CN109764265A - Integrated flip-over type COB driving - Google Patents
Integrated flip-over type COB driving Download PDFInfo
- Publication number
- CN109764265A CN109764265A CN201910033509.9A CN201910033509A CN109764265A CN 109764265 A CN109764265 A CN 109764265A CN 201910033509 A CN201910033509 A CN 201910033509A CN 109764265 A CN109764265 A CN 109764265A
- Authority
- CN
- China
- Prior art keywords
- driving plate
- driving
- cob
- flip
- over type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
The invention discloses integrated flip-over type COB drivings, including driving plate, the upper center outer surface of the driving plate is fixedly connected with driving aluminum substrate center, the upper end outer surface at the driving aluminum substrate center is fixedly installed with COB lamp bead, two side external surface of upper end of the driving plate offers mounting hole, one side external surface of upper end of the driving plate is fixedly installed with SMD patch, another side external surface in the upper end of the driving plate is fixedly connected with chip, the center outer surface at the driving aluminum substrate center is provided with electronic unit, the upper end outer surface of the driving plate is fixedly connected with, upside-down mounting is driven by COB, effectively reduce the various faults of manual operation, improve the service life of driving plate and lamps and lanterns, visual angle is big and easily adjusts, reduce out the loss of anaclasis, improve life of product, reduce product maintenance cost, it can Corresponding equipment is saved, manufacturing equipment input cost is lower, and production efficiency is higher, is conducive to people's use.
Description
Technical field
The present invention relates to field of LED illumination, are specifically integrated flip-over type COB driving.
Background technique
This device product is to belong to electronic technology field, be COB light source be inverted in driving plate with driving realization it is integrated,
Downlight can be widely used in, on the lamps and lanterns product such as shot-light, with the development of society, lamps and lanterns specification requirement is increasingly segmented
Change, the demand of client is also higher and higher, and present apparatus product can be widely applied to shot-light and other lamps and lanterns, and customizing different angles needs
It asks.
During the installation process, COB drives the operation of achievable following form: firstly the need of manual welding driving and COB lamp
Pearl process, COB welding seperated with driving, COB light source upside-down mounting driving plate can effectively reduce the various faults of manual operation.
But though existing COB driving structure is simple, it is easy to operate, have a single function, work in COB driving
In the process, industry mostly uses greatly COB welding procedure seperated with driving at present, after driving is using SMD patch, also needs manual welding
Driving and the various processes such as COB lamp bead, complex procedures carry out in subsequent handling operating process to driving and COB lamp bead, can be because
Human body generates electrostatic and the high temperature of soldering iron causes permanent damage to light source, will affect the service life of lamps and lanterns, integrated SMD driving
For more lamp bead patches, non-uniform light, hot spot easy to form, shot-light effect is poor, has certain adverse effect, for this purpose, I
Propose integrated flip-over type COB driving.
Summary of the invention
The technical problem to be solved by the present invention is to overcome the existing defects, provides integrated flip-over type COB driving, can be effective
Solve the problems in background technique.
To achieve the above object, the invention provides the following technical scheme: one flip-over type COB drives, including driving plate, institute
The upper center outer surface for stating driving plate is fixedly connected with driving aluminum substrate center, the upper end appearance at the driving aluminum substrate center
Face is fixedly installed with COB lamp bead, and two side external surface of upper end of the driving plate offers mounting hole, the upper end of the driving plate
One side external surface is fixedly installed with SMD patch, and another side external surface in the upper end of the driving plate is fixedly connected with chip, the drive
The center outer surface at dynamic aluminum substrate center is provided with electronic unit, and the upper end outer surface of the driving plate is fixedly connected with.
1. being used as a preferred technical solution of the present invention, the quantity of the mounting hole is two groups, outside the mounting hole
Surface is fixedly connected by small-sized nut with the outer surface of driving plate, and the quantity of the electronic unit is dry group, the electronics list
The input terminal of member and the output end of mounting hole are electrically connected, and the quantity is several groups.
2. being used as a preferred technical solution of the present invention, mounting groove is offered between the COB lamp bead and driving plate, institute
The outer surface for stating COB lamp bead is fixedly connected by mounting groove with the center outer surface of driving plate.
3. being used as a preferred technical solution of the present invention, the generally integration SMD of the driving plate is driven, the drive
The inside of movable plate is fixedly installed with more SMD patches.
4. being used as a preferred technical solution of the present invention, the quantity of the COB lamp bead is several groups, the driving plate
Inside is fixedly installed with resistance wire, and the quantity of resistance wire is several groups, the input terminal of resistance wire and the output end electricity of driving plate
Property connection.
5. being used as a preferred technical solution of the present invention, the inside of the driving plate is fixedly installed with soldering iron, and soldering iron is logical
It crosses human body electrostatic energy and generates higher temperature, COB upside-down mounting is integrated form encapsulation.
Compared with prior art, the beneficial effects of the present invention are:
1, for the present invention by COB upside-down mounting, COB upside-down mounting is to avoid the dead lamp of broken string using no gold thread flip-chip packaged technique
Risk, improves yield, does not squeeze the risk of broken string, using flip LED chips, can bear relative to positive cartridge chip bigger
Rush of current, can high current use, welded using tin cream, thermal conductivity is higher, and thermal resistance is low, and chip thrust is big, and COB upside-down mounting is sufficiently sent out
It waves the resistance to more high current of chip and is produced as Material Cost optimization without gold thread, the system thermal resistance of COB upside-down mounting will be sealed far below tradition SMD
The system thermal resistance of dress, is greatly improved the service life of LED, and COB is inverted in the process that application end eliminates Reflow Soldering, significantly drops
Low application end production and manufacturing process, while can save corresponding equipment, it is lower to manufacture equipment input cost, production effect
Rate is higher, and COB upside-down mounting is integrated with driving, light source can be avoided to occur phenomena such as short-circuit in the welding process, COB upside-down mounting is for dress
Decorations illumination has very big advantage, and life of product can be improved in superior reliability, reduces product maintenance cost, is different from COB and drives
Dynamic fission welding, COB upside-down mounting are integrated form encapsulation, are area sources, and visual angle is big and easily adjusts, and reduces out the loss of anaclasis, COB
Light source upside-down mounting driving plate can effectively reduce the various faults of manual operation, improve the service life of driving plate and lamps and lanterns.
Detailed description of the invention
Fig. 1 is that whole view of the invention is intended to;
In figure: 1, driving plate;2, SMD patch;3, mounting hole;4, COB lamp bead;5, aluminum substrate center is driven;6, chip;7,
Electronic unit;8, solder.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Referring to Fig. 1, the present invention provides a kind of technical solution: integrated flip-over type COB driving, including driving plate 1, driving plate
1 upper center outer surface is fixedly connected with driving aluminum substrate center 5, the fixed peace in the upper end outer surface at driving aluminum substrate center 5
Equipped with COB lamp bead 4, two side external surface of upper end of driving plate 1 offers mounting hole 3, and one side external surface of upper end of driving plate 1 is solid
Dingan County is equipped with SMD patch 2, and another side external surface in the upper end of driving plate 1 is fixedly connected with chip 6, driving aluminum substrate center 5
Center outer surface is provided with electronic unit 7, and the upper end outer surface of driving plate 1 is fixedly connected with 8.
Evade COB welding risk, it is easy in production process, greatly reduce labor intensity, in the present embodiment, preferably
, the quantity of mounting hole 3 is two groups, and the outer surface of mounting hole 3 is fixedly connected by small-sized nut with the outer surface of driving plate 1,
The quantity of electronic unit 7 is dry group, and the input terminal of electronic unit 7 and the output end of mounting hole 3 are electrically connected, if 8 quantity is
Dry group.
Corresponding equipment can be saved, manufacturing equipment input cost is lower, and production efficiency is higher, excellent in the present embodiment
Choosing, mounting groove is offered between COB lamp bead 4 and driving plate 1, the outer surface of COB lamp bead 4 passes through mounting groove and driving plate 1
Center outer surface is fixedly connected.
Visual angle is big and easily adjusts, and reduces out the loss of anaclasis, improves life of product, reduces product maintenance cost, this reality
It applies in example, it is preferred that the generally integration SMD of driving plate 1 drives, and the inside of driving plate 1 is fixedly installed with more SMD patches
Piece 2.
5, in the present embodiment, it is preferred that the quantity of COB lamp bead 4 is several groups, and the inside of driving plate 1 is fixedly installed with electricity
Silk is hindered, and the quantity of resistance wire is several groups, the input terminal of resistance wire and the output end of driving plate 1 are electrically connected.
The various faults of manual operation are effectively reduced, improve the service life of driving plate and lamps and lanterns, it is excellent in the present embodiment
Choosing, the inside of driving plate 1 is fixedly installed with soldering iron, and soldering iron can generate higher temperature by static electricity on human body, and COB upside-down mounting is collection
Accepted way of doing sth encapsulation.
The working principle of the invention and process for using: when in use, operator is both needed to wear antistatic hand when production operation
Set or bracelet, workbench need to select low thermally conductive platform, such as antistatic skin, bakelite plate, firstly, welding temperature is at 280 DEG C -350
DEG C, weld interval should control at three to five seconds, secondly, 4 positive and negative anodes pad prewelding of COB lamp bead, is first burn-on on pad with soldering iron
Scolding tin is preceded by tin on circumscripted power line, and is stained with tin on soldering iron, is placed on one welded disc, plus electric wire, the soldering iron of tin
It rising while welding, solder fusing lifts soldering iron at once, finally, 4 surface colloid protective film of COB lamp bead is opened after the completion of welding, this
Invention operation effectively reduces the various faults of manual operation, improves the service life of driving plate and lamps and lanterns, visual angle is big and easily adjusts
It is whole, the loss of anaclasis is reduced out, life of product is improved, product maintenance cost is reduced, corresponding equipment can be saved, is manufactured
Equipment input cost is lower, and production efficiency is higher, is conducive to people's use.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
A variety of variations, modification, replacement can be carried out to these embodiments without departing from the principles and spirit of the present invention by understanding
And modification, the scope of the present invention is defined by the appended.
Claims (6)
1. one flip-over type COB drives, including driving plate (1), it is characterised in that: the upper center appearance of the driving plate (1)
Face is fixedly connected with driving aluminum substrate center (5), and the upper end outer surface of driving aluminum substrate center (5) is fixedly installed with COB
Two side external surface of upper end of lamp bead (4), the driving plate (1) offers mounting hole (3), the upper end one of the driving plate (1)
Side external surface is fixedly installed with SMD patch (2), and another side external surface in upper end of the driving plate (1) is fixedly connected with chip
(6), the center outer surface of driving aluminum substrate center (5) is provided with electronic unit (7), outside the upper end of the driving plate (1)
Surface is fixedly connected with (8).
2. one flip-over type COB driving according to claim 1, it is characterised in that: the quantity of the mounting hole (3) is two
The outer surface of group, the mounting hole (3) is fixedly connected by small-sized nut with the outer surface of driving plate (1), the electronic unit
(7) quantity is dry group, and the input terminal of the electronic unit (7) and the output end of mounting hole (3) are electrically connected, (8)
Quantity is several groups.
3. one flip-over type COB driving according to claim 1, it is characterised in that: the COB lamp bead (4) and driving plate
(1) mounting groove is offered between, the outer surface of the COB lamp bead (4) is solid by mounting groove and the center outer surface of driving plate (1)
Fixed connection.
4. one flip-over type COB driving according to claim 1, it is characterised in that: generally the one of the driving plate (1)
Body SMD driving, the inside of the driving plate (1) is fixedly installed with more SMD patches (2).
5. one flip-over type COB according to claim 1 driving, it is characterised in that: the quantity of the COB lamp bead (4) is
Several groups, the inside of the driving plate (1) are fixedly installed with resistance wire, and the quantity of resistance wire is several groups, resistance wire it is defeated
The output end for entering end and driving plate (1) is electrically connected.
6. one flip-over type COB driving according to claim 1, it is characterised in that: the inside of the driving plate (1) is fixed
Soldering iron is installed, soldering iron can generate higher temperature by static electricity on human body, and COB upside-down mounting is integrated form encapsulation.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910033509.9A CN109764265A (en) | 2019-01-14 | 2019-01-14 | Integrated flip-over type COB driving |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910033509.9A CN109764265A (en) | 2019-01-14 | 2019-01-14 | Integrated flip-over type COB driving |
Publications (1)
Publication Number | Publication Date |
---|---|
CN109764265A true CN109764265A (en) | 2019-05-17 |
Family
ID=66453788
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201910033509.9A Pending CN109764265A (en) | 2019-01-14 | 2019-01-14 | Integrated flip-over type COB driving |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN109764265A (en) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201462727U (en) * | 2009-04-02 | 2010-05-12 | 上海晨阑光电器件有限公司 | LED circuit structure adopting flexible wire circuit board |
US20120002407A1 (en) * | 2009-09-14 | 2012-01-05 | Li Qing Charles | Light emitting diode light source modules |
CN104465956A (en) * | 2014-12-31 | 2015-03-25 | 深圳市晶台股份有限公司 | Integrated LED packaging structure |
CN105355757A (en) * | 2015-11-16 | 2016-02-24 | 江西华柏节能照明科技协同创新有限公司 | Integrated light engine packaging method |
CN207896117U (en) * | 2018-02-11 | 2018-09-21 | 江西众光照明科技有限公司 | A kind of flip LED light source that AC220V drivings can be used directly |
CN207938646U (en) * | 2018-03-30 | 2018-10-02 | 新月光电(深圳)股份有限公司 | COB high density LED upside-down mounting light sources |
-
2019
- 2019-01-14 CN CN201910033509.9A patent/CN109764265A/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201462727U (en) * | 2009-04-02 | 2010-05-12 | 上海晨阑光电器件有限公司 | LED circuit structure adopting flexible wire circuit board |
US20120002407A1 (en) * | 2009-09-14 | 2012-01-05 | Li Qing Charles | Light emitting diode light source modules |
CN104465956A (en) * | 2014-12-31 | 2015-03-25 | 深圳市晶台股份有限公司 | Integrated LED packaging structure |
CN105355757A (en) * | 2015-11-16 | 2016-02-24 | 江西华柏节能照明科技协同创新有限公司 | Integrated light engine packaging method |
CN207896117U (en) * | 2018-02-11 | 2018-09-21 | 江西众光照明科技有限公司 | A kind of flip LED light source that AC220V drivings can be used directly |
CN207938646U (en) * | 2018-03-30 | 2018-10-02 | 新月光电(深圳)股份有限公司 | COB high density LED upside-down mounting light sources |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN106449542B (en) | A kind of encapsulating structure of the semiconductor luminous chip of the airtight no silica gel of form | |
CN104952864B (en) | LED filament and its manufacture method | |
CN205428913U (en) | Power semiconductor module | |
CN207781646U (en) | A kind of LED chip face-down bonding structure and LED lamp bead | |
CN207052626U (en) | A kind of flip LED light source | |
CN103824906A (en) | LED (light-emitting diode) encapsulating method and LED device | |
CN209655074U (en) | Integrated flip-over type COB driving | |
CN209418538U (en) | A kind of packaging structure of light source of high power LED | |
CN106764560B (en) | Manufacturing method of LED lamp | |
CN105140374A (en) | Routing-free LED packaging structure and preparation method therefor | |
CN102522695A (en) | Nano silver soldering paste packaged 60-watt 808-nano high-power semiconductor laser module and packaging method thereof | |
CN109764265A (en) | Integrated flip-over type COB driving | |
EP3190328B1 (en) | A led light simulating the structure of incandescent light | |
CN203787456U (en) | Flip chip packaging structure | |
CN206480621U (en) | A kind of LED chip inverted structure | |
CN202150488U (en) | Mounting structure used for LED wafers | |
CN204464275U (en) | A kind of sealing device of New LED filament | |
CN107394033A (en) | LED filament manufacturing process and LED filament | |
CN204088362U (en) | A kind of chip upside-down mounting type LED silk | |
CN208422955U (en) | A kind of UV-LED light source and its lamps and lanterns | |
CN202268386U (en) | LED (Light Emitting Diode) packaging structure | |
CN206419687U (en) | A kind of Novel LED light | |
CN203800085U (en) | Bar-shaped LED all-direction light source | |
CN205960024U (en) | Flip LED chip | |
CN206877993U (en) | A kind of LED based on front pad can eutectic encapsulating structure |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190517 |
|
RJ01 | Rejection of invention patent application after publication |