CN110010746A - 具有磷光体转换器的无胶发光器件 - Google Patents

具有磷光体转换器的无胶发光器件 Download PDF

Info

Publication number
CN110010746A
CN110010746A CN201910202058.7A CN201910202058A CN110010746A CN 110010746 A CN110010746 A CN 110010746A CN 201910202058 A CN201910202058 A CN 201910202058A CN 110010746 A CN110010746 A CN 110010746A
Authority
CN
China
Prior art keywords
light emitting
wavelength converting
film
emitting element
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201910202058.7A
Other languages
English (en)
Chinese (zh)
Inventor
G.巴辛
P.马丁
H.H.崔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lumileds Holding BV
Lumileds LLC
Original Assignee
Lumileds Holding BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lumileds Holding BV filed Critical Lumileds Holding BV
Publication of CN110010746A publication Critical patent/CN110010746A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0361—Manufacture or treatment of packages of wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0363—Manufacture or treatment of packages of optical field-shaping means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means

Landscapes

  • Led Device Packages (AREA)
CN201910202058.7A 2014-01-07 2014-12-30 具有磷光体转换器的无胶发光器件 Pending CN110010746A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201461924283P 2014-01-07 2014-01-07
US61/924283 2014-01-07
CN201480072576.7A CN105874617A (zh) 2014-01-07 2014-12-30 具有磷光体转换器的无胶发光器件

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201480072576.7A Division CN105874617A (zh) 2014-01-07 2014-12-30 具有磷光体转换器的无胶发光器件

Publications (1)

Publication Number Publication Date
CN110010746A true CN110010746A (zh) 2019-07-12

Family

ID=52472353

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201910202058.7A Pending CN110010746A (zh) 2014-01-07 2014-12-30 具有磷光体转换器的无胶发光器件
CN201480072576.7A Pending CN105874617A (zh) 2014-01-07 2014-12-30 具有磷光体转换器的无胶发光器件

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201480072576.7A Pending CN105874617A (zh) 2014-01-07 2014-12-30 具有磷光体转换器的无胶发光器件

Country Status (7)

Country Link
US (1) US11024781B2 (https=)
EP (1) EP3092666B1 (https=)
JP (1) JP6709159B2 (https=)
KR (1) KR102323289B1 (https=)
CN (2) CN110010746A (https=)
TW (1) TWI724985B (https=)
WO (1) WO2015104623A1 (https=)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6217705B2 (ja) * 2015-07-28 2017-10-25 日亜化学工業株式会社 発光装置及びその製造方法
DE102015113961A1 (de) * 2015-08-24 2017-03-02 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen eines Konverterelements, Verfahren zum Herstellen eines optoelektronischen Bauelements, Konverterelement und optoelektronisches Bauelement
US10763404B2 (en) 2015-10-05 2020-09-01 Maven Optronics Co., Ltd. Light emitting device with beveled reflector and manufacturing method of the same
TWI677114B (zh) * 2015-10-05 2019-11-11 行家光電股份有限公司 具導角反射結構的發光裝置
CN107039572B (zh) * 2016-02-03 2019-05-10 行家光电股份有限公司 具非对称性光形的发光装置及其制造方法
US10230030B2 (en) 2016-01-28 2019-03-12 Maven Optronics Co., Ltd. Light emitting device with asymmetrical radiation pattern and manufacturing method of the same
JP6304297B2 (ja) 2016-04-06 2018-04-04 日亜化学工業株式会社 発光装置の製造方法
EP3491679B1 (en) 2016-07-26 2023-02-22 CreeLED, Inc. Light emitting diodes, components and related methods
TWI599078B (zh) * 2016-08-05 2017-09-11 行家光電股份有限公司 具濕氣阻隔結構之晶片級封裝發光裝置
JP6798279B2 (ja) * 2016-11-28 2020-12-09 豊田合成株式会社 発光装置の製造方法
JP2018155968A (ja) 2017-03-17 2018-10-04 日亜化学工業株式会社 透光性部材の製造方法及び発光装置の製造方法
JP6471764B2 (ja) * 2017-03-31 2019-02-20 日亜化学工業株式会社 発光装置の製造方法
KR101877237B1 (ko) * 2017-05-23 2018-08-09 주식회사 세미콘라이트 반도체 발광소자 및 이의 제조 방법
CN109804476A (zh) * 2017-09-15 2019-05-24 厦门市三安光电科技有限公司 一种白光led封装结构以及白光源系统
JP6677232B2 (ja) * 2017-09-29 2020-04-08 日亜化学工業株式会社 発光装置の製造方法
US10854794B2 (en) * 2017-12-20 2020-12-01 Lumileds Llc Monolithic LED array structure
US11121298B2 (en) * 2018-05-25 2021-09-14 Creeled, Inc. Light-emitting diode packages with individually controllable light-emitting diode chips
DE102018119323A1 (de) * 2018-08-08 2020-02-13 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen von Konversionselementen, Konversionselemente, Verfahren zum Herstellen eines lichtemittierenden Halbleiterbauteils und lichtemittierendes Halbleiterbauteil
USD902448S1 (en) 2018-08-31 2020-11-17 Cree, Inc. Light emitting diode package
US11233183B2 (en) * 2018-08-31 2022-01-25 Creeled, Inc. Light-emitting diodes, light-emitting diode arrays and related devices
US11335833B2 (en) * 2018-08-31 2022-05-17 Creeled, Inc. Light-emitting diodes, light-emitting diode arrays and related devices
DE102018127521B4 (de) 2018-11-05 2026-03-05 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Halbleiterbauelement und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements
US10910433B2 (en) * 2018-12-31 2021-02-02 Lumileds Llc Pixelated LED array with optical elements
US11101411B2 (en) * 2019-06-26 2021-08-24 Creeled, Inc. Solid-state light emitting devices including light emitting diodes in package structures
KR102625710B1 (ko) * 2021-09-24 2024-01-16 주식회사 루츠 형광체의 제조방법
CN114551495B (zh) * 2022-03-01 2026-02-10 镭昱光电科技(苏州)有限公司 显示器件及其制备方法
DE102022122981A1 (de) * 2022-09-09 2024-03-14 Ams-Osram International Gmbh Verfahren zum Herstellen eines optoelektronischen Bauelements und optoelektronisches Bauelement
WO2025242660A1 (en) * 2024-05-23 2025-11-27 Ams-Osram International Gmbh Converter element laminate, method for fixing a converter element on a radiation emitting semiconductor chip, and radiation emitting device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102185042A (zh) * 2011-03-28 2011-09-14 北京大学深圳研究生院 Led封装方法、封装器件、光调节方法及系统
CN102347427A (zh) * 2010-08-02 2012-02-08 斯坦雷电气株式会社 发光装置及其制造方法
CN103154146A (zh) * 2011-06-16 2013-06-12 东丽株式会社 含荧光体片材、使用其的led发光装置及其制造方法
CN103165797A (zh) * 2013-03-13 2013-06-19 上海大学 白光led薄膜封装用荧光粉预制薄膜及其制备方法
CN103178195A (zh) * 2011-12-26 2013-06-26 日东电工株式会社 发光二极管装置的制造方法

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4109756B2 (ja) 1998-07-07 2008-07-02 スタンレー電気株式会社 発光ダイオード
US7361938B2 (en) * 2004-06-03 2008-04-22 Philips Lumileds Lighting Company Llc Luminescent ceramic for a light emitting device
US7560294B2 (en) 2004-06-07 2009-07-14 Toyoda Gosei Co., Ltd. Light emitting element and method of making same
JP4857596B2 (ja) 2004-06-24 2012-01-18 豊田合成株式会社 発光素子の製造方法
US7553683B2 (en) * 2004-06-09 2009-06-30 Philips Lumiled Lighting Co., Llc Method of forming pre-fabricated wavelength converting elements for semiconductor light emitting devices
US7256483B2 (en) * 2004-10-28 2007-08-14 Philips Lumileds Lighting Company, Llc Package-integrated thin film LED
US7858408B2 (en) * 2004-11-15 2010-12-28 Koninklijke Philips Electronics N.V. LED with phosphor tile and overmolded phosphor in lens
US7344952B2 (en) 2005-10-28 2008-03-18 Philips Lumileds Lighting Company, Llc Laminating encapsulant film containing phosphor over LEDs
US8080828B2 (en) * 2006-06-09 2011-12-20 Philips Lumileds Lighting Company, Llc Low profile side emitting LED with window layer and phosphor layer
US20080121911A1 (en) * 2006-11-28 2008-05-29 Cree, Inc. Optical preforms for solid state light emitting dice, and methods and systems for fabricating and assembling same
JP4927019B2 (ja) * 2007-04-10 2012-05-09 信越化学工業株式会社 蛍光体含有接着性シリコーン組成物、該組成物からなる組成物シート、及び該シートを使用する発光装置の製造方法
TWI404228B (zh) 2007-07-12 2013-08-01 Epistar Corp 半導體發光裝置與其製造方法
US9024340B2 (en) 2007-11-29 2015-05-05 Nichia Corporation Light emitting apparatus and method for producing the same
US10147843B2 (en) * 2008-07-24 2018-12-04 Lumileds Llc Semiconductor light emitting device including a window layer and a light-directing structure
JP5518502B2 (ja) * 2009-01-27 2014-06-11 シチズン電子株式会社 発光ダイオードの製造方法
US7855394B2 (en) * 2009-06-18 2010-12-21 Bridgelux, Inc. LED array package covered with a highly thermal conductive plate
US9048404B2 (en) * 2009-07-06 2015-06-02 Zhuo Sun Thin flat solid state light source module
US8431423B2 (en) * 2009-07-16 2013-04-30 Koninklijke Philips Electronics N.V. Reflective substrate for LEDS
US20110049545A1 (en) * 2009-09-02 2011-03-03 Koninklijke Philips Electronics N.V. Led package with phosphor plate and reflective substrate
DE112011102800T8 (de) * 2010-08-25 2013-08-14 Samsung Electronics Co., Ltd. Phosphorfilm, Verfahren zum Herstellen desselben, Beschichtungsverfahren für eine Phosphorschicht, Verfahren zum Herstellen eines LED-Gehäuses und dadurch hergestelltes LED-Gehäuse
DE102010042217A1 (de) * 2010-10-08 2012-04-12 Osram Ag Optoelektronisches Halbleiterbauelement und Verfahren zu seiner Herstellung
US8884330B2 (en) * 2011-04-13 2014-11-11 Osram Sylvania Inc. LED wavelength-converting structure including a thin film structure
JP2013016588A (ja) * 2011-07-01 2013-01-24 Citizen Electronics Co Ltd Ｌｅｄ発光装置
JP2013038187A (ja) * 2011-08-05 2013-02-21 Stanley Electric Co Ltd 発光装置およびその製造方法
JP6033557B2 (ja) 2012-03-06 2016-11-30 日東電工株式会社 封止シート、および、それを用いた発光ダイオード装置の製造方法
CN102800794A (zh) 2012-08-17 2012-11-28 南通脉锐光电科技有限公司 一种光学波长转换器件以及在白光发光器件的应用
JP2014093403A (ja) * 2012-11-02 2014-05-19 Shin Etsu Chem Co Ltd 熱硬化性シリコーン樹脂シート及びその製造方法、該熱硬化性シリコーン樹脂シートを使用する発光装置及びその製造方法
JP2014096491A (ja) * 2012-11-09 2014-05-22 Nitto Denko Corp 蛍光体層被覆半導体素子、その製造方法、半導体装置およびその製造方法
JP6070498B2 (ja) * 2012-12-21 2017-02-01 信越化学工業株式会社 蛍光体含有層と白色顔料含有層を有する熱硬化性シリコーン樹脂シート、それを使用する発光装置の製造方法及び封止発光半導体装置
CN103236485B (zh) 2013-04-16 2016-01-13 哈尔滨鎏霞光电技术有限公司 一种在蓝宝石透明导热板上制作发光体的方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102347427A (zh) * 2010-08-02 2012-02-08 斯坦雷电气株式会社 发光装置及其制造方法
CN102185042A (zh) * 2011-03-28 2011-09-14 北京大学深圳研究生院 Led封装方法、封装器件、光调节方法及系统
CN103154146A (zh) * 2011-06-16 2013-06-12 东丽株式会社 含荧光体片材、使用其的led发光装置及其制造方法
CN103178195A (zh) * 2011-12-26 2013-06-26 日东电工株式会社 发光二极管装置的制造方法
CN103165797A (zh) * 2013-03-13 2013-06-19 上海大学 白光led薄膜封装用荧光粉预制薄膜及其制备方法

Also Published As

Publication number Publication date
KR20160106152A (ko) 2016-09-09
WO2015104623A1 (en) 2015-07-16
TWI724985B (zh) 2021-04-21
EP3092666A1 (en) 2016-11-16
JP2017501589A (ja) 2017-01-12
US20170301832A1 (en) 2017-10-19
US11024781B2 (en) 2021-06-01
KR102323289B1 (ko) 2021-11-08
JP6709159B2 (ja) 2020-06-10
EP3092666B1 (en) 2019-08-28
TW201539801A (zh) 2015-10-16
CN105874617A (zh) 2016-08-17

Similar Documents

Publication Publication Date Title
US11024781B2 (en) Glueless light emitting device with phosphor converter
US20110031516A1 (en) Led with silicone layer and laminated remote phosphor layer
JP5511524B2 (ja) 光半導体用封止シート
JP5107886B2 (ja) 光半導体装置の製造方法
JP5078644B2 (ja) 光半導体素子封止用樹脂シートおよび光半導体装置
US20100283065A1 (en) Led device with a light extracting rough structure and manufacturing methods thereof
KR101641384B1 (ko) 광반도체의 캡슐화를 위한 시트
JP2013526078A5 (https=)
JP2009231750A (ja) 光半導体素子封止用樹脂シートおよび光半導体装置
JP2016201546A (ja) 発光装置を製造する方法
WO2014203793A1 (ja) 発光装置、その製造のための封止フィルム積層体、および発光装置の製造方法
CN103180945A (zh) 用于制造发光器件的层压支撑膜及其制造方法
WO2013075393A1 (en) Led device with a light extracting rough structure and manufacturing methods thereof
CN105393374A (zh) 具有光学元件并且没有衬底载体的pc led
WO2013175338A1 (en) Phosphor coating process for discrete light emitting devices
JP2018006490A (ja) シート成形体の製造方法、及びそれを用いた発光装置の製造方法
TW200938000A (en) Optical device and method of fabricating the same
CN104282820A (zh) 发光二极管及其封装方法
KR20160059450A (ko) 몰드 기판, 패키지 구조체 및 이들의 제조 방법
JP5428122B2 (ja) 樹脂成型品とその成型方法、および、発光装置とその製造方法
JP2019179791A (ja) モジュールの製造方法及び光学モジュールの製造方法
TW201515274A (zh) 發光二極體製造方法
CN115332422A (zh) 发光器件的制备方法、发光器件及背光模组
JP2012129362A (ja) 光半導体装置
CN106252474A (zh) 一种倒装白光led芯片及其制造方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20190712