WO2012014251A1 - Détecteur d'images bidimensionnelles - Google Patents
Détecteur d'images bidimensionnelles Download PDFInfo
- Publication number
- WO2012014251A1 WO2012014251A1 PCT/JP2010/004753 JP2010004753W WO2012014251A1 WO 2012014251 A1 WO2012014251 A1 WO 2012014251A1 JP 2010004753 W JP2010004753 W JP 2010004753W WO 2012014251 A1 WO2012014251 A1 WO 2012014251A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- heat
- base plate
- disposed
- dimensional image
- image detector
- Prior art date
Links
- 238000006243 chemical reaction Methods 0.000 claims abstract description 47
- 239000000758 substrate Substances 0.000 claims abstract description 41
- 239000011810 insulating material Substances 0.000 claims description 6
- 238000009825 accumulation Methods 0.000 claims description 4
- 230000005855 radiation Effects 0.000 claims description 4
- 230000001939 inductive effect Effects 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims 1
- 238000001816 cooling Methods 0.000 abstract description 30
- 239000011159 matrix material Substances 0.000 abstract description 23
- 239000000463 material Substances 0.000 description 9
- 239000003507 refrigerant Substances 0.000 description 8
- 238000001514 detection method Methods 0.000 description 6
- 238000012986 modification Methods 0.000 description 6
- 230000004048 modification Effects 0.000 description 6
- 239000010409 thin film Substances 0.000 description 6
- 239000003990 capacitor Substances 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000011669 selenium Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000020169 heat generation Effects 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- MARUHZGHZWCEQU-UHFFFAOYSA-N 5-phenyl-2h-tetrazole Chemical compound C1=CC=CC=C1C1=NNN=N1 MARUHZGHZWCEQU-UHFFFAOYSA-N 0.000 description 2
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 2
- QWUZMTJBRUASOW-UHFFFAOYSA-N cadmium tellanylidenezinc Chemical compound [Zn].[Cd].[Te] QWUZMTJBRUASOW-UHFFFAOYSA-N 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910052711 selenium Inorganic materials 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14634—Assemblies, i.e. Hybrid structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Measurement Of Radiation (AREA)
- Apparatus For Radiation Diagnosis (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
La présente invention concerne un détecteur d'images bidimensionnelles dans lequel une plaque conductrice de chaleur (21) est prévue sur une plaque de base (7), des unités Peltier d'extrémité (39) sont agencées pour l'utilisation de circuit externe, et des unités Peltier centrales (29) sont agencées pour un substrat à matrice active (11) et une couche de conversion (13), assurant le refroidissement et l'isothermalisation respectivement, permettant ainsi d'accroître l'efficacité d'isothermalisation et de refroidissement avec une structure relativement simple. En outre, l'air extérieur pénétrant à travers une prise d'air (51) dans un capot (5) traverse efficacement des ventilateurs de refroidissement (35 et 45) dans les éléments Peltier (33 et 43), éliminant ainsi efficacement la chaleur depuis lesdits éléments Peltier (33 et 43).
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2010/004753 WO2012014251A1 (fr) | 2010-07-26 | 2010-07-26 | Détecteur d'images bidimensionnelles |
| JP2012526191A JP5549731B2 (ja) | 2010-07-26 | 2010-07-26 | 二次元画像検出器 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2010/004753 WO2012014251A1 (fr) | 2010-07-26 | 2010-07-26 | Détecteur d'images bidimensionnelles |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2012014251A1 true WO2012014251A1 (fr) | 2012-02-02 |
Family
ID=45529504
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2010/004753 WO2012014251A1 (fr) | 2010-07-26 | 2010-07-26 | Détecteur d'images bidimensionnelles |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP5549731B2 (fr) |
| WO (1) | WO2012014251A1 (fr) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109893157A (zh) * | 2019-04-03 | 2019-06-18 | 河南明峰医疗科技有限公司 | 一种pet探测器散热结构 |
| JP2020110287A (ja) * | 2019-01-10 | 2020-07-27 | 株式会社日立製作所 | 放射線撮像装置 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05333157A (ja) * | 1992-05-28 | 1993-12-17 | Shimadzu Corp | 放射線検出器 |
| JP2007135708A (ja) * | 2005-11-15 | 2007-06-07 | Toshiba Corp | Ｘ線検出装置 |
| JP2009082230A (ja) * | 2007-09-27 | 2009-04-23 | Fujifilm Corp | 画像検出器及び画像撮影システム |
| WO2009118832A1 (fr) * | 2008-03-25 | 2009-10-01 | 株式会社 島津製作所 | Dispositif de saisie d'images d'un rayonnement |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02236484A (ja) * | 1989-03-10 | 1990-09-19 | Hitachi Medical Corp | 多素子放射線検出装置 |
-
2010
- 2010-07-26 JP JP2012526191A patent/JP5549731B2/ja active Active
- 2010-07-26 WO PCT/JP2010/004753 patent/WO2012014251A1/fr active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05333157A (ja) * | 1992-05-28 | 1993-12-17 | Shimadzu Corp | 放射線検出器 |
| JP2007135708A (ja) * | 2005-11-15 | 2007-06-07 | Toshiba Corp | Ｘ線検出装置 |
| JP2009082230A (ja) * | 2007-09-27 | 2009-04-23 | Fujifilm Corp | 画像検出器及び画像撮影システム |
| WO2009118832A1 (fr) * | 2008-03-25 | 2009-10-01 | 株式会社 島津製作所 | Dispositif de saisie d'images d'un rayonnement |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020110287A (ja) * | 2019-01-10 | 2020-07-27 | 株式会社日立製作所 | 放射線撮像装置 |
| JP7114495B2 (ja) | 2019-01-10 | 2022-08-08 | 富士フイルムヘルスケア株式会社 | 放射線撮像装置 |
| CN109893157A (zh) * | 2019-04-03 | 2019-06-18 | 河南明峰医疗科技有限公司 | 一种pet探测器散热结构 |
| CN109893157B (zh) * | 2019-04-03 | 2023-11-17 | 河南明峰医疗科技有限公司 | 一种pet探测器散热结构 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5549731B2 (ja) | 2014-07-16 |
| JPWO2012014251A1 (ja) | 2013-09-09 |
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