CN107591336B - A kind of preparation method of low-temperature co-fired ceramic substrate cavity structure - Google Patents
A kind of preparation method of low-temperature co-fired ceramic substrate cavity structure Download PDFInfo
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Abstract
The preparation method of low-temperature co-fired ceramic substrate cavity structure of the invention, have following steps: LTCC green band is cut into LTCC ceramic chips, then the multi-disc LTCC ceramic chips of well cutting are successively subjected to first stage lamination, to be respectively formed cover plate of upper layer, sublayer plate and lower plywood；Sublayer plate and lower plywood are subjected to second stage lamination, to form laminated sheet；Cover plate of upper layer and laminated sheet are subjected to phase III lamination, to form LTCC bars of block for having cavity structure；Ltcc substrate biscuit is obtained after cutting to LTCC bars of block, is then sintered ltcc substrate biscuit；Stack pressure, temperature and time in the technique of phase III lamination are respectively less than the parameter in the technique of the first and second stage laminations.According to the present invention, the manufacturing cost of the low-temperature co-fired ceramic substrate with cavity structure is greatly reduced, the mass production of low-temperature co-fired ceramic substrate cavity structure is conducive to.
Description
Technical field
The present invention relates to a kind of manufacturing field of low-temperature co-fired ceramic substrate more particularly to a kind of low-temperature co-fired ceramic substrates
The preparation method of cavity structure.
Background technique
Low-temperature co-fired ceramics (Low Temperature Co-fired Ceramic；Hereinafter referred to as LTCC) technology is as one
It plants mature multilager base plate technique and is widely used, by forming the green band cofired materials of thick film screen printing, make circuit
Design space expanded from traditional two-dimensional surface to three-dimensional space.Using LTCC technology building cavity structure very
Suitable for burying in passive device, the size of component and the area of package substrate are thus greatly reduced.In addition, LTCC base
Cavity structure in plate be also extensively used for LTCC microchannel, LTCC microreactor, LTCC sensor, LTCC driver,
And in the structures such as LTCC multifunctional unit substrate.Therefore, the technology of preparing for grasping ltcc substrate cavity structure has important meaning
Justice.
In the preparation process of ltcc substrate, it usually needs use heat and other static pressuring processes with guarantee multilayer LTCC ceramic chips it
Between combine closely.However, easily cause the cavity structure in ltcc substrate to collapse during hot isostatic pressing, this mainly by
Laminating the high lamination pressure in technique in traditional LTCC causes LTCC ceramic chips to generate inelastic deformation.In addition, in sintering process
In, the softening of glass ingredient also results in certain structural deformation.In existing document report and patent document, such as comparison text
Part 1, the construction method in relation to ltcc substrate cavity is mostly using the polymer or carbon materials that can be volatilized when filling is sintered in the cavities
The method of material avoids collapsing for hot isostatic pressing cavity structure in this, as sacrificial layer material, and then obtains smooth
Cavity structure.
However, there are shortcomings for this method, for example, the flatness in order to guarantee cavity, the size of sacrificial layer material
It needs to exactly match with the size of cavity with green；It, need to also be in ltcc substrate in order to guarantee after being sintered without residual substance in cavity
The additional exhaust passage of upper design, constantly adjusts sintering process etc., increase as a result, ltcc substrate preparation process complexity and
Cost.
Existing technical literature:
Patent document:
Patent document 1: Chinese patent discloses 104103525 A of CN.
Summary of the invention
Problems to be solved by the invention:
In view of the problem present on, the present inventor is with keen determination, proposes one kind and does not need to fill using any cavity
Or the preparation method of the ltcc substrate cavity structure of expendable material reduces production cost to simplify preparation process.
The means solved the problems, such as:
In order to solve the above-mentioned technical problem, the preparation method of ltcc substrate cavity structure of the invention, has following steps:
LTCC green band is cut into LTCC ceramic chips, then LTCC ceramic chips described in the multi-disc by well cutting successively carry out
First stage lamination, to be respectively formed cover plate of upper layer and lower plywood；Separately the LTCC ceramic chips are punched, then will beat
LTCC ceramic chips described in the multi-disc in good hole successively carry out first stage lamination, to form the sublayer plate for having cavity structure；
The sublayer plate and the lower plywood are subjected to second stage lamination, to form laminated sheet；
The cover plate of upper layer and the laminated sheet are subjected to phase III lamination, to form the LTCC for having cavity structure
Bar block；
Ltcc substrate biscuit is obtained after cutting to the LTCC bars of block, then burns the ltcc substrate biscuit
Knot；
Wherein, the stack pressure in the technique of the phase III lamination, temperature and time are respectively less than described first and
Parameter in the technique of two-stage lamination.
According to the present invention, the new of cavity structure ltcc substrate can be prepared without the filling of any cavity or expendable material
Method realizes the preparation of smooth cavity structure by unique three steps laminated process, and simple process is easy to operate, Ji Nengbao
It is smooth to hold cavity structure, equal deformation will not be collapsed, moreover it is possible to which solving introducing expendable material in traditional preparation process leads to technique
The contingency questions such as complexity and sintering residual contaminants cavity, greatly reduce the ltcc substrate with cavity structure as a result,
Manufacturing cost is conducive to the mass production of ltcc substrate cavity structure.In addition, lower plywood is usually ltcc substrate load capacity
Position, can compare thick thus first carry out laminating being not susceptible to deformation, therefore in lamination process, lower plywood should below, sublayer
Plate carries out lamination above, should not be inverted.
Also, the first, second stage lamination is the pressure within zone of reasonableness in order to guarantee close adhesion between layers
It is bigger, temperature is higher, the time is longer, be more conducive to the bonding effect between single layer, and then improve sintered density, and third rank
Section lamination is that the important step to form cavity structure is easy to make when pressure, temperature, time are greater than the parameter in the first, second stage
It is collapsed at cavity, therefore the stack pressure in the technique of phase III lamination, temperature and time were respectively less than for the first and second stages
Parameter in the technique of lamination can effectively prevent the appearance of the situation.
Also, in the present invention, being also possible to the first and second stages lamination using same process condition.By means of
This, same tier condition can guarantee that cover plate of upper layer, lower plywood, sublayer intralamellar part have similar internal stress, and sintering process is not
It is easy to crack.
Also, in the present invention, be also possible to described first and first stage lamination technique in, stack pressure is 3 ~ 5
MPa, stack temperature are 55 ~ 65 DEG C, and the lamination time is 90 ~ 150 seconds.
Also, in the present invention, being also possible in the technique of the second stage lamination, stack pressure is 1 ~ 3 MPa, is folded
Layer temperature is 50 ~ 60 DEG C, and the lamination time is 30 ~ 90 seconds.
Also, in the present invention, being also possible in the technique of the sintering, 450 DEG C ~ 500 are warming up to from 1 DEG C/min of room temperature
DEG C, 60 ~ 120 min are kept the temperature, are then warming up to 800 ~ 900 DEG C from 5 ~ 10 DEG C/min, keep the temperature 15 ~ 60 min.
Also, in the present invention, the technique for being also possible to the lamination carries out in laminating machine.
Invention effect:
The preparation method simple process of ltcc substrate cavity structure proposed by the present invention, can effectively reduce production cost, has
Conducive to the mass production of ltcc substrate cavity structure.It, will preferably now according to following specific embodiments and with reference to attached drawing
Understand above content and other objects, features and advantages of the invention.
Detailed description of the invention
Fig. 1 is the process signal for the preparation method of ltcc substrate cavity structure for showing an implementation form according to the present invention
Figure；
Fig. 2 is the section SEM for showing ltcc substrate cavity structure obtained by according to embodiments of the present invention 1 preparation method
Photo；
Fig. 3 is the section SEM for showing ltcc substrate cavity structure obtained by according to embodiments of the present invention 2 preparation method
Photo；
Symbol description:
1 ltcc substrate；
2 cover plate of upper layer；
3 sublayer plates；
4 lower plywoods；
5 laminated sheets；
6 LTCC bars of blocks；
1A LTCC ceramic chips；
1B ltcc substrate biscuit.
Specific embodiment
The present invention is further illustrated below in conjunction with attached drawing and following embodiments, it should be appreciated that attached drawing and following embodiments
It is merely to illustrate the present invention, is not intended to limit the present invention.Identical in the various figures or corresponding appended drawing reference indicates the same part, and saves
Slightly repeated explanation.
Fig. 1 is the process signal for the preparation method of 1 cavity structure of ltcc substrate for showing an implementation form according to the present invention
Figure.In the implementation form shown in FIG. 1, the preparation method of 1 cavity structure of ltcc substrate of the invention has following steps:
If being cut into dry plate LTCC ceramic chips 1A to coiled LTCC green band, if then by the dry plate LTCC ceramic chips of part well cutting
1A successively carries out first stage lamination, to be respectively formed cover plate of upper layer 2 and lower plywood 4；If separately to the dry plate LTCC of well cutting
Ceramic chips 1A is punched, if the dry plate LTCC ceramic chips 1A having openning hole successively then is carried out first stage lamination, thus shape
At the sublayer plate 3 for having cavity structure；Sublayer plate 3 and lower plywood 4 are subjected to second stage lamination, to form laminated sheet 5；It will
Cover plate of upper layer 2 and laminated sheet 5 carry out phase III lamination, to form the LTCC bars of block 6 for having cavity structure；And to LTCC
Bar block 6 obtains ltcc substrate biscuit 1B after being cut, and is then sintered ltcc substrate biscuit 1B.
It is described in detail now in conjunction with attached drawing 1.As shown in Figure 1, according to the design thickness of ltcc substrate 1, to LTCC substrate
It is cut, cutting mode is unlimited, using techniques well known.If obtaining dry plate LTCC ceramic chips 1A after cutting, so
Afterwards according to specific design requirement, carried out if the dry plate LTCC ceramic chips 1A of a portion well cutting is sequentially placed into laminating machine
First stage lamination, to be respectively formed the cover plate of upper layer 2 and lower plywood 4 of ltcc substrate 1.Lamination is used in this implementation form
Machine carries out the technique of lamination, but should not necessarily be limited by this.Wherein, in the technique of first stage lamination, for example, stack pressure can be 3 ~ 5
MPa, stack temperature can be 55 ~ 65 DEG C, and the lamination time can be 90 ~ 150 seconds, but be also not necessarily limited to this, can be according to specific design requirement
And it changes.
Using techniques well known means, if the other dry plate LTCC ceramic chips 1A to well cutting is punched, punching
After the completion, if the dry plate LTCC ceramic chips 1A having openning hole is sequentially placed into progress first stage lamination in laminating machine, to be formed
Sublayer plate 3 with cavity structure.
Sublayer plate 3 and lower plywood 4 are sequentially placed into progress second stage lamination in laminating machine, to form laminated sheet 5.This
Process conditions identical with above-mentioned first stage lamination can be used in place's second stage lamination, but can also be different.First and second ranks
Same process condition can be used in section lamination, it is possible thereby to guarantee cover plate of upper layer 2, lower plywood 4, have inside sublayer plate 3 it is similar
Internal stress, sintering process is not easy to crack, and however, you can also not same, it is smaller only to change space.Then, by cover plate of upper layer 2 and conjunction layer
Plate 5 is sequentially placed into progress phase III lamination in laminating machine, to form the LTCC bars of block 6 for having cavity structure.Wherein, third
Stack pressure, temperature and time in the technique of stage lamination are respectively less than the parameter in the technique of first stage lamination (that is, also small
In second stage lamination), this is because the first, second stage lamination is to guarantee close adhesion between layers, pressure
It is bigger, temperature is higher, the time is longer, be more conducive to the bonding effect between single layer, and then improve sintered density, and third rank
Section lamination is that the important step to form cavity structure be easy to cause sky when pressure, temperature, time are greater than the parameter of first stage
Chamber collapses.
In the technique of the phase III lamination of this implementation form, for example, stack pressure can be 1 ~ 3 MPa, stack temperature can
It is 50 ~ 60 DEG C, the lamination time can be 30 ~ 90 seconds, but not limited to this.In addition, first carrying out lamination energy with lower plywood 4 to sub- laminate 3
Enough make in lamination process that deformation occurs with the sublayer plate of cavity.
LTCC bars of block 6 obtained is cut, so that ltcc substrate biscuit 1B is obtained, finally again by ltcc substrate biscuit
1B is put into high-temperature electric resistance furnace and is sintered, and thus obtains the ltcc substrate 1 with cavity structure.The work of the sintering of this implementation form
It in skill, is sintered according to LTCC sample sintering schedule, such as 450 DEG C ~ 500 DEG C can be warming up to from 1 DEG C/min of room temperature, heat preservation 60
Then ~ 120 min are warming up to 800 ~ 900 DEG C from 5 ~ 10 DEG C/min, keep the temperature 15 ~ 60 min, but not limited to this, it can be according to reality
Demand specifically changes.In addition, being sintered the equipment of technique also without limitation.
The preparation method of the ltcc substrate cavity structure proposed according to the present invention is filled or is sacrificed without any cavity
Material can smooth, the best in quality ltcc substrate 1 with cavity structure of preparation structure, can avoid because filling or expendable material
Sintering volatilization bring cavity pollution problem not to the utmost, and the cavity preparation process of ltcc substrate is greatlied simplify, it can be extensive
Applied to LTCC microchannel, LTCC microreactor, LTCC sensor, LTCC driver and the more function of LTCC for having cavity structure
It can integrate in the production of substrate, simple process is at low cost, being capable of a large amount of industrialization.
Below in conjunction with the drawings and specific embodiments each implementation form that present invention be described in more detail.Wherein, Fig. 2 is to show
The section SEM photograph of 1 cavity structure of ltcc substrate obtained by according to embodiments of the present invention 1 preparation method out, Fig. 3 is to show
The section SEM photograph of 1 cavity structure of ltcc substrate obtained by according to embodiments of the present invention 2 preparation method.
(embodiment 1)
The preparation method of according to embodiments of the present invention 11 cavity structure of ltcc substrate, the specific steps are as follows:
Firstly, 5 LTCC ceramic chips 1A of well cutting are sequentially placed into progress first stage lamination in laminating machine.Lamination work
Stack pressure in skill is 5 MPa, and stack temperature is 65 DEG C, and the lamination time is 120 seconds, and 1 cavity knot of ltcc substrate is thus made
The cover plate of upper layer 2 of structure.15 LTCC ceramic chips 1A of well cutting are sequentially placed into progress first stage lamination in laminating machine, system again
At the lower plywood 4 of 1 cavity structure of ltcc substrate.
Then, 10 LTCC ceramic chips 1A are punched, and according to the design height of cavity structure, using with the first rank
The identical process conditions of section lamination carry out first stage lamination to 10 LTCC ceramic chips 1A having openning hole, and it is free that band is thus made
The sublayer plate 3 of cavity configuration.
After again, sublayer plate 3 and lower plywood 4 are placed sequentially in laminating on platform in laminating machine, with stack pressure for 5
MPa, stack temperature are 65 DEG C, and the form that the lamination time is 120 seconds carries out second stage lamination, and laminated sheet 5 is consequently formed.Again will
Cover plate of upper layer 2 and laminated sheet 5 are placed sequentially in laminating machine, and with stack pressure for 3 MPa, stack temperature is 60 DEG C, when lamination
Between for 60 seconds form carry out phase III lamination, thus formed have cavity structure LTCC bars of block 6.
Finally, obtaining ltcc substrate biscuit 1B after LTCC bars of block 6 obtained is cut on demand, high-temperature electric resistance furnace is put it into
In, 450 DEG C are warming up to according to from 1 DEG C/min of room temperature, keeps the temperature 60 min, is then warming up to 850 DEG C from 5 DEG C/min, heat preservation 30
The LTCC sample sintering schedule of min is sintered.So far, the ltcc substrate 1 with cavity structure can be obtained, sectional view is such as
Shown in Fig. 2.
(embodiment 2)
The preparation method of according to embodiments of the present invention 21 cavity structure of ltcc substrate, the specific steps are as follows:
Firstly, 10 LTCC ceramic chips 1A of well cutting are sequentially placed into progress first stage lamination in laminating machine.Lamination
Stack pressure in technique is 3 MPa, and stack temperature is 55 DEG C, and the lamination time is 90 seconds, and 1 cavity knot of ltcc substrate is thus made
The cover plate of upper layer 2 of structure.15 LTCC ceramic chips 1A of well cutting are sequentially placed into progress first stage lamination in laminating machine, system again
At the lower plywood 4 of 1 cavity structure of ltcc substrate.
Then, 10 LTCC ceramic chips 1A are punched, and according to the design height of cavity structure, using with the first rank
The identical process conditions of section lamination carry out first stage lamination to 10 LTCC ceramic chips 1A having openning hole, and it is free that band is thus made
The sublayer plate 3 of cavity configuration.
After again, sublayer plate 3 and lower plywood 4 are placed sequentially in laminating on platform in laminating machine, with stack pressure for 3
MPa, stack temperature are 55 DEG C, and the form that the lamination time is 90 seconds carries out second stage lamination, and laminated sheet 5 is consequently formed.Again will
Cover plate of upper layer 2 and laminated sheet 5 are placed sequentially in laminating machine, and with stack pressure for 1 MPa, stack temperature is 50 DEG C, when lamination
Between for 30 seconds form carry out phase III lamination, thus formed have cavity structure LTCC bars of block 6.
Finally, obtaining ltcc substrate biscuit 1B after LTCC bars of block 6 obtained is cut on demand, high-temperature electric resistance furnace is put it into
In, 500 DEG C are warming up to according to from 1 DEG C/min of room temperature, keeps the temperature 120 min, is then warming up to 900 DEG C from 10 DEG C/min, heat preservation 15
The LTCC sample sintering schedule of min is sintered.So far, the ltcc substrate 1 with cavity structure can be obtained, sectional view is such as
Shown in Fig. 3.
Above specific embodiment has carried out further specifically the purpose of the present invention, technical scheme and beneficial effects
It is bright, it should be appreciated that the above is only a kind of specific embodiments of the invention, however it is not limited to protection model of the invention
It encloses, under the objective for not departing from essential characteristic of the invention, the present invention can be presented as diversified forms, therefore the implementation in the present invention
Form is to be illustrative rather than definitive thereof, and is limited since the scope of the present invention is defined by the claims rather than by specification, Er Qieluo
All changes in the full scope of equivalents of the range that claim defines or the range that it is defined are understood to be included in right
In claim.All within the spirits and principles of the present invention, any modification, equivalent substitution, improvement and etc. made should all wrap
Containing within protection scope of the present invention.
Claims (2)
1. a kind of preparation method of low-temperature co-fired ceramic substrate cavity structure, has following steps:
LTCC green band is cut into LTCC ceramic chips by step 1, and then LTCC ceramic chips described in the multi-disc by well cutting are successively
First stage lamination is carried out, to be respectively formed cover plate of upper layer and lower plywood；Separately the LTCC ceramic chips are punched, then
LTCC ceramic chips described in the multi-disc having openning hole successively are subjected to first stage lamination, to form the sublayer for having cavity structure
Plate；
The sublayer plate and the lower plywood are carried out second stage lamination, so that laminated sheet is formed, in the lamination mistake by step 2
Cheng Zhong, the sublayer plate with cavity structure are located at the top of the lower plywood；
The cover plate of upper layer and the laminated sheet are carried out phase III lamination by step 3, to be formed with cavity structure
LTCC bars of block；
Step 4 obtains ltcc substrate biscuit after cutting to the LTCC bars of block, then by the ltcc substrate biscuit into
Row sintering；
In above-mentioned steps one into step 3,
The first and second stages lamination uses same process condition, in the technique of the first and second stages lamination, folds
Stressor layer is 3 ~ 5 MPa, and stack temperature is 55 ~ 65 DEG C, and the lamination time is 90 ~ 150 seconds；
Stack pressure, temperature and time in the technique of the phase III lamination are respectively less than the first and second stages lamination
Technique in parameter, in the technique of the phase III lamination, stack pressure is 1 ~ 3 MPa, and stack temperature is 50 ~ 60 DEG C,
The lamination time is 30 ~ 90 seconds；
The first stage lamination, second stage lamination, all lamination steps of phase III lamination are completed using laminating machine.
2. the preparation method of low-temperature co-fired ceramic substrate cavity structure according to claim 1, which is characterized in that the burning
In the technique of knot, 450 DEG C ~ 500 DEG C are warming up to from 1 DEG C/min of room temperature, 60 ~ 120 min are kept the temperature, then from 5 ~ 10 DEG C/min liter
Temperature keeps the temperature 15 ~ 60 min to 800 ~ 900 DEG C.
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108507621B (en) * | 2018-05-18 | 2020-08-25 | 浙江矽瓷科技有限公司 | LTCC-based passive wireless pressure and temperature integrated sensor and preparation method thereof |
| CN108695040B (en) * | 2018-08-13 | 2021-10-08 | 西南应用磁学研究所 | LTCF device with air cavity and manufacturing method thereof |
| CN110559960A (en) * | 2019-09-25 | 2019-12-13 | 华南理工大学 | High-flux ceramic microreactor |
| CN112437559B (en) * | 2020-11-16 | 2022-02-18 | 中国科学院空天信息创新研究院 | Laminating method of LTCC substrate double-sided cavity structure |
| CN113043648B (en) * | 2021-03-08 | 2024-01-26 | 洛阳航辉新材料有限公司 | Hot isostatic pressing method of flat plate castings |
| CN115557795A (en) * | 2022-09-07 | 2023-01-03 | 广东环波新材料有限责任公司 | Sintering method of low-temperature co-fired ceramic substrate |
| CN116041046B (en) * | 2023-01-31 | 2024-03-26 | 中国电子科技集团公司第五十四研究所 | Lamination method of high-thickness LTCC substrate |
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| US7204900B1 (en) * | 2004-04-29 | 2007-04-17 | Northrop Grumman Corporation | Method of fabricating structures using low temperature cofired ceramics |
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Effective date of registration: 20201123 Address after: 5 / F, 42 Wansheng street, Hengdian Town, Dongyang City, Jinhua City, Zhejiang Province Patentee after: Zhejiang silicon ceramic technology Co., Ltd Address before: 322118 No.42, Wansheng street, Hengdian Town, Dongyang City, Jinhua City, Zhejiang Province Patentee before: hengdian group holding Co.,Ltd. |