CN110007113A - Test jack - Google Patents
Test jack Download PDFInfo
- Publication number
- CN110007113A CN110007113A CN201811376927.XA CN201811376927A CN110007113A CN 110007113 A CN110007113 A CN 110007113A CN 201811376927 A CN201811376927 A CN 201811376927A CN 110007113 A CN110007113 A CN 110007113A
- Authority
- CN
- China
- Prior art keywords
- test jack
- conductive powder
- polymeric beads
- polymeric
- insulator layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0416—Connectors, terminals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
- H01R33/74—Devices having four or more poles, e.g. holders for compact fluorescent lamps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2201/00—Connectors or connections adapted for particular applications
- H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Connecting Device With Holders (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The present invention provides a kind of test jack.The test jack can connect between semiconductor devices and tester, to execute electrical testing to the semiconductor devices.The test jack may include insulator layer, polymeric beads and conductive powder.The insulator layer can be arranged between the semiconductor devices and the tester.The polymeric beads can be arranged in the whole surface of the insulator layer.The conductive powder can be arranged in the insulator layer to form multiple groups.
Description
Cross reference to related applications
The 10-2017-0184088 South Korea submitted this application claims on December 29th, 2017 to Korean Intellectual Property Office
The priority of application, by quoting whole be incorporated herein.
Technical field
Various embodiments can usually be related to a kind of semiconductor devices, be connected to semiconductor package more particularly, to one kind
Test jack between piece installing and tester.
Background technique
In general, the reliability in order to ensure semiconductor package part before semiconductor package part is consigned to consumer, it can
Semiconductor package part is tested under the pressure condition of normal condition and/or such as high temperature and high pressure to draw semiconductor package part
It is divided into normal semiconductor packaging part and abnormal semiconductor package part.
Semiconductor package part can be fixed to test jack.Having test jack with a semiconductor package can be loaded
Into tester to execute test process to semiconductor package part.Test jack can be supported by silicone resin.
However, silicone resin may have low heat distortion temperature.In addition, the volume of silicone resin easily changes because of temperature.Cause
This, the shape of test jack can easily vary.As a result, the shape of the change of test jack may cause with small spacing
The test crash of semiconductor package part.
Summary of the invention
In the example embodiment of the disclosure, a kind of test jack be can connect between semiconductor devices and tester,
To execute electrical testing to the semiconductor devices.The test jack may include insulator layer, polymeric beads and conductive powder.
The insulator layer can be arranged between the semiconductor devices and the tester.The polymeric beads can be arranged in institute
It states in the whole surface of insulator layer.The conductive powder can be arranged in the insulator layer to form multiple groups.
In the example embodiment of the disclosure, a kind of test jack may include silicon polymer synthetic rubber and multiple conductions
Powder group.The silicon polymer synthetic rubber may include the silicone rubber resina and polymeric synthetic resin being mixed with each other.It is described
Conductive powder group may include conductive powder.It is poly- that the conductive powder group can magnetically be arranged in the silicon with uniform rule
It closes in object synthetic rubber.
Detailed description of the invention
By the detailed description below in conjunction with attached drawing, the above and other side of the theme of the disclosure will be more clearly understood
Face, feature and advantage, in which:
Fig. 1 is the sectional view for showing a kind of test jack according to example embodiment.
Fig. 2A and Fig. 2 B is the sectional view of the particle arrangement for the test jack for showing the average diameter according to polymeric beads；
Fig. 3 A and Fig. 3 B are the sectional views for showing the restoring force of test jack according to example embodiment；
Fig. 4 A to Fig. 4 C is the sectional view for showing the gap variation of the conductive powder group under high temperature and low temperature；
Fig. 5 is the curve graph for showing the heat-resistant limit temperature of polymer according to example embodiment；
Fig. 6 is the curve graph for showing the resistance based on testing time according to example embodiment；
Fig. 7 is the curve graph for showing the contact force based on testing time according to example embodiment；
Fig. 8 is the curve graph for showing distribution of resistance at high temperature according to example embodiment；And
Fig. 9 is the curve graph for showing distribution of resistance at low temperature according to example embodiment.
Specific embodiment
Various embodiments of the present invention will be described in greater detail with reference to the attached drawings.Attached drawing is various embodiments (and intermediate structure)
Schematic diagram.It is therefore contemplated that the configuration of the diagram as caused by such as manufacturing technology and/or tolerance and the variation of shape.
Therefore, described embodiment should not be construed as limited to specific configuration and shape shown in this article, but may include not de-
The deviation of configuration and vpg connection from conception and range of the invention as defined in the appended claims.
Sectional view and/or plan view herein with reference to idealized embodiments of the invention describe the present invention.However, this hair
Bright embodiment is not necessarily to be construed as limitation present inventive concept.Although some embodiments of the present invention will be shown and be described,
It will be appreciated by the skilled addressee that in the case where not departing from the principle of the present invention and conception, it can be in these embodiments
In make change.
Fig. 1 is the sectional view for showing a kind of test jack according to example embodiment.
With reference to Fig. 1, the test jack 100 of the example embodiment can be arranged in semiconductor devices 102 and tester 104 it
Between.Test jack 100 may include body layer 110.
Body layer 110 may include silicon insulating materials.Multiple insulating polymer pearls 120 and conductive powder 130 can be arranged
In body layer 110.
Insulating polymer pearl 120 can be distributed in the whole region of body layer 110.
Conductive powder 130 can be distributed in the outer end with the external terminal 102a of semiconductor devices 102 and tester 104
At the corresponding region sub- 104a.
Because body layer 110 can have insulation characterisitic, body layer 110 can prevent the oxidation of conductive powder 130
Electric short circuit between conductive powder 130.In addition, body layer 110 can prevent particle infiltration into test jack 100.Insulation
Silicon may include silicone rubber resina.Alternatively, body layer 110 may include the elastic material with expansion characteristics and shrinkage character.
For example, body layer 110 may include the heat-resistant polymer with cross-linked structure, such as polybutadiene rubber, polyurethane rubber, day
Right rubber, polyisoprene rubber etc..
Body layer 110 can have cone or arcuate top surface to ensure individual contacts.Flexible printed circuit board
(FPCB) film can be arranged on the upper surface of body layer 110.Contact guidance film with contact hole can be arranged in body layer
To ensure individual contacts on 110 upper surface.FPCB film and contact guidance film can also be arranged in the lower surface of body layer 110
On.Frame can surround body layer 110.Frame may include the stainless steel for shielding electromagnetic wave.
Conductive powder 130 may include the conductive particle that can magnetically arrange.Conductive powder 130 may include Au and/
Or Ni powder.Conductive powder 130 may include Au, Ag, Fe, Ni, Co and combinations thereof.The surface of each conductive powder 130 can be with
It is electroplate with the layer with dissimilar metal, to improve the electric conductivity of conductive powder 130.
Conductive powder 130 can be tightly arranged to form a group 130g.Conductive powder group 130g can be relative to body layer
110 surface forms vertical conductive path.Therefore, when that can test semiconductor devices 102, conductive characteristic can be by phase
Minimum pressure in the vertical direction on the surface of body layer 110 is indicated.That is, by making electric current flowing using minimum pressure,
By the conductive density of enhancing in vertical direction, and by improving electrical characteristics, it can be ensured that testing reliability.
Fig. 2A and Fig. 2 B is the sectional view of the particle arrangement for the test jack for showing the average diameter according to polymeric beads.Figure
2A can show the sectional view of the test jack when the average diameter of polymeric beads can be more than reference value, and Fig. 2 B can be with
Show the sectional view of the test jack when the average diameter of polymeric beads is no more than reference value.
The average diameter of conductive powder 130 can be about 20 μm to about 40 μm.Although conductive powder 130 may not have spy
Fixed fixed mode, but the conductive powder 130 that average diameter is about 20 μm to about 40 μm can have electrical characteristics outstanding.Example
Such as, when the average diameter of conductive powder 130 can be below about 20 μm, although the bond strength between particle can be enhanced,
It is that the resistance of conductive powder 130 may increase.When the average diameter of conductive powder 130 can be greater than about 40 μm, although can be with
It is readily formed particle, but the conductivity of conductive powder 130 may be reduced due to low conductive density.
Polymeric beads 120 may include polymethyl methacrylate (PMMA) synthetic resin, synthetic rubber etc..Alternatively, poly-
Closing object pearl 120 may include other polymers and PMMA.
Conductive powder 130 can not have specific shape.In the exemplary embodiment, polymeric beads 120 may include having
The ball of uniform shapes.Alternatively, the shape of polymeric beads 120 can be not limited to spherical shape.For example, in order to conductive powder 130 it
Between be uniformly distributed polymeric beads 120, polymeric beads 120 can have the shape of almost spherical.Conductive powder 130 in order to prevent
Arrangement is interrupted, and polymeric beads 120 can have the spherical shape that diameter is about 5 μm to about 20 μm.
Under conditions of the average diameter for ensuring the conductive powder 130 of electric conductivity can be about 30 μm, work as polymer
When the diameter of pearl 120 can be lower than 5 μm, the combination that polymeric beads 120 as shown in Figure 2 A will not play supplement conductive powder 130 is strong
The effect of degree.When the diameter of polymeric beads 120 can be higher than 20 μm, polymeric beads 120 as shown in Figure 2 B can reduce conduction
The bond strength of powder 130, to deteriorate the electrical characteristics of conductive powder 130.Particularly, when can be executed to conductive powder 130
When electroplating technology is to improve conductivity, large-sized polymeric beads 120 may damage the plated film of conductive powder 130.
Therefore, when the average diameter of polymeric beads 120 can be about the 20% of the average diameter of conductive powder 130 to about
When 50%, polymeric beads 120 can supplement body layer 110 and be used to support the mechanical property of conductive powder 130 with improvement and pass through
Conductive powder 130 is set to be bonded to each other to enhance electrical characteristics.
Fig. 3 A and Fig. 3 B are the sectional views for showing the restoring force of test jack according to example embodiment.Fig. 3 A shows master
Conductive metal powder 130 and Fig. 3 B in body layer 110 show insulating polymer pearl 120 and conductive gold in body layer 110
Belong to powder 130.
With reference to Fig. 3 A, the conducting sphere or conductive welding disk of semiconductor devices 102 can press to test jack 100.Body layer
110 can due to from the pressure of semiconductor devices 102 flexible deformation.That is, can produce contraction distortion in body layer 110.
When conducting sphere can not press to test jack 100, contraction distortion still be may remain in body layer 110.Work as body layer
110 can only include conductive metal powder 130 when, body layer 110 can have high-compressibility and low restoring force.
With reference to Fig. 3 B, when body layer 110 may include conductive metal powder 130 and polymeric beads 120, polymeric beads
120 can supplement the flexible deformation of body layer 110, so that can be with the shape of retainer body layer 110 after the pressure of conducting sphere.
For example, when the weight of body layer 110 (that is, silicone rubber resina) can have about 100 weight %, polymeric beads
The amount of polymeric synthetic resin in 120 can be about 20 weight % to about 40 weight %.Body layer 110 and polymeric beads 120
Mixing ratio can be about 1:0.2, preferably from about 1:0.25.
When polymeric synthetic resin can be below about 20 weight % relative to the amount of silicone rubber resina, recovery effects may
It is very small.When polymeric synthetic resin can be greater than about 40 weight % relative to the amount of silicone rubber resina, compression effectiveness can be with
It is cancelled to lose elastic effect.
In the exemplary embodiment, insulating body layer 110 and insulating polymer pearl 120 can separate.Alternatively, can be used
Silicon-Macroscopic single crystal rubber, it includes insulating body layer 110 formed integrally with one another and insulating polymer pearls 120.Silicon-polymerization
Object synthetic rubber may include the functional polymer pearl in silicon base and silicon base.
When test jack 100 can be contacted with conducting sphere or conductive welding disk, silicon-Macroscopic single crystal rubber can play benefit
Fill the effect of impact strength.Silicone rubber resina can have weak heat resistance and weak cold resistance under high temperature and low temperature.On the contrary,
Polymeric synthetic resin can have strong heat resistance and strong cold resistance.Therefore, polymeric synthetic resin can be with silicon rubber
Resin is mixed to supplement heat resistance and cold resistance.As a result, testing reliability can be improved.
Particularly, silicone rubber resina can have high thermal expansion coefficient.Therefore, silicone rubber resina may be bad at high temperature
Change and deforms.On the contrary, the silicone rubber resina with polymeric synthetic resin can have heat resistance outstanding to inhibit to deform.
Although silicone rubber resina can have weak heat resistance, the silicone rubber resina with polymeric synthetic resin can have improvement
Thermal stability.
In addition, silicone rubber resina can have high volume change according to temperature.Particularly, silicone rubber resina is about 130
It can be easily deformed at a temperature of DEG C.In addition, there may be cracks in silicone rubber resina.
Fig. 5 is the curve graph for showing the heat-resistant limit temperature of polymer according to example embodiment.
With reference to Fig. 5, about 200 DEG C at a temperature of, weight loss will not be generated in polymeric synthetic resin.At about 200 DEG C
Temperature after can generate weight loss.Therefore, the heat resistance of polymeric synthetic resin can be higher than the heat resistance of silicon.Therefore,
It may be noted that polymeric synthetic resin can have temperature tolerance outstanding.
Compare the resistance in retest
Fig. 6 is the curve graph for showing the resistance based on testing time according to example embodiment.Comparative example in Fig. 6 is shown
Body layer 110 only including conductive powder 130 is gone out, and the example embodiment in Fig. 6 is shown including 130 He of conductive powder
The body layer 110 of polymeric beads 120.
The resistance of test jack can increase because of the retest of semiconductor devices 102.Because conductive powder 130 can be with
It is vertically magnetically arranged with uniform rule, so the flowing of charge can under the pressure of conducting sphere when testing beginning
To be constant.However, the arrangement of conductive powder 130 may be unordered in body layer 110 when can be with retest,
To make resistance increase.
On the contrary, according to example embodiment, because polymeric beads 120 can be between conductive powder 130, when conduction
When ball may repeatedly press to test jack 100, the unordered of conductive powder 130 can be prevented.
Hitting power (stroke) needed for comparing in testing
Fig. 7 is the curve graph for showing the contact force based on testing time according to example embodiment.Comparative example in Fig. 7
Body layer 110 only including conductive powder 130 is shown, and the example embodiment in Fig. 7 is shown including conductive powder 130
With the body layer 110 of polymeric beads 120.
In order to test semiconductor devices 102, conducting sphere can press to test jack 100.The pressure of conducting sphere may need
Want contact force.Maximum hitting power needed for the change in depth of about 0.2mm can be not greater than about 30gf.
With reference to Fig. 7, it may be noted that under identical testing time, the hitting power of example embodiment, which can be less than, to be compared
Exemplary hitting power.It may be noted furthermore that the hitting power of example embodiment can be not greater than about 30gf.On the contrary, it may be noted that
Hitting power to comparative example can be with not less than about 30gf.
Compare resistance at high temperature
Fig. 8 is the curve graph for showing distribution of resistance at high temperature according to example embodiment.Comparative example in Fig. 8 is shown
Body layer 110 only including conductive powder 130 is gone out, and the example embodiment in Fig. 8 is shown including 130 He of conductive powder
The body layer 110 of polymeric beads 120.
Resistance can with temperature proportional increase.Particularly, when test jack 100 may include silicone rubber resina,
Silicone rubber resina can be expanded according to the raising of temperature.The bond strength of conductive powder 130 can reduce to increase resistance
Greatly.
When polymeric beads 120 can be mixed with silicone rubber resina, the expansion of silicone rubber resina can be inhibited.Therefore, it leads
The bond strength of electro-powder 130 can be kept, so that resistance will not increase as the temperature rises.In addition, because polymer
Pearl 120 can keep the bond strength of conductive powder 130, thus conductive powder 130 can be it is unordered to prevent resistance bad
Change.
Compare resistance at low temperature
Fig. 4 A to Fig. 4 C is the sectional view for showing the gap variation of the conductive powder group under high temperature and low temperature.Fig. 4 A is shown
The sectional view of test jack at room temperature.In Figure 4 A, P1 can indicate the conductive powder group 130g magnetically arranged it
Between gap.Fig. 4 B shows the sectional view of test jack at high temperature.In figure 4b, P2 can indicate magnetically arranging
Conductive powder group 130g between gap.Fig. 4 C shows the sectional view of test jack at low temperature.In figure 4 c, P3 can
To indicate the gap between the conductive powder group 130g magnetically arranged.
Resistance may be influenced by low temperature and high temperature.Because the body layer 110 including silicone rubber resina can be in low temperature
Lower contraction, so low temperature may influence the bond strength of conductive powder 120.
As shown in Figure 4 B, the gap between conductive powder 130 may broaden because of the expansion of body layer 110 at high temperature.
Therefore, the gap P2 between the conductive powder group 130g under high temperature can be than the gap between conductive powder group 130g at room temperature
P1 is narrower.
As shown in Figure 4 C, the gap between conductive powder 130 may narrow because of the contraction of body layer 110 at low temperature.
Therefore, the gap P3 between the conductive powder group 130g under low temperature can be than the gap between conductive powder group 130g at room temperature
P1 is wider.
According to temperature change, gap P1, P2 and P3 between conductive powder group 130g will not be less than about 1mm, so that
There may be contact faults between test jack 100 and semiconductor devices 102.
On the contrary, polymeric beads 120 can keep conductive powder 130 when body layer 110 may include polymeric beads 120
Bond strength.Therefore, according to temperature change, expansion and contraction in body layer 110 can be suppressed to make the change of resistance
Change and reduces.
Fig. 9 is the curve graph for showing distribution of resistance at low temperature according to example embodiment.Comparative example in Fig. 9 is shown
Body layer 110 only including conductive powder 130 is gone out, and the example embodiment in Fig. 9 is shown including 130 He of conductive powder
The body layer 110 of polymeric beads 120.
With reference to Fig. 9, comparative example can have wide distribution of resistance.On the contrary, example embodiment can have the electricity of concentration
Resistance distribution.
According to example embodiment, test jack may include the conductive powder being magnetically arranged in body layer, and gather
The diameter of conjunction object pearl is not more than about the 50% of the average diameter of conductive powder.
The restoring force for being accordingly used in the silicon body layer of support conductive powder can be enhanced.The silicon changed because expanding and shrinking
The available compensation of the restoring force of body layer.As a result, test jack can have improved characteristic.
The above embodiment of the present invention is intended to illustrate and not limit the present invention.Various substitutions and equivalent are possible.
The present invention is by embodiment described herein limited.Present invention is also not necessarily limited to any certain types of semiconductor devices.In view of
Present disclosure, other additions, reduction or modification are it will be apparent that and being intended to come within the scope of the appended claims.
Claims (14)
1. a kind of test jack is connected between semiconductor devices and tester to execute electrical testing, the test jack packet
It includes:
Insulator layer is arranged between the semiconductor devices and the tester；
Polymeric beads are evenly arranged in the insulator layer；And
Conductive powder is arranged in the insulator layer to form multiple groups.
2. test jack as described in claim 1, wherein described group including the conductive powder is relative to the insulator
The surface of layer is arranged vertically, to form conductive path in the insulator layer.
3. test jack as described in claim 1, wherein described group including the conductive powder can be arranged in it is described
At the corresponding position of the terminal of the terminal of semiconductor devices and the tester.
4. test jack as described in claim 1, wherein the polymeric beads are arranged between the conductive powder.
5. test jack as claimed in claim 4, wherein each polymeric beads have spherical form, and diameter is the conduction
About the 25% to about 50% of the diameter of powder.
6. test jack as claimed in claim 5, wherein the diameter of the conductive powder is about 20 μm to about 40 μm, and
The diameter of the polymeric beads is about 5 μm to about 20 μm.
7. test jack as described in claim 1, wherein the insulator layer includes silicone rubber resina.
8. test jack as described in claim 1, wherein the polymeric beads include polymetylmethacrylate synthesis
Resin or synthetic rubber.
9. test jack as described in claim 1, wherein the conductive powder includes at least one of Au and Ni.
10. test jack as described in claim 1, wherein the mixing ratio of the insulator layer and the polymeric beads is about
1:0.2 to about 1:0.4.
11. test jack as described in claim 1, wherein the polymeric beads include insulating materials.
12. a kind of test jack, comprising:
Silicon polymer synthetic rubber comprising the silicone rubber resina and polymeric synthetic resin being mixed with each other；And
Conductive powder group comprising conductive powder, the conductive powder are magnetically arranged in the silicon with uniform rule and polymerize
In object synthetic rubber.
13. test jack as claimed in claim 12, wherein the polymeric synthetic resin has about 200 DEG C of thermal denaturation
Temperature.
14. test jack as claimed in claim 12, wherein the silicone rubber resina is mixed with the polymeric synthetic resin
Composition and division in a proportion is about 100 weight %: about 20 weight % to about 40 weight %.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2017-0184088 | 2017-12-29 | ||
| KR1020170184088A KR101967401B1 (en) | 2017-12-29 | 2017-12-29 | Test socket |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110007113A true CN110007113A (en) | 2019-07-12 |
| CN110007113B CN110007113B (en) | 2021-04-30 |
Family
ID=66163827
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811376927.XA Active CN110007113B (en) | 2017-12-29 | 2018-11-19 | Test socket |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR101967401B1 (en) |
| CN (1) | CN110007113B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102664541B1 (en) * | 2021-11-10 | 2024-05-09 | 주식회사 티에프이 | Rubber socket for testing semiconductor package |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1808125A (en) * | 2004-12-06 | 2006-07-26 | 三星电子株式会社 | Connector for testing a semiconductor package |
| CN101237105A (en) * | 2007-02-02 | 2008-08-06 | 富士康(昆山)电脑接插件有限公司 | Test connector |
| CN101344571A (en) * | 2007-07-10 | 2009-01-14 | 三星电子株式会社 | Socket, and test apparatus and method using the socket |
| CN203967308U (en) * | 2013-12-27 | 2014-11-26 | 惠州比亚迪电子有限公司 | A kind of coupling assembling of USB socket |
| CN104884964A (en) * | 2012-12-28 | 2015-09-02 | 株式会社Isc | Test socket and socket body |
| KR101588844B1 (en) * | 2014-12-30 | 2016-01-26 | 주식회사 아이에스시 | Test connector with coil type Carbon Nano Tube |
| CN105452877A (en) * | 2013-07-24 | 2016-03-30 | 株式会社Isc | Conductive connector and manufacturing method therefor |
| CN105527472A (en) * | 2014-10-17 | 2016-04-27 | 株式会社Isc | Test socket |
| KR20160046621A (en) * | 2014-10-21 | 2016-04-29 | 삼성전자주식회사 | Test socket for testing semiconductor chip package and manufacturing method of the same |
| CN205879987U (en) * | 2016-06-28 | 2017-01-11 | 宝沃汽车（中国）有限公司 | Test connection ware frock and anchor clamps thereof |
| KR101718865B1 (en) * | 2015-11-26 | 2017-03-22 | (주)티에스이 | Test Socket |
| CN107024605A (en) * | 2016-01-29 | 2017-08-08 | 泰克元有限公司 | Testing, sorting machine plug connector |
| KR101769882B1 (en) * | 2016-02-15 | 2017-09-05 | (주)티에스이 | Test Socket |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101567296B1 (en) * | 2014-10-30 | 2015-11-10 | 주식회사 아이에스시 | Color changeable test soket and method for manufacturing thereof |
| KR101667929B1 (en) * | 2015-03-31 | 2016-10-20 | (주)티에스이 | Silicon rubber socket |
| KR102329801B1 (en) * | 2015-10-21 | 2021-11-22 | 삼성전자주식회사 | Manufacturing method of test socket and test method for semiconductor package |
-
2017
- 2017-12-29 KR KR1020170184088A patent/KR101967401B1/en active IP Right Grant
-
2018
- 2018-11-19 CN CN201811376927.XA patent/CN110007113B/en active Active
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1808125A (en) * | 2004-12-06 | 2006-07-26 | 三星电子株式会社 | Connector for testing a semiconductor package |
| CN101237105A (en) * | 2007-02-02 | 2008-08-06 | 富士康(昆山)电脑接插件有限公司 | Test connector |
| CN101344571A (en) * | 2007-07-10 | 2009-01-14 | 三星电子株式会社 | Socket, and test apparatus and method using the socket |
| CN104884964A (en) * | 2012-12-28 | 2015-09-02 | 株式会社Isc | Test socket and socket body |
| CN105452877A (en) * | 2013-07-24 | 2016-03-30 | 株式会社Isc | Conductive connector and manufacturing method therefor |
| CN203967308U (en) * | 2013-12-27 | 2014-11-26 | 惠州比亚迪电子有限公司 | A kind of coupling assembling of USB socket |
| CN105527472A (en) * | 2014-10-17 | 2016-04-27 | 株式会社Isc | Test socket |
| KR20160046621A (en) * | 2014-10-21 | 2016-04-29 | 삼성전자주식회사 | Test socket for testing semiconductor chip package and manufacturing method of the same |
| KR101588844B1 (en) * | 2014-12-30 | 2016-01-26 | 주식회사 아이에스시 | Test connector with coil type Carbon Nano Tube |
| KR101718865B1 (en) * | 2015-11-26 | 2017-03-22 | (주)티에스이 | Test Socket |
| CN107024605A (en) * | 2016-01-29 | 2017-08-08 | 泰克元有限公司 | Testing, sorting machine plug connector |
| KR101769882B1 (en) * | 2016-02-15 | 2017-09-05 | (주)티에스이 | Test Socket |
| CN205879987U (en) * | 2016-06-28 | 2017-01-11 | 宝沃汽车（中国）有限公司 | Test connection ware frock and anchor clamps thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110007113B (en) | 2021-04-30 |
| KR101967401B1 (en) | 2019-04-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100582785C (en) | Connector for testing a semiconductor package | |
| KR100618017B1 (en) | Electric resistance measuring connector and measuring device and measuring method for circuit board electric resistance | |
| CN104285151B (en) | Allow the test jack of simple alignment | |
| JP3543765B2 (en) | Probe device for wafer inspection | |
| CN109313953B (en) | Anisotropic conductive sheet comprising conductive particles mixed with different kinds of particles | |
| KR102090961B1 (en) | Device for test socket having a plurality of vertically stacked rubber sockets | |
| US20160033551A1 (en) | Socket for testing semiconductor device | |
| KR102036105B1 (en) | Data signal transmission connector | |
| JP6918518B2 (en) | Electrical property inspection jig | |
| TWI692642B (en) | Conductive contact and anisotropic conductive sheet with the same | |
| TW202136792A (en) | Test socket and test apparatus having the same, manufacturing method for the test socket | |
| KR102444643B1 (en) | Conductive particle and data signal transmission connector having the same | |
| KR102153221B1 (en) | Anisotropic conductive sheet | |
| JP4379949B2 (en) | Anisotropic conductive sheet, method for manufacturing the same, electrical inspection apparatus for circuit device, and electrical inspection method | |
| CN110007113A (en) | Test jack | |
| KR102063762B1 (en) | Contactor for connecting bga type electronic device and method for manufacturing the same | |
| TW200931024A (en) | Probe card | |
| JP2002139541A (en) | Inspection tool for electric circuit part and inspection method of electric circuit part | |
| KR20170108655A (en) | Test socket and fabrication method thereof | |
| KR102102816B1 (en) | Data signal transmission connector and manufacturing method for the same | |
| KR101683010B1 (en) | The non-alignment rubber contactor, Rubber contact sheet containing the same, Manufacturing method thereof and Test socket using the same | |
| KR102046283B1 (en) | Anisotropic conductive sheet | |
| KR20220082085A (en) | Probe sheet and method for manufacturing the probe sheet | |
| JP2000353556A (en) | Anisotropic conductive sheet support and anisotropic conductive sheet with support | |
| KR101042374B1 (en) | Manufacturing method of interfering sheet and interfering sheet |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |