CN109390243A - 具有粘附层的功率电子组件，以及用于制造所述组件的方法 - Google Patents

具有粘附层的功率电子组件，以及用于制造所述组件的方法 Download PDF

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Publication number
CN109390243A
CN109390243A CN201810872291.1A CN201810872291A CN109390243A CN 109390243 A CN109390243 A CN 109390243A CN 201810872291 A CN201810872291 A CN 201810872291A CN 109390243 A CN109390243 A CN 109390243A
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CN
China
Prior art keywords
adhesion layer
power electronics
electronics assemblies
roughness
power semiconductor
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CN201810872291.1A
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English (en)
Inventor
H·U·萨格鲍姆
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Semikron GmbH and Co KG
Semikron Elektronik GmbH and Co KG
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Semikron GmbH and Co KG
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Publication of CN109390243A publication Critical patent/CN109390243A/zh
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Abstract

提出了一种方法和由该方法制造的组件，该组件配置为具有基板、具有功率半导体元件和设置在它们之间的粘附层，其中基板具有面向功率半导体元件的第一表面，其中功率半导体元件具有面向基板的第三表面，其中粘附层具有第二表面，该第二表面优选地跨整个区域接触第三表面并且具有第一一致的表面轮廓，该第一一致的表面轮廓具有第一粗糙度，并且其中功率半导体元件的与第三表面相对的第四表面具有第二表面轮廓，该第二表面轮廓具有第二粗糙度，所述第二表面轮廓遵循第一表面轮廓。

Description

具有粘附层的功率电子组件，以及用于制造所述组件的方法
技术领域
本发明涉及一种功率电子组件，所述功率电子组件具有基板、具有功率半导体元件和设置在它们之间的粘附层。本发明还描述了一种用于配置这种类型的功率电子组件的方法。
背景技术
当前从通常已知的现有技术中获知的是：粘附层通过各种方法设置在基板上，例如通过丝网印刷或模版印刷。此后，特别是配置为功率半导体元件的配合部件设置在粘附层上。取决于附加层的设计实施例，还执行进一步的工业标准方法步骤，以便最终在基板和功率半导体元件之间配置材料一体连接。工业标准方法特别是焊接、粘附剂粘结和加压烧结方法。
材料一体连接的耐久性不足，特别是在温度波动下耐久性不足，是常见的缺点。
发明内容
注意到所述情况，本发明的目的在于提供一种功率电子组件以及用于制造后者即功率电子组件的方法，其中改善了材料一体连接的耐久性。
根据本发明，该目的通过如下所述的功率电子组件和如下所述的方法来实现。
根据本发明的功率电子组件配置为具有基板、具有功率半导体元件和设置在它们之间的粘附层，其中基板具有面向功率半导体元件的第一表面，其中功率半导体元件具有面向基板的第三表面，其中粘附层具有第二表面，该第二表面优选地跨整个区域接触第三表面并且具有第一一致的表面轮廓，该第一一致的表面轮廓具有第一粗糙度，并且其中功率半导体元件的与第三表面相对的第四表面具有第二表面轮廓，该第二表面轮廓具有第二粗糙度，所述第二表面轮廓遵循第一表面轮廓。在本文和下文中术语轮廓应理解为两个“轮廓”具有相同类型的三维结构，其中结构的高度不必相同。术语“粗糙度”在本文和下文中应理解为根据DIN 4760的平均粗糙度Ra。以这种方式配置的功率电子组件具有显著的优点，即第二和第三表面之间的连接得到显著改善。这是由于三维特性与结构的细度因此与粗糙度相结合所导致的。
在组件的一个优选设计实施例中，第二粗糙度的值在第一粗糙度的值的50％和100％之间，优选地在85％和99％之间，以及特别优选地在95％和99％之间。
有利的是，第一粗糙度被配置成以一致或不一致的方式从功率半导体元件的中心朝向外部变化。因此，分配给功率半导体元件的中心的第一粗糙度可以高于或低于功率半导体元件的周边上的粗糙度。
优选的，在功率半导体元件的中心和下面限定的粘附层(2)的第一平均厚度在10μm和200μm之间，优选地在20μm和100μm之间，以及特别优选地在10μm和30μm之间，或在50μm和80μm之间。在此，第一值范围对于烧结金属层是特别优选的，而在焊料层的情况下第二值范围是优选的。对于粘附层而言的值没有明显优选的限定范围，因为该层的特定性质共同决定了优选的值范围。平均厚度在本文和下文中应理解为一范围的平均值，该范围足够大以便在确定厚度时粗糙度的影响被平均化。换言之，平均厚度值不考虑所分配表面的粗糙度，因为到确定粗糙度的中心线为止来测量厚度。
第一粗糙度优选具有的值在粘附层的第一平均厚度的5％和50％之间，优选10％和30％之间，以及特别优选15％和20％之间。
在功率半导体元件的周边和下面限定的粘附层的第二平均厚度具有的值最大为第一平均厚度的95％，优选最大为第一平均厚度的90％，以及特别优选最大为第一平均厚度的80％。
在一个优选的设计实施例中，基板配置成刚性的，特别是具有陶瓷基板载体，该陶瓷基板载体具有设置在其上的金属导体路径。在另一个优选的设计实施例中，基板配置成柔性的，特别是配置成具有薄膜/箔型电绝缘基板载体，其具有设置于其上的金属导体路径。
根据本发明的用于制备根据本发明的组件的方法包括顺序为a-b-c-d-e的以下方法步骤，其中步骤b)和c)可以同时进行，或包括顺序为a-c-b-d-e的以下方法步骤：
a)提供基板和功率半导体元件；
b)将粘附层设置在基板的第一表面上；
c)构造粘附层的第二表面以配置一致的表面结构；
d)设置功率半导体元件，其中其第三表面位于粘附层的第二表面上；
e)将功率半导体元件连接到粘附层。
在此可有利的是，粘附层通过丝网印刷(screen printing)方法设置在基板的第一表面上，并且表面结构通过丝网印刷方法至少初始地配置，因此不是最终的表现形式，特别地还不是最终的第一粗糙度。
替代地，粘附层可以通过模版印刷(stencil printing)方法设置在基板的第一表面上。在此的表面结构可以通过压印印模(embossing stamp)产生。
另一种可能的替代方案是将粘附层设置在中间载体上，特别是将粘附层设置在载体板材或载体薄膜/箔上，并通过转移方法从中间载体放置到基板的第一表面上。在此的表面结构可以由中间载体的第五表面的负性结构(negative structure)产生。
只要没有明确地或本身地排除，或者与本发明的概念相矛盾，则在每种情况下以单数形式提到的特征，特别是功率半导体元件和粘附层，当然在加压烧结方法的背景下可以复数存在。
应当理解的是，本发明的各种设计实施例，无论后者是在组件或方法的上下文中提及，都可以单独地或以任意组合实现，以便实现改进。具体地，在不脱离本发明范围的情况下，上文和下文提到和解释的特征不仅可以所述的组合使用，而且可以其他组合使用或单独使用。
附图说明
本发明的进一步解释、有利的细节和特征源自本发明的示例性实施例的以下描述，其在图1至图5中示意性地且未按比例示出，或者从其相应的部分示出。
在附图中：
图1示出根据本发明的第一功率电子组件，其具有附加的连接装置；
图2示出根据本发明的第二功率电子组件；
图3示出根据本发明的第三功率电子组件，其具有附加的连接装置；以及
图4和图5示出根据本发明的功率电子组件的第三表面的特殊设计实施例。
具体实施方式
图1示出根据本发明的第一功率电子组件，其具有附加的连接装置5。示出了基本上工业标准的功率电子装置基板1，其在此配置成具有刚性基板载体10，刚性基板载体10配置成绝缘材料构件，特别地由具有300μm厚度的工业陶瓷制成。在所述绝缘材料构件10上设置导体路径12，该导体路径12配置成铜层压件，其同样具有300μm的厚度。对于设置在所述铜层压件上的薄的贵金属层也是工业标准的，因此，薄的贵金属层具有第一表面120。
对于所述导体路径12和功率半导体元件2(以示例性的方式为晶体管或二极管)之间的导电和导热的材料一体连接而言，这样的连接配置成通过烧结连接、特别是加压烧结连接是工业标准的。为此目的，功率半导体元件3具有面向第一表面的第三表面320，工业标准的薄的贵金属同样设置在所述第三表面320上。
在此配置为烧结金属层的粘附层2设置在第一表面120和第三表面320之间。工业标准的烧结金属层由烧结材料制成，优选地由液体和银薄片的悬浮体构成，其设置在两个配合部件之间。通过压力对两个配合部件的影响并且在大多数情况下还通过温度对两个配合部件的影响将该烧结材料转移到烧结金属层中。
在此烧结金属层2具有跨整个范围的平均厚度约为20μm。此外，根据本发明，所述烧结金属层2，更具体地其面向功率半导体元件3的第二表面220，具有第一一致的表面轮廓，第一一致的表面轮廓具有第一粗糙度。在该第一功率电子组件的情况下，第二表面220的表面轮廓被配置成不规则的。在此，第二表面220的第一粗糙度具有约4μm的值Ra。。
纯粹为了清楚起见，功率半导体元件3被示出为被间隔开。诸如在此所示的工业标准功率半导体元件具有的厚度在约为50μm至120μm的范围内，这就是所述功率半导体元件尽管具有晶体结构而在一定限度内是柔性的原因。第三表面320几乎跨整个区域接触第二表面220。
功率半导体元件3的第四表面340与第三表面320相对定位，并且根据本发明具有第二表面轮廓，该第二表面轮廓具有第二粗糙度，其中第二表面轮廓由于上述配置烧结连接的过程而遵循第一表面轮廓。该第四表面340的第二粗糙度约为第一粗糙度的值的98％。换言之，烧结层的结构在功率半导体元件3的第四表面340上几乎再现，并且在该设计实施例中可以在没有视觉辅助的情况下被识别。
为了配置具有第一粗糙度的第一表面轮廓，可以在根据本发明方法的方法步骤c)中配置期望的第一表面轮廓，其中借助于压印印模在烧结材料的第二表面220中压印所述第一表面轮廓，也就是说在烧结连接的配置之前和烧结材料转化为烧结金属之前。在压印的时间点时，粗糙度仍然可以具有一值，其等于后面烧结金属层的第二表面的值的两倍。
此外示出了功率半导体元件3的另一个导电连接，特别是后者即功率半导体元件3的第四表面340的导电连接，纯粹为了清楚起见而间隔开。该第四表面通过烧结金属4构成的另一层连接到连接装置5。该工业标准的连接装置由导电和电绝缘薄膜/箔50,52,54的序列层组成。
图2示出根据本发明的第二功率电子组件。图示的是柔性基板1，在此其配置成具有为基板载体的具有50μm厚度的绝缘材料薄膜/箔14。构成导体路径并且具有80μm厚度的金属箔16设置在所述绝缘材料薄膜/箔14上。对于要设置在所述金属箔16上的非常薄的贵金属层而言，同样是工业标准，因此，薄的贵金属层具有第一表面160。
在此的压力烧结连接还构成所述导体路径16和功率半导体元件3之间的导电的材料一体连接。为此目的，功率半导体元件具有面向第一表面的第三表面320，同样在所述第三表面320上设置薄的贵金属层。
在此同样配置成烧结金属层的粘附层2设置在第一表面120和第三表面320之间。在此烧结金属层2跨整个范围具有的平均厚度约为15μm。此外，根据本发明的第二表面220具有第一一致的表面轮廓，该第一表面轮廓具有第一粗糙度。在该第一功率电子组件的情况下，第二表面220的表面轮廓以规则的方式配置。在此，第二表面220的第一粗糙度具有约2μm的值Ra。
纯粹为了清楚起见功率半导体元件3被示出为间隔开。在此功率半导体元件3具有的厚度约为60μm。功率半导体元件3的第三表面320跨整个区域接触第二表面220。
根据本发明的功率半导体元件3的第四表面340具有第二表面轮廓，该第二表面轮廓具有第二粗糙度，其中第二表面轮廓同样遵循第一表面轮廓。所述第四表面340的第二粗糙度约为第一粗糙度值的99％。换言之，烧结层2的结构在功率半导体元件3的第四表面340上几乎完全再现，并且在没有视觉辅助的情况下同样可识别。
为了配置具有第一粗糙度的第一表面轮廓，可以在根据本发明方法的方法步骤c)中配置所需的第一表面轮廓，其中通过丝网印刷方法施加烧结材料，由此，通过适当选择丝网结构和烧结材料的粘度，自动配置表面轮廓。在压印的该时间点，粗糙度可具有的值仍然高于后面的烧结金属层的第二表面的值。
图3示出根据本发明的第三功率电子组件，其具有附加的连接装置5，其方式类似于根据图1的方式。在此的实质区别在于，粘附层2(在此是粘附剂层)不具有均匀的平均厚度，而是在功率半导体元件3的中心具有约80μm的第一平均厚度，而在功率半导体元件3的周边区域中的平均厚度约为70μm。由于上述已经提到的原因，这种类型的功率半导体元件3的曲度没有问题，特别是出于所述功率半导体元件3的较小厚度的原因。
从原则上而言，在没有在此明确表示的情况下，第二表面220和第四表面340具有根据本发明的表面轮廓，其分别具有指定的第一和第二粗糙度。
在指定方法的上下文中，在步骤b)中将处于非交联状态的相应粘附剂层施加到导体路径12的第一表面120。在此使用具有高粘度的粘附剂。此后，功率半导体元件3设置在粘附剂层2上并通过印模(印模具有包括曲率的限定表面轮廓)固定，直到粘附剂的交联已经进行到足够的程度使得粘附层2的第二表面220的形状不再被改变或至少不再被基本上改变。
图4和图5示出根据本发明的功率电子组件的第二表面220的特殊设计实施例。在每种情况下示出的是粘附层2，优选地是由烧结金属构成的层，其具有第一表面轮廓。作为烧结材料的这些层已经在制备方法的背景下通过模版印刷方法施加到导体路径12上，并且随后通过压印方法构造表面，也就是说，表面结构已经配置成具有限定的粗糙度。
在通过加压烧结方法将烧结材料转变成由烧结金属2构成的层时，根据图4的位于中心的第二表面220具有一定的粗糙度，该粗糙度具有的值对应于周边粗糙度值的约一半，所述中心也对应于待设置的功率半导体元件3的中心，所述周边也对应于待设置的功率半导体元件3的周边。因此，该粗糙度的值从中心朝向周边稳定地增加。
根据图5的第二表面220的粗糙度对应于根据图4的粗糙度。然而，在由烧结金属制成该层的情况下，中心的第一平均厚度224小于周边上的第一平均厚度。周边上的第二平均厚度226约比中心的第二平均厚度高出5％。

Claims (26)

1.功率电子组件，其具有基板(1)、具有功率半导体元件(3)和设置在它们之间的粘附层(2)，其中基板(1)具有面向功率半导体元件(3)的第一表面(120,160)，其中功率半导体元件(3)具有面向基板(2)的第三表面(320)，其中粘附层(2)具有第二表面(220)，该第二表面(220)接触第三表面(320)并且具有第一一致的表面轮廓，该第一一致的表面轮廓具有第一粗糙度，并且其中功率半导体元件(3)的与第三表面(320)相对的第四表面(340)具有第二表面轮廓，该第二表面轮廓具有第二粗糙度，所述第二表面轮廓遵循第一表面轮廓。
2.根据权利要求1所述的功率电子组件，其特征在于：
第二粗糙度的值在第一粗糙度的值的50％和100％之间。
3.根据权利要求1所述的功率电子组件，其特征在于：
第二粗糙度的值在第一粗糙度的值的85％和99％之间。
4.根据权利要求1所述的功率电子组件，其特征在于：
第二粗糙度的值在第一粗糙度的值的95％和99％之间。
5.根据前述权利要求任一项所述的功率电子组件，其特征在于：
第一粗糙度被配置成以一致或不一致的方式从功率半导体元件(3)的中心朝向外部变化。
6.根据前述权利要求1-4中任一项所述的功率电子组件，其特征在于：
在功率半导体元件(3)的中心限定的粘附层(2)的第一平均厚度(224)在10μm和200μm之间。
7.根据前述权利要求1-4中任一项所述的功率电子组件，其特征在于：
在功率半导体元件(3)的中心限定的粘附层(2)的第一平均厚度(224)在20μm和100μm之间。
8.根据前述权利要求1-4中任一项所述的功率电子组件，其特征在于：
在功率半导体元件(3)的中心限定的粘附层(2)的第一平均厚度(224)在10μm和30μm之间，或在50μm和80μm之间。
9.根据前述权利要求1-4中任一项所述的功率电子组件，其特征在于：
第一粗糙度具有的值在粘附层(2)的第一平均厚度(224)的5％和50％之间。
10.根据前述权利要求1-4中任一项所述的功率电子组件，其特征在于：
第一粗糙度具有的值在粘附层(2)的第一平均厚度(224)的10％和30％之间。
11.根据前述权利要求1-4中任一项所述的功率电子组件，其特征在于：
第一粗糙度具有的值在粘附层(2)的第一平均厚度(224)的15％和20％之间。
12.根据前述权利要求1-4中任一项所述的功率电子组件，其特征在于：
粘附层(2)构造为粘附剂连接层或焊料层或烧结金属层。
13.根据前述权利要求1-4中任一项所述的功率电子组件，其特征在于：
在功率半导体元件(3)的周边限定的粘附层(2)的第二平均厚度(226)具有的值最大为第一平均厚度(224)的95％。
14.根据前述权利要求1-4中任一项所述的功率电子组件，其特征在于：
在功率半导体元件(3)的周边限定的粘附层(2)的第二平均厚度(226)具有的值最大为第一平均厚度(224)的90％。
15.根据前述权利要求1-4中任一项所述的功率电子组件，其特征在于：
在功率半导体元件(3)的周边限定的粘附层(2)的第二平均厚度(226)具有的值最大为第一平均厚度(224)的80％。
16.根据权利要求1-4中任一项所述的功率电子组件，其特征在于：
基板(1)配置成刚性的。
17.根据权利要求1-4中任一项所述的功率电子组件，其特征在于：
基板(1)配置成具有陶瓷基板载体(10)，该陶瓷基板载体(10)具有设置在其上的金属导体路径(12)。
18.根据权利要求1-4中任一项所述的功率电子组件，其特征在于：
基板(1)配置成柔性的。
19.根据权利要求1-4中任一项所述的功率电子组件，其特征在于：
基板(1)配置成具有薄膜/箔型电绝缘基板载体(14)，其具有设置于其上的金属导体路径(16)。
20.用于制备根据前述权利要求任一项所述的功率电子组件的方法，其包括顺序为a-b-c-d-e的以下方法步骤，其中步骤b)和c)可以同时进行，或包括顺序为a-c-b-d-e的以下方法步骤：
a)提供基板(1)和功率半导体元件(3)；
b)将粘附层(2)设置在基板(1)的第一表面上(120,160)；
c)构造粘附层(2)的第二表面(220)以配置一致的表面结构；
d)设置功率半导体元件(3)，其中其第三表面(320)位于粘附层(2)的第二表面(220)上；
e)将功率半导体元件(3)连接到粘附层(2)。
21.根据权利要求20所述的方法，其特征在于：
粘附层(2)通过丝网印刷方法设置在基板(1)的第一表面(120,160)上，并且表面结构通过丝网印刷方法至少初始地配置。
22.根据权利要求20所述的方法，其特征在于：
粘附层(2)通过模版印刷方法设置在基板(1)的第一表面(120,160)上。
23.根据权利要求22所述的方法，其特征在于：
表面结构通过压印印模产生。
24.根据权利要求20所述的方法，其特征在于：
将粘附层(2)设置在中间载体上，并通过转移方法从中间载体放置到基板(1)的第一表面(120,160)上。
25.根据权利要求24所述的方法，其特征在于：
中间载体是载体板材或载体薄膜/箔。
26.根据权利要求24或25所述的方法，其特征在于：
表面结构由中间载体的第五表面的负性结构产生。
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