CN207487857U

CN207487857U - ceramic capacitive pressure sensor

Info

Publication number: CN207487857U
Application number: CN201721257840.1U
Authority: CN
Inventors: 赵兴奎; 廖景昌; 朱里鹏
Original assignee: Xiangyang Core Sensor Technology Co Ltd
Current assignee: Xiangyang Core Sensor Technology Co Ltd
Priority date: 2017-09-28
Filing date: 2017-09-28
Publication date: 2018-06-12
Anticipated expiration: 2027-09-28

Abstract

The utility model discloses a kind of ceramic capacitive pressure sensors, including thin substrate and thick substrate, thin substrate and thick substrate are equal-sized square structure, and thin substrate is divided into several thin substrate square units by way of laser scribing, thick substrate is prefabricated into several thick substrate square units by the way of dry-pressing formed；Thin substrate metal electrode is provided on each thin substrate square unit, thick substrate metal electrode, circular metal electrode, thick substrate lead electrode, endless metal lead electrode, thin substrate lead electrode and conductive hole are provided on each thick substrate square unit；Hard shoulder each is provided between thin substrate square unit and each thick substrate square unit, together with thin substrate is relatively fixed with thick substrate, is sent into oven cured into ceramic capacitive pressure sensor main body.The utility model simultaneously can several preset independent sensor main body units, can meet the needs of batch production, energy-efficient, the reliability of product is high.

Description

Ceramic capacitive pressure sensor

Technical field

The utility model is related to a kind of capacitance pressure transducer, more particularly to a kind of ceramic capacitive pressure sensor, Belong to pressure sensor technique field.

Background technology

Ceramic capacitive pressure sensor is all using circular design, in two opposite faces of thickness two panels ceramic substrate at present Electrode is set, and using hard shoulder etc. as the distance between spacer coordination electrode, to form the capacitance of specified initial capacitance value Device.When ceramic thin substrate is by external pressure, thin substrate will appear deformation, and capacitance is caused to increase, according to the change of this capacitance Change value, you can detect the external pressure that substrate is born.

The basic technology of this ceramic capacitive pressure sensor is：It is cut by laser the thick substrate of thin substrate → dry-pressing formed In → thin substrate and thick substrate set electrode → electrode is burnt into → set hard shoulder → by press burn make thickness substrate become one Electrode → curing in entirety → elargol → upper lead extraction.The ceramic capacitive pressure sensor laser that this kind of technique makes is cut It is cut into circle, setting electrode, firing electrode, one entirety of thickness substrate pressure firing, lead lead-out mode on interior electrode points elargol, production Energy is relatively low, firing energy consumption is higher, makes a big impact to ceramic capacitive pressure sensor batch production.

Utility model content

The purpose of the utility model is to provide a kind of ceramic capacitive pressure sensor, the sensor not only energy saving height Effect and the reliability of product height.

To achieve the above object, the technical solution adopted in the utility model is, a kind of ceramic capacitive pressure sensor, Including thin substrate and thick substrate, the thin substrate and thick substrate are equal-sized square structure, and thin substrate passes through laser The mode of scribing line is divided into several thin substrate square units, and thick substrate is prefabricated into several thick substrate squares by the way of dry-pressing formed Unit；Thin substrate metal electrode is provided on each thin substrate square unit, thick base is provided on each thick substrate square unit Sheetmetal electrode, circular metal electrode, thick substrate lead electrode, endless metal lead electrode, thin substrate lead electrode and conduction Hole；Hard shoulder is each provided between thin substrate square unit and each thick substrate square unit, thin substrate and thick substrate are opposite It is fixed together, is sent into oven cured into ceramic capacitive pressure sensor main body.

Preferably, there are three the conductive hole settings, conductive lead wire is embedded into each conductive hole.

Preferably, the length of embedment of the conductive lead wire is no more than the thickness of thick substrate metal electrode.

Preferably, the hard shoulder is stamped to form by spacer, and the planform of spacer and thin substrate square list The electrode domain structure of member is identical.

Preferably, the thickness of the spacer be 10 μm -30 μm, have the function of conduction and sealing-in, while play every From effect.

The beneficial effects of the utility model：The utility model simultaneously can several preset independent sensor main body lists Member can meet the needs of batch production, energy-efficient, and the ceramic pressure produced through technical solutions of the utility model passes Sensor, the reliability of product are high.

Description of the drawings

It, below will be to institute in embodiment or description of the prior art in order to illustrate more clearly of the technical solution of the utility model Attached drawing to be used is needed to be briefly described.

Fig. 1 is the utility model pressure sensor elasticity thin substrate figure；

Fig. 2 is the utility model pressure sensor thick substrate figure；

Fig. 3 is the utility model pressure sensor Thin Elastic electrode of substrate figure；

Fig. 4 is the utility model pressure sensor thick substrate electrode figure；

Fig. 5 is the utility model pressure sensor ceramics gap spacer figure；

Fig. 6 is the utility model pressure sensor entirety sectional view.

In figure：1. thin substrate, 1-1. thin substrate square units, 2. thick substrates, 2-1. thick substrate square units, 3. thin substrates Metal electrode, 4. thick substrate metal electrodes, 5. circular metal electrodes, 6. thick substrate lead electrodes, 7. endless metal lead electrodes, 8. thin substrate lead electrode, 9. conductive holes, 10. hard shoulders, 11. conductive lead wires, 12. spacers.

Specific embodiment

In order to make those skilled in the art better understand the technical solutions in the application, below in conjunction with embodiment pair Technical solution in the application is clearly and completely described.

As shown in figs 1 to 6, the utility model discloses a kind of ceramic capacitive pressure sensors, which is characterized in that packet Thin substrate 1 and thick substrate 2 are included, the thin substrate 1 and thick substrate 2 are equal-sized square structure, and thin substrate 1 is by swashing The mode of light scribing line is divided into several thin substrate square unit 1-1, and thick substrate 2 is prefabricated into several thick bases by the way of dry-pressing formed Plate square unit 2-1；Thin substrate metal electrode 3, each thick substrate square unit are provided on each thin substrate square unit 1-1 Be provided on 2-1 thick substrate metal electrode 4, circular metal electrode 5, thick substrate lead electrode 6, endless metal lead electrode 7, Thin substrate lead electrode 8 and conductive hole 9；Each set between thin substrate square unit 1-1 and each thick substrate square unit 2-1 There is hard shoulder 10, together with thin substrate 1 is relatively fixed with thick substrate 2, be sent into oven cured into ceramic capacitive pressure sensor Main body.

There are three the settings of conductive hole 9, and conductive lead wire 11, conductive lead wire 11 and conduction are embedded into each conductive hole 9 Hole 9 is fitted close.The length of embedment of the conductive lead wire 11 is no more than the thickness of thick substrate metal electrode 4.

The hard shoulder 10 is stamped to form by spacer 12, and the planform of spacer 12 and thin substrate square unit 1- 1 electrode domain structure is identical.The thickness of the spacer 12 is 10 μm -30 μm, has the function of conductive and sealing-in and rises To the effect of isolation.

In specific application, hard shoulder 10 is made of formula as below：

20-40 parts of flake silver powder；Spherical silver powder 20-40 parts；

10-30 parts of epoxy resin；10-20 parts of polyvinyl alcohol；

30-40 parts of pure water；Dispersant：0.5-3 parts；

Plasticizer：5-20 parts；Wherein dispersant fish oil or triethanolamine, plasticizer use polyethylene glycol or glycerine.

Slurry is made through ball milling in above-mentioned material, tape casting is the spacer that thickness is 10 μm of -30um, will using punching machine If spacer is washed into hard shoulder of the dry thickness for 10 μm of -30um.

With positioning mold by single electroded thin substrate square unit, the hard shoulder of inner circle foreign side, electroded thick base Plate is put into baker and carries out curing molding, and ultimately forms square ceramic capacitance pressure transducer, entirety.

Described embodiment is the utility model part of the embodiment, instead of all the embodiments.Based on this reality With the embodiment in novel, those of ordinary skill in the art are obtained every other without making creative work Embodiment shall fall within the protection scope of the present invention.

Claims

1. a kind of ceramic capacitive pressure sensor, which is characterized in that including thin substrate (1) and thick substrate (2), the thin substrate (1) and thick substrate (2) is equal-sized square structure, and thin substrate (1) be divided by way of laser scribing it is several thin Substrate square unit (1-1), thick substrate (2) are prefabricated into several thick substrate square units (2-1) by the way of dry-pressing formed；Often Thin substrate metal electrode (3) is provided on a thin substrate square unit (1-1), is set on each thick substrate square unit (2-1) There is thick substrate metal electrode (4), circular metal electrode (5), thick substrate lead electrode (6), endless metal lead electrode (7), thin Substrate lead electrode (8) and conductive hole (9)；Each thin substrate square unit (1-1) and each thick substrate square unit (2-1) it Between be provided with hard shoulder (10), thin substrate (1) and thick substrate (2) are relatively fixed together, are sent into oven cured into ceramic condenser Formula pressure sensor body.

2. ceramic capacitive pressure sensor according to claim 1, which is characterized in that the conductive hole (9) is provided with Three, each conductive hole (9) is interior to be embedded into conductive lead wire (11).

3. ceramic capacitive pressure sensor according to claim 2, which is characterized in that conductive lead wire (11) are buried Enter the thickness that depth is no more than thick substrate metal electrode (4).

4. according to claim 1-3 any one of them ceramic capacitive pressure sensors, which is characterized in that the hard shoulder (10) it is stamped to form by spacer (12), and the planform of spacer (12) and the electrode version of thin substrate square unit (1-1) Graph structure is identical.

5. ceramic capacitive pressure sensor according to claim 4, which is characterized in that the thickness of the spacer (12) It is 10 μm -30 μm, there is conductive and sealing-in.