CN109893157A - A kind of pet detector radiator structure - Google Patents
A kind of pet detector radiator structure Download PDFInfo
- Publication number
- CN109893157A CN109893157A CN201910265439.XA CN201910265439A CN109893157A CN 109893157 A CN109893157 A CN 109893157A CN 201910265439 A CN201910265439 A CN 201910265439A CN 109893157 A CN109893157 A CN 109893157A
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- Prior art keywords
- heat
- conducting layer
- length
- cooling
- pet detector
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- 238000001816 cooling Methods 0.000 claims abstract description 52
- 239000000463 material Substances 0.000 claims abstract description 22
- 238000010438 heat treatment Methods 0.000 claims abstract description 9
- 235000012149 noodles Nutrition 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 5
- 239000007769 metal material Substances 0.000 claims description 5
- 229910052710 silicon Inorganic materials 0.000 claims description 5
- 239000010703 silicon Substances 0.000 claims description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 229910002804 graphite Inorganic materials 0.000 claims description 3
- 239000010439 graphite Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 10
- 238000009413 insulation Methods 0.000 abstract description 7
- 230000017525 heat dissipation Effects 0.000 abstract description 4
- 230000005855 radiation Effects 0.000 abstract description 4
- 238000002059 diagnostic imaging Methods 0.000 abstract description 3
- 239000007770 graphite material Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005057 refrigeration Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 208000014644 Brain disease Diseases 0.000 description 1
- 206010028980 Neoplasm Diseases 0.000 description 1
- 238000005119 centrifugation Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000003745 diagnosis Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 201000010099 disease Diseases 0.000 description 1
- 208000037265 diseases, disorders, signs and symptoms Diseases 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000004060 metabolic process Effects 0.000 description 1
- 238000002600 positron emission tomography Methods 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000009897 systematic effect Effects 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
- 239000005439 thermosphere Substances 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The present invention provides a kind of pet detector radiator structures, it is related to medical imaging equipment technical field, be installed on the support plate surface of the detector unit array, including be successively overlying on the support plate surface the first heat-conducting layer and the second heat-conducting layer, be installed on the second thermally conductive layer surface main structure body, be installed on the centrifugal fan of one end and the first cooling fin being installed on inside main structure body inside main structure body；The centrifugal fan includes inlet side and air side, and the air side is arranged oppositely with the first cooling fin；First heat-conducting layer is flexible insulation Heat Conduction Material；Second heat-conducting layer is length-width direction super-high heat-conductive coefficient Heat Conduction Material, and length and width of the length and width of second heat-conducting layer respectively with the detector unit array match.The heat that heating device on PCB support plate generates can be transferred to rapidly cooling heat radiation system, improve heat dissipation effect.
Description
Technical field
The present invention relates to medical imaging device technical field more particularly to a kind of pet detector radiator structures.
Background technique
PET(positron emission tomography) it is a kind of nuclear medical imaging device, Position Technique is applied, can get disease
The functional metabolism situation for becoming position, plays a significant role the diagnosis and treatment for instructing tumour, heart, brain diseases.
Wherein detector is the core devices of PET system, detector buried in oblivion according to the γ photon detected meet event come
The annihilation location and intensity of human body inside radiation isotope are judged, to obtain the same position of radioactivity by a series of algorithm for reconstructing
The distributed image of element.
The array that pet detector is made of several detector cells, and the encapsulation of corresponding electronic signal process system and
At.Wherein, detector cells 10 are coupled with SiPM(silicon photomultiplier by scintillation crystal 11) PCB support plate 12 constitute, such as scheme
Shown in 1.
Wherein SiPM(silicon photomultiplier) energy resolution and temporal resolution characteristic have strong temperature-independent
Property, SiPM is used at a lower temperature, can be improved these characteristics.Meanwhile the temperature difference in detector everywhere between SiPM is answered
It is small as far as possible, in favor of improving the homogeneity and stability of systematic entirety energy.
In the prior art, generation when often reducing heating device work using single air cooling system or water-cooling system
Influence of the heat to SiPM, the former heat-sinking capability is poor, and air side and the inlet side temperature difference are larger, the spy below air side
It is higher to survey device cell temperature；Latter configuration is complicated, and additional water circulation system need to be arranged.
Based on this, the applicant specializes in this, develops a kind of pet detector radiator structure, this case is thus
It generates.
Summary of the invention
In order to solve drawbacks described above existing in the prior art, the present invention provides a kind of pet detector radiator structure, energy
The heat that heating device on PCB support plate generates is transferred to rapidly cooling heat radiation system, improves heat dissipation effect.
To achieve the goals above, the technical solution adopted by the present invention is as follows:
A kind of pet detector radiator structure, is installed on the support plate surface of the detector unit array, including is successively overlying on described
First heat-conducting layer and the second heat-conducting layer on support plate surface, are installed on structure master at the main structure body for being installed on the second thermally conductive layer surface
The centrifugal fan of internal portion one end and the first cooling fin being installed on inside main structure body；The centrifugal fan includes air inlet
Side and air side, the air side are arranged oppositely with the first cooling fin；First heat-conducting layer is flexible insulation Heat Conduction Material, institute
State the second heat-conducting layer be length-width direction super-high heat-conductive coefficient Heat Conduction Material, the length and width of second heat-conducting layer respectively with the detection
The length and width of device cell array match.
Preferably, further including the electronic cooling component for being installed on the other end inside the main structure body, the electronics system
Cold component includes fixed plate, the cooling piece for being installed on fixed plate side, the second cooling fin for being installed on the fixed plate other side；It is described
Cooling piece includes huyashi-chuuka (cold chinese-style noodles) and hot face, and the huyashi-chuuka (cold chinese-style noodles) is bonded with main structure body bottom surface.
Preferably, the cooling piece uses semiconductor chilling plate.
Preferably, first heat-conducting layer uses thermal coefficient for the silicon thermally conductive gel pad of 1-12W/m K；Described second
Heat-conducting layer uses length-width direction thermal coefficient for 500-2000W/m K, the graphite that thickness direction thermal coefficient is 1-12W/m K
Piece, second heat-conducting layer with a thickness of 0.5-3mm.
Preferably, the main structure body uses high thermal conductivity metal material.Metal material greater than 100W/m K can boundary
It is set to high thermal conductivity metal material.
Preferably, it is preferred that the thermal coefficient of first heat-conducting layer is that 5 W/m K, the second heat-conducting layer length-width direction are thermally conductive
Coefficient is 1800 W/m K, thickness direction thermal coefficient is 5 W/m K.
The principle of the invention and the technical effect being able to achieve: graphite material thickness is overcome using the material property of the first heat-conducting layer
Spend that too thin, compressible amount is too small can not to be bonded each different height heating device and the on-insulated problem of graphite material, and sharp
There is the characteristic of super-high heat-conductive coefficient with the material length-width direction of the second heat-conducting layer, enable heat rapidly in entire detector
Diffusion, reduces the temperature gradient in face in the array surface that unit is constituted, to make to be located at the spy below inlet side and air side
Surveying device unit has lesser temperature difference.
(1) present invention is used in combination flexible insulation Heat Conduction Material and has the heat conduction material of super-high heat-conductive coefficient in length-width direction
The heat that heating device on PCB support plate generates rapidly and uniformly is transferred to cooling system by material.
(2) present invention is used in combination air-cooled and electronic cooling, detector cells below inlet side and air side it
Between the temperature difference it is smaller, maintain in detector module the temperature uniformity of SiPM well.
(3) present invention is not needed using traditional water cooling, therefore does not need complicated water-cooling system, it is only necessary to simple high
Material conducts heat layer, fan and electronic cooling device are led, it is compact-sized, simple and reliable, it is low in cost.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of single crystal in a kind of pet detector radiator structure of the present embodiment；
Fig. 2 is a kind of overall structure diagram of pet detector radiator structure of the present embodiment；
Fig. 3 is a kind of sectional view of pet detector radiator structure of the present embodiment；
Fig. 4 is the structural schematic diagram of electronic cooling component in a kind of pet detector radiator structure of the present embodiment.
Mark explanation: detector cells 10, scintillation crystal 11, PCB support plate 12, the first heat-conducting layer 21, main structure body 22, the
One cooling fin 221, the second heat-conducting layer 23, centrifugal fan 24, inlet side 241, air side 242, electronic cooling component 25, cooling piece
251, the second cooling fin 252.
Specific embodiment
In order to make the attainable technical effect of technological means of the invention and its institute, more perfect exposure can be become apparent from,
One embodiment is hereby provided, and is described in detail as follows in conjunction with attached drawing:
As shown in Figure 1-3, a kind of pet detector radiator structure of the present embodiment, is installed on the PCB support plate of 10 array of detector cells
12 surfaces, including being successively overlying on first heat-conducting layer 21 on 12 surface of PCB support plate and the second heat-conducting layer 23, being installed on the second heat-conducting layer
The main structure body 22 on 23 surfaces, the centrifugal fan 24 for being installed on 22 inside one end of main structure body and it is installed on main structure body 22
The first internal cooling fin 221；First cooling fin 221 can be independently installed cooling fin, can also be directly in main structure body
Processing is produced on 22.In the present embodiment, the first cooling fin 221 is directly produced by slotting on main structure body 22.
Centrifugal fan 24 includes inlet side 241 and air side 242, and air side 242 is arranged oppositely with the first cooling fin 221；
First heat-conducting layer 21 is flexible insulation Heat Conduction Material, and the second heat-conducting layer 23 is length-width direction super-high heat-conductive coefficient Heat Conduction Material.By
There is tack and higher compressibility in flexible insulation Heat Conduction Material, can compensate on the PCB support plate 12 of detector cells 10
The difference in height of different heat device preferably paving can increase thermocontact area in 12 surface of PCB support plate, therefore can be promoted
Heat dissipation effect.Therefore overcome that graphite material thickness is too thin, the compressible too small nothing of amount using the material property of the first heat-conducting layer 21
Method is bonded each different height heating device and the on-insulated problem of graphite material.Length-width direction has super-high heat-conductive coefficient
Heat Conduction Material is set between flexible insulation Heat Conduction Material and main structure body 22, length and width dimensions and flexible insulation Heat Conduction Material
Length and width match.Two kinds of materials combine, and can utilize the characteristic of two kinds of Heat Conduction Materials simultaneously, can be by the PCB of detector cells 10
The heat that heating device generates on support plate 12, is rapidly transferred to main structure body 22, by the cooling heat radiation system of main structure (from
Heart fan 24 and cooling fin) and external environment progress heat exchange, improve heat dissipation effect.
As shown in figs. 1 and 4, the present embodiment preferably further includes being installed on the 22 inside other end of main structure body (far from centrifugation
One end of fan 24) electronic cooling component 25, electronic cooling component 25 includes fixed plate, is installed on the refrigeration of fixed plate side
Piece 251, the second cooling fin 252 for being installed on the fixed plate other side；Cooling piece 251 includes huyashi-chuuka (cold chinese-style noodles) and hot face, huyashi-chuuka (cold chinese-style noodles) and structure master
The fitting of 22 bottom surface of body.Cooling piece 251 reduces the temperature of 242 lower section of air side, while the heat that hot face generates by the refrigeration of huyashi-chuuka (cold chinese-style noodles)
Amount is taken away by cooling fin by the air-flow that centrifugal fan 24 is blown out.
Due to entire 10 array of detector cells, the support plate not in place that radiates is had, can also be existed between each support plate
Cooling effect is different, will generate the temperature difference, therefore electronic cooling component 25 is arranged in the other end of main structure body 22, utilize first
The characteristic of 23 material of heat-conducting layer 21 and the second heat-conducting layer can generate heating device on the PCB support plate 12 of detector cells 10
Heat is rapidly transferred to main structure body 22, while being carried out by the quick electronic cooling component 25 of refrigeration effect with external environment
Heat exchange, therefore can be to avoid cooling blind spot is generated, the temperature gradient reduced along 10 array length direction of detector cells is poor, contracting
The small temperature difference between the detector cells 10 of 242 lower section of inlet side 241 and air side, makes entire detector cells 10
Temperature is uniform.
The preferred cooling piece 251 of the present embodiment uses semiconductor chilling plate 251.Semiconductor chilling plate 251 does not need any
Refrigerant, can continuous work due to other rotary parts, slide unit be a kind of solid sheet, therefore while working, does not have
Vibration, noise, service life are long, and installation is easy.And 251 thermal inertia of semiconductor chilling plate is very small, and cooling time quickly, therefore is given
Detector cells 10 bring good cooling effect.Therefore semiconductor chilling plate 251 is used, temperature can be rapidly reduced,
The heat that support plate generates is taken away at the first time, reduces heat and is transmitted to SiPM, therefore reduces influence of the temperature to SiPM.
Preferred first heat-conducting layer 21 of the present embodiment uses thermal coefficient for the silicon thermally conductive gel pad of 1-12W/m K；Second
Heat-conducting layer 23 uses length-width direction thermal coefficient for 500-2000W/m K, the graphite that thickness direction thermal coefficient is 1-12W/m K
Piece；Second heat-conducting layer 23 with a thickness of 0.5-3mm.The first heat-conducting layer 21 and second that above-mentioned thermal coefficient range is respectively adopted is led
Thermosphere 23, and using the second heat-conducting layer 23 of above-mentioned thickness, can satisfy the thermally conductive demand to be realized of the present embodiment.
The preferred main structure body 22 of the present embodiment uses high thermal conductivity metal material.It realizes fast speed heat transmitting, facilitates reality
Existing fast cooling.
Preferably preferably the thermal coefficient of the first heat-conducting layer 21 is 5 W/m K, 23 length and width side of the second heat-conducting layer to the present embodiment
To thermal coefficient be 1800 W/m K, thickness direction thermal coefficient is 5 W/m K.Above-mentioned preferred thermal coefficient is respectively adopted
First heat-conducting layer 21 and the second heat-conducting layer 23, can largely reach required effect.
The above content is combine the preferred embodiment of the present invention to made by provided technical solution further specifically
It is bright, and it cannot be said that the present invention specific implementation be confined to it is above-mentioned these explanation, for the common skill of the technical field of the invention
For art personnel, without departing from the inventive concept of the premise, a number of simple deductions or replacements can also be made, all should be considered as
It belongs to the scope of protection of the present invention.
Claims (6)
1. a kind of pet detector radiator structure is installed on the support plate surface of the detector unit array, it is characterised in that: packet
Include the first heat-conducting layer for being successively overlying on the support plate surface and the second heat-conducting layer, the structure master for being installed on the second thermally conductive layer surface
Body is installed on the centrifugal fan of one end and the first cooling fin being installed on inside main structure body inside main structure body；It is described from
Heart fan includes inlet side and air side, and the air side is arranged oppositely with the first cooling fin；First heat-conducting layer is flexibility
Insulating heat-conduction material；Second heat-conducting layer is length-width direction super-high heat-conductive coefficient Heat Conduction Material, the length of second heat-conducting layer
The wide length and width respectively with the detector unit array match.
2. a kind of pet detector radiator structure as described in claim 1, it is characterised in that: further include being installed on the structure
The electronic cooling component of the body interior other end, the electronic cooling component include fixed plate, the system for being installed on fixed plate side
Cold, be installed on the second cooling fin of the fixed plate other side；The cooling piece includes huyashi-chuuka (cold chinese-style noodles) and hot face, the huyashi-chuuka (cold chinese-style noodles) and structure master
The fitting of body bottom surface.
3. a kind of pet detector radiator structure as claimed in claim 2, it is characterised in that: the cooling piece uses semiconductor
Cooling piece.
4. a kind of pet detector radiator structure as described in claim 1, it is characterised in that: first heat-conducting layer is used and led
Hot coefficient is the silicon thermally conductive gel pad of 1-12W/m K；Second heat-conducting layer uses length-width direction thermal coefficient for 500-
2000W/m K, thickness direction thermal coefficient be 1-12W/m K graphite flake, second heat-conducting layer with a thickness of 0.5-3mm.
5. a kind of pet detector radiator structure as described in claim 1, it is characterised in that: the main structure body is led using height
Heating rate metal material.
6. a kind of pet detector radiator structure as claimed in claim 4, it is characterised in that: preferred first heat-conducting layer
Thermal coefficient is 5 W/m K, the second heat-conducting layer length-width direction thermal coefficient is 1800 W/m K, thickness direction thermal coefficient is 5
W/m•K。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910265439.XA CN109893157B (en) | 2019-04-03 | 2019-04-03 | PET detector heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910265439.XA CN109893157B (en) | 2019-04-03 | 2019-04-03 | PET detector heat radiation structure |
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| Publication Number | Publication Date |
|---|---|
| CN109893157A true CN109893157A (en) | 2019-06-18 |
| CN109893157B CN109893157B (en) | 2023-11-17 |
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ID=66955269
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910265439.XA Active CN109893157B (en) | 2019-04-03 | 2019-04-03 | PET detector heat radiation structure |
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Cited By (2)
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| CN108186040A (en) * | 2017-12-27 | 2018-06-22 | 上海联影医疗科技有限公司 | PET detecting modules and the PET detecting devices with the module |
| CN113286458A (en) * | 2021-05-14 | 2021-08-20 | 深圳市迪比科电子科技有限公司 | Composite radiation heat dissipation plastic shell suitable for closed power equipment |
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| Publication number | Publication date |
|---|---|
| CN109893157B (en) | 2023-11-17 |
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