CN109468077A - 半导体晶圆保护用粘合带 - Google Patents
半导体晶圆保护用粘合带 Download PDFInfo
- Publication number
- CN109468077A CN109468077A CN201811045398.5A CN201811045398A CN109468077A CN 109468077 A CN109468077 A CN 109468077A CN 201811045398 A CN201811045398 A CN 201811045398A CN 109468077 A CN109468077 A CN 109468077A
- Authority
- CN
- China
- Prior art keywords
- adhesive
- adhesive tape
- mentioned
- adhesive phase
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/255—Polyesters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/006—Presence of polyester in the substrate
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017171814A JP6906402B2 (ja) | 2017-09-07 | 2017-09-07 | 半導体ウエハ保護用粘着テープ |
JP2017-171814 | 2017-09-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN109468077A true CN109468077A (zh) | 2019-03-15 |
Family
ID=65663048
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201811045398.5A Pending CN109468077A (zh) | 2017-09-07 | 2018-09-07 | 半导体晶圆保护用粘合带 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6906402B2 (ko) |
KR (1) | KR102525373B1 (ko) |
CN (1) | CN109468077A (ko) |
TW (1) | TWI780212B (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114829533A (zh) * | 2019-12-18 | 2022-07-29 | 积水化学工业株式会社 | 粘接剂、胶带、电器产品、车载部件及固定方法 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7421976B2 (ja) * | 2020-03-27 | 2024-01-25 | 三井化学株式会社 | ペリクル、およびその製造方法 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1670942A (zh) * | 2004-03-17 | 2005-09-21 | 日东电工株式会社 | 切割模片粘接膜 |
CN1690152A (zh) * | 2004-04-22 | 2005-11-02 | 日东电工株式会社 | 粘合剂组合物和其制造方法及其用途 |
CN1927977A (zh) * | 2005-09-06 | 2007-03-14 | 日东电工株式会社 | 粘合片和使用该粘合片的制品的加工方法 |
CN1927978A (zh) * | 2005-09-06 | 2007-03-14 | 日东电工株式会社 | 粘合片和使用该粘合片的制品的加工方法 |
CN101186789A (zh) * | 2006-09-01 | 2008-05-28 | 日东电工株式会社 | 切割用压敏粘着带或片和拾取被加工物的切断片的方法 |
CN101993667A (zh) * | 2009-08-07 | 2011-03-30 | 日东电工株式会社 | 半导体晶圆保持保护用粘合片、半导体晶圆的背面磨削方法 |
CN107112228A (zh) * | 2015-03-02 | 2017-08-29 | 古河电气工业株式会社 | 半导体晶片表面保护用胶带和半导体晶片的加工方法 |
CN109937245A (zh) * | 2016-11-17 | 2019-06-25 | 琳得科株式会社 | 半导体加工用粘合片 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU2003220925A1 (en) * | 2003-03-28 | 2004-10-25 | Denki Kagaku Kogyo Kabushiki Kaisha | Adhesive tape for electronic member |
JP2005019759A (ja) * | 2003-06-27 | 2005-01-20 | Mitsui Chemicals Inc | 半導体ウェハ表面保護用粘着フィルム及び該粘着フィルムを用いる半導体ウェハ保護方法 |
JP4574234B2 (ja) * | 2004-06-02 | 2010-11-04 | リンテック株式会社 | 半導体加工用粘着シートおよび半導体チップの製造方法 |
JP5049620B2 (ja) * | 2007-03-20 | 2012-10-17 | リンテック株式会社 | 粘着シート |
US8368218B2 (en) * | 2009-01-14 | 2013-02-05 | Dow Corning Corporation | Adhesive flexible barrier film, method of forming same, and organic electronic device including same |
JP2010209158A (ja) * | 2009-03-06 | 2010-09-24 | Nitto Denko Corp | 粘着シート及びそれを用いた半導体ウェハの加工方法 |
JP5544766B2 (ja) * | 2009-06-15 | 2014-07-09 | 日立化成株式会社 | 半導体加工用接着フィルム積層体 |
CN104271694B (zh) * | 2012-05-14 | 2017-03-22 | 琳得科株式会社 | 带粘接性树脂层的片和半导体装置的制造方法 |
JP2014210880A (ja) * | 2013-04-19 | 2014-11-13 | 日東電工株式会社 | 熱硬化性樹脂組成物及び半導体装置の製造方法 |
JP2015017159A (ja) * | 2013-07-09 | 2015-01-29 | スリーエム イノベイティブ プロパティズ カンパニー | 半導体ウェハ加工用粘着フィルム、薄層化された半導体ウェハの製造方法及び半導体チップの製造方法 |
JP2015185691A (ja) | 2014-03-24 | 2015-10-22 | 古河電気工業株式会社 | 半導体ウェハ加工用粘着テープ、該粘着テープの製造方法および半導体ウェハの加工方法 |
JP6553331B2 (ja) * | 2014-05-21 | 2019-07-31 | 日東電工株式会社 | 粘着シート |
JP6623210B2 (ja) * | 2015-03-02 | 2019-12-18 | リンテック株式会社 | ダイシングシートおよび半導体チップの製造方法 |
JP6819293B2 (ja) * | 2015-10-29 | 2021-01-27 | 東レ株式会社 | 仮貼り用積層体フィルム、仮貼り用積層体フィルムを用いた基板加工体および積層基板加工体の製造方法、ならびにこれらを用いた半導体装置の製造方法 |
-
2017
- 2017-09-07 JP JP2017171814A patent/JP6906402B2/ja active Active
-
2018
- 2018-08-22 TW TW107129292A patent/TWI780212B/zh active
- 2018-09-04 KR KR1020180105253A patent/KR102525373B1/ko active IP Right Grant
- 2018-09-07 CN CN201811045398.5A patent/CN109468077A/zh active Pending
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1670942A (zh) * | 2004-03-17 | 2005-09-21 | 日东电工株式会社 | 切割模片粘接膜 |
CN1690152A (zh) * | 2004-04-22 | 2005-11-02 | 日东电工株式会社 | 粘合剂组合物和其制造方法及其用途 |
CN1927977A (zh) * | 2005-09-06 | 2007-03-14 | 日东电工株式会社 | 粘合片和使用该粘合片的制品的加工方法 |
CN1927978A (zh) * | 2005-09-06 | 2007-03-14 | 日东电工株式会社 | 粘合片和使用该粘合片的制品的加工方法 |
CN101186789A (zh) * | 2006-09-01 | 2008-05-28 | 日东电工株式会社 | 切割用压敏粘着带或片和拾取被加工物的切断片的方法 |
CN101993667A (zh) * | 2009-08-07 | 2011-03-30 | 日东电工株式会社 | 半导体晶圆保持保护用粘合片、半导体晶圆的背面磨削方法 |
CN107112228A (zh) * | 2015-03-02 | 2017-08-29 | 古河电气工业株式会社 | 半导体晶片表面保护用胶带和半导体晶片的加工方法 |
CN109937245A (zh) * | 2016-11-17 | 2019-06-25 | 琳得科株式会社 | 半导体加工用粘合片 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114829533A (zh) * | 2019-12-18 | 2022-07-29 | 积水化学工业株式会社 | 粘接剂、胶带、电器产品、车载部件及固定方法 |
Also Published As
Publication number | Publication date |
---|---|
TWI780212B (zh) | 2022-10-11 |
JP2019047075A (ja) | 2019-03-22 |
KR102525373B1 (ko) | 2023-04-26 |
TW201912746A (zh) | 2019-04-01 |
JP6906402B2 (ja) | 2021-07-21 |
KR20190027731A (ko) | 2019-03-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20190315 |
|
WD01 | Invention patent application deemed withdrawn after publication |