CN109863593A - 散热电路板、功率模块及制备散热电路板的方法 - Google Patents

散热电路板、功率模块及制备散热电路板的方法 Download PDF

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Publication number
CN109863593A
CN109863593A CN201680004437.XA CN201680004437A CN109863593A CN 109863593 A CN109863593 A CN 109863593A CN 201680004437 A CN201680004437 A CN 201680004437A CN 109863593 A CN109863593 A CN 109863593A
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China
Prior art keywords
conductive pattern
circuit board
cooling circuit
metal oxide
conducting layer
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CN109863593B (zh
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胡启钊
钟山
李国庆
林伟健
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Rayben Technologies Hk Ltd
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Rayben Technologies Hk Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)

Abstract

一种散热电路板、功率模块及制备散热电路板的方法，该散热电路板包括：金属氧化物基板(10)，具有相对设置的第一表面(11)和第二表面(12)；第一导电图案(21)，包括在基板(10)的厚度方向上自第一表面(11)朝向第二表面(12)延伸的第一内导电层(211)以及自第一表面(11)远离第二表面(12)延伸的第一外导电层(212)；第二导电图案(22)，形成在基板(10)的第一表面(11)侧；其中，第一导电图案(21)的厚度大于第二导电图案(22)的厚度。通过采用金属氧化物基板作为导电图案的载体、并将导电图案的一部分嵌入金属氧化物基板内部从而降低了产品体积及成本。

Description

PCT国内申请，说明书已公开。

Claims (15)

  1. PCT国内申请，权利要求书已公开。
CN201680004437.XA 2016-07-15 2016-07-15 散热电路板、功率模块及制备散热电路板的方法 Active CN109863593B (zh)

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PCT/CN2016/090102 WO2018010159A1 (zh) 2016-07-15 2016-07-15 散热电路板、功率模块及制备散热电路板的方法

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CN109863593B CN109863593B (zh) 2022-11-04

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WO (1) WO2018010159A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110859022A (zh) * 2018-08-24 2020-03-03 三赢科技（深圳）有限公司 电路板及应用该电路板的电子装置
CN113597124A (zh) * 2021-07-28 2021-11-02 恒赫鼎富(苏州)电子有限公司 一种适用于厚铜的超精细fpc线路制作工艺

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101170873A (zh) * 2006-10-27 2008-04-30 阿奇公司 电路板单元及其制造方法
US20120073863A1 (en) * 2010-09-29 2012-03-29 Samsung Electro-Mechanics Co., Ltd. Anodized heat-radiating substrate and method of manufacturing the same
CN103416109A (zh) * 2010-12-24 2013-11-27 Lg伊诺特有限公司 印刷电路板及其制造方法
CN104125710A (zh) * 2014-08-12 2014-10-29 上海航天电子通讯设备研究所 一种基于铝阳极氧化技术的基板及其制造方法
CN204680693U (zh) * 2015-06-10 2015-09-30 乐健科技（珠海）有限公司 高导热金属基板及led模组
CN105489747A (zh) * 2015-12-31 2016-04-13 乐健科技（珠海）有限公司 高导热金属基板及其制作方法、led模组及其制作方法
CN105722311A (zh) * 2015-09-22 2016-06-29 乐健集团有限公司 制备带有陶瓷散热器的刚挠结合印刷电路板的方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008010584A (ja) * 2006-06-28 2008-01-17 Ngk Spark Plug Co Ltd 複合基板
US20140251658A1 (en) * 2013-03-07 2014-09-11 Bridge Semiconductor Corporation Thermally enhanced wiring board with built-in heat sink and build-up circuitry

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101170873A (zh) * 2006-10-27 2008-04-30 阿奇公司 电路板单元及其制造方法
US20120073863A1 (en) * 2010-09-29 2012-03-29 Samsung Electro-Mechanics Co., Ltd. Anodized heat-radiating substrate and method of manufacturing the same
CN103416109A (zh) * 2010-12-24 2013-11-27 Lg伊诺特有限公司 印刷电路板及其制造方法
CN104125710A (zh) * 2014-08-12 2014-10-29 上海航天电子通讯设备研究所 一种基于铝阳极氧化技术的基板及其制造方法
CN204680693U (zh) * 2015-06-10 2015-09-30 乐健科技（珠海）有限公司 高导热金属基板及led模组
CN105722311A (zh) * 2015-09-22 2016-06-29 乐健集团有限公司 制备带有陶瓷散热器的刚挠结合印刷电路板的方法
CN105489747A (zh) * 2015-12-31 2016-04-13 乐健科技（珠海）有限公司 高导热金属基板及其制作方法、led模组及其制作方法

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CN109863593B (zh) 2022-11-04
WO2018010159A1 (zh) 2018-01-18

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