CN110010742B - 具有波长转换材料的密闭密封的led模块 - Google Patents

具有波长转换材料的密闭密封的led模块 Download PDF

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Publication number
CN110010742B
CN110010742B CN201910257207.XA CN201910257207A CN110010742B CN 110010742 B CN110010742 B CN 110010742B CN 201910257207 A CN201910257207 A CN 201910257207A CN 110010742 B CN110010742 B CN 110010742B
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substrate
light emitting
transparent plate
cavity
emitting device
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Chinese (zh)
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CN110010742A (zh
Inventor
K.斯米祖
B.J.莫兰
M.M.布特沃思
O.B.斯彻金
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Koninklijke Philips NV
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Koninklijke Philips NV
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0361—Manufacture or treatment of packages of wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses

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CN201910257207.XA 2013-02-11 2014-02-10 具有波长转换材料的密闭密封的led模块 Active CN110010742B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361763081P 2013-02-11 2013-02-11
US61/763081 2013-02-11
CN201480008361.9A CN104969371A (zh) 2013-02-11 2014-02-10 具有波长转换材料的密闭密封的led模块

Related Parent Applications (1)

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CN201480008361.9A Division CN104969371A (zh) 2013-02-11 2014-02-10 具有波长转换材料的密闭密封的led模块

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CN110010742A CN110010742A (zh) 2019-07-12
CN110010742B true CN110010742B (zh) 2021-11-12

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CN201910257207.XA Active CN110010742B (zh) 2013-02-11 2014-02-10 具有波长转换材料的密闭密封的led模块
CN201480008361.9A Pending CN104969371A (zh) 2013-02-11 2014-02-10 具有波长转换材料的密闭密封的led模块

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Country Link
US (3) US10002855B2 (https=)
EP (1) EP2954566B1 (https=)
JP (2) JP2016507162A (https=)
KR (1) KR20150119179A (https=)
CN (2) CN110010742B (https=)
TW (1) TWI645583B (https=)
WO (1) WO2014122626A1 (https=)

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JP2018532256A (ja) * 2015-08-12 2018-11-01 コーニング インコーポレイテッド 密封型装置及びその構成方法
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KR102415343B1 (ko) * 2017-09-25 2022-06-30 엘지전자 주식회사 디스플레이 디바이스
KR102498252B1 (ko) * 2017-09-26 2023-02-10 삼성전자주식회사 발광 칩들을 포함하는 디스플레이 및 그 제조 방법
CN109962149B (zh) * 2017-12-14 2020-10-27 Tcl科技集团股份有限公司 一种封装薄膜及其制备方法、光电器件
CN113544829A (zh) * 2019-03-07 2021-10-22 康宁股份有限公司 用于管芯向上的扇出型封装的玻璃载体及其制造方法
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Also Published As

Publication number Publication date
US10700044B2 (en) 2020-06-30
JP2016507162A (ja) 2016-03-07
EP2954566B1 (en) 2020-04-08
EP2954566A1 (en) 2015-12-16
US10002855B2 (en) 2018-06-19
US20150371975A1 (en) 2015-12-24
TWI645583B (zh) 2018-12-21
US20180366451A1 (en) 2018-12-20
JP2019220726A (ja) 2019-12-26
US20200328194A1 (en) 2020-10-15
TW201442294A (zh) 2014-11-01
KR20150119179A (ko) 2015-10-23
CN110010742A (zh) 2019-07-12
CN104969371A (zh) 2015-10-07
US11081471B2 (en) 2021-08-03
WO2014122626A1 (en) 2014-08-14

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