CN109536897A - A kind of continuous organic material evaporating-plating equipment in 24 sources - Google Patents
A kind of continuous organic material evaporating-plating equipment in 24 sources Download PDFInfo
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- CN109536897A CN109536897A CN201910040797.0A CN201910040797A CN109536897A CN 109536897 A CN109536897 A CN 109536897A CN 201910040797 A CN201910040797 A CN 201910040797A CN 109536897 A CN109536897 A CN 109536897A
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- vacuum chamber
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- vacuum
- heating plate
- organic material
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- 238000007747 plating Methods 0.000 title claims abstract description 30
- 239000011368 organic material Substances 0.000 title claims abstract description 23
- 239000000758 substrate Substances 0.000 claims abstract description 67
- 238000010438 heat treatment Methods 0.000 claims abstract description 41
- 238000001704 evaporation Methods 0.000 claims abstract description 32
- 230000008020 evaporation Effects 0.000 claims abstract description 29
- 238000007740 vapor deposition Methods 0.000 claims abstract description 23
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims abstract description 21
- 229910052750 molybdenum Inorganic materials 0.000 claims abstract description 21
- 239000011733 molybdenum Substances 0.000 claims abstract description 21
- 239000000463 material Substances 0.000 claims description 24
- 239000000523 sample Substances 0.000 claims description 16
- 238000002309 gasification Methods 0.000 claims description 4
- 238000011897 real-time detection Methods 0.000 claims description 4
- 210000000481 breast Anatomy 0.000 claims description 3
- 239000011553 magnetic fluid Substances 0.000 claims description 3
- 230000008878 coupling Effects 0.000 claims description 2
- 238000010168 coupling process Methods 0.000 claims description 2
- 238000005859 coupling reaction Methods 0.000 claims description 2
- 230000005611 electricity Effects 0.000 claims description 2
- 238000010025 steaming Methods 0.000 claims description 2
- 210000004556 brain Anatomy 0.000 claims 1
- 239000010408 film Substances 0.000 description 36
- 239000000956 alloy Substances 0.000 description 7
- 229910045601 alloy Inorganic materials 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- 238000005194 fractionation Methods 0.000 description 3
- 238000005275 alloying Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007792 addition Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000001883 metal evaporation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
- C23C14/505—Substrate holders for rotation of the substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/542—Controlling the film thickness or evaporation rate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The present invention discloses a kind of continuous organic material evaporating-plating equipment in 24 sources, including device framework, the upper end of the device framework is equipped with vacuum chamber and touch control computer, and touch control computer is located at vacuum chamber one side edge position, the front end of the device framework is equipped with molecule pump controller, the vacuum chamber two sides are symmetrically installed with molecular pump, the inner bottom of the vacuum chamber is equipped with baffle and electrode, the electrode is located at the bottom end two sides of baffle, evaporation source selecting hole is offered on the baffle, the bottom end middle position of the baffle is connected with No.1 motor, and No.1 motor is located in device framework, upper substrate is installed right above the baffle；The continuous organic material evaporating-plating equipment in 24 sources of one kind of the invention can uniformly receive to evaporate the molecule or atom to come up from different vapor deposition molybdenum boats, and heating temperature and the heating time of vapor deposition molybdenum boat are adjusted by the thickness changing trend of organic film and uniformity, to obtain the organic film plating of target component, thickness.
Description
Technical field
The invention belongs to multi-source organic material evaporated device technical fields, the more particularly a kind of continuous organic material in 24 sources
Evaporating-plating equipment.
Background technique
Enterprise is when prepared by the scientific research and small lot for carrying out film new material in one's power for present colleges, Research Center, using vacuum
Coating system realizes the growth of multiclass thin-film material, mainly there is metal evaporation, organic vapor deposition equipment.Organic vapor deposition equipment is main
For the best equipment of organic electroluminescent, illuminating device, solar battery and semiconductor technology research, work efficiency is high, tool
There is the effect got twice the result with half the effort；But existing organic material evaporated device has the disadvantage that (1) same during use
Under evaporating temperature, the vapour pressure of each element is different in alloy, therefore evaporation rate is also different, can generate fractionation phenomenon, often
Less than the alloy or compound film of desired proportional components；(2) when the alloy or change that two or more element composition is deposited
When closing raw material, the film with raw material identical component may not can be obtained；(3) when the alloy for preparing predetermined ingredient with vapour deposition method or
When compound film, evaporation source need to be improved, such as using moment vapour deposition method and double evaporation sources, small organic molecule is after evaporation
It is easy to gather the local non-uniform phenomenon of generation on vacuum cabin head substrate.
Summary of the invention
In order to overcome above-mentioned technical problem, the purpose of the present invention is to provide a kind of continuous organic material vapor deposition dresses in 24 sources
It is standby, it is realized by using 24 organic vapor deposition sources to upper substrate material alloys plated film, can uniformly receive to come from different vapor depositions
Molybdenum boat evaporates the molecule or atom to come up, and vapor deposition molybdenum boat is adjusted by the thickness changing trend of organic film and uniformity
Heating temperature and heating time, to obtain the organic film plating of target component, thickness.
The purpose of the present invention can be achieved through the following technical solutions:
A kind of continuous organic material evaporating-plating equipment in 24 sources, including device framework, the upper end of the device framework are equipped with very
Empty cabin and touch control computer, and touch control computer is located at vacuum chamber one side edge position, the front end of the device framework is equipped with molecule
Pump controller, the vacuum chamber two sides are symmetrically installed with molecular pump, and the inner bottom of the vacuum chamber is equipped with baffle and electrode,
The electrode is located at the bottom end two sides of baffle, and evaporation source selecting hole, the bottom end interposition of the baffle are offered on the baffle
It sets and is connected with No.1 motor, and No.1 motor is located in device framework, is equipped with upper substrate right above the baffle, through true
Empty cabin top left side position is connected with film thickness gauge probe, and film thickness gauge probe stretches to upper substrate surface, runs through the vacuum chamber
Top right side position is equipped with vacuum gauge, gate valve is equipped on the molecular pump, gate valve described in two groups is about vacuum chamber pair
Claim setting；
Movable rear door is installed on the vacuum chamber rear end, is movably installed with front door on the vacuum chamber front end, institute
Stating vacuum chamber bosom position distribution has evaporation source, and the vacuum chamber side offers spare interface.
As a further solution of the present invention: No. two motors, No. two motors are installed right above the vacuum chamber
Be connected with shaft coupling, magnetic fluid in turn from top to bottom and be connected with heating plate through vacuum chamber top center position, it is described on
Substrate is rotated by No. two motors with heating plate is closed.
As a further solution of the present invention: O-ring and clip, and electrode are installed on the upper end inner wall of the vacuum chamber
Pass through with vacuum gauge and is tightly connected at the top of O-ring and clip and vacuum chamber.
As a further solution of the present invention: the back of institute's device framework is equipped with film thickness gauge controller, and film thickness gauge is visited
Head is electrically connected with film thickness gauge controller, and output end and film thickness gauge controller, vacuum gauge, the molecular pump of the touch control computer control
Device and vacuum chamber are electrically connected.
As a further solution of the present invention: lower substrate being installed immediately below the baffle, is provided with 24 on lower substrate
Group vapor deposition molybdenum boat, and material to be deposited is placed on 24 groups of vapor deposition molybdenum boats, the bottom end of the baffle is equipped with lower heating plate, and keeps off
Plate and lower heating plate are connected by the bottom of electrode and vacuum chamber.
As a further solution of the present invention: high vacuum unit, the upper end of the upper substrate are installed in the vacuum chamber
Heating plate is installed.
As a further solution of the present invention: through the molecular pump inside and vacuum chamber side is provided with vacuum
Pipeline, the gate valve and vacuum line cooperate.
As a further solution of the present invention: the evaporating-plating equipment specific steps are as follows:
Step 1: in the upper heating plate and lower heating plate that upper substrate and lower substrate are respectively placed in vacuum chamber, under
Material to be deposited is placed respectively on 24 groups of vapor deposition molybdenum boats of substrate；
Step 2: closing and fastens front door and rear door, and starting high vacuum unit vacuumizes vacuum chamber, reaches to vacuum
When below to target value, upper heating plate to upper substrate heat, lower heating plate to vapor deposition molybdenum boat carry out program heating, lower substrate to
The evaporation source selecting hole gasification evolution that evaporation material is equipped with from baffle in the form of molecule or atom after heated, forms plating material
Steam stream be incident on upper substrate surface, while No. two motors drive upper substrate at the uniform velocity to rotate with heating plate is closed；
Step 3: film thickness gauge probe is installed on the Thickness Variation and uniformly of upper substrate surface and real-time detection upper substrate plated film
Property.
Beneficial effects of the present invention:
1, it realizes by using 24 continuous organic material evaporation sources to baseplate material alloy coating, can effectively avoid
Small organic molecule is easy the upper substrate at the top of vacuum chamber after evaporation and gathers the local non-uniform phenomenon of generation, and upper substrate is at No. two
Cooperate target head to carry out uniform rotation under the action of motor, while film thickness gauge being installed through vacuum chamber top left side and pops one's head in and protrudes into
To upper substrate surface, upper substrate Thickness Variation and uniformity can be detected in real time, it is ensured that coating quality.
2, by offering evaporation source selecting hole on baffle, can be good at treating point generated after evaporation material is heated
Son or atom are selected, to obtain the film with raw material identical component.
3, molecular pump is cooperated to vacuumize vacuum chamber by high vacuum unit, and vacuum gauge can be to true in vacuum chamber
Reciprocal of duty cycle is detected, it is ensured that the vacuum state of vacuum chamber, so that vacuum chamber each alloying element under evaporating temperature of the same race
Vapour pressure is consistent, and avoids evaporation rate different, causes to generate fractionation phenomenon.
Detailed description of the invention
The present invention will be further described below with reference to the drawings.
Fig. 1 is a kind of overall structure diagram of the continuous organic material evaporating-plating equipment in 24 sources of the invention.
Fig. 2 is the schematic diagram of internal structure of vacuum chamber in a kind of continuous organic material evaporating-plating equipment in 24 sources of the invention.
1 in figure, No.1 motor；2, electrode；3, baffle；4, evaporation source selecting hole；5, upper substrate；6, film thickness gauge is popped one's head in；7,
No. two motors；8, vacuum gauge；9, gate valve；10, molecular pump；11, touch control computer；12, molecule pump controller；13, rear door；
14, spare interface；15, evaporation source；16, vacuum chamber；17, front door；18, upper heating plate；19, lower substrate；20, lower heating plate；
21, device framework.
Specific embodiment
Below in conjunction with the embodiment of the present invention, technical scheme in the embodiment of the invention is clearly and completely described,
Obviously, described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.Based in the present invention
Embodiment, all other embodiment obtained by those of ordinary skill in the art without making creative efforts, all
Belong to the scope of protection of the invention.
As shown in Figs. 1-2, the continuous organic material evaporating-plating equipment in a kind of 24 sources, including device framework 21, the device framework
21 upper end is equipped with vacuum chamber 16 and touch control computer 11, and touch control computer 11 is located at 16 one side edge position of vacuum chamber, described
The front end of device framework 21 is equipped with molecule pump controller 12, and 16 two sides of vacuum chamber are symmetrically installed with molecular pump 10, described
The inner bottom of vacuum chamber 16 is equipped with baffle 3 and electrode 2, and the electrode 2 is located at the bottom end two sides of baffle 3, on the baffle 3
Offer evaporation source selecting hole 4, the bottom end middle position of the baffle 3 is connected with No.1 motor 1, and No.1 motor 1 is located at and sets
In standby frame 21, the surface of the baffle 3 is equipped with upper substrate 5, is connected with film thickness through 16 top left side position of vacuum chamber
Instrument probe 6, and film thickness gauge probe 6 stretches to 5 surface of upper substrate, is equipped with vacuum through the 16 top right side position of vacuum chamber
8 are advised, gate valve 9 is installed on the molecular pump 10, gate valve 9 described in two groups is symmetrical arranged about vacuum chamber 16；
Movable rear door 13 is installed on 16 rear end of vacuum chamber, is movably installed with front deck on 16 front end of vacuum chamber
Door 17, the 16 bosom position distribution of vacuum chamber has evaporation source 15, and 16 side of vacuum chamber offers spare interface 14.
The surface of the vacuum chamber 16 is equipped with No. two motors 7, and No. two motors 7 are connected with connection in turn from top to bottom
Axis device, magnetic fluid are simultaneously connected with heating plate 18 through 16 top center position of vacuum chamber, and the upper substrate 5 passes through No. two motors
7 rotate with heating plate 18 is closed.
O-ring and clip are installed, and electrode 2 and vacuum gauge 8 pass through O-ring on the upper end inner wall of the vacuum chamber 16
And it is tightly connected at the top of clip and vacuum chamber 16.
The back of institute's device framework 21 is equipped with film thickness gauge controller, and film thickness gauge probe 6 and film thickness gauge controller are electrical
Connection, output end and film thickness gauge controller, 16 electricity of vacuum gauge 8, molecule pump controller 12 and vacuum chamber of the touch control computer 11
Property connection.
The underface of the baffle 3 is equipped with lower substrate 19, and 24 groups of vapor deposition molybdenum boats, and 24 groups of steamings are provided on lower substrate 19
It is placed with material to be deposited on plating molybdenum boat, the bottom end of the baffle 3 is equipped with lower heating plate 20, and baffle 3 and lower heating plate 20
It is connect by electrode 2 with the bottom of vacuum chamber 16.
High vacuum unit is installed, the upper end of the upper substrate 5 is equipped with heating plate 18 in the vacuum chamber 16.
Through the molecular pump 10 inside and 16 side of vacuum chamber is provided with vacuum line, the gate valve 9 with
Vacuum line cooperation.
The evaporating-plating equipment specific steps are as follows:
Step 1: the upper heating plate 18 and lower heating plate upper substrate 5 and lower substrate 19 being respectively placed in vacuum chamber 16
On 20, material to be deposited is placed respectively on 24 groups of vapor deposition molybdenum boats of lower substrate 19；
Step 2: closing and fastens front door 17 and rear door 13, and starting high vacuum unit vacuumizes vacuum chamber 16, to
When vacuum reaches target value or less, upper heating plate 18 heats upper substrate 5, and 20 pairs of vapor deposition molybdenum boats of lower heating plate carry out program and add
Heat, the evaporation source selecting hole 4 that the material to be deposited of lower substrate 19 is equipped with from baffle 3 in the form of molecule or atom after heated
Gasification evolution, the steam stream for forming plating material is incident on 5 surface of upper substrate, while No. two motors 7 drive with heating plate 18 is closed
Substrate 5 at the uniform velocity rotates；
Step 3: film thickness gauge probe 6 be installed on 5 surface of upper substrate and 5 plated film of real-time detection upper substrate Thickness Variation and
Uniformity.
The continuous organic material evaporating-plating equipment in a kind of 24 sources, at work, firstly, upper substrate and lower substrate are respectively placed in
In upper heating plate and lower heating plate in vacuum chamber, material to be deposited is placed respectively on 24 groups of vapor deposition molybdenum boats of lower substrate,
It is secondary, front door and rear door are closed and fastened, equipment is operated by touch control computer, in the effect of molecule pump controller
Under, powering on, starting high vacuum unit vacuumizes vacuum chamber, when vacuum reaches target value 10-2Pa or less, upper heating
Plate heats upper substrate, and lower heating plate carries out program heating to vapor deposition molybdenum boat, and the material to be deposited of lower substrate is after heated to divide
The evaporation source selecting hole gasification evolution that the form of son or atom is equipped with from baffle, the steam for forming plating material are flowed into upper substrate table
Face, continuous forming core diffusion sublimates to form solid film, and during film forming, No. two motors drive upper substrate under certain speed
Rotation evaporates the molecules or atom that come up from different vapor deposition molybdenum boats for uniformly receiving, and wherein front door and rear door are set
It sets and is installed convenient for the pick-and-place sample of organic source and disassembly in evaporation molybdenum boat, vacuum chamber can be good at vacuum ring needed for providing experiment
Border, electrode and vacuum gauge pass through to be tightly connected at the top of O-ring and clip and vacuum chamber, to improve the leakproofness of vacuum chamber
Can, finally, passing through film thickness gauge controller by the way that film thickness gauge probe through vacuum chamber top left side and is installed on upper substrate surface
The Thickness Variation and uniformity for controlling film thickness gauge probe real-time detection upper substrate plated film, the thickness detected by film thickness gauge probe
The heating temperature of parameter adjustment vapor deposition molybdenum boat and heating time, so that the organic film plating of target component, thickness is obtained, by true
Empty cabin side offers spare interface, can be the other function spare interfaces of extension.
The present invention realizes by using 24 continuous organic material evaporation sources to baseplate material alloy coating, can be effective
It avoids small organic molecule from being easy the upper substrate at the top of vacuum chamber after evaporation and gathers the local non-uniform phenomenon of generation, and upper substrate exists
Cooperate target head to carry out uniform rotation under the action of No. two motors, while film thickness gauge probe being installed simultaneously through vacuum chamber top left side
It is extend into upper substrate surface, upper substrate Thickness Variation and uniformity can be detected in real time, it is ensured that coating quality；By
Evaporation source selecting hole is offered on baffle, can be good at treating the molecule generated after evaporation material is heated or atom is selected
It selects, to obtain the film with raw material identical component；Molecular pump is cooperated to vacuumize vacuum chamber by high vacuum unit, and
Vacuum gauge can detect vacuum degree in vacuum chamber, it is ensured that the vacuum state of vacuum chamber, so that vacuum chamber is of the same race
The vapour pressure of each alloying element is consistent under evaporating temperature, avoids evaporation rate different, causes to generate fractionation phenomenon.
In the description of this specification, the description of reference term " one embodiment ", " example ", " specific example " etc. means
Particular features, structures, materials, or characteristics described in conjunction with this embodiment or example are contained at least one implementation of the invention
In example or example.In the present specification, schematic expression of the above terms may not refer to the same embodiment or example.
Moreover, particular features, structures, materials, or characteristics described can be in any one or more of the embodiments or examples to close
Suitable mode combines.
Above content is only to structure of the invention example and explanation, affiliated those skilled in the art couple
Described specific embodiment does various modifications or additions or is substituted in a similar manner, without departing from invention
Structure or beyond the scope defined by this claim, is within the scope of protection of the invention.
Claims (8)
1. a kind of continuous organic material evaporating-plating equipment in 24 sources, which is characterized in that including device framework (21), the device framework
(21) upper end is equipped with vacuum chamber (16) and touch control computer (11), and touch control computer (11) is located at vacuum chamber (16) one side edge
The front end of position, the device framework (21) is equipped with molecule pump controller (12), and vacuum chamber (16) two sides are symmetrically installed
Have molecular pump (10), the inner bottom of the vacuum chamber (16) is equipped with baffle (3) and electrode (2), and the electrode (2) is located at gear
The bottom end two sides of plate (3) offer evaporation source selecting hole (4) on the baffle (3), the bottom end middle position of the baffle (3)
It is connected with No.1 motor (1), and No.1 motor (1) is located in device framework (21), is equipped with right above the baffle (3)
Substrate (5) is connected with film thickness gauge probe (6) through vacuum chamber (16) top left side position, and film thickness gauge probe (6) stretches to
Substrate (5) surface is equipped with vacuum gauge (8) through the vacuum chamber (16) top right side position, pacifies on the molecular pump (10)
Equipped with gate valve (9), gate valve described in two groups (9) is symmetrical arranged about vacuum chamber (16)；
It is equipped with movable rear door (13) on vacuum chamber (16) rear end, before being movably installed on vacuum chamber (16) front end
Hatch door (17), vacuum chamber (16) the bosom position distribution have evaporation source (15), and vacuum chamber (16) side offers
Spare interface (14).
2. the continuous organic material evaporating-plating equipment in a kind of 24 source according to claim 1, which is characterized in that the vacuum chamber
(16) No. two motors (7) are installed, No. two motors (7) are connected with shaft coupling, magnetic fluid in turn from top to bottom right above
And be connected with heating plate (18) through vacuum chamber (16) top center position, the upper substrate (5) is matched by No. two motors (7)
Close heating plate (18) rotation.
3. the continuous organic material evaporating-plating equipment in a kind of 24 source according to claim 1, which is characterized in that the vacuum chamber
(16) O-ring and clip are installed, and electrode (2) and vacuum gauge (8) pass through O-ring and clip and vacuum on upper end inner wall
It is tightly connected at the top of cabin (16).
4. the continuous organic material evaporating-plating equipment in a kind of 24 source according to claim 1, which is characterized in that institute's device framework
(21) back is equipped with film thickness gauge controller, and film thickness gauge probe (6) and film thickness gauge controller are electrically connected, the touch-control electricity
The output end of brain (11) is electrically connected with film thickness gauge controller, vacuum gauge (8), molecule pump controller (12) and vacuum chamber (16).
5. the continuous organic material evaporating-plating equipment in a kind of 24 source according to claim 1, which is characterized in that the baffle (3)
Underface be equipped with lower substrate (19), 24 groups of vapor deposition molybdenum boats are provided on lower substrate (19), and place on 24 groups of vapor deposition molybdenum boats
Need evaporation material, the bottom end of the baffle (3) is equipped with lower heating plate (20), and baffle (3) and lower heating plate (20) pass through
Electrode (2) is connect with the bottom of vacuum chamber (16).
6. the continuous organic material evaporating-plating equipment in a kind of 24 source according to claim 1, which is characterized in that the vacuum chamber
(16) high vacuum unit is installed in, the upper end of the upper substrate (5) is equipped with heating plate (18).
7. the continuous organic material evaporating-plating equipment in a kind of 24 source according to claim 1, which is characterized in that run through the molecule
It pumps the inside of (10) and vacuum chamber (16) side is provided with vacuum line, the gate valve (9) and vacuum line cooperate.
8. the continuous organic material evaporating-plating equipment in a kind of 24 source according to claim 1, which is characterized in that the evaporating-plating equipment
Specific steps are as follows:
Step 1: the upper heating plate (18) that upper substrate (5) and lower substrate (19) are respectively placed in vacuum chamber (16) is added with lower
On hot plate (20), material to be deposited is placed respectively on 24 groups of vapor deposition molybdenum boats of lower substrate (19)；
Step 2: closing and fastens front door (17) and rear door (13), and starting high vacuum unit vacuumizes vacuum chamber (16),
When vacuum reaches target value or less, upper heating plate (18) heats upper substrate (5), and lower heating plate (20) carries out vapor deposition molybdenum boat
Program heating, the steaming that the material to be deposited of lower substrate (19) is equipped with from baffle (3) in the form of molecule or atom after heated
Plating source selecting hole (4) gasification evolution, the steam stream for forming plating material are incident on upper substrate (5) surface, while No. two motor (7) cooperations
Upper heating plate (18) drives upper substrate (5) at the uniform velocity to rotate；
Step 3: film thickness gauge probe (6) is installed on the Thickness Variation of upper substrate (5) surface and real-time detection upper substrate (5) plated film
And uniformity.
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| CN209508393U (en) * | 2019-01-16 | 2019-10-18 | 合肥百思新材料研究院有限公司 | A kind of continuous organic material evaporating-plating equipment in 24 sources |
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| JP2008121104A (en) * | 2006-10-16 | 2008-05-29 | Able:Kk | Vacuum vapor-deposition apparatus |
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