WO2012014251A1

WO2012014251A1 - Two-dimensional image detector

Info

Publication number: WO2012014251A1
Application number: PCT/JP2010/004753
Authority: WO
Inventors: 吉牟田　利典
Original assignee: 株式会社島津製作所
Priority date: 2010-07-26
Filing date: 2010-07-26
Publication date: 2012-02-02
Also published as: JP5549731B2; JPWO2012014251A1

Abstract

In the disclosed two-dimensional image detector, a heat-conducting plate (21) is provided on a base plate (7), end Peltier units (39) are provided for external-circuit use, and center Peltier units (29) are provided for an active matrix substrate (11) and a conversion layer (13), taking care of cooling and isothermalization respectively, thereby increasing isothermalization and cooling efficiency with a comparatively simple structure. Furthermore, external air brought in via an air intake (51) in a cover (5) efficiently passes through cooling fans (35 and 45) in the Peltier elements (33 and 43), thereby efficiently removing heat from said Peltier elements (33 and 43).

Description

2D image detector

The present invention relates to a two-dimensional image detector for detecting light or radiation used in the medical field, industrial field, nuclear field and the like.

Conventionally, as this type of device (first device), there is the one shown in FIG.
This first device includes a conversion layer 101 made of a semiconductor, an accumulation / read circuit 103 attached to the conversion layer 101, a holding member 105 that holds the conversion layer 101 and the accumulation / read circuit 103 in a stacked manner, The cooling pipe 107 embedded in the holding member 105, the pre-stage circuit 109 disposed on the lower surface of the holding member 105, the post-stage circuit 111 connected to the pre-stage circuit 109, the pre-stage circuit 109 and the accumulation / read circuit 103 are connected. The flexible cable 113 and the fan 115 for stirring the air in the case are provided.

In the first device configured as described above, the charge detected by the conversion layer 101 is read as a signal by the storage / readout circuit 103, the signal is amplified by the pre-stage circuit 109, and then the signal is easily processed by the post-stage circuit 111. Convert to signal. It should be noted that the refrigerant is circulated through the cooling pipe 107 and the air is stirred by the fan 115, thereby making the conversion layer 101 constant temperature and mainly cooling the amplifier circuit 109.

Further, as another conventional device (second device), a conversion layer and a storage / readout circuit are stacked, and these are arranged with a spacer spaced from the casing, and further, a storage / readout circuit is provided by the spacer. There is a configuration in which a pre-stage circuit or the like is arranged apart from the outside, a Peltier element is attached inside or outside the housing, and outside air is taken in by a fan and air in the housing is discharged ( For example, see Patent Document 1).

In the second device configured in this way, the previous circuit, which is a heat source, is separated from the conversion layer, and the temperature of the air between them is controlled by the Peltier element, thereby making the conversion layer constant temperature, and the amplifier circuit Cool down.
JP 2003-14860 (paragraphs “0012” and “0013”, FIGS. 2 and 3)

However, the conventional example having such a configuration has the following problems.
That is, since the conventional first apparatus distributes the refrigerant, there is a risk of refrigerant leakage. In addition, a configuration for cooling or circulating the refrigerant is necessary, and there is a problem that the apparatus becomes complicated.

In addition, the second conventional apparatus is a cooling using a Peltier element, but is by replacing the air in the gap between the conversion layer, the storage / readout circuit, the previous circuit, etc., and is equivalent to air cooling. Therefore, there is a problem that the constant temperature and cooling efficiency are poor.

Furthermore, the conventional apparatus has only one configuration related to temperature control, and there is a problem that a large deviation occurs in the temperature distribution in the two-dimensional image detector.

The present invention has been made in view of such circumstances, and there is no inconvenience such as refrigerant leakage, and the temperature distribution and cooling efficiency can be increased with a relatively simple configuration while reducing the temperature distribution bias. An object of the present invention is to provide a two-dimensional image detector capable of

In order to achieve such an object, the present invention has the following configuration.
That is, the present invention includes a conversion layer that converts light or radiation into a charge signal, a storage / readout substrate that stores and reads out the charge signal converted by the conversion layer, and the storage / readout substrate and the conversion layer. A state in which heat exchange is possible between the base plate and the base plate that is stacked and held in the direction, the external circuit disposed on the other surface of the base plate and electrically connected to the storage / readout substrate. The heat conduction plate disposed on the other surface of the base plate, the first Peltier element disposed on the heat conduction plate and disposed at a position corresponding to the external circuit, and the first Peltier element A first duct for inducing heat generated in the first Peltier element; a second Peltier element disposed on the heat conductive plate and disposed in a region where the external circuit is not disposed; and the second Peltier element. Induces heat generated in A second duct for, and is characterized in that it comprises a and a fan for discharging heat from the first duct and the second duct.

[Operation / Effect] According to the present invention, the first Peltier element is mainly responsible for cooling the external circuit via the heat conducting plate. In addition, the second Peltier element is mainly responsible for the constant temperature of the conversion layer via the heat conductive plate. The heat generated in the first Peltier element and the second Peltier element is induced by the first duct and the second duct and efficiently exhausted by the fan. Therefore, the temperature of the conversion layer and the cooling efficiency of the external circuit can be increased with a relatively simple configuration while avoiding inconvenience such as refrigerant leakage. In addition, since temperature control is shared by the first Peltier element that mainly cools the external circuit and the second Peltier element that mainly keeps the temperature of the conversion layer, the bias in temperature distribution is compared with the conventional one. Can be made smaller.

In the present invention, the external circuit includes a pre-stage circuit that generates a large amount of heat and a post-stage circuit that generates less heat than the pre-stage circuit, and the base plate has a thin step portion at the periphery of the other surface. Preferably, the pre-stage circuit is disposed in the step portion with a heat transfer member interposed between the pre-stage circuit and the heat conducting plate. Of the external circuits, the pre-stage circuit connected to the storage / read-out substrate is arranged in the step portion of the base plate, so that the wiring length between the pre-stage circuit and the storage / read-out substrate can be shortened. Therefore, noise can be reduced.

In the present invention, it is preferable that the pre-stage circuit is disposed between the base plate and a heat insulating material. Heat conduction from the previous circuit to the base plate can be suppressed, and uneven distribution of heat can be suppressed.

In the present invention, it is preferable that the post-stage circuit is disposed between the base plate and a heat insulating material. Although the latter circuit generates less heat than the former circuit, it is possible to suppress an uneven temperature distribution by arranging a heat insulating material between the latter circuit and the base plate.

In the present invention, the heat conduction plate includes a center heat conduction plate located at the center of the base plate and an end heat conduction plate corresponding to the position of the external circuit, and can be separated from each other. It is preferable that With only the central heat conduction plate attached to the base plate, adjustment to external circuits and connection of wiring can be performed. Therefore, assembly and maintenance can be easily performed.

According to the two-dimensional image detector according to the present invention, the first Peltier element is mainly responsible for cooling the external circuit via the heat conductive plate, and the second Peltier element is mainly converted through the heat conductive plate. Responsible for constant temperature. The heat generated in the first Peltier element and the second Peltier element is induced by the first duct and the second duct and efficiently exhausted by the fan. Therefore, while avoiding inconveniences such as refrigerant leakage between the conversion layer and the external circuit, the temperature of the conversion layer and the cooling efficiency of the external circuit can be increased with a relatively simple configuration. In addition, since temperature control is shared by the first Peltier element that mainly cools the external circuit and the second Peltier element that mainly keeps the temperature of the conversion layer, the bias in temperature distribution is compared with the conventional one. Can be made smaller.

It is a perspective view which shows schematic structure of the flat panel type | mold X-ray detector which concerns on an Example. It is a figure which shows the connection relation of an active matrix substrate and an external circuit. It is a longitudinal cross-sectional view which shows the principal part of an active matrix substrate. It is a side view which shows the arrangement | positioning state of an external circuit. It is a schematic diagram which shows constant temperature and cooling. It is a side view which shows the modification of a base board. It is a side view which shows the modification of a heat conductive board. It is a perspective view which shows the other modification of a heat conductive board. It is a longitudinal cross-sectional view which shows schematic structure of the two-dimensional image detector which concerns on a prior art example.

1 ... Flat panel X-ray detector (FPD)
DESCRIPTION OF SYMBOLS 3 ... Detector part 5 ... Cover 7 ... Base board 9 ... Backlight 11 ... Active matrix board | substrate 13 ... Conversion layer 15 ... Amplifier circuit 17 ... AD board | substrate 19 ... Flexible cable 21 ... Thermal conduction board 23 ... Central part thermal conduction board 27 ... Connecting member 29 ... Central Peltier unit 39 ...

End Peltier unit

31, 41 ...

Peltier unit

33, 43 ...

Peltier element

35, 45 ... Cooling

fins

37, 47 ... Duct 49 ... Fan 51 ... Inlet 53 ... Exhaust

An embodiment of the present invention will be described below with reference to the drawings.
FIG. 1 is a perspective view illustrating a schematic configuration of a flat panel X-ray detector according to an embodiment.

As a two-dimensional image detector of the present invention, a flat panel X-ray detector 1 (hereinafter referred to as FPD 1) will be described as an example. The FPD 1 is, for example, a direct conversion type detector that detects X-rays transmitted through a subject.

The FPD 1 includes a detector unit 3 and a cover 5. The detector unit 3 includes a base plate 7, a backlight 9, an active matrix substrate 11, and a conversion layer 13. The base plate 7 includes a backlight 9 on a lower surface corresponding to one surface, an active matrix substrate 11 on the lower surface, and a conversion layer 13 stacked on the lower surface. The conversion layer 13 is made of amorphous selenium (a-Se), for example, and has a size of about 280 mm to 500 mm square in plan view. For example, the conversion layer 13 is covered with an insulator or the like by a mold structure in order to prevent discharge. In addition, examples of the material constituting the conversion layer 13 include cadmium telluride (CdTe) and cadmium zinc telluride (CdZnTe). The backlight 9 is provided to improve the detection lag in the conversion layer 13.

The base plate 7 is a plate-like member made of a material having high thermal conductivity. However, since the backlight 9, the active matrix substrate 11, and the conversion layer 13 described above are held and members to be described later are held, a strength that can hold them is required. Here, as an example, aluminum having high thermal conductivity and high rigidity is employed, but other materials may be employed as long as each member can be held and sufficient thermal conductivity is provided.

On the upper surface corresponding to the other surface of the base plate 7, an amplifier circuit 15 which is a part of an external circuit and an AD substrate 17 connected to the subsequent stage are arranged. Here, as an example, the amplifier circuit 15 and the AD board 17 are arranged on the left and right in FIG. The amplifier circuit 15 is electrically connected to the active matrix substrate 11 with a flexible cable 19. Although not shown, gate drive circuits described later are arranged at the front and rear positions in FIG.

The above-described active matrix substrate 11 corresponds to the “storage / readout substrate” in the present invention, the amplifier circuit 15 corresponds to the “previous circuit” in the present invention, and the AD substrate 17 corresponds to the “follower circuit” in the present invention. To do. The amplifier circuit 15 and the AD board 17 correspond to the “external circuit” in the present invention.

The heat conduction plate 21 is disposed on the upper surface of the base plate 7. The heat conductive plate 21 includes a central heat conductive plate 23 disposed at the central portion of the base plate 7 and two end heat conductive plates 25 disposed at the left and right end portions of the base plate 7. The two end heat conductive plates 25 correspond to the positions where the amplifier circuit 15 and the AD substrate 17 described above are arranged on the base plate 7. The central part heat conduction plate 23 and the end part heat conduction plate 25 are connected to each other by a connecting member 27 so that heat can be transferred. More specifically, the connecting members 27 are attached to the upper surfaces of the left and right ends of the central heat conducting plate 23, and the end heat conducting plates 25 are attached to the upper surface of the connecting member 27. In other words, the end portion heat conductive plate 25 has an appearance shape in which the wings are spread around the center portion heat conductive plate 23. The center part heat conduction plate 23 and the end part heat conduction plate 25 are made of, for example, aluminum, and the connecting member 27 is made of, for example, copper. Since copper has a higher thermal conductivity than aluminum, it is preferable as a constituent material. However, since it is necessary to attach the structure mentioned later to the upper surface, the center part heat conductive plate 23 and the edge part heat conductive plate 25 employ | adopt aluminum for the convenience on a process.

A central Peltier unit 29 is attached to the upper surface of the central thermal conductive plate 23. The central Peltier unit 29 is composed of two Peltier units 31. The two Peltier units 31 are arranged at the front and back with a central portion in consideration of the air flow during exhaust heat. Each Peltier unit 31 includes a Peltier element 33, a cooling fin 35, and a duct 37. The Peltier element 33 is a thin plate-like temperature control device using heat transfer between different metals. The cooling fin 35 is attached to the upper surface of the Peltier element 33 and radiates heat generated by the Peltier element 33. The duct 37 is configured to cover the cooling fins 35 with both ends in a direction orthogonal to the direction in which the cooling fins 35 are arranged open. The duct 37 guides the heat of the cooling fin 35 together with the air only in the gap direction of the cooling fin 35.

The end Peltier unit 39 is attached to the upper surface of each end heat conduction plate 25. The end Peltier unit 39 is configured in the same manner as the central Peltier unit 29 described above. That is, it is composed of two Peltier units 41 and is arranged with a central portion in consideration of exhaust heat efficiency. Each Peltier unit 41 includes a Peltier element 43, a cooling fin 45, and a duct 47.

A fan 49 is attached to the center of the end Peltier unit 39. The fan 49 sucks air from four sides in the lateral direction and exhausts it upward. Conversely, the fan 49 may be configured to suck air from above and discharge outside air in four lateral directions. The fan 49 is preferably a low noise type or a low rotation type that does not adversely affect the collected signal. The reason why the fan 49 is disposed at this position is to efficiently exhaust heat on the side of the amplifier circuit 15 that generates a large amount of heat. The reason why the fan 49 is not disposed between the Peltier units 31 constituting the central Peltier unit 29 is that the role of the central Peltier unit 29 is more constant than cooling. However, a power supply three-terminal regulator may be attached to the central heat conduction plate 23. Since this component generates a relatively large amount of heat, the fan 49 may be disposed between the Peltier units 31 in consideration of the heat generated by this component.

The central Peltier unit 29 and the end Peltier unit 39 are temperature-controlled independently for each

Peltier element

33, 43. The control is preferably performed based on a temperature signal of a temperature sensor (not shown) attached to the side surface of the conversion layer 13 or the end heat conductive plate 25.

The end Peltier unit 39 described above corresponds to the “first Peltier element” in the present invention, and the central Peltier unit 29 corresponds to the “second Peltier element” in the present invention. The duct 47 corresponds to a “first duct” in the present invention, and the duct 37 corresponds to a “second duct” in the present invention.

The cover 5 is attached so as to cover the upper part of the detector unit 3 described above. An intake port 51 is formed on the side surface of the cover 5 in the front-rear direction. Each intake port 51 corresponds to the arrangement position of the duct 37 of the central Peltier unit 29 and the duct 47 of the end Peltier unit 39. An exhaust port 53 is formed on the upper surface of the cover 5. Each exhaust port 53 is formed at a position corresponding to the fan 49. When the above-described fan 49 is operated, the outside air is sucked through the intake ports 51, and the heat of the

Peltier elements

33 and 43 is exhausted through the exhaust ports 53 through the

ducts

37 and 47.

Refer to FIG. 2 and FIG. 3 here. 2 is a diagram showing a connection relationship between the active matrix substrate and an external circuit, and FIG. 3 is a longitudinal sectional view showing a main part of the active matrix substrate.

The active matrix substrate 11 has detection elements DU arranged in a two-dimensional matrix and is patterned on an insulating substrate 55 such as glass. The active matrix substrate 11 includes a collection electrode 57, a capacitor Ca, and a thin film transistor Tr. The collection electrode 57 collects the charge signal converted by the conversion layer 13. The capacitor Ca accumulates the charge signal collected by the collecting electrode 57. The thin film transistor Tr is a switching element that is turned on and off by an external signal and reads a charge signal accumulated in the capacitor Ca. One detection element DU is composed of a collection electrode 57, a capacitor Ca, a thin film transistor Tr, and a set of a conversion layer 13 and an application electrode 59 in a region corresponding thereto. A bias voltage Va is applied to the application electrode 59. Here, for convenience of explanation, it is assumed that 10 × 10 two-dimensional matrices of the active matrix substrate 11 are configured.

The active matrix substrate 11 includes gate lines G1 to G10 and data lines D1 to D10. The gate lines G1 to G10 are electrically connected to the gate of the thin film transistor Tr for each row of the detection elements DU. The data lines D1 to D10 are electrically connected to the reading side of the thin film transistor Tr for each column of the detection elements DU. In the following description, the gate lines G1 to G10 and the data lines D1 to D10 are referred to as the gate line G and the data line D unless particularly distinguished.

A gate drive circuit 61 is connected to the gate lines G1 to G10. Further, a charge / voltage conversion amplifier 63, a multiplexer 65, and an A / D converter 67 are connected to the data lines D1 to D10 in that order. The charge / voltage conversion amplifier 63 is mounted on the amplifier circuit 15 described above, and the multiplexer 65 and the A / D converter 67 are mounted on the AD substrate 17 described above.

The gate drive circuit 61 applies a voltage to the gate line G to turn on the thin film transistor Tr and output the charge signal accumulated in the capacitor Ca from the data line D to the charge voltage conversion amplifier 63. The charge-voltage conversion amplifier 63 converts the received charge signal into a voltage signal. The multiplexer 65 outputs a plurality of voltage signals as one voltage signal. The A / D converter 67 converts the voltage signal from the multiplexer 65 into a digital signal. Among these circuits, the charge-voltage conversion amplifier 63 (amplifier circuit 15) generates a larger amount of heat than other circuits and receives a delicate charge signal from the detection element DU. It is also a required part.

Reference is now made to FIG. FIG. 4 is a side view showing an arrangement state of the external circuit.
In addition, it is preferable that the amplifier circuit 15 having a large amount of heat generation is disposed on the base plate 7 via the sponge material 71 and the heat transfer member 75 is disposed on the upper surface via the heat transfer gel material 73. The heat transfer member 75 is in contact with the lower surface of the end heat transfer member 25. The sponge material 71 is, for example, silicon resin, and suppresses heat from being transmitted to the base plate 7. The heat transfer member 75 is made of copper, for example. Since the amplifier circuit 15 is disposed on the lower surface via the sponge material 71 and disposed on the upper surface via the heat transfer member 75, the generated heat is suppressed from being transmitted to the base member 7 and the generated heat is generated. Is transmitted to the end heat transfer member 25 through the heat transfer member 75. In addition, the AD substrate 17 that generates a certain amount of heat although having a smaller amount of heat generation than the amplifier circuit 15 is preferably attached to the base plate 7 via a thin resin plate 77. The resin plate 77 is a heat insulating material such as polycarbonate.

By the way, the conversion layer 13 is attached to the active matrix substrate 11 in a mold structure. When the conversion layer 13 is at a low temperature of 0 ° C. or lower, peeling or cracking may occur due to a difference in expansion coefficient from the glass of the insulating substrate 55. There is. In the case of amorphous selenium (a-Se) at a high temperature of 40 ° C. or higher, the phenomenon of crystallization may occur and the physical properties may be altered. Therefore, it is important to make the conversion layer 13 and the active matrix substrate 11 constant in temperature. In this embodiment, as described above, the heat conductive plate 21 is provided on the base plate 7, and the central Peltier unit 29 is further provided. Therefore, by controlling the central Peltier unit 29 to absorb heat or heat, the conversion layer 13 and the active matrix substrate 11 can be kept at a constant temperature.

Further, the heat generated in the amplifier circuit 15 that generates heat is transmitted to the end heat conduction plate 25 via the heat transfer member 75 and cooled by the end Peltier unit 39. Further, although the heat generation amount is small, the heat generated in the AD substrate 17 that generates heat is transmitted to the end heat transfer member 25 and cooled by the end Peltier unit 39.

Please refer to FIG. FIG. 5 is a schematic diagram showing constant temperature / cooling.
The FPD 1 configured as described above generates an air flow as indicated by a two-dot chain line arrow in FIG. In addition, about the back side in FIG. 5, although the flow of air is abbreviate | omitted on account of illustration, the flow similar to a near side arises. In particular, since the

Peltier elements

33 and 43 are provided with

ducts

37 and 47, the outside air sucked from the intake port 51 of the cover 5 (not shown) efficiently passes through the cooling

fins

35 and 45 of the

Peltier elements

33 and 43. It is supposed to be. Thereby, the heat of the

Peltier elements

33 and 43 is efficiently discharged.

Thus, without using a refrigerant or the like, an end Peltier unit 39 is provided for an external circuit such as an amplifier circuit 15, and a central Peltier unit 29 is provided for the active matrix substrate 11 and the conversion layer 13, thereby cooling and isothermalizing. By taking charge of each, a constant temperature and cooling efficiency can be improved with a relatively simple configuration. Incidentally, the in-plane temperature deviation in the conversion layer 13 is conventionally about 5 ° C., but according to the configuration of this embodiment, it can be about 2 ° C.

Reference is now made to FIG. FIG. 6 is a side view showing a modification of the base plate.
Instead of the base plate 7 described above, a base plate 7A shown in FIG. 6 may be employed. In the base plate 7A, a stepped portion 81 is formed in the peripheral portion of the upper surface which is the other surface of the base plate 7A. The step portion 81 is formed thinner than the central portion of the base plate 7A. The amplifier circuit 15 is disposed along with the sponge material 71 at the step portion 81. However, since it is necessary to electrically connect the amplifier circuit 15 disposed in the step portion 81 and the AD substrate 17, the step between the upper surface on the center side of the base plate 7A and the step portion 81 does not become extremely large. Is preferred. Further, since the base plate 7A is screwed together with the base plate 7A in a state where the above-described members are placed, it is preferable that the base plate 7A has a stepped portion 81 that does not extremely reduce the rigidity. With this configuration, the distance between the amplifier circuit 15 and the active matrix substrate 11 can be shortened. Therefore, the length of the flexible cable 19 can be shortened, and noise reduction can be achieved.

Reference is now made to FIG. FIG. 7 is a side view showing a modification of the heat conducting plate.
The above-described heat conductive plate 21 is preferably configured like the heat conductive plate 21A of FIG. The heat conductive plate 21A is configured such that the central heat conductive plate 23 and the end heat conductive plate 25 are separable from each other. For example, a screw is inserted into a screw hole (not shown) formed in the connecting member 27 of the end heat conductive plate 25, and the end heat conductive plate 25 is fastened to the central heat conductive plate 23 with a screw. . With this configuration, it is possible to easily access the AD board 17 and the amplifier circuit 15 with only the central heat conduction plate 23 attached to the base plate 7A as shown in FIG. Therefore, adjustment and wiring connection can be easily performed, and assembly and maintenance of the FPD 1 can be easily performed.

Further, it is preferable that the end heat conductive plate 25 of the heat conductive plate 21 is configured as shown in FIG. FIG. 8 is a perspective view showing another modification of the heat conductive plate.

This heat conductive plate 21 has a notch 83 formed in the end heat conductive plate 25A. The notch 83 has an elongated shape along the end of the central heat conductive plate 23. Accordingly, the connecting member 27 is divided into two connecting members 27A. By providing such a notch 83, it is possible to easily access the AD board 17 and the amplifier circuit 15 without removing the end heat conductive plate 25A, and to easily perform maintenance and the like. be able to.

The present invention is not limited to the above embodiment, and can be modified as follows.

(1) In the above-described embodiment, the two Peltier elements 43 are provided as the first Peltier elements, and the two Peltier elements 33 are provided as the second Peltier elements. It is not limited to. That is, it is only necessary to arrange Peltier elements that can ensure in-plane uniformity and achieve sufficient cooling and constant temperature.

(2) In the embodiment described above, the FPD 1 includes the backlight 9, but the FPD 1 of the present invention does not need to include the backlight 9.

(3) In the above-described embodiment, the FPD 1 includes the active matrix substrate 11 and the conversion layer 13 on the lower surface of the base plate 7, but the FPD 1 includes the active matrix substrate 11 and the conversion layer 13 on the upper surface of the base plate 7. It may be a form provided.

As described above, the present invention is suitable for a two-dimensional image detector that detects light or radiation.

Claims

A conversion layer that converts light or radiation into a charge signal;
An accumulation / readout substrate for accumulating and reading out charge signals converted by the conversion layer;
A base plate for laminating and holding the storage / readout substrate and the conversion layer on one surface;
An external circuit electrically connected to the storage / readout substrate and disposed on the other surface of the base plate;
A heat conducting plate disposed on the other surface of the base plate in a state in which heat exchange is possible with the base plate;
A first Peltier element disposed on the heat conducting plate and disposed at a position corresponding to the external circuit;
A first duct for inducing heat generated in the first Peltier element;
A second Peltier element disposed on the heat conducting plate and disposed in a region where the external circuit is not disposed;
A second duct for inducing heat generated in the second Peltier element;
A fan for exhausting heat from the first duct and the second duct;
A two-dimensional image detector.
The two-dimensional image detector according to claim 1,
The external circuit includes a front circuit that generates a large amount of heat and a rear circuit that generates less heat than the front circuit.
The base plate includes a stepped portion having a small thickness at the periphery of the other surface,
The two-dimensional image detector, wherein the pre-stage circuit is disposed at the step portion with a heat transfer member interposed between the pre-stage circuit and the heat conduction plate.
The two-dimensional image detector according to claim 2,
The two-dimensional image detector, wherein the pre-stage circuit is disposed between the base plate via a heat insulating material.
The two-dimensional image detector according to claim 2 or 3,
The two-dimensional image detector, wherein the post-stage circuit is disposed between the base plate and a heat insulating material.
The two-dimensional image detector according to any one of claims 1 to 4,
The heat conductive plate includes a central heat conductive plate located at a central portion of the base plate and an end heat conductive plate corresponding to the position of the external circuit, and is configured to be separable from each other. A two-dimensional image detector.