CN108668516A - The radiator and its temprature control method of electrosurgery unit - Google Patents

The radiator and its temprature control method of electrosurgery unit Download PDF

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Publication number
CN108668516A
CN108668516A CN201810869251.1A CN201810869251A CN108668516A CN 108668516 A CN108668516 A CN 108668516A CN 201810869251 A CN201810869251 A CN 201810869251A CN 108668516 A CN108668516 A CN 108668516A
Authority
CN
China
Prior art keywords
heat
module
temperature
radiator
electrosurgery unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201810869251.1A
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Chinese (zh)
Inventor
蒋青
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sesame Bloom Medical Devices (shanghai) Co Ltd
Original Assignee
Sesame Bloom Medical Devices (shanghai) Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sesame Bloom Medical Devices (shanghai) Co Ltd filed Critical Sesame Bloom Medical Devices (shanghai) Co Ltd
Priority to CN201810869251.1A priority Critical patent/CN108668516A/en
Publication of CN108668516A publication Critical patent/CN108668516A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00Machines, plants or systems, using electric or magnetic effects
    • F25B21/02Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B49/00Arrangement or mounting of control or safety devices
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336Heat pipes, e.g. wicks or capillary pumps
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20381Thermal management, e.g. evaporation control

Abstract

The present invention provides a kind of radiator and its temprature control method of electrosurgery unit, includes mainly a heat collecting module, a radiating module, a heat insulation module, a thermal conduction module.And use following temprature control method:Temperature sensor measurement temperature is provided the temperature difference for the heat transfer device such as heat pipe, the heat at heat source is transferred at low-temperature receiver rapidly using microprocessor control thermoelectric cooler work.Thus, it is possible to efficiently distribute the heat of the generation of the power component in electrosurgery unit;It is quieter when radiator operation work, realize zero noise of running;It realizes the electronic component inside electrosurgery unit to be isolated from the outside, keeps the cleaning of inner space, reduce the failure rate of product, improve service life;The radiator it is small with it is light-weight, conducive to electrosurgery unit to miniaturization develop with lightweight direction.

Description

The radiator and its temprature control method of electrosurgery unit
Technical field
The present invention is about a kind of radiator, especially in regard to the radiator of electrosurgery unit.
Temprature control method of the present invention also about the radiator of aforementioned electrosurgical equipment.
Background technology
It needs to realize the conversion of its energy, ginseng using some semiconductor components and devices in the host computer control circuit of electrosurgery unit Functions, these semiconductor components and devices such as number control and adjusting include power device, such as Metal-Oxide Semiconductor field-effect Transistor(MOSFET), insulated gate bipolar transistor(IGBT)Deng.Power device will produce certain heat at work, such as A major issue needed to be considered when what heat dissipation is electrosurgery unit design.
In the prior art, electrosurgery unit radiates in such a way that traditional heat-dissipating piece is combined with radiator fan.Heat dissipation Fan can introduce noise, and may be by inside host in the dust band in environment, and the dust in environment is attached to the electricity in host It can cause component failure on sub- component.But also it is bad to bring heat dissipation effect, radiator is mechanical connection service life It is limited.
In view of this, it is necessory to provide a kind of radiator and its temprature control method of electrosurgery unit, to solve The aforementioned defect caused by heat emission fan radiates.
Invention content
First purpose of the present invention is that the heat dissipation effect of the power component in electrosurgery unit becomes apparent from.
Second object of the present invention is, electrosurgery unit runs quieter when work, realizes zero noise of operation.
Third object of the present invention is that the electronic component inside electrosurgery unit is isolated with external world's realization, is kept The cleaning of inner space reduces the failure rate of product, improves service life.
Fourth object of the present invention is, reduces the volume and weight for mitigating cooling fin in electrosurgery unit, to profit Develop to miniaturization with lightweight direction in electrosurgery unit.
To achieve the aforementioned purpose, the present invention provides a kind of radiator of electrosurgery unit, including:
One host computer control circuit has a heat source;
One heat collecting module, heat collecting module all standing heat source, the heat of heat source to be concentrated on the heat collecting module;
One radiating module, the radiating module have a low-temperature receiver;
One heat insulation module, the heat insulation module are arranged between the low-temperature receiver and the heat source, to completely cut off the heat source region and be somebody's turn to do The heat of low-temperature receiver region directly transmits;
One thermal conduction module passes through heat insulation module, heat collecting module and radiating module is connected, heat to be transferred to from heat source side Low-temperature receiver end.
Preferably, which is the power device in host control circuit.
Preferably, which is Metal-Oxide Semiconductor field-effect transistor or insulated gate bipolar crystal Pipe.
Preferably, which includes a thermal conductive silicon rubber cushion, a heat-conducting metal block;The thermal conductive silicon rubber cushion connects the heat Source;The heat-conducting metal block connects the thermal conductive silicon rubber cushion;The thermal conduction module is arranged in the heat-conducting metal block.
Preferably, the material of the heat-conducting metal block is aluminium or copper.
Preferably, which includes a heat pipe;The heat pipe includes a closed shell, a working media, a tool There is the tube core of capillary structure;The shape of the heat pipe is U-shaped.
Preferably, which includes one group of cooling fin, a thermoelectric cooler;The material of the cooling fin is aluminium or copper; The thermal conduction module is threaded through in this group of cooling fin;The thermoelectric cooler is bonded with one end of this group of cooling fin, to reduce this The temperature of group cooling fin.
Preferably, which also includes a radiating control module;The radiating control module includes,
One temperature sensor connects the heat collecting module, to measure the temperature of the heat collecting module;
One microprocessor, the temperature sensor are connect with the microprocessor signals;
One relay, the relay are connect with the microprocessor, which is switched on or switched off the thermoelectric cooler operating circuit With the connection of power supply.
Preferably, which is a closed cavity, is vacuum in the cavity.
The present invention also provides a kind of temprature control method of the radiator of electrosurgery unit,
The first step, the actual temperature of the heat collecting module of the host computer control circuit of the temperature sensor measurement electrosurgery unit;
Second step, by the method for threshold value comparison, a microprocessor is by the target temperature of the actual temperature of the heat collecting module and setting Degree compares,
When the actual temperature is bigger than the target temperature, which sends out an enabling signal so that a relay connects one Thermoelectric cooler and power supply, thermoelectric cooler refrigeration, to reduce by one by the temperature at the low-temperature receiver of thermal isolation;
Third walks, a heat pipe, absorbs one working media of heat of vaporization in heat source side, until low-temperature receiver end release heat condenses work Jie Matter, the working media are back to heat source side by the tube core of a capillary pipe structure, and heat is conducted from heat source side to low-temperature receiver end;
4th step, when the actual temperature is smaller than the target temperature, which sends out a stop signal so that a relay A thermoelectric cooler and power supply are disconnected, which stops refrigeration, heat pipe both ends thermal balance.
Accordingly, the present invention provides a kind of radiator and its temprature control method of electrosurgery unit, and main includes a collection Thermal modules, a radiating module, a heat insulation module, a thermal conduction module.And use following temprature control method:Temperature sensor is surveyed Amount temperature provides the temperature difference using microprocessor control thermoelectric cooler work for the heat transfer device such as heat pipe, rapidly will be at heat source Heat be transferred at low-temperature receiver.Thus, it is possible to efficiently distribute the heat of the generation of the power component in electrosurgery unit;It should It is quieter when radiator operation work, realize 0 noise of running;Realize electronic component inside electrosurgery unit with it is outer Boundary is isolated, and keeps the cleaning of inner space, reduces the failure rate of product, improves service life;The radiator it is small with again Amount is light, develops to miniaturization with lightweight direction conducive to electrosurgery unit.
Description of the drawings
Fig. 1 is the connection diagram of the present invention in a preferred embodiment.
Fig. 2 is present invention connection diagram in a further preferred embodiment.
Fig. 3 is the temprature control method flow chart of the radiator of an electrosurgery unit provided by the invention.
Reference sign.
Heat source 1
Heat collecting module 2
Radiating module 3
Low-temperature receiver 4
Heat insulation module 5
Thermal conduction module 6
Power device(Metal-Oxide Semiconductor field-effect transistor or insulated gate bipolar transistor etc.)11,12 ... ..., 1N
Thermal conductive silicon fat pad 21
Heat-conducting metal block 22
Cooling fin 31
Thermoelectric cooler(Semiconductor refrigeration chip)32
Radiating control module 33
Temperature sensor 331
Microprocessor 332
Relay 333
Power supply 34
Vacuum chamber 51
U-shaped heat pipe 61
Temperature detection step S1
Threshold value rate-determining steps S2
Adopting heat pipes for heat transfer step S3
Step S4 is closed in cooling.
Specific implementation mode
Referring to Fig. 1, the present invention provides a kind of radiator of electrosurgery unit, including:One host computer control circuit, has One heat source 1;One heat collecting module 2,2 all standing of heat collecting module heat source 1, the heat of heat source 1 is concentrated to the collection hot-die On block 2;One radiating module 3, the radiating module have a low-temperature receiver 4;One heat insulation module 5, the heat insulation module 5 are arranged in the low-temperature receiver 4 Between the heat source 1, directly transmitted to completely cut off 1 region of heat source and the heat of 4 region of low-temperature receiver;One heat transfer Module 6 passes through heat insulation module 5, heat collecting module 2 and radiating module 3 is connected, heat is transferred to low-temperature receiver end from heat source side 1 4。
Referring to Fig. 2, the heat source is the power device 11,12 ... ... in host control circuit, 1N.It is common, power device Part has Metal-Oxide Semiconductor field-effect transistor or insulated gate bipolar transistor etc..These power devices are working When, certain heat can be generated, so as to cause heat high point in many places is had in control circuit.
The heat collecting module 2 includes a thermal conductive silicon rubber cushion 21, a heat-conducting metal block 22;The thermal conductive silicon rubber cushion 21 connects the heat Source 1;The heat-conducting metal block 22 connects the thermal conductive silicon rubber cushion 21;The thermal conduction module 6 is arranged in the heat-conducting metal block 22.Heat conduction Silicagel pad 21 has cushioning effect, to protect control circuit not to be damaged, heat-conducting metal block 22 can by many places hot source point 11, The heat of 12 ... ..., 1N focus on the heat-conducting metal block 22.Temperature on the heat-conducting metal block 22 has indirectly reacted the heat The size of the heat in source 1.Under normal conditions, the material with good heat conductivity is needed to make the heat-conducting metal block 22, is generally selected With aluminium or copper.
The thermal conduction module 6 includes a heat pipe 61;The heat pipe 61 includes a closed shell, and a working media, one has The tube core of capillary structure;The shape of the heat pipe 61 is U-shaped.Show that heat pipe quantity is two in the present embodiment.General work medium can To select water, methanol, nano-fluid etc..The principle of heat pipe 61 is, in 1 region of heat source(I.e. heat-conducting metal block 22 is by through area Domain), heat exchange occurs between heat pipe 61 and the heat-conducting metal block 22, so that working media evaporation absorbs heat;In low-temperature receiver 4 In region(I.e. cooling fin 31 is by pass-through zone), occur heat exchange between heat pipe 61 and the cooling fin 31, it is gaseous in heat pipe 61 Working media condensation release heat;In other regions, heat pipe 61 is adiabatic with the external world.The tube core that working media passes through capillary pipe structure It is back to heat pipe and corresponds to 1 region of heat source, carry out next heat transfer cycle.
The radiating module 3 includes one group of cooling fin 31, a thermoelectric cooler 32;The material of the cooling fin 31 is aluminium or copper; The thermal conduction module 6 is threaded through in this group of cooling fin 31;The thermoelectric cooler 32 is bonded with one end of this group of cooling fin 31, to Reduce the temperature of this group of cooling fin 31.So as to form low-temperature receiver 4.In general, this group of cooling fin 31 makes fin radiator
The radiating module 3 also includes a radiating control module 33;The radiating control module 33 includes a temperature sensor 331, even The heat collecting module 2 is connect, to measure the temperature of the heat collecting module 2;One microprocessor(MCU)332, the temperature sensor 331 with 332 signal of microprocessor connects;One relay 333, the relay 333 are connect with the microprocessor 332, the relay 333 It is switched on or switched off the connection of thermoelectric cooler 32 operating circuit and power supply 34.
The operation principle of thermoelectric cooler 32 is to utilize Peltier(Peltier)Effect, in p-type thermoelectric element, N-type heat The both ends of electric device apply the electric current of specific direction, and heat can be transferred to the other end from one end of thermoelectric element.
The heat insulation module 5 is a closed cavity, is vacuum 51 in the cavity.The heat insulation module 5 mainly by low-temperature receiver 4 with Other heats(Most importantly heat source)It is thermally shielded.
It is the structure assembled state and its connection relation of the present invention above, referring to Fig. 3, a kind of electricity provided by the invention is outer The temprature control method of the radiator of section's equipment, as described below.
The first step, temperature detection step S1.The collection of the host computer control circuit of the one temperature sensor measurement electrosurgery unit The actual temperature of thermal modules.
Thus, it is possible to know the height of the heat of the heat source indirectly.
Second step, threshold value rate-determining steps S2.By the method for threshold value comparison, a microprocessor is by the reality of the heat collecting module Temperature is compared with the target temperature of setting, and when the actual temperature is bigger than the target temperature, which sends out startup letter Number so that a relay connects a thermoelectric cooler and power supply, thermoelectric cooler refrigeration, to reduce by one by the cold of thermal isolation Temperature at source.
Thus, it is possible to generate the temperature low-temperature receiver low compared with heat source temperature to promote heat transfer.
Third walks, adopting heat pipes for heat transfer step S3.One heat pipe absorbs one working media of heat of vaporization, until low-temperature receiver end in heat source side Release heat condenses the working media, which is back to heat source side by the tube core of a capillary pipe structure, by heat from heat Source is conducted to low-temperature receiver end.
To, the heat that power device in the control circuit in electrosurgery unit generates is taken to outside the electrosurgery unit, And by the measures such as radiate, cool down, the heat in the region is reduced.
Step S4 is closed in 4th step, cooling.When the actual temperature is smaller than the target temperature, which sends out one and stops Stop signal a so that relay disconnects a thermoelectric cooler and power supply, which stops refrigeration, and heat pipe both ends heat is flat Weighing apparatus.
To which the temperature of heat collecting module in electrosurgery unit is maintained a setting value hereinafter, namely indirect control The final of radiator maintains a certain setting calorie value or less to cooling heat source effect.
In conclusion the present invention provides a kind of radiator and its temprature control method of electrosurgery unit, include mainly One heat collecting module 2, a radiating module 3, a heat insulation module 5, a thermal conduction module 6.And use following temprature control method:Temperature Sensor measures temperature S1 provides the temperature difference using microprocessor control thermoelectric cooler work S2 for the heat transfer device such as heat pipe, The heat at heat source is transferred to S3 at low-temperature receiver rapidly, to which heat from heat source is maintained at a reduced levels S4, is thus reached Preferable heat dissipation effect.Thus, it is possible to efficiently distribute the heat of the generation of the power component 1 in electrosurgery unit;This is dissipated It is quieter when thermal operation work, realize 0 noise of running;Realize the electronic component inside electrosurgery unit and the external world Isolation, keeps the cleaning of inner space, reduces the failure rate of product, improves service life;The radiator is small and weight Gently, develop to miniaturization with lightweight direction conducive to electrosurgery unit.
The above is presently preferred embodiments of the present invention, should not limit the present invention with this.It is all according to the claims in the present invention institute The equivalent replacement of work or modification, belong to the scope of protection of the invention.

Claims (10)

1. a kind of radiator of electrosurgery unit, which is characterized in that include:
One host computer control circuit has a heat source;
One heat collecting module, heat collecting module all standing heat source, the heat of heat source to be concentrated on the heat collecting module;
One radiating module, the radiating module have a low-temperature receiver;
One heat insulation module, the heat insulation module are arranged between the low-temperature receiver and the heat source, to completely cut off the heat source region and be somebody's turn to do The heat of low-temperature receiver region directly transmits;
One thermal conduction module passes through heat insulation module, heat collecting module and radiating module is connected, heat to be transferred to from heat source side Low-temperature receiver end.
2. the radiator of electrosurgery unit as described in claim 1, which is characterized in that the heat source is in host control circuit Power device.
3. the radiator of electrosurgery unit as claimed in claim 2, which is characterized in that the power device is metal-oxide Object semiconductor field effect transistor or insulated gate bipolar transistor.
4. the radiator of electrosurgery unit as described in claim 1, which is characterized in that the heat collecting module includes a heat conduction Silicagel pad, a heat-conducting metal block;The thermal conductive silicon rubber cushion connects the heat source;The heat-conducting metal block connects the thermal conductive silicon rubber cushion;The heat Conduction module is arranged in the heat-conducting metal block.
5. the radiator of electrosurgery unit as claimed in claim 4, which is characterized in that the material of the heat-conducting metal block is Aluminium or copper.
6. the radiator of electrosurgery unit as described in claim 1, which is characterized in that the thermal conduction module includes a heat Pipe;The heat pipe includes a closed shell, a working media, a tube core with capillary structure;The shape of the heat pipe is U-shaped.
7. the radiator of electrosurgery unit as described in claim 1, which is characterized in that the radiating module includes one group of heat dissipation Piece, a thermoelectric cooler;The material of the cooling fin is aluminium or copper;The thermal conduction module is threaded through in this group of cooling fin;The thermoelectricity Refrigerator is bonded with one end of this group of cooling fin, to reduce the temperature of this group of cooling fin.
8. the radiator of electrosurgery unit as claimed in claim 7, which is characterized in that the radiating module also includes a heat dissipation Control module;The radiating control module includes,
One temperature sensor connects the heat collecting module, to measure the temperature of the heat collecting module;
One microprocessor, the temperature sensor are connect with the microprocessor signals;
One relay, the relay are connect with the microprocessor, which is switched on or switched off the thermoelectric cooler operating circuit With the connection of power supply.
9. the radiator of electrosurgery unit as described in claim 1, which is characterized in that the heat insulation module is a closing chamber Body is vacuum in the cavity.
10. a kind of temprature control method of the radiator of electrosurgery unit, which is characterized in that
The first step, the actual temperature of the heat collecting module of the host computer control circuit of the temperature sensor measurement electrosurgery unit;
Second step, by the method for threshold value comparison, a microprocessor is by the target temperature of the actual temperature of the heat collecting module and setting Degree compares,
When the actual temperature is bigger than the target temperature, which sends out an enabling signal so that a relay connects one Thermoelectric cooler and power supply, thermoelectric cooler refrigeration, to reduce by one by the temperature at the low-temperature receiver of thermal isolation;
Third walks, a heat pipe, absorbs one working media of heat of vaporization in heat source side, until low-temperature receiver end release heat condenses work Jie Matter, the working media are back to heat source side by the tube core of a capillary pipe structure, and heat is conducted from heat source side to low-temperature receiver end;
4th step, when the actual temperature is smaller than the target temperature, which sends out a stop signal so that a relay A thermoelectric cooler and power supply are disconnected, which stops refrigeration, heat pipe both ends thermal balance.
CN201810869251.1A 2018-08-02 2018-08-02 The radiator and its temprature control method of electrosurgery unit Pending CN108668516A (en)

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Application Number Priority Date Filing Date Title
CN201810869251.1A CN108668516A (en) 2018-08-02 2018-08-02 The radiator and its temprature control method of electrosurgery unit

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Application Number Priority Date Filing Date Title
CN201810869251.1A CN108668516A (en) 2018-08-02 2018-08-02 The radiator and its temprature control method of electrosurgery unit

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109582065A (en) * 2019-01-23 2019-04-05 青岛大学 Temprature control method based on thermoelectric effect
CN109938730A (en) * 2019-01-31 2019-06-28 佛山瑞加图医疗科技有限公司 Radiator
CN112038745A (en) * 2020-08-17 2020-12-04 中国人民解放军空军工程大学 Active phased array radar antenna array surface autonomous heat dissipation device based on Peltier effect

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Publication number Priority date Publication date Assignee Title
JPH08145522A (en) * 1994-11-16 1996-06-07 Fuji Electric Co Ltd Electronic freezing refrigerator
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CN103115455A (en) * 2013-01-28 2013-05-22 山东大学 No-hole and mute heat dissipation device of closed box body
CN103715473A (en) * 2012-09-29 2014-04-09 北京有色金属研究总院 Thermal management system of power battery
CN106066674A (en) * 2016-05-27 2016-11-02 东莞市联洲知识产权运营管理有限公司 A kind of superconductive radiating quiet case
CN206450949U (en) * 2016-12-06 2017-08-29 杭州海康威视数字技术股份有限公司 A kind of video camera cooling structure and the video camera with it

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Publication number Priority date Publication date Assignee Title
JPH08145522A (en) * 1994-11-16 1996-06-07 Fuji Electric Co Ltd Electronic freezing refrigerator
CN1855452A (en) * 2005-04-19 2006-11-01 台达电子工业股份有限公司 Radiating moudle of electronic device
CN103715473A (en) * 2012-09-29 2014-04-09 北京有色金属研究总院 Thermal management system of power battery
CN103115455A (en) * 2013-01-28 2013-05-22 山东大学 No-hole and mute heat dissipation device of closed box body
CN106066674A (en) * 2016-05-27 2016-11-02 东莞市联洲知识产权运营管理有限公司 A kind of superconductive radiating quiet case
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109582065A (en) * 2019-01-23 2019-04-05 青岛大学 Temprature control method based on thermoelectric effect
CN109938730A (en) * 2019-01-31 2019-06-28 佛山瑞加图医疗科技有限公司 Radiator
CN112038745A (en) * 2020-08-17 2020-12-04 中国人民解放军空军工程大学 Active phased array radar antenna array surface autonomous heat dissipation device based on Peltier effect

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Application publication date: 20181016