023.5U Active CN209310957U (en) | 2019-01-07 | 2019-01-07 | Pressure/capacitance type ceramic pressure sensor with printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209310957U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113447164A (en) * | 2021-06-23 | 2021-09-28 | 浙江沃德尔科技集团股份有限公司 | Integrated pressure sensor module |
-
2019
- 2019-01-07 CN CN201920019023.5U patent/CN209310957U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113447164A (en) * | 2021-06-23 | 2021-09-28 | 浙江沃德尔科技集团股份有限公司 | Integrated pressure sensor module |
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