CN109893157B - PET detector heat radiation structure - Google Patents
PET detector heat radiation structure Download PDFInfo
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- CN109893157B CN109893157B CN201910265439.XA CN201910265439A CN109893157B CN 109893157 B CN109893157 B CN 109893157B CN 201910265439 A CN201910265439 A CN 201910265439A CN 109893157 B CN109893157 B CN 109893157B
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- 230000005855 radiation Effects 0.000 title claims abstract description 4
- 238000001816 cooling Methods 0.000 claims abstract description 26
- 239000000463 material Substances 0.000 claims abstract description 12
- 238000005057 refrigeration Methods 0.000 claims description 18
- 239000004065 semiconductor Substances 0.000 claims description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 5
- 239000007769 metal material Substances 0.000 claims description 5
- 229910052710 silicon Inorganic materials 0.000 claims description 5
- 239000010703 silicon Substances 0.000 claims description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 229910002804 graphite Inorganic materials 0.000 claims description 3
- 239000010439 graphite Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 10
- 238000010438 heat treatment Methods 0.000 abstract description 9
- 238000002059 diagnostic imaging Methods 0.000 abstract description 2
- 230000017525 heat dissipation Effects 0.000 description 18
- 238000002600 positron emission tomography Methods 0.000 description 15
- 239000004020 conductor Substances 0.000 description 10
- 239000007770 graphite material Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- ZGHQUYZPMWMLBM-UHFFFAOYSA-N 1,2-dichloro-4-phenylbenzene Chemical compound C1=C(Cl)C(Cl)=CC=C1C1=CC=CC=C1 ZGHQUYZPMWMLBM-UHFFFAOYSA-N 0.000 description 2
- 230000002285 radioactive effect Effects 0.000 description 2
- 208000014644 Brain disease Diseases 0.000 description 1
- 206010028980 Neoplasm Diseases 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000003745 diagnosis Methods 0.000 description 1
- 208000019622 heart disease Diseases 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000002372 labelling Methods 0.000 description 1
- 230000003902 lesion Effects 0.000 description 1
- 230000004060 metabolic process Effects 0.000 description 1
- 238000009206 nuclear medicine Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The application provides a PET detector heat radiation structure, which relates to the technical field of medical imaging equipment, and is arranged on the surface of a carrier plate of a detector unit array, and comprises a first heat conduction layer and a second heat conduction layer which are sequentially covered on the surface of the carrier plate, a structural main body arranged on the surface of the second heat conduction layer, a centrifugal fan arranged at one end inside the structural main body, and a first radiating fin arranged inside the structural main body; the centrifugal fan comprises an air inlet side and an air outlet side, and the air outlet side is arranged opposite to the first radiating fins; the first heat conduction layer is made of flexible insulating heat conduction materials; the second heat conduction layer is made of a heat conduction material with ultrahigh heat conduction coefficient in the length-width direction, and the length-width of the second heat conduction layer is matched with the length-width of the detector unit array respectively. The heat generated by the heating device on the PCB can be quickly transferred to the cooling and radiating system, and the radiating effect is improved.
Description
Technical Field
The application relates to the technical field of medical imaging equipment, in particular to a PET detector heat dissipation structure.
Background
PET (positron emission tomography) is a nuclear medicine imaging device, and by using positron technology, the functional metabolism condition of a lesion part can be obtained, so that the PET has an important role in guiding diagnosis and treatment of tumor, heart and brain diseases.
The detector is a core device of the PET system, and judges the annihilation position and intensity of the radioactive isotope in the human body according to the detected gamma photon annihilation coincidence event, so that a distribution image of the radioactive isotope is obtained through a series of reconstruction algorithms.
The PET detector is formed by packaging an array formed by a plurality of detector units and a corresponding electronic signal processing system. The detector unit 10 is composed of a scintillation crystal 11, a PCB carrier plate 12 coupled with sipms (silicon photomultipliers), as shown in fig. 1.
Where the energy resolution and time resolution characteristics of sipms (silicon photomultipliers) have a strong temperature dependence, the use of sipms at lower temperatures can improve these characteristics. Meanwhile, the temperature difference between SiPMs at all positions in the detector is as small as possible, so that the uniformity and stability of the overall performance of the system are improved.
In the prior art, a single air cooling system or water cooling system is often used for reducing the influence of heat generated by a heating device during working on SiPM, the heat dissipation capacity of the heating device is poor, the temperature difference between an air outlet side and an air inlet side is large, and the temperature of a detector unit below the air outlet side is high; the latter is complex in structure and requires an additional water circulation system.
Based on the above, the present inventors have conducted special studies on this, and developed a heat dissipation structure for a PET detector, which is generated by this scheme.
Disclosure of Invention
In order to solve the defects in the prior art, the application provides the PET detector heat dissipation structure which can rapidly transfer heat generated by a heating device on a PCB to a cooling heat dissipation system and improve the heat dissipation effect.
In order to achieve the above purpose, the technical scheme adopted by the application is as follows:
the PET detector heat dissipation structure is arranged on the surface of a carrier plate of the detector unit array and comprises a first heat conduction layer, a second heat conduction layer, a structural main body, a centrifugal fan and a first heat dissipation fin, wherein the first heat conduction layer and the second heat conduction layer are sequentially coated on the surface of the carrier plate, the structural main body is arranged on the surface of the second heat conduction layer, the centrifugal fan is arranged at one end inside the structural main body, and the first heat dissipation fin is arranged inside the structural main body; the centrifugal fan comprises an air inlet side and an air outlet side, and the air outlet side is arranged opposite to the first radiating fins; the first heat conduction layer is made of flexible insulating heat conduction materials, the second heat conduction layer is made of heat conduction materials with ultra-high heat conduction coefficients in the length-width direction, and the length-width of the second heat conduction layer is matched with the length-width of the detector unit array respectively.
Preferably, the electronic refrigeration assembly is arranged at the other end of the inside of the structural main body, and comprises a fixed plate, a refrigeration piece arranged at one side of the fixed plate and a second cooling piece arranged at the other side of the fixed plate; the refrigerating sheet comprises a cold surface and a hot surface, and the cold surface is attached to the bottom surface of the structural main body.
Preferably, the refrigerating sheet is a semiconductor refrigerating sheet.
Preferably, the first heat conduction layer adopts a silicon heat conduction gel pad with a heat conduction coefficient of 1-12W/m.K; the second heat conduction layer is made of graphite sheets with the heat conduction coefficient in the length-width direction of 500-2000W/m.K and the heat conduction coefficient in the thickness direction of 1-12W/m.K, and the thickness of the second heat conduction layer is 0.5-3mm.
Preferably, the structural body is made of a high thermal conductivity metal material. The metallic material greater than 100W/m.k may be defined as a high thermal conductivity metallic material.
Preferably, the first heat conductive layer has a heat conductivity of 5W/m.K, the second heat conductive layer has a heat conductivity of 1800W/m.K in the longitudinal and width directions, and the thickness direction has a heat conductivity of 5W/m.K.
The principle and the technical effect of the application can be realized: the material characteristics of the first heat conduction layer are utilized to solve the problems that the thickness of the graphite material is too thin, the compressible quantity is too small to be attached to heating devices with different heights and the graphite material is not insulated, and the characteristics of the second heat conduction layer that the material length and width directions have ultrahigh heat conduction coefficients are utilized to enable heat to rapidly diffuse in an array plane formed by the whole detector units, so that the temperature gradient in the plane is reduced, and the detector units below the air inlet side and the air outlet side have smaller temperature difference.
(1) The heat radiating system combines the flexible insulating heat conducting material with the ultrahigh heat conductivity coefficient in the length-width direction to rapidly and uniformly transfer the heat generated by the heating device on the PCB carrier plate to the heat radiating system.
(2) The application combines air cooling and electronic refrigeration, has smaller temperature difference between the detector units positioned below the air inlet side and the air outlet side, and well maintains the temperature uniformity of the SiPM in the detector module.
(3) The application does not need to use traditional water cooling, so that a complex water cooling system is not needed, and only a simple high-conductivity material heat conducting layer, a fan and an electronic refrigeration device are needed, so that the structure is compact, simple and reliable, and the cost is low.
Drawings
Fig. 1 is a schematic structural diagram of a single crystal in a heat dissipation structure of a PET detector according to the present embodiment;
fig. 2 is a schematic diagram of the overall structure of a heat dissipation structure of a PET detector according to the present embodiment;
FIG. 3 is a cross-sectional view of a heat dissipation structure of a PET detector according to the present embodiment;
fig. 4 is a schematic structural diagram of an electronic refrigeration component in a heat dissipation structure of a PET detector according to the present embodiment.
Labeling and describing: the detector unit 10, the scintillation crystal 11, the PCB 12, the first heat conduction layer 21, the structural body 22, the first heat dissipation sheet 221, the second heat conduction layer 23, the centrifugal fan 24, the air inlet side 241, the air outlet side 242, the electronic refrigeration component 25, the refrigeration sheet 251 and the second heat dissipation sheet 252.
Detailed Description
In order to make the technical means and the technical effects achieved by the technical means of the application clearer and more perfect, an embodiment is provided, and the following detailed description is given with reference to the accompanying drawings:
as shown in fig. 1-3, the heat dissipation structure of the PET detector of the present embodiment is mounted on the surface of the PCB carrier plate 12 of the array of detector units 10, and includes a first heat conduction layer 21 and a second heat conduction layer 23 sequentially covering the surface of the PCB carrier plate 12, a structural body 22 mounted on the surface of the second heat conduction layer 23, a centrifugal fan 24 mounted at one end inside the structural body 22, and a first heat dissipation fin 221 mounted inside the structural body 22; the first heat sink 221 may be a separate heat sink or may be machined directly into the structural body 22. In this embodiment, the first heat sink 221 is directly formed by grooving the structural body 22.
The centrifugal fan 24 comprises an air inlet side 241 and an air outlet side 242, and the air outlet side 242 is arranged opposite to the first cooling fins 221; the first heat conducting layer 21 is made of flexible insulating heat conducting material, and the second heat conducting layer 23 is made of heat conducting material with ultra-high heat conductivity coefficient in the length-width direction. Because the flexible insulating heat-conducting material has self-viscosity and higher compressibility, the height difference of different heating devices on the PCB carrier plate 12 of the detector unit 10 can be compensated, and the flexible insulating heat-conducting material can be well paved on the surface of the PCB carrier plate 12, so that the heat-radiating effect can be improved. The material characteristics of the first heat conducting layer 21 are utilized to overcome the problems that the thickness of the graphite material is too thin, the compressibility is too small to be fit with heating devices with different heights, and the graphite material is not insulated. The heat conductive material with ultra-high heat conductivity in the length-width direction is arranged between the flexible insulating heat conductive material and the structural body 22, and the length-width dimension of the heat conductive material is matched with the length-width dimension of the flexible insulating heat conductive material. The two materials are combined, so that the characteristics of the two heat conducting materials can be utilized simultaneously, heat generated by a heating device on the PCB 12 of the detector unit 10 can be quickly conducted to the structural main body 22, and heat exchange is carried out between the cooling and radiating system (the centrifugal fan 24 and the radiating fins) of the main body structure and the external environment, so that the radiating effect is improved.
As shown in fig. 1 and 4, the present embodiment preferably further includes an electronic refrigeration unit 25 mounted at the other end (the end far from the centrifugal fan 24) inside the structural body 22, and the electronic refrigeration unit 25 includes a fixed plate, a refrigeration sheet 251 mounted at one side of the fixed plate, and a second heat sink 252 mounted at the other side of the fixed plate; the cooling plate 251 includes a cold face and a hot face, and the cold face is attached to the bottom surface of the structural body 22. The cooling fins 251 reduce the temperature below the air outlet side 242 by cooling of the cold face, while the heat generated by the hot face is carried away by the air flow blown by the centrifugal fan 24 through the cooling fins.
Because the whole detector unit 10 array has the carrier plate that the heat dissipation is not in place, the cooling effect between each carrier plate can also be different, the temperature difference will be produced, therefore, set up electronic refrigeration subassembly 25 at the other end of structure main part 22, utilize the characteristic of first heat conduction layer 21 and second heat conduction layer 23 material, can conduct the heat that the device produced that generates heat on the PCB carrier plate 12 of detector unit 10 to structure main part 22 rapidly, simultaneously carry out the heat exchange with external environment through the quick electronic refrigeration subassembly 25 of refrigeration effect, consequently can avoid producing the cooling blind spot, reduce the temperature gradient difference along detector unit 10 array length direction, reduce the temperature difference between the detector unit 10 that is located air inlet side 241 and air-out side 242 below, make the temperature of whole detector unit 10 even.
The preferred cooling sheet 251 of the present embodiment employs a semiconductor cooling sheet 251. The semiconductor refrigeration sheet 251 does not need any refrigerant, can continuously work, and is a solid sheet without other rotating parts and sliding parts, so that the semiconductor refrigeration sheet has no vibration, noise, long service life and easy installation during working. The semiconductor refrigerating plate 251 has very small thermal inertia and fast refrigerating time, so that a good cooling effect is brought to the detector unit 10. Therefore, the semiconductor refrigeration piece 251 is adopted, the temperature can be quickly reduced, heat generated by the carrier plate is taken away in the first time, and the heat transfer to the SiPM is reduced, so that the influence of the temperature on the SiPM is reduced.
The preferred first heat conductive layer 21 of this embodiment adopts a silicon heat conductive gel pad with a heat conductivity coefficient of 1-12W/m.K; the second heat conduction layer 23 is made of graphite sheets with a heat conduction coefficient of 500-2000W/m.K in the length-width direction and a heat conduction coefficient of 1-12W/m.K in the thickness direction; the thickness of the second heat conductive layer 23 is 0.5-3mm. The first heat conducting layer 21 and the second heat conducting layer 23 with the above heat conducting coefficient ranges and the second heat conducting layer 23 with the above thickness are adopted respectively, so that the heat conducting requirement to be realized in the embodiment can be met.
The structural body 22 of the preferred embodiment is made of a high thermal conductivity metal material. Realize quick heat transfer, help realizing quick cooling.
The preferred first heat conductive layer 21 of this embodiment has a heat conductivity of 5W/m.K, the second heat conductive layer 23 has a length-width direction heat conductivity of 1800W/m.K, and the thickness direction heat conductivity of 5W/m.K. The first heat conductive layer 21 and the second heat conductive layer 23 having the above-mentioned preferred heat conductive coefficients are used, respectively, so that the desired effect can be achieved to a large extent.
The foregoing is a further detailed description of the provided technical solution in connection with the preferred embodiments of the present application, and it should not be construed that the specific implementation of the present application is limited to the above description, and it should be understood that several simple deductions or substitutions may be made by those skilled in the art without departing from the spirit of the present application, and all the embodiments should be considered as falling within the scope of the present application.
Claims (4)
1. PET detector heat radiation structure installs in detector cell array's carrier plate surface, its characterized in that: the electronic cooling device comprises a first heat conduction layer, a second heat conduction layer, a structural main body, a centrifugal fan, an electronic cooling assembly and a first cooling fin, wherein the first heat conduction layer and the second heat conduction layer are sequentially coated on the surface of a carrier plate, the structural main body is arranged on the surface of the second heat conduction layer, the centrifugal fan is arranged at one end inside the structural main body, the electronic cooling assembly is arranged at the other end inside the structural main body, and the first cooling fin is arranged inside the structural main body; the centrifugal fan comprises an air inlet side and an air outlet side, and the air outlet side is arranged opposite to the first radiating fins; the first heat conduction layer is made of flexible insulating heat conduction materials; the second heat conduction layer is made of a heat conduction material with ultrahigh heat conduction coefficient in the length-width direction, and the length-width of the second heat conduction layer is matched with the length-width of the detector unit array respectively; the electronic refrigeration assembly comprises a fixed plate, a refrigeration piece arranged on one side of the fixed plate and a second cooling piece arranged on the other side of the fixed plate; the refrigerating sheet comprises a cold surface and a hot surface, and the cold surface is attached to the bottom surface of the structural main body; the structural body is made of a high-heat-conductivity metal material.
2. A PET detector heat sink structure as claimed in claim 1, wherein: the refrigerating sheet adopts a semiconductor refrigerating sheet.
3. A PET detector heat sink structure as claimed in claim 1, wherein: the first heat conduction layer adopts a silicon heat conduction gel pad with a heat conduction coefficient of 1-12W/m.K; the second heat conduction layer is made of graphite sheets with the heat conduction coefficient in the length-width direction of 500-2000W/m.K and the heat conduction coefficient in the thickness direction of 1-12W/m.K, and the thickness of the second heat conduction layer is 0.5-3mm.
4. A PET detector heat sink structure as claimed in claim 3, wherein: the heat conductivity of the first heat conduction layer is 5W/m.K, the heat conductivity of the second heat conduction layer in the length-width direction is 1800W/m.K, and the heat conductivity in the thickness direction is 5W/m.K.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201910265439.XA CN109893157B (en) | 2019-04-03 | 2019-04-03 | PET detector heat radiation structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910265439.XA CN109893157B (en) | 2019-04-03 | 2019-04-03 | PET detector heat radiation structure |
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| CN109893157A CN109893157A (en) | 2019-06-18 |
| CN109893157B true CN109893157B (en) | 2023-11-17 |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108186040B (en) * | 2017-12-27 | 2021-05-14 | 上海联影医疗科技股份有限公司 | PET detection module and PET detection device with same |
| CN113286458A (en) * | 2021-05-14 | 2021-08-20 | 深圳市迪比科电子科技有限公司 | Composite radiation heat dissipation plastic shell suitable for closed power equipment |
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