CN110021693A - 一种多杯的led cob显示屏模组及其制作方法 - Google Patents
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Abstract
本发明涉及一种多杯的LED COB显示屏模组及其制作方法,具体而言,在双面或者多层显示屏线路板上,将控制元件通过SMT焊接在背面,将多组R、G、B的LED芯片进行固晶焊线在显示屏线路板上,或者将多组R、G、B倒装芯片倒装焊在显示屏线路板上,在带多个孔的板背面施加上胶水,贴到显示屏线路板上的芯片间隙处,固化后形成多个孔杯,在孔杯底部已经有了和线路板导通的芯片,然后再在杯里施加封装胶水,加热固化后,即制成了多杯的LED COB显示屏模组,本发明采用先固晶焊线后贴杯的方式,解决了在固晶焊线时杯很小,固晶嘴和焊线瓷嘴下不去的问题,用COB的封装方式做出更清晰、更高密度显示屏。
Description
技术领域
本发明涉及LED应用领域,具体涉及一种多杯的LED COB显示屏模组及其制作方法。
背景技术
现有的显示屏COB模组都是用模顶的方式封装芯片的,设备投资大,封装胶昂贵。
为了克服以上的缺陷和不足,本发明采取用胶粘剂贴杯的方法,先将多组R、G、B的LED芯片进行固晶焊线在显示屏线路板上,在对位粘贴一带孔的板形成孔杯,R、G、B的LED芯片在孔杯内的线路板上,再在杯里施加封装胶水,避开了模顶的高投资高成本,又能用COB的封装方式做出更清晰、更高密度显示屏,同时采用封装固晶焊线后再贴杯的方式,解决了在固晶焊线前贴了杯,在杯很小时,固晶嘴和焊线瓷嘴下不去的问题。
发明内容
本发明涉及一种多杯的LED COB显示屏模组及其制作方法,具体而言,在双面或者多层显示屏线路板上,将控制元件通过SMT焊接在背面,将多组R、G、B的LED芯片进行固晶焊线在显示屏线路板上,或者将多组R、G、B倒装芯片倒装焊在显示屏线路板上,在带多个孔的板背面施加上胶水,贴到显示屏线路板上的芯片间隙处,固化后形成多个孔杯,在孔杯底部已经有了和线路板导通的芯片,然后再在杯里施加封装胶水,加热固化后,即制成了多杯的LED COB显示屏模组,本发明采用先固晶焊线后贴杯的方式,解决了在固晶焊线时杯很小,固晶嘴和焊线瓷嘴下不去的问题,用COB的封装方式做出更清晰、更高密度显示屏。
根据本发明提供了一种多杯的LED COB显示屏模组的制作方法,具体而言,在双面或者多层显示屏线路板上,将控制元件通过SMT焊接在背面,将多组R、G、B的LED芯片进行固晶焊线在显示屏线路板上,或者将多组R、G、B倒装芯片倒装焊在显示屏线路板上,在带多个孔的板背面施加上胶水,贴到显示屏线路板上的芯片间隙处,固化后形成多个孔杯,在孔杯底部已经有了和线路板导通的芯片,然后再在杯里施加封装胶水,加热固化后,即制成了多杯的LED COB显示屏模组。
根据本发明还提供了一种多杯的LED COB显示屏模组,包括:显示屏控制元件;显示屏PCB板;粘贴孔杯板的已固化的胶粘剂;粘贴带孔的板形成的孔杯;封装在杯底的R、G、BLED芯片;已固化的封装胶水;其特征在于,所述粘贴孔杯板的已固化的胶粘剂是用的透光的胶、或者是不透光的胶,所述粘贴带孔的板形成的孔杯是用透光的树脂材料制成的、或者是用不透光的树脂材料制成的、或者是用金属材料制成的、或者是用非金属无机材料制成的,一个杯里一组R、G、B芯片、或者是一个杯里有多组R.G.B芯片,芯片是正装芯片或者是倒装芯片,所述的显示屏控制元件通过SMT焊接在所述显示屏PCB板背面。
根据本发明的一优选实施例,所述的一种多杯的LED COB显示屏模组,其特征在于,所述的显示屏PCB板是双面的线路板、或者多层的线路板。
根据本发明的一优选实施例,所述的一种多杯的LED COB显示屏模组,其特征在于,所述的已固化的封装胶水是环氧的封装胶水、或者是硅胶。
在以下对附图和具体实施方式的描述中,将阐述本发明的一个或多个实施例的细节。
附图说明
通过结合以下附图阅读本说明书,本发明的特征、目的和优点将变得更加显而易见,对附图的简要说明如下。
图1为在显示屏线路板的背面,通过SMT将控制元件焊接在显示屏线路板上的截面示意图。
图2为在显示屏线路板上将多组R、G、B的LED芯片固晶焊线在显示屏线路板上的截面示意图。
图3为在显示屏线路板上将多组R、G、B的LED芯片固晶焊线在显示屏线路板上的平面示意图。
图4为制作的多杯杯板的平面示意图。
图5为多杯杯板与固晶焊线后的显示屏线路板对位粘贴在一起的平面示意图。
图6为多杯杯板与固晶焊线后的显示屏线路板对位粘贴在一起的截面示意图。
图7为多杯的LED COB显示屏模组的截面示意图。
具体实施方式
下面将以优选实施例为例来对本发明进行详细的描述。
但是本领域技术人员应当理解,以下所述仅仅是举例说明和描述一些优选实施方式,对本发明的权利要求并不具有任何限制。
在显示屏线路板1的背面,采用传统的SMT贴片方式,将控制元件2焊接在显示屏线路板1的背面上(如图1所示)。
将如图1所示的焊了控制元件2的显示屏线路板1,放在佑光DB382固晶机的夹具上,将多组R、G、B的LED芯片3固晶在显示屏线路板1上,烘烤固化,然后通过ASM-AB350焊线机用金属焊线4将多组R、G、B的LED芯片2,焊线连接在线路板1上的对应焊盘里(如图2、图3所示)。
用0.4~0.6mm厚的FR4黑色树脂的玻纤板5,根据设计的位置在黑色树脂的玻纤板5上钻孔,形成孔杯5.1,这样就制成了不透光的多杯杯板(如图4所示)。
将不透光的多杯杯板一面用点胶机点封装胶水在杯板上,然后与固晶焊线后的显示屏线路板1对位粘贴在一起,多杯杯板贴到了每组芯片的间隙上,形成在一个杯5.1里有一组R、G、B的LED芯片3,然后在烤箱里烘烤固化,使胶水将杯板与显示屏线路板1牢固结合粘牢(如图5、图6所示),再将封装胶水6用点胶机均匀的点在每个杯5.1里,烘烤固化,制作成如图6所示的多杯的LED COB显示屏模组。
本发明采取用胶粘剂贴杯的方法,先将多组R、G、B的LED芯片进行固晶焊线在显示屏线路板上,在对位粘贴一带孔的板形成孔杯,R、G、B的LED芯片在孔杯内的线路板上,再在杯里施加封装胶水,避开了模顶的高投资高成本,又能用COB的封装方式做出更清晰、更高密度显示屏,同时采用封装固晶焊线后再贴杯的方式,解决了在固晶焊线前贴了杯,在杯很小时,固晶嘴和焊线瓷嘴下不去的问题。
以上结合附图将一种多杯的LED COB显示屏模组及其制作方法的具体实施例对本发明进行了详细的描述。但是,本领域技术人员应当理解,以上所述仅仅是举例说明和描述一些具体实施方式,对本用新型的范围,尤其是权利要求的范围,并不具有任何限制。
Claims (4)
1.一种多杯的LED COB显示屏模组的制作方法,具体而言,在双面或者多层显示屏线路板上,将控制元件通过SMT焊接在背面,将多组R、G、B的LED芯片进行固晶焊线在显示屏线路板上,或者将多组R、G、B倒装芯片倒装焊在显示屏线路板上,在带多个孔的板背面施加上胶水,贴到显示屏线路板上的芯片间隙处,固化后形成多个孔杯,在孔杯底部已经有了和线路板导通的芯片,然后再在杯里施加封装胶水,加热固化后,即制成了多杯的LED COB显示屏模组。
2.一种多杯的LED COB显示屏模组,包括:
显示屏控制元件;
显示屏PCB板;
粘贴孔杯板的已固化的胶粘剂;
粘贴带孔的板形成的孔杯;
封装在杯底的R、G、B LED芯片;
已固化的封装胶水;
其特征在于,所述粘贴孔杯板的已固化的胶粘剂是用的透光的胶、或者是不透光的胶,所述粘贴带孔的板形成的孔杯是用透光的树脂材料制成的、或者是用不透光的树脂材料制成的、或者是用金属材料制成的、或者是用非金属无机材料制成的,一个杯里一组R、G、B芯片、或者是一个杯里有多组R.G.B芯片,芯片是正装芯片或者是倒装芯片,所述的显示屏控制元件通过SMT焊接在所述显示屏PCB板背面。
3.根据权利要求2所述的一种多杯的LED COB显示屏模组,其特征在于,所述的显示屏PCB板是双面的线路板、或者多层的线路板。
4.根据权利要求2所述的一种多杯的LED COB显示屏模组,其特征在于,所述的已固化的封装胶水是环氧的封装胶水、或者是硅胶。
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN111446348A (zh) * | 2020-04-06 | 2020-07-24 | 深圳市洲明科技股份有限公司 | 一种封装方法和led灯板 |
CN112133208A (zh) * | 2020-07-29 | 2020-12-25 | 杭州美卡乐光电有限公司 | Led显示模组与制作方法、led显示屏与制作方法 |
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US6238223B1 (en) * | 1997-08-20 | 2001-05-29 | Micro Technology, Inc. | Method of depositing a thermoplastic polymer in semiconductor fabrication |
CN203300159U (zh) * | 2013-07-09 | 2013-11-20 | 深圳市华海诚信电子显示技术有限公司 | 一种基于板上芯片封装技术的led显示屏 |
CN207868224U (zh) * | 2018-01-09 | 2018-09-14 | 王定锋 | 一种多杯的led cob显示屏模组 |
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Patent Citations (3)
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US6238223B1 (en) * | 1997-08-20 | 2001-05-29 | Micro Technology, Inc. | Method of depositing a thermoplastic polymer in semiconductor fabrication |
CN203300159U (zh) * | 2013-07-09 | 2013-11-20 | 深圳市华海诚信电子显示技术有限公司 | 一种基于板上芯片封装技术的led显示屏 |
CN207868224U (zh) * | 2018-01-09 | 2018-09-14 | 王定锋 | 一种多杯的led cob显示屏模组 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN111446348A (zh) * | 2020-04-06 | 2020-07-24 | 深圳市洲明科技股份有限公司 | 一种封装方法和led灯板 |
CN111446348B (zh) * | 2020-04-06 | 2021-04-13 | 深圳市洲明科技股份有限公司 | 一种封装方法和led灯板 |
CN112133208A (zh) * | 2020-07-29 | 2020-12-25 | 杭州美卡乐光电有限公司 | Led显示模组与制作方法、led显示屏与制作方法 |
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