CN109863593A - Cooling circuit board, power module and the method for preparing cooling circuit board - Google Patents
Cooling circuit board, power module and the method for preparing cooling circuit board Download PDFInfo
- Publication number
- CN109863593A CN109863593A CN201680004437.XA CN201680004437A CN109863593A CN 109863593 A CN109863593 A CN 109863593A CN 201680004437 A CN201680004437 A CN 201680004437A CN 109863593 A CN109863593 A CN 109863593A
- Authority
- CN
- China
- Prior art keywords
- conductive pattern
- circuit board
- cooling circuit
- metal oxide
- conducting layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
Abstract
A kind of cooling circuit board, power module and the method for preparing cooling circuit board, the cooling circuit board include: metal oxide substrate (10), have the first surface (11) and second surface (12) being oppositely arranged；The first outer conducting layer (212) that first conductive pattern (21) includes the first inner conducting layer (211) extended on the thickness direction of substrate (10) from first surface (11) towards second surface (12) and is extended from first surface (11) far from second surface (12)；Second conductive pattern (22) is formed in first surface (11) side of substrate (10)；Wherein, the thickness of the first conductive pattern (21) is greater than the thickness of the second conductive pattern (22).By using metal oxide substrate as the carrier of conductive pattern and by a part insertion metal oxide substrate inside of conductive pattern to reduce small product size and cost.
Description
The present invention relates to a kind of cooling circuit board, power module and the methods for preparing cooling circuit board, more particularly, to a kind of using metal oxide substrate as cooling circuit board, the power module including the cooling circuit board and the method for preparing the cooling circuit board of electrical isolation carrier.
With the fast development in the high current product market of EV (electric car), HEV (hybrid vehicle) and frequency converter etc., high power, high current output, the high power component to radiate, such as IGBT (insulated gate bipolar transistor) etc., become the focus of technological development.Currently, the needs of in order to meet high current and high heat dissipation, be typically employed in the cooling circuit board that aluminium nitride ceramics surface forms conductive pattern, but this cooling circuit board there are still it is at high cost, be difficult to realize many deficiencies such as miniaturization, there are further improved necessity.
Summary of the invention
The first aspect of the present invention provides a kind of cooling circuit board, comprising:
Metal oxide substrate has the first surface and second surface being oppositely arranged；
First conductive pattern, including the first inner conducting layer extended on the thickness direction of metal oxide substrate from first surface towards second surface and the first outer conducting layer extended from first surface far from second surface；
Second conductive pattern is formed in the first surface side of metal oxide substrate；
Wherein, the thickness of the first conductive pattern is greater than the thickness of the second conductive pattern.
In the present invention, firstly, since using metal oxide substrate as electrical isolation carrier, thus dissipate
Cost is relatively low for heater circuit plate, and has good heat dissipation performance；Secondly, cooling circuit board the first conductive pattern with different thickness and the second conductive pattern, wherein the first thicker conductive pattern is for loading biggish electric current, the second relatively thin conductive pattern has considerable flexibility for loading lesser electric current, thus in load current design and conducting wire thickness design；In addition, the first inner conducting layer in the first thicker conductive pattern is embedded in metal oxide substrate, allow the first conductive pattern using relatively narrow line width, and reduce the thickness of the first outer conductive pattern, to promote the miniaturization of cooling circuit board.
A kind of specific embodiment according to the present invention, above-mentioned metal be can anodized metallization, such as titanium, magnesium, aluminum or aluminum alloy, especially aluminum or aluminum alloy.Metal oxide substrate can be prepared and the metal substrate to such as aluminum or aluminum alloy substrate carries out selective anodic oxidation, this has the advantages that be relatively low cost and easy to preparation.
Another specific embodiment according to the present invention, metal oxide substrate by can the metal substrate of anodic oxidation carry out selective anodized and be prepared, the not oxidized part of metal substrate forms the first inner conducting layer.In this embodiment, it further reduced the preparation cost of cooling circuit board and the not oxidized part of metal substrate is formed as the first inner conducting layer.
The first inner conducting layer is completely covered in another specific embodiment according to the present invention, the first outer conducting layer.Thus, it is possible to protect using the first outer conducting layer to the first inner conducting layer, and the line width of the first conductive pattern is reduced, further to promote the miniaturization of cooling circuit board.
Another specific embodiment according to the present invention, the second above-mentioned conductive pattern include the second inner conducting layer extended on the thickness direction of substrate from first surface towards second surface and the second outer conducting layer for extending from first surface far from second surface.Wherein, the thickness of the second inner conducting layer less than the first inner conducting layer thickness, and the thickness of the second outer conducting layer be equal to the first outer conducting layer thickness.
Preferably, the second inner conducting layer is similarly the not oxidized part in metal substrate and is formed, and the second inner conducting layer is completely covered in the second outer conducting layer.
The outer surface of another specific embodiment according to the present invention, the first conductive pattern and the second conductive pattern is substantially concordant.In this embodiment, the first conductive pattern of different line thicknesses and the outer surface of the second conductive pattern are substantially concordant, consequently facilitating to the installation or encapsulation of various elements during preparing power module.
Metal oxide substrate is at least partly run through in another specific embodiment according to the present invention, the region that power component installation position (its quantity can be one or more as needed) is corresponded in the first inner conducting layer.Preferably, the region in the first inner conducting layer corresponding to power component installation position extends completely through metal oxide substrate；It is highly preferred that the first inner conducting layer extends completely through metal oxide substrate.Such to be advantageous in that, the first inner conducting layer forms the thermally conductive pathways through metal oxide substrate on the thickness direction of cooling circuit board, to improve the heat dissipation performance of cooling circuit board.
Preferably, above-mentioned cooling circuit board further comprises:
Resin insulating barrier is formed in the second surface side of metal oxide substrate；
Ceramic heat-dissipating body runs through resin insulating barrier, and is thermally connected with the part for running through metal oxide substrate in the first inner conducting layer of corresponding power component installation position；
Third conductive pattern and/or thermal diffusion layer for increasing ceramic heat-dissipating body heat dissipation area, are formed in the surface side of resin insulating barrier and ceramic heat-dissipating body far from metal oxide substrate.
In above-mentioned technical proposal, the thickness of metal oxide substrate is preferably controlled to 50 microns to 300 microns, and more preferably control is 80 microns to 250 microns.
In above-mentioned technical proposal, firstly, resin insulating barrier can provide preferable mechanical support for metal oxide substrate, to improve the mechanical strength of cooling circuit board；Secondly, the heat in the first inner conducting layer can be conducted through ceramic heat-dissipating body to the biggish third conductive pattern of area and/or thermal diffusion layer, so that cooling circuit board has the heat dissipation performance further enhanced.
In the present invention, it also may include other metal layers except layers of copper that the first outer conducting layer and the second outer conducting layer, which can only include layers of copper,.For example, the first outer conducting layer and the second outer conducting layer include difference
The intermediate metal layer (such as titanium, chromium or cobalt layers) being formed on the first inner conducting layer and the second inner conducting layer, the layers of copper on metal layer formed between, and the nickel layer and/or layer gold that are formed in layers of copper.
Another aspect provides a kind of power modules comprising any one cooling circuit board as described above and the power component being arranged on the cooling circuit board.Wherein, which can be arranged directly on the cooling circuit board, can also be to be arranged on the cooling circuit board indirectly after encapsulated by packaging body.The power component can be the various power components of LED (light emitting diode), thyristor, GTO (gate level turn-off thyristor), GTR (power transistor), MOSFET (electric power field effect transistor), IGBT (insulated gate bipolar transistor) and Power Diode Pumped etc..
Another aspect of the invention additionally provides a kind of method for preparing cooling circuit board comprising following steps:
(1) provide can anodic oxidation metal substrate, which has the first surface and second surface that are oppositely arranged；
(2) selective anodized is carried out to the metal substrate, to be wherein embedded with the metal oxide substrate of interior conductive pattern；Wherein, which extends from the first surface of metal oxide substrate to second surface；
(3) the metal layer of conductive pattern at least covering is formed in the first surface of metal oxide substrate；
(4) etching process is patterned to the metal layer, to obtain being formed on the first surface and cover the outer conductive pattern of interior conductive pattern.
In above-mentioned technical proposal, on the one hand, the metal oxide substrate of interior conductive pattern is wherein embedded with and carrying out selective anodized to metal substrate, thus cost is relatively low for cooling circuit board, and has good heat dissipation performance；Secondly, allowing outer conductive pattern using relatively narrow line width and thickness, to promote the miniaturization of cooling circuit board in interior conductive pattern insertion metal oxide substrate；In addition, the technical barrier that different-thickness route in the prior art is unable to co-planar designs is breached, consequently facilitating preparing power module since the surface of obtained outer conductive pattern is substantially concordant
During installation or encapsulation to various elements.
A kind of specific embodiment according to the present invention, above-mentioned metal substrate are aluminum substrate or aluminium alloy base plate.As other selectable embodiments, above-mentioned metal substrate can also be that other can anodized metal substrate such as titanium-base and magnesium substrate.
Another specific embodiment according to the present invention, above-mentioned interior conductive pattern includes conductive pattern in conductive pattern and second in first, and the thickness of conductive pattern is greater than the thickness of conductive pattern in second in first.In this embodiment, due to conductive pattern in conductive pattern and second in obtained cooling circuit board with different thickness first, wherein in thicker first conductive pattern for loading biggish electric current, conductive pattern has more preferably flexibility for loading lesser electric current, thus in load current design and conducting wire thickness design in relatively thin second.
Metal oxide substrate is at least partly run through in another specific embodiment according to the present invention, the region that power component installation position is corresponded in above-mentioned interior conductive pattern.Preferably, the region in interior conductive pattern corresponding to power component installation position extends completely through metal oxide substrate；It is highly preferred that interior conductive pattern extends completely through metal oxide substrate.Such to be advantageous in that, interior conductive pattern forms the thermally conductive pathways through metal oxide substrate on the thickness direction of cooling circuit board, to improve the heat dissipation performance of cooling circuit board.
The above method further comprises following steps as a preferred implementation manner:
(5) radiator is provided, which includes ceramic heat-dissipating body and the metal layer for being formed in two apparent surface of ceramic heat-dissipating body；
(6) the metal layer on a surface being formed in two apparent surface of ceramic heat-dissipating body is made to be thermally coupled to the part for running through metal oxide substrate in the interior conductive pattern of corresponding power component installation position；
(7) resin insulating barrier is formed in the second surface side of metal oxide substrate, and make surface of the resin insulating barrier with radiator far from metal oxide substrate substantially concordant；
Resin insulating barrier and radiator far from the surface of metal oxide substrate prepare conductive pattern and/
Or the thermal diffusion layer of the heat dissipation area for increasing radiator.
In above-mentioned technical proposal, firstly, resin insulating barrier can provide preferable mechanical support for metal oxide substrate, to improve the mechanical strength of cooling circuit board；Secondly, heat in interior conductive pattern can be conducted through radiator to the conductive pattern and/or thermal diffusion layer for being formed in the surface of resin insulating barrier and radiator far from metal oxide substrate, the conductive pattern and/or thermal diffusion layer can increase the heat dissipation area of cooling circuit board, so that cooling circuit board has the heat dissipation performance further enhanced.
It is highly preferred that step (7) in, resin insulating barrier is formed with metal foil on its surface far from metal oxide substrate.Such benefit is, step (8) in the thermal diffusion layer of the uniform and easily controllable conductive pattern of thickness and/or the heat dissipation area for increasing radiator can be relatively easily prepared far from the surface of metal oxide substrate in resin insulating barrier and radiator.
It should be noted that, " conductive pattern " and " conductive layer " in the present invention means it with conducting function but is not excluded for it with other function (such as heat dissipation), and might not have electric current process in the partial region of conductive pattern and conductive layer in practical applications.That is, partial region in conductive pattern and conductive layer may be what no electric current passed through in practical applications, and the partial region in conductive pattern and conductive layer is applied not only to transmission electric current in practical applications, but also is used as thermally conductive pathways and realizes the transmitting of heat.
In order to more clearly illustrate the objectives, technical solutions, and advantages of the present invention, the present invention is described in further detail with reference to the accompanying drawings and detailed description.
Fig. 1-4 is the schematic diagram for indicating the preparation flow of cooling circuit board embodiment 1 of the present invention；
Fig. 5 is the structural schematic diagram of cooling circuit board embodiment 1 of the present invention；
Fig. 6 is the structural schematic diagram of cooling circuit board embodiment 2 of the present invention；
Fig. 7-8 indicates metal oxide substrate preparation process in cooling circuit board embodiment 3 of the present invention
Schematic diagram；
Fig. 9 is the structural schematic diagram of cooling circuit board embodiment 3 of the present invention；
Figure 10-13 is the schematic diagram for indicating the preparation flow of cooling circuit board embodiment 4 of the present invention；
Figure 14 is the structural schematic diagram of cooling circuit board embodiment 4 of the present invention；
Figure 15 is the structural schematic diagram of power module embodiment of the present invention.
Cooling circuit board and preparation method thereof embodiment 1
Fig. 5 is the structural schematic diagram of cooling circuit board embodiment 1 of the present invention.As shown in figure 5, the cooling circuit board of the present embodiment includes metal oxide substrate 10, the first conductive pattern 21 and the second conductive pattern 22.Wherein, metal oxide substrate 10 has the first surface 11 and second surface 12 being oppositely arranged；First conductive pattern 21 includes the first inner conducting layer 211 extended on the thickness direction of metal oxide substrate 10 from first surface 11 towards second surface 12 and the first outer conducting layer 212 for extending from first surface 11 far from second surface 12；Second conductive pattern 22 is formed on the first surface 11 of metal oxide substrate 10, and its thickness is substantially equal to the thickness of the first outer conducting layer 212.
Fig. 1-4 shows the preparation flow of cooling circuit board embodiment 1.As shown in Figure 1; first; there is provided can anodic oxidation metal substrate 1 (such as aluminum substrate); and the patterned anode oxide protective layer 100B adaptable with the pattern with the first inner conducting layer 211 is formed on its first surface 11, the anodic oxidation protective layer 100A for completely covering second surface 12 is formed on its second surface 12.Wherein, the thickness of metal substrate 1 can be 50 microns to 300 microns, preferably 100 microns to 200 microns.
Then as shown in Fig. 2, carrying out selective anodic oxidation to the metal substrate 1 for forming matcoveredn 100A and 100B.The oxidation process occurs from the first surface 11 of metal substrate 1 first, so that the part that unprotected layer 100B is covered is oxidizing to predetermined thickness, forms oxide regions 1A and non-oxide region 1B.
Then as shown in Figure 3; it removes the protective layer 100A of second surface 12 but retains the protective layer 100B of first surface; to carry out oxidation processes to metal substrate 1 from second surface 12, so that metal substrate 1 is changed into the metal oxide substrate 10 for being embedded with interior conductive pattern 211 (or first inner conducting layer 211).Wherein, interior conductive pattern 211 (or first inner conducting layer 211) extends on the thickness direction of metal oxide substrate 10 from first surface 11 towards second surface 12, but does not run through metal oxide substrate 10.
Then as shown in Figure 4, metal layer 20 is formed in the first surface 11 of metal oxide substrate 10, wherein, metal layer 20 can be formed as follows: such as intermediate metal layer of titanium, chromium or cobalt being formed by PVD process in the first surface 11 of metal oxide substrate 10 first, the thickness of the intermediate metal layer can be 20 nanometers to 200 nanometers, preferably 50 nanometers to 150 nanometers；Bottom layers of copper is then formed by PVD process on the intermediate metal layer, the thickness of the bottom layers of copper can be 0.2 micron to 2 microns, preferably 0.5 micron to 1.5 microns；Form the thickening layers of copper of predetermined thickness in the bottom layers of copper finally by plating mode, the thickness of the thickening layers of copper can be 35 microns to 350 microns, such as about 210 microns.
Later, patterned etching process is carried out to metal layer 20, to form the outer conductive pattern for including the first outer conducting layer 212 and the second conductive pattern 22, to obtain cooling circuit board embodiment 1 as shown in Figure 5.Wherein, the first outer conducting layer 212 is formed as the pattern being adapted with the first inner conducting layer 211, and the first inner conducting layer 211 (or interior conductive pattern 211) is completely covered.
Cooling circuit board embodiment 2
Fig. 6 is the structural schematic diagram of cooling circuit board embodiment 2.As shown in Figure 6, the cooling circuit board of the present embodiment includes the metal oxide substrate 110 with the first surface 111 and second surface 112 being oppositely arranged, and the first conductive pattern 121 includes the first outer conducting layer 1212 for extending to the first inner conducting layer 1211 of second surface 112 (i.e. through metal oxide substrate 110) from first surface 111 on the thickness direction of metal oxide substrate 110 and extending from first surface 111 far from second surface 112；Second conductive pattern 122 is formed on the first surface 111 of metal oxide substrate 10.Wherein,
The first inner conducting layer 1211 is completely covered in one outer conducting layer 1212, and has the thickness being essentially equal with the second conductive pattern 122.
In addition, in this embodiment, the first inner conducting layer 1211 constitutes interior conductive pattern, the first outer conducting layer 1212 and the second conductive pattern 122 constitute outer conductive pattern.
Cooling circuit board embodiment 3
Fig. 9 is the structural schematic diagram of cooling circuit board embodiment 3.As shown in Figure 9, the cooling circuit board of the present embodiment includes the metal oxide substrate 200 with the first surface 201 and second surface 202 being oppositely arranged, and the first conductive pattern 221 includes the first outer conducting layer 2212 for extending to the first inner conducting layer 2211 of second surface 202 (i.e. through metal oxide substrate 200) from first surface 201 on the thickness direction of metal oxide substrate 200 and extending from first surface 201 far from second surface 202；Second conductive pattern 222 includes the second inner conducting layer 2221 extended on the thickness direction of metal oxide substrate 200 from first surface 201 towards second surface 202 and the second outer conducting layer 2222 for extending from first surface 201 far from second surface 202.Wherein, for the thickness of the second inner conducting layer 2221 less than the thickness of the first inner conducting layer 2211, the thickness of the second outer conducting layer 2222 is equal to the thickness of the first outer conducting layer 2212.
In addition, in this embodiment, first inner conducting layer (conductive pattern in first) 2211 and the second inner conducting layer (conductive pattern in second) 2221 constitute interior conductive pattern, and the first outer conducting layer 2212 and the second outer conducting layer 2222 constitute outer conductive pattern.
Fig. 7-8 is the schematic diagram for indicating 200 preparation process of metal oxide substrate in cooling circuit board embodiment 3.It is shown in Figure 7; first; there is provided can anodic oxidation metal substrate 1 (such as aluminum substrate); and the anodic oxidation protective layer 100A for being formed on its second surface 202 with the patterned anode oxide protective layer 100B being adapted with the pattern of the first inner conducting layer 2211 and the second inner conducting layer 2221 and completely covering second surface 202 is formed on its first surface 201；Then, selective anodic oxidation is carried out to the metal substrate 1 for forming matcoveredn 100A and 100B, the oxidation process is first from first
Surface 201 carries out, so that the part that unprotected layer 100B is covered is oxidizing to predetermined thickness.
Then as shown in Figure 8; so that the protective layer 100A of second surface 202 forms the protection pattern 100A ' adaptable with the pattern of the first inner conducting layer 2211; and oxidation processes are carried out to metal substrate 1 from second surface 202, so that metal substrate 1, which is changed into, is embedded with the metal oxide substrate 200 including the interior conductive pattern of conductive pattern 2221 (or second inner conducting layer 2221) in conductive pattern 2211 (or first inner conducting layer 2211) and second in first.
Then, referring to step as shown in Figure 4, metal layer is formed in the first surface 201 of metal oxide substrate 200, and patterned etching process is carried out to the metal layer, to form the outer conductive pattern for including the first outer conducting layer 2212 and the second outer conducting layer 2222, to obtain cooling circuit board embodiment 3 as shown in Figure 9.Wherein, the first inner conducting layer 2211 is completely covered in the first outer conducting layer 2212, and the second inner conducting layer 2221 is completely covered in the second outer conducting layer 2222.
Cooling circuit board embodiment 4
Figure 14 is the structural schematic diagram of cooling circuit board embodiment 4.As shown in figure 14, the cooling circuit board of the present embodiment further comprises on the basis of cooling circuit board embodiment 3: resin insulating barrier 40 and 52 is formed in the second surface side of metal oxide substrate 200；Multiple ceramic heat-dissipating bodies 31 are thermally connected and run through respectively resin insulating barrier 40 and 52 with the region for corresponding to power component installation position 2210 in the first inner conducting layer 2211 and are thermally connected with the first inner conducting layer 2211 of neighbouring power component installation position 2210；Third conductive pattern 61 is formed in surface of the resin insulating barrier 52 far from metal oxide substrate 200；For increasing the thermal diffusion layer 62 of 31 heat dissipation area of ceramic heat-dissipating body, it is attached to the surface of ceramic heat-dissipating body 31 and resin insulating barrier 52 far from metal oxide substrate 200.
Correspondingly, metal oxide substrate 200 as shown in Figure 10 is prepared according to method described in embodiment 3, and radiator 30 is provided, and radiator 30 includes ceramic heat-dissipating body 31 and the metal layer 32 for being respectively formed at 31 liang of apparent surfaces of ceramic heat-dissipating body.
Referring next to Figure 11,31 liang of apparent surfaces of ceramic heat-dissipating body will be formed in by welding material 33
In a surface on metal layer 32 be soldered to the first inner conducting layer 2211 so that multiple radiators 30 are thermally connected with the region for corresponding to power component installation position 2210 in the first inner conducting layer 2211 and with the first inner conducting layer 2211 of neighbouring power component installation position 2210 respectively.In addition, as shown in figure 11, providing the prepreg 40 with through-hole 41 and the FR4 plate 50 with through-hole 51, FR4 plate 50 includes the copper foil layer 53 positioned at the resin medium layer 52 of inside and positioned at outside, and through-hole 41 and through-hole 51 allow radiator 30 to pass through respectively.Wherein, the quantity of prepreg 40 can be one or more layers as needed.
Then, simultaneously hot pressing metal oxide substrate 200, prepreg 40 and FR4 plate 50 is laminated, and for example, by grinding technics removal hot pressing to overflow to the solidified resin on 32 surface of copper foil layer 53 and metal layer, and make the surface of the two substantially concordant, to obtain cooling circuit board as shown in figure 12.In other embodiments of the invention, resin insulating barrier can also be formed in the second surface side of metal oxide substrate 200 by the method for mold injection, and the resin insulating barrier is ground for example, by grinding technics, so that surface of the resin insulating barrier with radiator far from metal oxide substrate is substantially concordant.
Referring next to shown in Figure 13, metal layer 220 is formed in the first surface side of cooling circuit board, second surface side forms metal layer 60.Wherein, metal layer 220 and metal layer 60 can have same or different thickness, and can prepare metal layer 220 according to the method for metal layer 20 is prepared in cooling circuit board preparation method embodiment 1.Furthermore it is possible to prepare metal layer 60 in accordance with the following steps: firstly, preparing bottom layers of copper by the method for electroless copper plating in the second surface side of cooling circuit board, the thickness of the bottom layers of copper can be 0.2 micron to 2 microns, preferably 0.5 micron to 1.5 microns；Then the thickening layers of copper for forming predetermined thickness in the bottom layers of copper by plating mode, to obtain metal layer 60.
Later, image conversion etching process is carried out to metal layer 220, to obtain the first outer conducting layer 2212 of the first inner conducting layer 2211 of covering, covers the second outer conducting layer 2222 of the second inner conducting layer 2221；Etching process is patterned to metal layer 60, copper foil layer 53 (and metal layer 32 far from metal oxide substrate 200), to obtain third conductive pattern 61 and thermal diffusion layer 62.It, can be in the present embodiment
Third conductive pattern 61 is electrically connected with the first conductive pattern 221 or the second conductive pattern 222 by those skilled in the art's conventional fashion (such as passing through conductive via).Through the above steps, cooling circuit board embodiment 4 shown in Figure 14 is obtained.
Power module embodiment
Figure 15 is the structural schematic diagram of power module embodiment of the present invention.As shown in figure 15, the power module is an IGBT module, including above-mentioned cooling circuit board embodiment 4, two igbt chips 71 being arranged on the power component installation position 2210 of the cooling circuit board, the first electronic building brick 72 and the second electronic building brick 73 being electrically connected with the second conductive pattern 222, first electronic building brick is, for example, capacitor or resistance, and the second electronic building brick is, for example, IC (integrated circuit) component.
Although the present invention is disclosed above in the preferred embodiment, above-mentioned preferred embodiment is not intended to limit the invention the range of implementation.Any those skilled in the art are not departing from invention scope of the invention, improve when can make a little, i.e., all same improvement done according to the present invention should be the scope of the present invention and be covered.
Claims (15)
- A kind of cooling circuit board, comprising:Metal oxide substrate has the first surface and second surface being oppositely arranged；First conductive pattern, including the first inner conducting layer extended on the thickness direction of the substrate from the first surface towards the second surface and the first outer conducting layer extended from the first surface far from the second surface；Second conductive pattern is formed in the first surface side of the substrate；Wherein, the thickness of first conductive pattern is greater than the thickness of second conductive pattern.
- Cooling circuit board as described in claim 1, wherein the metal is can anodized metallization, especially aluminum or aluminum alloy.
- Cooling circuit board as described in claim 1, wherein the metal oxide substrate by can the metal substrate of anodic oxidation carry out selective anodized and be prepared, the not oxidized part of the metal substrate forms first inner conducting layer.
- Cooling circuit board as described in claim 1, wherein first inner conducting layer is completely covered in first outer conducting layer.
- Cooling circuit board as described in claim 1, wherein, second conductive pattern includes the second inner conducting layer extended on the thickness direction of the substrate from the first surface towards the second surface and the second outer conducting layer for extending from the first surface far from the second surface；And wherein, the thickness of second inner conducting layer is less than the thickness of first inner conducting layer, and the thickness of second outer conducting layer is equal to the thickness of first outer conducting layer.
- Cooling circuit board as described in claim 1, wherein first conductive pattern and the outer surface of second conductive pattern are substantially concordant.
- Cooling circuit board as described in claim 1, wherein the metal oxide substrate is at least partly run through in the region in first inner conducting layer corresponding to power component installation position.
- Cooling circuit board as claimed in claim 7 further comprises:Resin insulating barrier is formed in the second surface side of the metal oxide substrate；Ceramic heat-dissipating body runs through the resin insulating barrier, and is thermally connected with the part for running through the metal oxide substrate in the first inner conducting layer of the corresponding power component installation position；Third conductive pattern and/or thermal diffusion layer for increasing ceramic heat-dissipating body heat dissipation area, are formed in the resin insulating barrier and the surface side of the ceramic heat-dissipating body far from the metal oxide substrate.
- A kind of power module, including cooling circuit board as claimed in any one of claims 1 to 8 and the power component being arranged on the cooling circuit board.
- A method of cooling circuit board is prepared, is included the following steps:(1) provide can anodic oxidation metal substrate, the metal substrate has the first surface and second surface that are oppositely arranged；(2) the anodized of selectivity is carried out to the metal substrate, to be wherein embedded with the metal oxide substrate of interior conductive pattern；Wherein, the interior conductive pattern extends from the first surface to the second surface；(3) the metal layer of the interior conductive pattern is at least covered in the first surface formation of the metal oxide substrate；(4) etching process is patterned to the metal layer, to obtain being formed on the first surface and cover the outer conductive pattern of the interior conductive pattern.
- Method as claimed in claim 10, wherein the metal substrate is aluminum or aluminum alloy substrate.
- Method as claimed in claim 10, wherein the interior conductive pattern includes leading in first Conductive pattern in electrical pattern and second, and the thickness of conductive pattern is greater than the thickness of conductive pattern in described second in described first.
- Method as claimed in claim 10, wherein the metal oxide substrate is at least partly run through in the region in the interior conductive pattern corresponding to power component installation position.
- Method as claimed in claim 13, further comprises following steps:(5) radiator is provided, and the radiator includes ceramic heat-dissipating body and the metal layer for being respectively formed at two apparent surface of ceramic heat-dissipating body；(6) the metal layer on a surface being formed in two apparent surface of ceramic heat-dissipating body is made to be thermally coupled to the part for running through the metal oxide substrate in the interior conductive pattern of the corresponding power component installation position；(7) resin insulating barrier is formed in the second surface side of the metal oxide substrate, and make surface of the resin insulating barrier with radiator far from the metal oxide substrate substantially concordant；(8) conductive pattern is prepared and/or the thermal diffusion layer for increasing the radiator heat-dissipation area far from the surface of the metal oxide substrate in the resin insulating barrier and radiator.
- Method as claimed in claim 14, wherein the resin insulating barrier is formed with metal foil on its surface far from the metal oxide substrate.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2016/090102 WO2018010159A1 (en) | 2016-07-15 | 2016-07-15 | Heat radiation circuit board, power module, and preparation method for the heat radiation circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109863593A true CN109863593A (en) | 2019-06-07 |
| CN109863593B CN109863593B (en) | 2022-11-04 |
Family
ID=60951599
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201680004437.XA Active CN109863593B (en) | 2016-07-15 | 2016-07-15 | Heat dissipation circuit board, power module and method for preparing heat dissipation circuit board |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN109863593B (en) |
| WO (1) | WO2018010159A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110859022A (en) * | 2018-08-24 | 2020-03-03 | 三赢科技（深圳）有限公司 | Circuit board and electronic device using same |
| CN113597124A (en) * | 2021-07-28 | 2021-11-02 | 恒赫鼎富(苏州)电子有限公司 | Hyperfine FPC circuit manufacturing process suitable for thick copper |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101170873A (en) * | 2006-10-27 | 2008-04-30 | 阿奇公司 | Circuit board unit and method for production thereof |
| US20120073863A1 (en) * | 2010-09-29 | 2012-03-29 | Samsung Electro-Mechanics Co., Ltd. | Anodized heat-radiating substrate and method of manufacturing the same |
| CN103416109A (en) * | 2010-12-24 | 2013-11-27 | Lg伊诺特有限公司 | Printed circuit board and method for manufacturing the same |
| CN104125710A (en) * | 2014-08-12 | 2014-10-29 | 上海航天电子通讯设备研究所 | Base plate based on aluminum anodizing technology and manufacture method thereof |
| CN204680693U (en) * | 2015-06-10 | 2015-09-30 | 乐健科技（珠海）有限公司 | High-thermal conductive metal base plate and LED module |
| CN105489747A (en) * | 2015-12-31 | 2016-04-13 | 乐健科技（珠海）有限公司 | High-thermal conductivity metal substrate and fabrication method thereof, LED module and fabrication method of LED module |
| CN105722311A (en) * | 2015-09-22 | 2016-06-29 | 乐健集团有限公司 | Method for preparing rigidity-flexibility combined printed circuit board with ceramic radiator |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008010584A (en) * | 2006-06-28 | 2008-01-17 | Ngk Spark Plug Co Ltd | Composite substrate |
| US20140251658A1 (en) * | 2013-03-07 | 2014-09-11 | Bridge Semiconductor Corporation | Thermally enhanced wiring board with built-in heat sink and build-up circuitry |
-
2016
- 2016-07-15 CN CN201680004437.XA patent/CN109863593B/en active Active
- 2016-07-15 WO PCT/CN2016/090102 patent/WO2018010159A1/en active Application Filing
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101170873A (en) * | 2006-10-27 | 2008-04-30 | 阿奇公司 | Circuit board unit and method for production thereof |
| US20120073863A1 (en) * | 2010-09-29 | 2012-03-29 | Samsung Electro-Mechanics Co., Ltd. | Anodized heat-radiating substrate and method of manufacturing the same |
| CN103416109A (en) * | 2010-12-24 | 2013-11-27 | Lg伊诺特有限公司 | Printed circuit board and method for manufacturing the same |
| CN104125710A (en) * | 2014-08-12 | 2014-10-29 | 上海航天电子通讯设备研究所 | Base plate based on aluminum anodizing technology and manufacture method thereof |
| CN204680693U (en) * | 2015-06-10 | 2015-09-30 | 乐健科技（珠海）有限公司 | High-thermal conductive metal base plate and LED module |
| CN105722311A (en) * | 2015-09-22 | 2016-06-29 | 乐健集团有限公司 | Method for preparing rigidity-flexibility combined printed circuit board with ceramic radiator |
| CN105489747A (en) * | 2015-12-31 | 2016-04-13 | 乐健科技（珠海）有限公司 | High-thermal conductivity metal substrate and fabrication method thereof, LED module and fabrication method of LED module |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109863593B (en) | 2022-11-04 |
| WO2018010159A1 (en) | 2018-01-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108133915B (en) | Power module with built-in power device and double-sided heat dissipation function and manufacturing method thereof | |
| US11862533B2 (en) | Fluid-cooled package having shielding layer | |
| US8569890B2 (en) | Power semiconductor device module | |
| JP6386746B2 (en) | Semiconductor device | |
| US8431445B2 (en) | Multi-component power structures and methods for forming the same | |
| US20160343636A1 (en) | Waterproof Electronic Device and Manufacturing Method Thereof | |
| JP2009536458A (en) | Semiconductor module and manufacturing method thereof | |
| US20150108531A1 (en) | Method of producing a component carrier, an electronic arrangement and a radiation arrangement, and component carrier, electronic arrangement and radiation arrangement | |
| US9230889B2 (en) | Chip arrangement with low temperature co-fired ceramic and a method for forming a chip arrangement with low temperature co-fired ceramic | |
| JP2002315358A (en) | Inverter device | |
| US20020001177A1 (en) | Power module having electronic power components, and a method of manufacturing such a module | |
| WO2019244623A1 (en) | Electrical power assembly, power module, method for manufacturing power module and electrical power assembly | |
| CN109863593A (en) | Cooling circuit board, power module and the method for preparing cooling circuit board | |
| US20190051586A1 (en) | Power module and power conversion system including same | |
| JP5175320B2 (en) | Heat dissipation board and manufacturing method thereof | |
| CN102710102A (en) | Liquid-cooled insulated gate bipolar transistor (IGBT) converter and manufacturing method | |
| CN111276447A (en) | Double-side cooling power module and manufacturing method thereof | |
| JP2012004527A (en) | Heat-radiating substrate and method of manufacturing the same | |
| US10083917B1 (en) | Power electronics assemblies and vehicles incorporating the same | |
| US9299633B2 (en) | Semiconductor device, heat radiation member, and manufacturing method for semiconductor device | |
| JP7018756B2 (en) | Power module board and power module | |
| JP2007096252A (en) | Liquid-cooling circuit substrate and liquid cooling electronic device | |
| CN107734838B (en) | PCB capable of fast radiating | |
| JP3829641B2 (en) | Power semiconductor module | |
| JP7221401B2 (en) | Electric circuit board and power module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |