CN110021588A - 一种带杯灯珠的led显示屏模组及其制作方法 - Google Patents

一种带杯灯珠的led显示屏模组及其制作方法 Download PDF

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CN110021588A
CN110021588A CN201810043768.5A CN201810043768A CN110021588A CN 110021588 A CN110021588 A CN 110021588A CN 201810043768 A CN201810043768 A CN 201810043768A CN 110021588 A CN110021588 A CN 110021588A
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王定锋
徐文红
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Abstract

本发明涉及一种带杯灯珠的LED显示屏模组及其制作方法，具体而言，在线路板上将多组R、G、B的LED芯片进行固晶焊线，或者将多组倒装R、G、B的芯片焊在线路板上，在带孔的板背面施上胶水，贴到线路板上的芯片间隙处，固化后形成孔杯，在孔杯底已经有了和线路板导通的芯片，然后再在杯里滴加封装胶水，烘烤固化，再用分切机分切成多个单杯灯珠，或者是多个多杯灯珠，将制作出的单杯灯珠、或者多杯灯珠及控制元件分别焊接到显示屏PCB的两面，一面是灯珠，另一面是控制元件，即制成了带杯灯珠的LED显示屏模组。

Description

一种带杯灯珠的LED显示屏模组及其制作方法
技术领域
本发明涉及线路板及LED应用领域，具体涉及一种带杯灯珠的LED显示屏模组及其制作方法。
背景技术
大角度发光的贴片灯珠用于制作圣诞灯，铜线灯及LED显示屏，液晶面板背光等产品，现有技术制作大角度灯珠时，都是用模顶方法制作，设备投资大，封装胶很贵，另外制作显示屏灯珠时，都是制作的单组单杯RGB灯珠，只有灯珠越小，才能制作高密度显示屏，但是灯珠太小，SMT贴片难度大，贴片良率低，而且灯珠太小贴片后由于焊点小很易脱落，很难制作高密度显示屏，而且现有的高密度显示屏灯珠都是不带杯的透明灯珠，发光角度太大，灯珠间串色混色，导致显示屏清晰度不好。
为了克服以上的缺陷和不足，本发明采取用胶粘剂贴杯的方法制作出既可透光杯的灯珠，又可以是不透光杯的灯珠，既可以是单杯灯珠又可以是多杯灯珠，避开了模顶的高投资高成本，又能用不透光的带杯灯珠做出显示屏更清晰，同时又用多杯制作的灯珠，灯珠焊脚多受力大，SMT焊接后不易脱落，良率高，效率高，能做更高密度显示屏，同时采封装固晶焊线后再贴杯的方式，解决了在固晶焊线前贴了杯，在杯很小时，固晶嘴和焊线瓷嘴下不去的问题。
发明内容
本发明涉及一种带杯灯珠的LED显示屏模组及其制作方法，具体而言，在线路板上将多组R、G、B的LED芯片进行固晶焊线，或者将多组倒装R、G、B的芯片焊在线路板上，在带孔的板背面施上胶水，贴到线路板上的芯片间隙处，固化后形成孔杯，在孔杯底已经有了和线路板导通的芯片，然后再在杯里滴加封装胶水，烘烤固化，再用分切机分切成多个单杯灯珠，或者是多个多杯灯珠，将制作出的单杯灯珠、或者多杯灯珠及控制元件分别焊接到显示屏PCB的两面，一面是灯珠，另一面是控制元件，即制成了带杯灯珠的LED显示屏模组。
根据本发明提供了一种多杯的LED COB显示屏模组的制作方法，具体而言，在双面或者多层显示屏线路板上，将控制元件通过SMT焊接在背面，将多组R、G、B的LED芯片进行固晶焊线在显示屏线路板上，或者将多组R、G、B倒装芯片倒装焊在显示屏线路板上，在带多个孔的板背面施加上胶水，贴到显示屏线路板上的芯片间隙处，固化后形成多个孔杯，在孔杯底部已经有了和线路板导通的芯片，然后再在杯里施加封装胶水，加热固化后，即制成了多杯的LED COB显示屏模组。
根据本发明提供了一种多杯的LED COB显示屏模组，包括：显示屏控制元件；显示屏PCB板；粘贴孔杯板的已固化的胶粘剂；粘贴带孔的板形成的孔杯；封装在杯底的R、G、BLED芯片；已固化的封装胶水；设置在显示屏PCB板背面的多个用于焊锡焊的金属焊点；其特征在于，所述粘贴孔杯板的已固化的胶粘剂是用的透光的封装胶、或者是不透光的胶，所述粘贴带孔的板形成的孔杯是用透光的封装胶同样的树脂材料制成的、或者是用不透光的树脂材料制成的、或者是用金属材料制成的、或者是用非金属无机材料制成的，一个杯里一组R、G、B芯片、或者是一个杯里有多组R.G.B芯片，芯片是正装芯片或者是倒装芯片，所述的显示屏控制元件通过SMT焊接在所述显示屏PCB板背面。
根据本发明的一优选实施例，所述的一种多杯的LED COB显示屏模组，其特征在于，所述的显示屏PCB板是双面的线路板、或者多层的线路板。
根据本发明的一优选实施例，所述的一种多杯的LED COB显示屏模组，其特征在于，所述的已固化的封装胶水是环氧的封装胶水、或者是硅胶。
在以下对附图和具体实施方式的描述中，将阐述本发明的一个或多个实施例的细节。
附图说明
通过结合以下附图阅读本说明书，本发明的特征、目的和优点将变得更加显而易见，对附图的简要说明如下。
图1为沉金的双面封装线路板的平面示意图。
图2为在沉金的双面封装线路板上固晶焊线后的平面示意图。
图3为制作的多杯杯板的平面示意图。
图4为多杯杯板与固晶焊线后的线路板1对位粘贴在一起的平面示意图。
图5为多杯多组的RGB线路板LED灯珠的平面示意图。
图6为多杯多组的RGB线路板LED灯珠的截面示意图。
图7为单组单杯的RGB线路板LED灯珠的平面示意图。
图8为单组单杯的RGB线路板LED灯珠的截面示意图。
图9为用多杯多组的RGB线路板LED灯珠，制作成的带杯灯珠LED显示屏模组的截面示意图。
图10为用单组单杯的RGB线路板LED灯珠，制作成的带杯灯珠LED显示屏模组的截面示意图。
具体实施方式
下面将以优选实施例为例来对本发明进行详细的描述。
但是本领域技术人员应当理解，以下所述仅仅是举例说明和描述一些优选实施方式，对本发明的权利要求并不具有任何限制。
将如图1所示的沉金的双面封装线路板1，放在佑光DB382固晶机上，将多组R、G、B的LED芯片2固晶在沉金的双面封装线路板1上，烘烤固化，然后通过ASM-AB350焊线机用金属焊线3将多组R、G、B的LED芯片2，焊线连接在线路板1上的对应焊盘里(如图2所示)。
在模腔盆面的表面涂上脱模剂，再将耐高温的环氧透明封装胶水注入在模腔盆里流平，烘烤固化，形成透明的环氧板4，然后从模腔盆里取出，根据设计的位置在环氧板4上钻出孔，形成孔杯4.1，制成了透光的多杯杯板(如图3所示)、或者用0.4～0.6mm厚的FR4黑色树脂的玻纤板4，根据设计的位置在黑色树脂的玻纤板4上钻出孔，形成孔杯4.1，这样就制成了不透光的多杯杯板(如图3所示)。
将不透光的多杯杯板一面用点胶机点封装胶水在杯板上，然后与固晶焊线后的线路板1对位粘贴在一起，多杯杯板贴到了每组芯片的间隙上，形成在一个杯4.1里有一组R、G、B的LED芯片2，然后在烤箱里烘烤固化，使胶水将杯板与线路板1牢固结合粘牢(如图4所示)，将封装胶水6用点胶机均匀的点在每个杯4.1里，烘烤固化，用分切机分切成多杯多组的RGB线路板LED灯珠(如图5、图6所示)。
或者将透光的多杯杯板一面用点胶机点封装胶水在杯板上，然后与固晶焊线后的线路板1对位粘贴在一起，多杯杯板贴到了每组芯片的间隙上，形成在一个杯4.1里有一组R、G、B的LED芯片2，然后在烤箱里烘烤固化，使胶水将杯板与线路板1牢固结合粘牢(如图4所示)，将封装胶水6用点胶机均匀的点在每个杯4.1里，烘烤固化，用分切机分切成单组单杯的RGB线路板LED灯珠(如图7、图8所示)。
将制作出的多杯多组的RGB线路板LED灯珠5焊接到显示屏PCB8的一面，将显示屏控制元件9焊接到显示屏PCB8的另一面，制成了带杯灯珠的LED显示屏模组。
或者是将制作出的单组单杯的RGB线路板LED灯珠7焊接到显示屏PCB8的一面，将显示屏控制元件9焊接到显示屏PCB8的另一面，制成了带杯灯珠的LED显示屏模组。
以上结合附图将一种带杯灯珠的LED显示屏模组及其制作方法的具体实施例对本发明进行了详细的描述。但是，本领域技术人员应当理解，以上所述仅仅是举例说明和描述一些具体实施方式，对本用新型的范围，尤其是权利要求的范围，并不具有任何限制。

Claims (4)

1.一种多杯的LED COB显示屏模组的制作方法，具体而言，在双面或者多层显示屏线路板上，将控制元件通过SMT焊接在背面，将多组R、G、B的LED芯片进行固晶焊线在显示屏线路板上，或者将多组R、G、B倒装芯片倒装焊在显示屏线路板上，在带多个孔的板背面施加上胶水，贴到显示屏线路板上的芯片间隙处，固化后形成多个孔杯，在孔杯底部已经有了和线路板导通的芯片，然后再在杯里施加封装胶水，加热固化后，即制成了多杯的LED COB显示屏模组。
2.一种多杯的LED COB显示屏模组，包括：
显示屏控制元件；
显示屏PCB板；
粘贴孔杯板的已固化的胶粘剂；
粘贴带孔的板形成的孔杯；
封装在杯底的R、G、B LED芯片；
已固化的封装胶水；
设置在显示屏PCB板背面的多个用于焊锡焊的金属焊点；
其特征在于，所述粘贴孔杯板的已固化的胶粘剂是用的透光的封装胶、或者是不透光的胶，所述粘贴带孔的板形成的孔杯是用透光的封装胶同样的树脂材料制成的、或者是用不透光的树脂材料制成的、或者是用金属材料制成的、或者是用非金属无机材料制成的，一个杯里一组R、G、B芯片、或者是一个杯里有多组R.G.B芯片，芯片是正装芯片或者是倒装芯片，所述的显示屏控制元件通过SMT焊接在所述显示屏PCB板背面。
3.根据权利要求2所述的一种多杯的LED COB显示屏模组，其特征在于，所述的显示屏PCB板是双面的线路板、或者多层的线路板。
4.根据权利要求2所述的一种多杯的LED COB显示屏模组，其特征在于，所述的已固化的封装胶水是环氧的封装胶水、或者是硅胶。
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