CN109713492A - 电连接器 - Google Patents

电连接器 Download PDF

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Publication number
CN109713492A
CN109713492A CN201811511524.1A CN201811511524A CN109713492A CN 109713492 A CN109713492 A CN 109713492A CN 201811511524 A CN201811511524 A CN 201811511524A CN 109713492 A CN109713492 A CN 109713492A
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elastic arm
electric connector
junction
base portion
extends
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何建志
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Lotes Guangzhou Co Ltd
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Lotes Guangzhou Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
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    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
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    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
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    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
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Abstract

本发明提供一种电连接器用以电性连接一对接元件至一电子元件，其包括：一绝缘本体，设有多个收容孔；多个端子，分别对应收容于多个所述收容孔，每一所述端子包括：一基部，收容于所述收容孔，一第一弹臂，自所述基部的顶端向上弯折延伸形成，所述第一弹臂具有一接触部，用于向上抵接所述对接组件，一第二弹臂，自所述第一弹臂向下弯折延伸形成，一第三弹臂，自所述基部的底端向下弯折延伸形成，所述第三弹臂的板面形成一导接部，一第四弹臂，自所述导接部向上弯折延伸形成，且延伸至所述第二弹臂的内侧或外侧与所述第二弹臂相抵接。本发明设计的所述第二弹臂位于所述第四弹臂的内侧或者外侧进行面与面抵接。

Description

电连接器
【技术领域】
本发明涉及一种电连接器，尤其涉及一种可传输高频信号且端子具有多条导电路径的电连接器及电子装置。
【背景技术】
现有的一种电连接器，其包括一绝缘本体以及收容于绝缘本体中的导电端子，该导电端子设有基部，由基部向上延伸形成第一弹臂，所述第一弹臂再向下弯折延伸形成一第二弹臂，由基部向下延伸形成一第三弹臂，所述第三弹臂再向上弯折形成一第四弹臂，所述第二弹臂与所述第四弹臂的末端均设有一弧形抵接部，所述弧形抵接部上下抵接，实现电性导通。
然而，芯片模块多次下压所述第一弹臂，所述第二弹臂抵接所述第四弹臂时，极易产生偏差，使所述第二弹臂的弧形抵接部与所述第四弹臂的弧形抵接部出现错位，发生偏移，导致所述第二弹臂无法抵接所述第四弹臂上，影响了所述端子的第二通路的导通，从而影响高频信号的传输。
因此有必要设计一种改良的电连接器，以克服上述问题。
【发明内容】
针对背景技术所面临的问题，本发明的创作目的在于提供一种由两个弹臂进行面与面抵接，从而导接电子元件的电连接器。
为了达到上述目的，本发明采用如下技术方案：
一种电连接器，用以电性连接一对接元件至一电子元件，其特征在于，包括：一绝缘本体，设有多个收容孔；多个端子，分别对应收容于多个所述收容孔，每一所述端子包括：一基部，收容于所述收容孔，一第一弹臂，自所述基部的顶端向上弯折延伸形成，所述第一弹臂具有一接触部，用于向上抵接所述对接元件，一第二弹臂，自所述第一弹臂向下弯折延伸形成，一第三弹臂，自所述基部的底端向下弯折延伸形成，所述第三弹臂的板面形成一导接部，一第四弹臂，自所述导接部向上弯折延伸形成，且延伸至所述第二弹臂的内侧或外侧与所述第二弹臂相抵接。
进一步，所述收容孔具有一第一侧壁，所述第一侧壁凸伸形成一挡块，所述挡块抵接所述基部的板面，所述第三弹臂在接近所述基部的部分朝向所述挡块方向凸伸形成一挡部，所述挡部挡止于所述挡块。
进一步，所述第二弹臂具有一第二弹臂内表面和一第二弹臂外表面，所述第四弹臂具有一第四弹臂内表面和一第四弹臂外表面，所述收容孔具有一第二侧壁，所述第二侧壁与所述第一侧壁相对设置，所述第二弹臂位于所述第二侧壁与所述第四弹臂之间且所述第二弹臂内表面抵接所述第四弹臂外表面。
进一步，所述第二弹臂具有一第二弹臂内表面和一第二弹臂外表面，所述第四弹臂具有一第四弹臂内表面和一第四弹臂外表面，所述收容孔具有一第二侧壁，所述第二侧壁与所述第一侧壁相对设置，所述第四弹臂位于所述第二侧壁与所述第二弹臂之间且所述第四弹臂内表面抵接所述第二弹臂外表面。
进一步，所述绝缘本体具有一下表面，所述第三弹臂显露出所述下表面形成所述导接部，所述导接部平行于所述下表面且为水平板状结构，所述第三弹臂在所述基部至所述导接部之间部分的宽度窄于所述导接部的宽度。
进一步，一开槽贯穿所述接触部并向下贯穿所述第二弹臂。
进一步，所述第四弹臂上设有一开口，所述开口贯穿所述第四弹臂。
进一步，所述基部底端的相对两侧分别形成一限位部，所述绝缘本体上设有一限位槽，所述限位部止挡于所述限位槽。
进一步，所述基部的顶端形成二连料部位于所述第一弹臂两侧，用于连接料带。
进一步，所述导接部在焊接至所述电子元件前，焊料预先焊接于所述导接部。
进一步，所述电子元件为电路板，其上设有多个导电片，所述导接部对应抵接所述导电片，所述导接部通过焊料焊接至所述电路板上，所述对接元件为芯片模块，其上设有多个垫片，所述接触部对应抵接所述垫片。
与现有技术相比，本发明电连接器具有以下有益效果：
本发明通过第二弹臂的表面与第四弹臂的表面进行抵接，从而增加了抵接部分的面积，保证了第二弹臂与第四弹臂能稳定的导通，从而使所述端子稳定的导接对接元件和电子元件，保证了信号传输的稳定性。
【附图说明】
图1为电连接器第一实施例的立体图；
图2为图1中的电连接器倒转180°后的立体图；
图3为图1的电连接器在芯片模块下压前的主视图；
图4为图1的电连接器在芯片模块下压后的主视图；
图5为图1的局部放大图；
图6为第二实施例中电连接器在芯片模块下压前的主视图。
具体实施方式的附图标号说明：
电连接器 100 绝缘本体 1 上表面 11
下表面 12 收容孔 13 长壁 131
第一侧壁 132 第二侧壁 133 限位槽 134
止挡部 1341 挡块 135 支柱 14
端子 2 基部 21 限位部 211
连料部 212 第一弹臂 22 接触部 221
第二弹臂 23 第二弹臂内表面 231 第二弹臂外表面 232
第三弹臂 24 挡部 241 导接部 242
第四弹臂 25 第四弹臂内表面 251 第四弹臂外表面 252
导引部 253 开槽 26 开口 27
芯片模块 3 底面 31 垫片 32
电路板 4 导接片 41 顶面 42
焊料 5 水平方向 X 纵长方向 Y
上下方向 Z
【具体实施方式】
为便于更好的理解本发明的目的、结构、特征以及功效等，现结合附图和具体实施方式对本发明作进一步说明。
如图1、2和图5所示，为本发明电连接器100的第一实施例，本发明电连接器100用以电性连接一对接元件至一电子元件，所述对接元件为一芯片模块3，所述电子元件为一电路板4，所述电连接器100包括一绝缘本体1，多个端子2固持于所述绝缘本体1，每一所述端子2一端弹性抵接所述芯片模块3，另一端通过焊料5焊接至所述电路板4，所述电连接器100定义一水平方向X、一横向方向Y及一上下方向Z，其中所述水平方向X、所述横向方向Y及所述上下方向Z两两相互垂直。在其它实施例中，所述对接元件和所述电子元件的种类不作限定，只要其能和所述电连接器100配合即可。
如图1、2和图5所示，所述绝缘本体1具有一上表面11和一下表面12及贯穿其所述上表面11和所述下表面12呈矩阵排列的多个收容孔13，位于同一列的多个所述收容孔13存在错位，多个所述收容孔13分别对应收容多个所述端子2，所述下表面12向下延伸形成多个支柱14，所述支柱14支撑于所述电路板4，所述收容孔13包括两长壁131和连接所述两长壁131的第一侧壁132和第二侧壁133，所述两长壁131在靠近第一侧壁132的位置分别向内凹陷形成一限位槽134，所述限位槽134的底部形成一止挡部1341，所述第一侧壁132向外凸伸形成一挡块135。
如图1、2和图5所示，所述端子2具有一基部21，所述基部21的板面抵接所述挡块135，所述基部21的顶端对称设置二连料部212，用于连接料带，所述基部21的底端相对两侧逐渐减小分别形成一限位部211，所述限位部211止挡于所述止挡部1341，防止所述端子2过度向下移动。
如图1、2和图5所示，所述基部21向上弯折延伸形成一第一弹臂22，所述第一弹臂22的顶部形成一接触部221，所述接触部221向下弯折延伸形成一第二弹臂23，所述第二弹臂23包括一第二弹臂内表面231和一第二弹臂外表面232，所述第一弹臂22和第二弹臂23上设有一开槽26，所述开槽26自所述接触部221贯穿至所述第二弹臂23。由于所述开槽26贯穿所述接触部221、部分所述第一弹臂22和所述第二弹臂23，如此既增加所述接触部221、所述第一弹臂22和所述第二弹臂23的弹性，又降低了所述端子2信号传输中的自感效应，避免相邻端子2之间的串音，有利于提高所述端子2高速信号的传输。另外，所述开槽26未延伸至所述第一弹臂22与所述基部21的弯折处，避免了所述第一弹臂22和所述第二弹臂23的强度过低。
所述基部21向下弯折延伸形成一第三弹臂24，所述第三弹臂24上设有一挡部241，所述挡部241由所述第三弹臂24与所述基部21的连接处朝向所述挡块135方向凸伸形成，所述挡部241止挡于所述挡块135，避免所述端子2过度向上移动，所述第三弹臂24的板面设有一水平板状导接部242，用以通过焊料5焊接所述电路板4，所述焊料5预先焊接至所述导接部242上，所述导接部242至所述基部21之间部分的宽度窄于所述导接部242的宽度，可防止所述焊料5沿所述导接部242向上流动。
所述导接部242向上弯折延伸形成一第四弹臂25，所述第四弹臂25设有一开口27，所述开口27贯穿所述第四弹臂25，用以降低所述端子2信号传输中的自感效应，所述第四弹臂25的末端朝向基部21方向延伸形成一导引部253，所述第四弹臂25包括一第四弹臂内表面251和一第四弹臂外表面252，在本实施例中，所述第二弹臂23位于所述第四弹臂25和所述第二侧壁133之间且所述第二弹臂内表面231抵接所述第四弹臂外表面252，保证了所述第二弹臂23与所述第四弹臂25抵接的稳定性。
如图1、3、4和图5所示，首先，在所述端子2安装于所述收容孔13之前，对应每一所述收容孔13的每一所述端子2通过所述连料部212连接同一所述料带(未图示)，通过所述料带(未图示)将多个所述端子2从上往下对应安装于所述收容孔13内。此时，所述挡部241位于所述挡块135的下方，所述挡部241止挡于所述挡块135，防止所述端子2过度向上移动，所述限位部211位于所述止挡部1341的上方，所述止挡部1341止挡所述限位部211，防止所述端子2过度向下移动。
然后，去除料带(未图示)，将所述芯片模块3放置在所述绝缘本体1上方，所述芯片模块3的底面31设有多个垫片32，所述垫片32分别与所述收容孔13对应设置，将所述电路板4放置在所述绝缘本体1下方，所述电路板4的顶面42设有多个导接片41，所述导接片41分别与所述收容孔13对应设置，所述绝缘本体1向下抵靠于电路板4时，所述支柱14支撑于所述电路板4，即保证了所述导接部242通过焊料5能与所述导接片41实现可靠焊接，又可防止所述绝缘本体1向下导接所述电路板4时，损伤所述端子2，在所述芯片模块3下压前，所述端子2收容于所述收容孔13中且可上下移动，由于所述开槽26贯穿所述第二弹臂23，所述开口27贯穿所述第四弹臂25，当所述第二弹臂内表面231抵接所述第四弹臂外表面252时，所述开槽26对应所述开口27，所述第二弹臂内表面231与所述第四弹臂外表面252形成两个接触部分，所述芯片模块3下压后，所述芯片模块3向下抵靠于所述绝缘本体1，所述垫片32抵接所述接触部221，所述第二弹臂23沿着所述第四弹臂外表面252向下移动，从而进一步抵接所述第四弹臂外表面252，因此，在所述芯片模块3与所述电路板4之间形成依次经由所述芯片模块3、所述接触部221、所述第一弹臂22、所述基部21、所述第三弹臂24、所述导接部242、所述电路板4的第一导电通路，以及形成依次经由所述芯片模块3、所述接触部221、所述第二弹臂23、所述第四弹臂25、所述导接部242、所述电路板4的第二导电通路，该第一导电通路与第二导电通路为并联设置，具有较小的自感应效应，减小了所述芯片模块3与所述电路板4间电讯传输时的电阻抗，进而确保了所述芯片模块3与所述电路板4间良好的电性导接及电讯传输性能。
最后，所述电连接器100经过回焊炉加热，所述导接片41上的焊料5融化，使所述导接部242与对应所述导接片41焊接固定连接。
如图6所示，在第二实施例中，所述第四弹臂25位于所述第二弹臂23与所述第二侧壁133之间，所述第二弹臂外表面232抵接所述第四弹臂内表面251，其他结构与第一实施例相同。
与现有技术相比，本发明电连接器100具有以下有益效果：
1.当所述芯片模块3多次下压后，由于所述第二弹臂内表面231与所述第四弹臂外表面252抵接，使得所述第二弹臂23与第四弹臂25不仅仅只在上下方向Z上有作用力，在水平方向X上同样有作用力，从而改善端子2下压时，所述第二弹臂23与所述第四弹臂25错位偏移的问题，保证了所述芯片模块3多次向下压后，所述端子2和所述芯片模块3、所述电路板4之间电性导通的稳定性。
2.所述端子2的所述挡部241位于所述挡块135的下方，防止了所述端子2过度向上移动，从而拉扯所述焊料5而造成所述焊料5的破损，所述限位部211位于所述止挡部1341的上方，防止了所述端子2过度向下移动，从而过度下压所述导接部242而造成所述导接部242损伤。所述端子2在所述收容孔13中可沿上下方向适度移动，即有效避免了所述端子2由于过度拉扯焊料5而造成所述焊料5的破损，又保证了所述端子2与所述电路板4的焊接稳定性，确保了所述电连接器100良好的电性导接。
3.当所述芯片模块3下压端子2時，与所述端子2形成两条导通路径，第一导通路径为依次经由所述芯片模块3、所述接触部221、所述第一弹臂22、所述基部21、所述第三弹臂24、所述导接部242、所述电路板4，以及第二导通路径为依次经由依次经由所述芯片模块3、所述接触部221、所述第二弹臂23、所述第四弹臂25、所述导接部242、所述电路板4的第二导电通路，该第一导电通路与第二导电通路为并联设置，具有较小的自感应效应，减小了芯片模块3与电路板4间电讯传输时的电阻抗，进而确保了芯片模块3与电路板4间良好的电性导接及电讯传输性能。
4.当所述第二弹臂内表面231抵接所述第四弹臂外表面252时，所述第二弹臂内表面231与所述第四弹臂外表面252形成两个接触部分，可保持第二导电通路导通的稳定性，保证了第二导电通路良好的导电效果。
以上详细说明仅为本发明之较佳实施例的说明，非因此局限本发明之专利范围，所以，凡运用本创作说明书及图示内容所为之等效技术变化，均包含于本创作之专利范围内。

Claims (11)

1.一种电连接器，用以电性连接一对接元件至一电子元件，其特征在于，包括：
一绝缘本体，设有多个收容孔；
多个端子，分别对应收容于多个所述收容孔，每一所述端子包括：
一基部，
一第一弹臂，自所述基部向上弯折延伸形成，所述第一弹臂具有一接触部，用于向上抵接所述对接元件，
一第二弹臂，自所述接触部向下弯折延伸形成，
一第三弹臂，自所述基部向下弯折延伸形成，所述第三弹臂的板面形成一导接部,用于向下抵接所述电子元件，
一第四弹臂，自所述导接部向上弯折延伸形成，且延伸至所述第二弹臂的内侧或外侧与所述第二弹臂相抵接。
2.如权利要求1所述的电连接器，其特征在于：所述收容孔具有一第一侧壁，所述第一侧壁凸伸形成一挡块，所述挡块抵接所述基部的板面，所述第三弹臂在接近所述基部的部分朝向所述挡块方向凸伸形成一挡部，所述挡部挡止于所述挡块。
3.如权利要求2所述的电连接器，其特征在于：所述第二弹臂具有一第二弹臂内表面和一第二弹臂外表面，所述第四弹臂具有一第四弹臂内表面和一第四弹臂外表面，所述收容孔具有一第二侧壁，所述第二侧壁与所述第一侧壁相对设置，所述第二弹臂位于所述第二侧壁与所述第四弹臂之间且所述第二弹臂内表面抵接所述第四弹臂外表面。
4.如权利要求2所述的电连接器，其特征在于：所述第二弹臂具有一第二弹臂内表面和一第二弹臂外表面，所述第四弹臂具有一第四弹臂内表面和一第四弹臂外表面，所述收容孔具有一第二侧壁，所述第二侧壁与所述第一侧壁相对设置，所述第四弹臂位于所述第二侧壁与所述第二弹臂之间且所述第四弹臂内表面抵接所述第二弹臂外表面。
5.如权利要求1所述的电连接器，其特征在于：所述绝缘本体具有一下表面，所述第三弹臂显露出所述下表面形成所述导接部，所述导接部平行于所述下表面且为水平板状结构，所述第三弹臂在所述基部至所述导接部之间部分的宽度窄于所述导接部的宽度。
6.如权利要求1所述的电连接器，其特征在于：一开槽贯穿所述接触部并向下贯穿所述第二弹臂。
7.如权利要求1所述的电连接器，其特征在于：所述第四弹臂上设有一开口，所述开口贯穿所述第四弹臂。
8.如权利要求1所述的电连接器，其特征在于：所述基部底端的相对两侧分别形成一限位部，所述绝缘本体上设有一限位槽，所述限位部止挡于所述限位槽。
9.如权利要求1所述的电连接器，其特征在于：所述基部的顶端形成二连料部位于所述第一弹臂两侧，用于连接料带。
10.如权利要求1所述的电连接器，其特征在于：所述导接部在焊接至所述电子元件前，焊料预先焊接于所述导接部。
11.如权利要求1所述的电连接器，其特征在于：所述电子元件为电路板，其上设有多个导电片，所述导接部对应抵接所述导电片，所述导接部通过焊料焊接至所述电路板上，所述对接元件为芯片模块，其上设有多个垫片，所述接触部对应抵接所述垫片。
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