CN207938646U - COB high density LED upside-down mounting light sources - Google Patents
COB high density LED upside-down mounting light sources Download PDFInfo
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- CN207938646U CN207938646U CN201820479488.4U CN201820479488U CN207938646U CN 207938646 U CN207938646 U CN 207938646U CN 201820479488 U CN201820479488 U CN 201820479488U CN 207938646 U CN207938646 U CN 207938646U
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- led chip
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- down mounting
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Abstract
The utility model is related to the technical fields of COB light source, disclose COB high density LED upside-down mounting light sources, including aluminum nitride ceramic substrate, pit is provided on aluminum nitride ceramic substrate, pit includes the first pit and the second dimple above the first pit, the diameter of second dimple is slightly larger compared with the diameter of the first pit, upside-down mounting has LED chip in first pit, transparent fluorescent glue is provided in second dimple, circuit structure is provided on aluminum nitride ceramic substrate, circuit structure is electrically connected with LED chip, circuit structure and LED chip unitary packed；Aluminum nitride ceramic substrate has thermal conductive resin and heat resistance; convenient for the heat dissipation of LED chip; it is provided with LED chip in first pit, second dimple is provided with above the first pit, fluorescent glue is coated in second dimple; in this way; fluorescent glue does not overflow second dimple, while fluorescent glue plays the role of protecting LED chip, LED chip fix stably; the weatherability for improving LED chip improves the service life of LED light source.
Description
Technical field
The utility model is related to the technical fields of COB light source, especially COB high density LED upside-down mounting light sources.
Background technology
COB light source is that the specular removal being placed directly against LED chip on the mirror metal substrate of high reflecting rate integrates area source
Technology, this technology eliminate holder concept, electroless plating, without Reflow Soldering, without patch process, therefore process reduces nearly one third,
Cost also saves one third.
COB light source can simply be interpreted as high power and integrate area source, can be according to product design structure design light source
Lighting area and appearance and size.COB light source has high colour developing, shine uniform, simple without hot spot, health environment-friendly, installation, user
The series of advantages such as just, just because of this, COB light source occupies very important status in LED light source domain, is widely used in
All trades and professions.
In the prior art, the service life of LED chip plays a crucial role the service life of LED light source, and
Often reality is that LED chip is more fragile, has been damaged, and fraction defective is high, and the luminous work of LED chip necessarily will produce largely
Heat, so the heat dissipation problem of LED chip is also extremely important.
Utility model content
The purpose of this utility model is to provide COB high density LED upside-down mounting light sources, it is intended to solve COB light in the prior art
The short problem of source service life.
The utility model is realized in this way COB high density LED upside-down mounting light sources, including aluminum nitride ceramic substrate, the nitrogen
Change and be provided with pit on aluminium ceramic substrate, the pit includes the first pit and second recessed above first pit
Hole, the diameter of diameter first pit of the second dimple is slightly larger, in first pit upside-down mounting have LED chip,
Be provided with transparent fluorescent glue in the second dimple, be provided with circuit structure on aluminum nitride ceramic substrate, the circuit structure with
The LED chip is electrically connected, the circuit structure and the LED chip unitary packed.
Further, the back side of the LED chip is light-emitting surface, and the front of the LED chip abuts the aluminium nitride pottery
Porcelain substrate.
Further, plating is equipped with one layer of silver layer between first pit and the LED chip.
Further, the aluminum nitride ceramic substrate is equipped with anode and cathode for connecting external power supply；It is described just
Pole is electrically connected by the circuit structure and the LED chip respectively with the cathode.
Further, the LED chip could alternatively be the LED chip group being made of multiple LED chips being connected in series with.
Further, the LED chip could alternatively be the LED chip group being made of multiple LED chips being connected in parallel.
Further, the transparent fluorescent glue is mixed to form by fluorescent powder and transparent adhesive tape.
Further, the transparent fluorescent glue is made of centrifugation apparatus of centrifugation technique.
Compared with prior art, COB high density LED upside-down mounting light sources provided by the utility model are made pottery by the way that aluminium nitride is arranged
Porcelain substrate, aluminum nitride ceramic substrate have thermal conductive resin and heat resistance, are convenient for the heat dissipation of LED chip, improve LED core
The working time of piece is provided with LED chip in the first pit, and second dimple is provided with above the first pit, is applied in second dimple
It is covered with fluorescent glue, in this way, fluorescent glue does not overflow second dimple, while fluorescent glue plays the role of protecting LED chip, LED core
Piece fix stably improves the weatherability of LED chip, improves the service life of LED light source, has provided to the user and has relatively defecated
Profit.
Description of the drawings
Fig. 1 is the front view for the COB high density LED upside-down mounting light sources that the utility model embodiment provides.
Specific implementation mode
In order to make the purpose of the utility model, technical solutions and advantages more clearly understood, below in conjunction with attached drawing and implementation
Example, the present invention will be further described in detail.It should be appreciated that specific embodiment described herein is only used to explain
The utility model is not used to limit the utility model.
The same or similar label correspond to the same or similar components in the attached drawing of the present embodiment；In retouching for the utility model
In stating, it is to be understood that if it is based on attached drawing to have the orientation or positional relationship of the instructions such as term "upper", "lower", "left", "right"
Shown in orientation or positional relationship, be merely for convenience of describing the present invention and simplifying the description, rather than indicate or imply institute
The device or element of finger must have a particular orientation, with specific azimuth configuration and operation, therefore position described in attached drawing is closed
The term of system only for illustration, should not be understood as the limitation to this patent, for those of ordinary skill in the art and
Speech, can understand the concrete meaning of above-mentioned term as the case may be.
The realization of the utility model is described in detail below in conjunction with specific embodiment.
Shown in referring to Fig.1, preferred embodiment is provided for the utility model.
COB high density LED upside-down mounting light sources, including aluminum nitride ceramic substrate 1 are provided with pit on aluminum nitride ceramic substrate 1,
Pit includes the first pit and the second dimple above the first pit, and the diameter of second dimple is straight compared with the first pit
Diameter is slightly larger, in the first pit upside-down mounting have LED chip 2, transparent fluorescent glue 3 is provided in second dimple, on aluminum nitride ceramic substrate 1
It is provided with circuit structure, circuit structure is electrically connected with LED chip 2,2 unitary packed of circuit structure and LED chip.
Aluminium nitride ceramics is the ceramics for principal crystalline phase with aluminium nitride (AIN).AIN crystal is using (AIN4) tetrahedron as structure list
The covalent key compound of member, has wurtzite, belongs to hexagonal crystal system.Chemical composition AI 65.81%, N 34.19%, proportion
3.261g/cm3, white or canescence, monocrystalline water white transparency, the distillation decomposition temperature under normal pressure are 2450 DEG C.AIN crystal is one
Kind high-temperature heat-resistance material, coefficient of thermal expansion are (4.0-6.0) × 10-6/℃.Polymorph A IN thermal conductivities reach 260W/ (m.k), than oxidation
Aluminium is 5-8 times high, so heat shock resistance is good, is resistant to 2200 DEG C very hot.In addition, aluminium nitride has not by molten aluminum and other meltings gold
The characteristic that category and GaAs corrode, especially has fabulous erosion resisting to molten aluminum liquid.
The COB high density LED upside-down mounting light sources of above-mentioned offer, by the way that aluminum nitride ceramic substrate 1, aluminum nitride ceramic substrate is arranged
1 has thermal conductive resin and heat resistance, is convenient for the heat dissipation of LED chip 2, improves the working time of LED chip 2, and first
It is provided with LED chip 2 in pit, second dimple is provided with above the first pit, fluorescent glue is coated in second dimple, in this way,
Fluorescent glue does not overflow second dimple, while fluorescent glue plays the role of that LED chip 2,2 fix stably of LED chip is protected to improve
The weatherability of LED chip 2, improves the service life of LED light source, has provided to the user compared with convenience.
Specifically, the back side of LED chip 2 is light-emitting surface, and the front of LED chip 2 abuts aluminum nitride ceramic substrate 1；Also
It is to say that LED chip 2 is fixed on by the way of upside-down mounting on aluminum nitride ceramic substrate 1, in this way, die bond thickness is thin, good heat dissipation can lead to
High current uses；Size can also accomplish smaller, cost-effective, and the promotion of heat dissipation performance can also promote the use longevity of LED light
Life, 2 upside-down mounting of LED chip fixation do not need gold thread bonding and are bound, and have saved production cost.
Furthermore plating is equipped with one layer of silver layer between the first pit and LED chip 2；Silver layer has good reflective function, LED
When the illumination that chip 2 is sent out is mapped to silver layer, the reflective function of silver layer can come out light reflection, improve amount of light, promote LED light
Light efficiency.
Aluminum nitride ceramic substrate 1 is equipped with anode and cathode for connecting external power supply；Positive electrode and negative electrode pass through respectively
Circuit structure is electrically connected with LED chip 2；In this way, when positive and negative on external power supply electric connection aluminum nitride ceramic substrate 1
Pole forms closed circuit, realizes power supply of the external power supply to 2 groups of LED chip, and 2 groups of LED chip carries out illumination work, sends out
Go out light.
In the present embodiment, LED chip 2 could alternatively be the LED chip 2 being made of multiple LED chips 2 being connected in series with
Group；Multiple LED chips 2 are carried out at the same time luminous work in this way, improve luminous flux, improve the illumination effect of LED light source.
Alternatively, as other embodiment, LED chip 2 could alternatively be to be made of multiple LED chips 2 being connected in parallel
2 groups of LED chip；In this way when some LED chip 2 breaks down, other LED chips 2 can also work normally, and improve LED
The service life of light source.
In the present embodiment, transparent fluorescent glue 3 is mixed to form by fluorescent powder and transparent adhesive tape；The light that fluorescent powder sends out LED into
Row effect, sends out the light of particular color, satisfies the use demand.
Specifically, transparent fluorescent glue 3 is made of centrifugation apparatus of centrifugation technique；Fluorescence is precipitated using centrifugation apparatus
Fluorescent powder in glue so that COB light source shines uniformly, and hot spot works well, while making the heat dissipation effect of fluorescent glue good.
The above is only the preferred embodiment of the utility model only, is not intended to limit the utility model, all at this
All any modification, equivalent and improvement etc., should be included in the utility model made by within the spirit and principle of utility model
Protection domain within.
Claims (8)
1.COB high density LED upside-down mounting light sources, which is characterized in that including aluminum nitride ceramic substrate, on the aluminum nitride ceramic substrate
It is provided with pit, the pit includes the first pit and the second dimple above first pit, and described second is recessed
The diameter of diameter first pit in hole is slightly larger, in first pit upside-down mounting have a LED chip, in the second dimple
It is provided with transparent fluorescent glue, circuit structure is provided on aluminum nitride ceramic substrate, the circuit structure and the LED chip are electrical
Connection, the circuit structure and the LED chip unitary packed.
2. COB high density LED upside-down mounting light sources as described in claim 1, which is characterized in that the back side of the LED chip is hair
The front of smooth surface, the LED chip abuts the aluminum nitride ceramic substrate.
3. COB high density LED upside-down mounting light sources as described in claim 1, which is characterized in that first pit and the LED
Plating is equipped with one layer of silver layer between chip.
4. COB high density LED upside-down mounting light sources as described in claim 1, which is characterized in that set on the aluminum nitride ceramic substrate
It is useful for the anode and cathode of connection external power supply；It is described anode with the cathode respectively by the circuit structure with it is described
LED chip is electrically connected.
5. COB high density LED upside-down mounting light sources according to any one of claims 1-4, which is characterized in that the LED chip can
To replace with the LED chip group being made of multiple LED chips being connected in series with.
6. COB high density LED upside-down mounting light sources according to any one of claims 1-4, which is characterized in that the LED chip can
To replace with the LED chip group being made of multiple LED chips being connected in parallel.
7. COB high density LED upside-down mounting light sources according to any one of claims 1-4, which is characterized in that the transparent fluorescent glue
It is mixed to form by fluorescent powder and transparent adhesive tape.
8. COB high density LED upside-down mounting light sources as claimed in claim 7, which is characterized in that the transparent fluorescent glue is set by centrifuging
It is standby to be made of centrifugation technique.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820479488.4U CN207938646U (en) | 2018-03-30 | 2018-03-30 | COB high density LED upside-down mounting light sources |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820479488.4U CN207938646U (en) | 2018-03-30 | 2018-03-30 | COB high density LED upside-down mounting light sources |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207938646U true CN207938646U (en) | 2018-10-02 |
Family
ID=63656289
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820479488.4U Expired - Fee Related CN207938646U (en) | 2018-03-30 | 2018-03-30 | COB high density LED upside-down mounting light sources |
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|---|---|
| CN (1) | CN207938646U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109764265A (en) * | 2019-01-14 | 2019-05-17 | 中山市高沃光电科技有限公司 | Integrated flip-over type COB driving |
-
2018
- 2018-03-30 CN CN201820479488.4U patent/CN207938646U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109764265A (en) * | 2019-01-14 | 2019-05-17 | 中山市高沃光电科技有限公司 | Integrated flip-over type COB driving |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181002 Termination date: 20200330 |