CN109937474A - 用于改进的装载端口背板的系统、装置及方法 - Google Patents

用于改进的装载端口背板的系统、装置及方法 Download PDF

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CN109937474A
CN109937474A CN201780069199.5A CN201780069199A CN109937474A CN 109937474 A CN109937474 A CN 109937474A CN 201780069199 A CN201780069199 A CN 201780069199A CN 109937474 A CN109937474 A CN 109937474A
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保罗·B·路透
道格拉斯·B·鲍姆加滕
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Abstract

实施方式提供了用于改进的装载端口的系统、装置及方法,改进的装载端口包括背板组件,所述背板组件支撑对接拖盘及基板载具开启器,其中所述背板组件包括:背板;校平块,能耦接至设备前端模块(EFEM);锥形孔调整组件,耦接在校平块与背板之间;以及狭缝孔调整组件,耦接在校平块与背板之间。锥形孔调整组件包括:锥形孔块,在第一端处耦接至校平块;螺纹块,耦接至背板;以及调整螺栓,耦接至锥形孔块及螺纹块。亦揭示了许多额外方面。

Description

用于改进的装载端口背板的系统、装置及方法
相关申请
本案要求享有于2016年11月10日提交的名称为“SYSTEMS,APPARATUS,ANDMETHODS FOR AN IMPROVED LOAD PORT BACKPLANE(用于改进的装载端口背板的系统、装置及方法)”的美国非临时专利申请案第15/348,964号(代理人案号24538-01/USA)的优先权,在此出于所有目的通过引用将该案的全文并入本文中。
技术领域
本申请案涉及电子器件制造系统,且更特别地涉及用于改进的装载端口背板的系统、装置及方法。
背景技术
设备前端模块(EFEM),有时称为工厂界面(FI),提供了用于将基板从载具传送至处理工具的非反应性环境。此举通过尽可能地密封EFEM的内部容积且将与基板材料大致不反应的气体(诸如氮)注入内部容积来达成。非反应性气体迫使任何反应性气体(诸如氧)离开EFEM。用于对接基板载具的装载端口通常附接至EFEM的前面。装载端口包括理想上抵靠EFEM的所述面而密封的背板。然而,抵靠EFEM而可靠地密封常规背板可为困难的。因此,需要用于改进的装载端口背板的系统、装置及方法。
发明内容
在一些实施方式中,提供一种装载端口系统。所述系统包括背板组件,所述背板组件支撑对接拖盘及基板载具开启器,其中所述背板组件包括:背板;校平块,能耦接至设备前端模块(EFEM);锥形孔调整组件,耦接在校平块与背板之间;以及狭缝孔调整组件,耦接在校平块与背板之间。所述锥形孔调整组件包括:锥形孔块,在第一端处耦接至校平块;螺纹块,耦接至背板;以及调整螺栓,耦接至锥形孔块及螺纹块。
在一些其他实施方式中,提供一种背板组件。所述背板组件包括:背板;校平块,能耦接至设备前端模块(EFEM);锥形孔调整组件,耦接在校平块与背板之间;以及狭缝孔调整组件,耦接在校平块与背板之间。所述锥形孔调整组件包括:锥形孔块,在第一端处耦接至校平块;螺纹块,耦接至背板;以及调整螺栓,耦接至锥形孔块及螺纹块。
在另外的其他实施方式中,提供一种将装载端口背板密封至设备前端模块(EFEM)的方法。所述方法包括以下步骤:提供包括背板组件的装载端口,所述背板组件具有校平块,所述校平块经由锥形孔调整组件和狭缝调整组件而耦接至所述装载端口的背板;将校平块耦接至EFEM;以及旋转锥形孔调整组件中的校平调整螺栓以调整背板的滚转。
实施方式的又一些特征、方面及优点将从以下详细描述、随附权利要求书及附图通过示出数个示例实施方式及实现方式而变得更加完全清楚,这些示例实施方式及实现方式包括预期用于执行实施方式的最佳模式。实施方式亦可有其他及不同的应用,且在不脱离所揭示的实施方式的范围的情况下,可在多个方面对实施方式的若干细节进行修改。据此,附图及描述应视为说明性的而非限制性的。附图并非必须按照比例绘制。说明书意欲覆盖落入权利要求的范围中的所有修改、等同物及替代物。
附图说明
图1为根据一些实施方式描绘电子器件处理系统的示例的方块图。
图2A为根据一些实施方式描绘示例装载端口的前等距视图。
图2B为根据一些实施方式描绘示例装载端口的后等距视图。
图3为根据一些实施方式描绘示例装载端口背板组件的后平面视图。
图4A为根据一些实施方式描绘第一背板调整机构的截面视图。
图4B为根据一些实施方式描绘第二背板调整机构的截面视图。
图5为根据一些实施方式示出示例方法的流程图。
具体实施方式
本文描述的实施方式提供用于改进的装载端口背板的系统、装置及方法,所述系统、装置及方法允许将装载端口可靠地密封至电子器件制造系统的设备前端模块(EFEM)。EFEM通常包括处于封闭的、正压、非反应性气体(例如,氮)环境中的传送机器人,且EFEM被安装至基板处理工具。EFEM使得能够在对接于装载端口(例如,在洁净室环境中)上的基板载具与基板处理工具之间传送基板(例如,无须暴露至反应性气体或其他污染物)。在装载端口的背板与EFEM之间维持密封。然而,归因于装载端口的重量,将常规装载端口背板固定至EFEM的前面而使得两个表面共面且均匀地压缩密封件可能是困难的。换言之,常规背板不包括使得能够容易地相对于EFEM的前面调整背板的安装硬件。不同于常规背板安装系统,本文所描述的新颖实施方式包括使用具有球形垫圈及锥形孔安装块的校平块,其促进调整背板的定向的俯仰和滚转两者,使得背板的表面可与EFEM的前表面对准且共面,因此可均匀地压缩密封构件。
转到图1,图示了根据一些实施方式的示例电子器件处理系统100的方块图。系统100包括耦接至EFEM 104的基板处理工具102。EFEM 104耦接至装载端口108的背板106。装载端口108的对接拖盘110适于支撑基板载具112,基板载具112可由装载端口108的基板载具开启器114开启。背板106安装在EFEM 104上,可压缩密封件116沿着背板106的主表面的周边延伸。为了均匀地压缩密封件116,面向EFEM 104的背板106的主表面被调整为与EFEM104的向面前的表面对准且共面。图2A及图2B分别描绘了装载端口108的前等距视图及后等距视图。可压缩密封件116被图示为在背板106的后表面上。
转到图3,图示了背板组件106’的详细前平面图。除了背板106之外,背板组件106’包括校平块302、锥形孔调整硬件304、狭缝调整硬件306及下部附接组件308(例如,螺栓、螺钉或其他紧固件)。校平块302附接至EFEM104的面。举例而言,校平块302可直接栓接至EFEM104的面向前的表面。如下文关于图4A及图4B更详细地描述,锥形孔调整硬件304及狭缝调整硬件306均支撑背板106,且允许调整背板106的俯仰(例如,向后倾斜至纸面中及向前倾斜出纸面)及滚转(例如,顺时针及逆时针旋转)。
图4A为锥形孔调整硬件304的放大的截面视图。校平调整螺栓402A从校平块302延伸至背板106。校平调整螺栓402A经由锥形孔块404A耦接至校平块302,锥形孔块404A经由螺栓405A耦接至校平块302。校平调整螺栓402A经由螺纹孔块406A耦接至背板106,螺纹孔块406A经由螺栓407A耦接至背板106。校平调整螺栓402A的头部408A放置在第一球形垫圈对410A上,第一球形垫圈对410A放置在锥形孔块404A上。在锥形孔块404A下方,第二球形垫圈对412A通过第一锁紧螺母414A抵靠锥形孔块404A而固定。第二锁紧螺母416A用于将校平调整螺栓402A固定在螺纹孔块406A中。
锥形孔块404A包括孔洞,所述孔洞在块体的下部分中扩张以在校平调整螺栓402A周围建立环形间隙418A。此环形间隙418A提供空间以用于在进行调整时旋转校平调整螺栓402A。在一些实施方式中,环形间隙418A可通过使锥形孔块404A中的通孔具有两个不同直径(例如,在上部分中较小且在下部分中较大)而形成,或通过形成具有锥形或渐缩的形状的通孔而形成。如图4A中所示,锥形孔块404A中的通孔的顶部及底部开口可为倾斜的,以为校平调整螺栓402A的旋转提供进一步的空隙。在一些实施方式中,环形间隙418A足够大以在调整期间容纳大约0.25度至大约2度的旋转。在一些实施方式中,锥形孔块404A中的通孔为校平调整螺栓402A的直径的大约1.05倍至大约1.1倍。此外,通过使用第一及第二球形垫圈对410A、412A,避免了校平调整螺栓402A的粘结(例如,由于所支撑的背板106的重量),且校平调整螺栓402A更佳地能够在锥形孔块404A中旋转。
在操作中,在拧紧锁紧螺母414A、416A之前,顺时针转动校平调整螺栓402A会抬升背板106的左侧(例如,在顺时针方向中调整背板106的滚转),且逆时针转动校平调整螺栓402A会降低背板106的左侧(例如,在逆时针方向中调整背板106的滚转)。在调整背板106的滚转时,校平调整螺栓402A在锥形孔块404A中旋转。
图4B为狭缝调整硬件306的放大的截面视图。校平调整螺栓402B从校平块302延伸至背板106。校平调整螺栓402B经由狭缝块404B耦接至校平块302,狭缝块404B经由螺栓405B耦接至校平块302。校平调整螺栓402B经由螺纹孔块406B耦接至背板106,螺纹孔块406B经由螺栓407B耦接至背板106。校平调整螺栓402B的头部408B放置在第一球形垫圈对410B上,第一球形垫圈对410B放置在狭缝块404B上。在狭缝块404B下方,第二球形垫圈对412B通过第一锁紧螺母414B抵靠狭缝块404B而固定。第二锁紧螺母416B用于将校平调整螺栓402B固定在螺纹孔块406B中。
狭缝块404B包括具有一纵向尺寸的狭缝418B,所述纵向尺寸在与狭缝块404B的纵向尺寸相同的方向中延伸。此布置允许在滚转方向中自由运动,但限制在俯仰方向中的运动。换言之,校平调整螺栓402B自由地顺时针及逆时针旋转,但受限于向前及向后倾斜。
在操作中,在拧紧锁紧螺母414B、416B之前,顺时针转动校平调整螺栓402B会抬升背板106的右侧(例如,在逆时针方向中调整背板106的滚转),且逆时针转动校平调整螺栓402B会降低背板106的右侧(例如,在顺时针方向中调整背板106的滚转)。在调整背板106的滚转时,校平调整螺栓402B在狭缝块404B中旋转。
在校平块302的一侧上的锥形孔块404A(锥形孔块404A将校平调整螺栓402A限制于固定位置但允许俯仰及滚转旋转两者)以及在另一侧上的狭缝块404B(狭缝块404B提供横向调整及滚转旋转)的组合实现装载端口背板106安装且调整至EFEM 104的改进的简易性。锥形孔块404A及狭缝块404B的配置的另一益处为确保装载端口背板106相对于EFEM104的位置可重复性。因此,孔块404A的布置可用作参考点,所有其他装载端口位置/定向调整均围绕所述参考点进行。
现转到图5,描绘了描绘将装载端口背板密封至EFEM的示例方法500的流程图。提供包括背板组件的装载端口,所述背板组件具有校平块,所述校平块经由在校平块之一上的锥形孔调整硬件304和在另一端上的狭缝调整硬件306而耦接至装载端口的背板(502)。将校平块耦接至EFEM(504)。旋转锥形孔调整硬件中的校平调整螺栓以调整背板的滚转,以相对于EFEM上的期望位置对准背板上的密封件(506)。旋转狭缝调整硬件中的校平调整螺栓以进一步调整滚转,以相对于EFEM上的期望位置对准背板上的密封件(508)。调整将校平块附接至EFEM的调整螺栓以使背板与EFEM的前表面共面(510)。
在此公开内容中描述了多个实施方式,这些实施方式仅以说明的目的呈现。所描述的实施方式并非且不意欲为任何意义上的限制。从本公开内容显而易见的是,目前所揭示的实施方式可广泛地应用至许多其他实施方式。本领域的普通技术人员将了解所揭示的实施方式可实践为具有各种修改及改变,诸如结构、逻辑、软件及电气修改。尽管所揭示的实施方式的特定特征可参考一或更多个特定实施方式及/或附图来描述,但应理解这些特征并非限制于使用在描述这些特征所参考的一或更多个特定实施方式或附图中,除非另外明确指明。
本公开内容并非所有实施方式的文字描述,亦非必须在所有实施方式中呈现的实施方式的特征的列表。本公开内容向本领域普通技术人员提供了若干实施方式的实现描述。这些实施方式的一些实施方式可能未在本申请案中要求保护,但仍可能在要求本申请案的优先权权益的一或更多个继续申请案中要求保护。
以上描述仅揭示了示例实施方式。落入权利要求范围中的上文所揭示的装置、系统及方法的修改将对本领域普通技术人员而言为显而易见的。据此,尽管已结合其示例性实施方式揭示了实施方式,但应理解,其他实施方式可落入如由以下权利要求书所界定的意欲的精神及范围中。

Claims (15)

1.一种装载端口系统,包含:
背板组件,支撑对接拖盘和基板载具开启器,
其中所述背板组件包括:
背板;
校平块,能耦接至设备前端模块(EFEM);
锥形孔调整组件,耦接在所述校平块与所述背板之间;以及
狭缝孔调整组件,耦接在所述校平块与所述背板之间,
其中所述锥形孔调整组件包括:
锥形孔块,在第一端处耦接至所述校平块;
螺纹块,耦接至所述背板;以及
调整螺栓,耦接至所述锥形孔块和所述螺纹块。
2.如权利要求1所述的装载端口系统,其中所述狭缝孔调整组件包括:
狭缝块,在第二端处耦接至所述校平块;
螺纹块,耦接至所述背板;以及
调整螺栓,耦接至所述狭缝块和所述螺纹块。
3.如权利要求2所述的装载端口系统,其中邻接所述调整螺栓上的所述锥形孔块而设置球形垫圈。
4.如权利要求3所述的装载端口系统,其中邻接所述调整螺栓上的所述狭缝块而设置球形垫圈。
5.如权利要求1所述的装载端口系统,其中所述背板包括密封件,且所述锥形孔调整组件和所述狭缝孔调整组件能操作以将所述密封件与所述EFEM对准。
6.如权利要求1所述的装载端口系统,其中所述锥形孔块包括通孔,所述通孔在下端处具有足够大的直径以允许所述调整螺栓在所述通孔中旋转,且在上端处具有足够小的直径以将所述调整螺栓保持在固定位置处。
7.如权利要求4所述的装载端口系统,进一步包含在所述校平块的所述第一端处的第一俯仰调整螺栓及在所述校平块的所述第二端处的第二俯仰调整螺栓。
8.一种背板组件,包含:
背板;
校平块,能耦接至设备前端模块(EFEM);
锥形孔调整组件,耦接在所述校平块与所述背板之间;以及
狭缝孔调整组件,耦接在所述校平块与所述背板之间,
其中所述锥形孔调整组件包括:
锥形孔块,在第一端处耦接至所述校平块;
螺纹块,耦接至所述背板;以及
调整螺栓,耦接至所述锥形孔块和所述螺纹块。
9.如权利要求8所述的背板组件,其中所述狭缝孔调整组件包括:
狭缝块,在第二端处耦接至所述校平块;
螺纹块,耦接至所述背板;以及
调整螺栓,耦接至所述狭缝块和所述螺纹块。
10.如权利要求9所述的背板组件,其中邻接所述调整螺栓上的所述锥形孔块而设置球形垫圈。
11.如权利要求10所述的背板组件,其中邻接所述调整螺栓上的所述狭缝块而设置球形垫圈。
12.如权利要求8所述的背板组件,其中所述背板包括密封件,且所述锥形孔调整组件和所述狭缝孔调整组件能操作以将所述密封件与所述EFEM对准。
13.一种将装载端口背板密封至设备前端模块(EFEM)的方法,所述方法包含以下步骤:
提供包括背板组件的装载端口,所述背板组件具有校平块,所述校平块经由锥形孔调整组件和狭缝调整组件而耦接至所述装载端口的背板;
将所述校平块耦接至所述EFEM;以及
旋转在所述锥形孔调整组件中的校平调整螺栓以调整所述背板的滚转。
14.如权利要求13所述的方法,进一步包含以下步骤:旋转在所述狭缝调整组件中的校平调整螺栓,以进一步调整所述背板的滚转,并且其中提供装载端口的步骤包括以下步骤:提供所述锥形孔调整组件,所述锥形孔调整组件包括在第一端处耦接至所述校平块的锥形孔块、耦接至所述背板的螺纹块、以及耦接至所述锥形孔块和所述螺纹块的所述调整螺栓。
15.如权利要求14所述的方法,其中提供所述锥形孔调整组件的步骤包括以下步骤:提供邻接所述调整螺栓上的所述锥形孔块设置的球形垫圈。
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