CN109301059A - Bonding wire packaging technology, LED component and the LED light of LED component - Google Patents
Bonding wire packaging technology, LED component and the LED light of LED component Download PDFInfo
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- CN109301059A CN109301059A CN201811105067.6A CN201811105067A CN109301059A CN 109301059 A CN109301059 A CN 109301059A CN 201811105067 A CN201811105067 A CN 201811105067A CN 109301059 A CN109301059 A CN 109301059A
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- 238000012536 packaging technology Methods 0.000 title claims abstract description 55
- 230000002787 reinforcement Effects 0.000 claims abstract description 196
- 238000003466 welding Methods 0.000 claims abstract description 142
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 11
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 32
- 229910001316 Ag alloy Inorganic materials 0.000 claims description 18
- 229910052763 palladium Inorganic materials 0.000 claims description 16
- 229910045601 alloy Inorganic materials 0.000 claims description 9
- 239000000956 alloy Substances 0.000 claims description 9
- 230000005611 electricity Effects 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 230000007704 transition Effects 0.000 description 15
- 230000006872 improvement Effects 0.000 description 10
- 238000000034 method Methods 0.000 description 10
- 238000001816 cooling Methods 0.000 description 6
- 238000005538 encapsulation Methods 0.000 description 6
- 238000004806 packaging method and process Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000009863 impact test Methods 0.000 description 3
- 230000004807 localization Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000004073 vulcanization Methods 0.000 description 3
- 239000000084 colloidal system Substances 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 229910000967 As alloy Inorganic materials 0.000 description 1
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000010186 staining Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 238000005987 sulfurization reaction Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
Abstract
The invention discloses a kind of bonding wire packaging technologies of LED component, LED component includes the bonding wire of LED chip, the bracket for carrying LED chip and at least one electric connection LED chip and bracket, bonding wire packaging technology is the following steps are included: welding wire is mounted on the chopper of bonding equipment by (1), and the bracket for being equipped with chip is located in wire welding area；(2) end of welding wire is sintered to form the first reinforcement ball, and reinforces ball bonding on the electrode of LED chip for first；(3) then the end of welding wire is welded on bracket by welding wire along the operation of setting track under the driving of chopper；(4) welding wire is cut off, sinters the welding wire on chopper into second reinforcement ball, then reinforces ball bonding for second and reinforces on ball first, and the second reinforcement ball is made at least to cover the first intermediate location for reinforcing ball and bonding wire.The invention also discloses a kind of LED component and LED light.The long service life of LED component of the invention.
Description
Technical field
The present invention relates to the bonding wire packaging technology of technical field of semiconductors more particularly to a kind of LED component, using the encapsulation
Technique encapsulates the LED light of this LED component of the LED component and application of bonding wire.
Background technique
The LED component of the prior art includes bracket, LED chip and bonding wire, the LED chip by bonding wire and bracket or
The connection of another LED chip of person covers packing colloid after the welding of LED component completion bonding wire again.Wherein, the weldering in LED component
Line is to guide bonding wire mobile according to the track of setting by chopper, and blade structure is as shown in Fig. 1, and chopper 1a is equipped with for bonding wire 2a
The top of the centre bore 11a passed through, chopper 1a are equipped with wire clamp 3a, when encapsulating the bonding wire of LED component, pass through the fixed bonding wire of wire clamp 3a
2a, convenient for bonding wire cutting etc..
Since the electrode of chip is more fragile, so a soldered ball generally can be first put on chip electrode, then again by soldered ball
Draw bonding wire outward to be formed in LED component for connecting the bonding wire of chip and bracket or chip and chip.Wherein, bonding wire
It is to sinter soldered ball by electronic flame-off wand sparking, bonding wire passes through the bonding wire meeting after electronic flame-off wand sparking with soldered ball adjacent part
Heat affected area is formed, heat affected area is due to coarse grains, and mechanical performance is declined relative to other positions, especially in soldered ball
It is the most fragile with the part of bonding wire transition, when packing colloid can generate centainly bonding wire due to expanding with heat and contract with cold at work
Stress, at this point, the part of bonding wire and soldered ball transition is easy to be torn, to influence the service life of entire device.Similarly, work as weldering
There is also identical problems with the connection of the bracket of LED component for the heat affected area of line.
The heat affected area service life in order to solve the problems, such as bonding wire is low, and the prior art is arranged to linearly at the both ends of bonding wire.
Such as notification number be CN204204914U Chinese utility model patent, the both ends of disclosed bonding wire be respectively vertical section 1b and
Straightway 2b, wherein the length of vertical section 1b and straightway 2b are greater than the length of heat affected area, i.e., heat are avoided at the position of bending
The zone of influence, to improve the whole service life of bonding wire.
Bonding wire will receive the influence that packaging plastic expands with heat and contract with cold during LED component use, the different parts of bonding wire
Thermal stress also can be different, and when bonding wire whole height is higher, service life can be shorter.And use LED disclosed in above-mentioned China
When encapsulating structure, necessarily it will affect since it is equipped with vertical section so the height of bonding wire is at least greater than the height of vertical section
The service life of bonding wire.
On the basis of the LED encapsulation structure disclosed in above-mentioned China, the prior art, which has been done, further to be improved, but is improved
LED component afterwards is using the arc for changing bonding wire to improve its service life, such as Publication No. CN 106784242A
The Chinese invention patent of Chinese invention patent and CN107978668A.Which kind of, regardless of the bonding wire using arc, it is necessarily required to
It solves the problems, such as that the heat affected area of bonding wire is fragile by vertical section, and will affect the whole height of bonding wire using vertical section,
Its service life that still will affect bonding wire.In addition, Publication No. CN 106784242A and Publication No. CN107978668A
Two parts of Chinese invention patents be required to using specific arc can achieve the effect that improve the service life, thus improve bonding wire plus
Work difficulty, and will limit the scope of application of bonding wire.
Summary of the invention
Technical problem to be solved by the present invention lies in provide a kind of bonding wire packaging technology of LED component, improve bonding wire
Service life, and then improve the bulk life time of LED component.
The technical problems to be solved by the invention also reside in, and provide a kind of bonding wire packaging technology of LED component, reduce bonding wire
Whole difference in height.
In order to solve the above-mentioned technical problems, the present invention provides a kind of bonding wire packaging technology of LED component, the LED device
Part includes the bonding wire of LED chip, the bracket for carrying LED chip and at least one electric connection LED chip and bracket, institute
State bonding wire packaging technology the following steps are included:
(1) welding wire is mounted on the chopper of bonding equipment, and the bracket for being equipped with chip is located in wire welding area；
(2) end of welding wire is sintered to form the first reinforcement ball, and reinforces ball bonding in the electrode of LED chip for first
On；
(3) then the end of welding wire is welded on bracket by welding wire along the operation of setting track under the driving of chopper, from
And form the bonding wire of connection LED chip and bracket；
(4) welding wire is cut off, sinters the welding wire on chopper into second reinforcement ball, then reinforces ball bonding first for second
Reinforce on ball, and the second reinforcement ball is made at least to cover the intermediate location of the first reinforcement ball and bonding wire, has welded the second reinforcement
Welding wire is cut off after ball.
As an improvement of the above scheme, step (11) are equipped between the step (1) and step (2), the step (11)
It include: to be sintered the end of soldered ball to form assistant reinforcement ball, and then assistant reinforcement ball bonding is cut off in the welding section of bracket
Welding wire；
In step (3), the end of the welding wire is welded on assistant reinforcement ball.
It as an improvement of the above scheme, further include step (5), the step (5) includes: to be sintered the end of welding wire to be formed
Third reinforces ball, and third is reinforced ball bonding on assistant reinforcement ball, and third is made to reinforce ball at least covering part bonding wire.
Another embodiment of bonding wire packaging technology as LED component, the LED component include LED chip, for holding
Carry LED chip bracket and at least one be electrically connected LED chip and bracket bonding wire, the bonding wire packaging technology include with
Lower step:
(1) welding wire is mounted on the chopper of bonding equipment, and the bracket for being equipped with chip is located in wire welding area；
(2) end of welding wire is sintered to form assistant reinforcement ball, and by assistant reinforcement ball bonding LED chip electrode
On；
(3) welding wire is cut off, the welding wire on chopper is sintered to form the first reinforcement ball, and reinforces ball bonding in bracket for first
Welding section；
(4) then the end of welding wire is welded on assistant reinforcement along the operation of setting track under the driving of chopper by welding wire
On ball, to form the bonding wire of connection LED chip and bracket；
(5) welding wire is cut off, sinters the welding wire on chopper into second reinforcement ball, then reinforces ball bonding first for second
Reinforce on ball, and the second reinforcement ball is made at least to cover the intermediate location of the first reinforcement ball and bonding wire, has welded the second reinforcement
Welding wire is cut off after ball.
It as an improvement of the above scheme, further include step (6), the step (6) includes: to be sintered the end of welding wire to be formed
Third reinforces ball, and third is then reinforced ball bonding on assistant reinforcement ball, and third is made to reinforce ball at least covering part bonding wire.
Another embodiment of bonding wire packaging technology as LED component, the LED component include LED chip, for holding
The bracket of LED chip and the bonding wire of at least one two LED chips of electric connection are carried, the bonding wire packaging technology includes following
Step:
(1) welding wire is mounted on the chopper of bonding equipment, and the bracket for being equipped with chip is located in wire welding area；
(2) end of welding wire is sintered to form assistant reinforcement ball, and by an assistant reinforcement ball bonding LED chip wherein
Electrode on, then cut off welding wire；
(3) end of welding wire is sintered to form the first reinforcement ball, and reinforces ball bonding in another LED chip for first
On electrode；
(4) then the end of welding wire is welded on assistant reinforcement along the operation of setting track under the driving of chopper by welding wire
On ball, to form the bonding wire of two LED chips of connection；
(5) welding wire is cut off, sinters the welding wire on chopper into second reinforcement ball, then reinforces ball bonding first for second
Reinforce on ball, and the second reinforcement ball is made at least to cover the intermediate location of the first reinforcement ball and bonding wire, has welded the second reinforcement
Welding wire is cut off after ball.
It as an improvement of the above scheme, further include step (6), the step (6) includes: to be sintered the end of welding wire to be formed
Third reinforces ball, and third is then reinforced ball bonding on assistant reinforcement ball, and third is made to reinforce ball at least covering part bonding wire.
As an improvement of the above scheme, the lower end of the chopper is equipped with rounded corner, and the diameter of the rounded corner is D1, described
The diameter of first reinforcement ball and the second reinforcement ball is D2, and the D2 is greater than D1, and D2 subtracts D1 equal to 8~25 μm.
As an improvement of the above scheme, the welding wire is silver alloy wire rod, and the surface of the silver alloy wire rod is coated with palladium layers.
As an improvement of the above scheme, the silver alloy wire rod is cylinder, the diameter and palladium layers of the silver alloy wire rod
Between thickness ratio be (400:1)~(800:1).
Correspondingly, the invention also discloses a kind of LED component, including LED chip, for carry the bracket of LED chip with
And at least one be electrically connected LED chip and bracket bonding wire, be welded with the first reinforcement ball on the electrode of the LED chip, it is described
One end of bonding wire is drawn to bracket by the first reinforcement ball and is connect, and is welded with covering at least partly bonding wire on the first reinforcement ball
Second reinforces ball；
Alternatively, being welded with assistant reinforcement ball on the electrode of the LED chip, the first reinforcement ball is welded on the bracket, it is described
One end of bonding wire is drawn to assistant reinforcement ball by the first reinforcement ball and is connect, and is welded with covering at least partly on the first reinforcement ball
The second of bonding wire reinforces ball.
As another embodiment of LED component, LED component disclosed in this invention includes at least two LED chips, is used for
The bracket of LED chip and the bonding wire of at least one two LED chips of electric connection are carried, two LED chips are respectively first
LED chip and the second LED chip are welded with assistant reinforcement ball on the electrode of first LED chip, second LED chip
It is welded with the first reinforcement ball on electrode, one end of the bonding wire, which is drawn by the first reinforcement ball to assistant reinforcement ball, to be connect, and described the
The second of covering at least partly bonding wire, which is welded with, on one reinforcement ball reinforces ball.
As an improvement of the above scheme, the bonding wire is silver alloy wire rod, and the surface of the silver alloy wire rod is equipped with palladium layers.
Correspondingly, the invention also discloses a kind of LED light, including at least one LED component of the present invention.
Implement the embodiment of the present invention, has the following beneficial effects:
1, bonding wire packaging technology, LED component and the LED light of LED component of the invention pass through phase of burn-oning on LED chip
The reinforcement ball answered improves the reliability connected between bonding wire and LED core plate electrode, in addition, the reinforcement ball burn-on on LED chip
It can prevent from generating directly compressing to LED core plate electrode in bonding wire and LED core plate electrode connection procedure, and then improve LED component
Reliability when bonding wire encapsulates.
2, when using the bonding wire packaging technology of LED component of the invention, bonding wire is reinforced ball by first and is drawn, bonding wire and first
Reinforce the most weak transition portion in the heat affected area formed between ball and pass through the covering of the second reinforcement ball again, the second reinforcement ball can mention
The fastness that high first reinforcement ball is connected with bonding wire.Even if packaging plastic LED component work when generate it is biggish expand with heat and contract with cold, weld
Line and the position of the first reinforcement ball transition are also less likely to occur to be broken under the protection of the first reinforcement ball and the second reinforcement ball.It can
See, the service life of bonding wire can be improved using the LED component that bonding wire packaging technology of the present invention is processed, and then improve LED component
Whole service life.
3, when using the bonding wire packaging technology of LED component of the invention, due to the first bonding wire for connecting of reinforcement ball can
It is improved by property, at this point, bonding wire is not easy to reinforce ball disengaging with first, so one end that bonding wire is connect with the first reinforcement ball is without another
Outer setting vertical section, and then the difference in height between bonding wire highest point and LED chip can be reduced, and lower bonding wire can be into one
Step improves the service life of bonding wire.
4, the bonding wire in LED component of the invention reinforces ball extraction by first, is formed between bonding wire and the first reinforcement ball
The most weak transition portion in heat affected area passes through the covering of the second reinforcement ball again, and the first reinforcement ball and weldering can be improved in the second reinforcement ball
The fastness of line connection.Even if packaging plastic LED component work when generate it is biggish expand with heat and contract with cold, bonding wire with first reinforcement ball mistake
The position crossed also is less likely to occur to be broken under the protection of the first reinforcement ball and the second reinforcement ball.As it can be seen that using bonding wire of the present invention
The service life of bonding wire can be improved in the LED component of packaging technology processing, and then improves the whole service life of LED component.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of chopper and welding wire；
Fig. 2 is the structural schematic diagram for the corresponding bonding wire of Chinese utility model patent that notification number is CN204204914U；
Fig. 3 is the flow chart of the bonding wire packaging technology in the embodiment of the present invention one；
Fig. 4 is the flow chart of the bonding wire packaging technology in the embodiment of the present invention two；
Fig. 5 is the flow chart of the bonding wire packaging technology in the embodiment of the present invention three；
Fig. 6 is the structural schematic diagram of the LED component of first way in the embodiment of the present invention four；
Fig. 7 is the structural schematic diagram of the LED component in the embodiment of the present invention five.
Specific embodiment
To make the object, technical solutions and advantages of the present invention clearer, the present invention is made into one below in conjunction with attached drawing
Step ground detailed description.Only this is stated, the present invention occurs in the text or will occur up, down, left, right, before and after, it is inside and outside etc. just
Position word is not to specific restriction of the invention only on the basis of attached drawing of the invention.
Embodiment one
Referring to attached drawing 3, present embodiment discloses a kind of bonding wire packaging technology of LED component, the LED component includes LED
Chip, the bracket for carrying LED chip and at least one are electrically connected the bonding wire of LED chip and bracket, wherein the weldering
Line packaging technology specifically includes following step.
S11, welding wire is mounted on the chopper of bonding equipment, and the bracket for being equipped with chip is located in wire welding area.Its
In, the wire welding area is that bonding equipment is used for localization region when welding for LED component.
S12, the end of welding wire is sintered to form the first reinforcement ball, and reinforces ball bonding in the electrode of LED chip for first
On.Specifically, the end of the welding wire, which strikes sparks to be sintered by fire stick, forms the first reinforcement ball, the first reinforcement ball passes through pressure
Power, ultrasonic wave and suitable temperature are fixed on the electrode of LED chip.
Preferably, step S111, the step S111 are equipped between the step S11 and step S12 are as follows:
The end of soldered ball is sintered to form assistant reinforcement ball, and by assistant reinforcement ball bonding in the welding section of bracket, then
Cut off welding wire.At this point, the end of the welding wire is welded on assistant reinforcement ball in following S13.The present embodiment passes through in bracket
On assistant reinforcement ball of burn-oning improve the fastness that connect with bracket of bonding wire, further increase the service life of bonding wire.
The end of welding wire, along the operation of setting track, is then welded on bracket by S13, welding wire under the driving of chopper,
To form the bonding wire of connection LED chip and bracket.The end of signified welding wire refers to the weldering at the knife mouth of chopper lower end herein
Silk.The bonding wire of the present embodiment can be two-dimensional structure, be also possible to three-dimensional structure, and when bonding wire is two-dimensional structure, bonding wire is in water
Plane is projected as straight line, and when bonding wire is three-dimensional structure, bonding wire is projected as warp architecture horizontal plane.As it can be seen that this
The bonding wire packaging technology of embodiment corresponds to welding wire setting track and can be in same plane operation, is also possible in Different Plane
Operation.
S14, cutting welding wire, sinter the welding wire on chopper into second reinforcement ball, then reinforce ball bonding for second
One reinforces on ball, and the second reinforcement ball is made at least to cover the intermediate location of the first reinforcement ball and bonding wire, has welded second and has added
Welding wire is cut off after strong ball.The process of bonding wire cutting are as follows: first pass through chopper bonding wire and cut off a part, then by above chopper
Wire clamp clamps bonding wire, finally again by mobile chopper so that welding wire is broken.
S15, the end of welding wire is sintered to form third reinforcement ball, and third is reinforced into ball bonding on assistant reinforcement ball,
And third is made to reinforce ball at least covering part bonding wire.In order to further reinforce the reliability connected between bonding wire and bracket,
The present embodiment covers upper third again on assistant reinforcement ball and reinforces ball, and third, which reinforces ball, can reinforce bonding wire and assistant reinforcement ball company
Connect the fastness of transition portion.
The bonding wire packaging technology of the LED component of the present embodiment improves weldering by burn-oning the first reinforcement ball on LED chip
The reliability connected between line and LED core plate electrode, in addition, burn-on on LED chip first reinforcement ball can prevent bonding wire with
In LED core plate electrode connection procedure to LED core plate electrode generate directly oppress, and then improve LED component bonding wire encapsulate when can
By property.
In addition, using the LED component of the present embodiment bonding wire packaging technology when, bonding wire by first reinforce ball draw, bonding wire
And first the most weak transition portion in the heat affected area that is formed between reinforcement ball pass through the covering of the second reinforcement ball again, second reinforces ball
The fastness that the first reinforcement ball is connected with bonding wire can be improved.Even if packaging plastic generates biggish heat expansion when LED component works
Shrinkage, bonding wire and the position of the first reinforcement ball transition are also less likely to occur to break under the protection of the first reinforcement ball and the second reinforcement ball
It splits.As it can be seen that the service life of bonding wire can be improved using the LED component that the present embodiment bonding wire packaging technology is processed, and then improve
The whole service life of LED component.
It should be noted that using the LED component of the present embodiment bonding wire packaging technology when, due to first reinforce ball connect
The reliability of the bonding wire connect improves, at this point, bonding wire is not easy to reinforce ball disengaging with first, so bonding wire is connect with the first reinforcement ball
One end without in addition setting vertical section, and then the difference in height between bonding wire highest point and LED chip can be reduced, and lower
Bonding wire can be further improved the service life of bonding wire.
In bonding wire no setting is required vertical section, the height of bonding wire can press it is very low, at this point, the camber of bonding wire mainly by
Into bonding wire encapsulation process, chopper and bonding wire select the influence of shape.
As the preferred embodiment of chopper, the lower end of the chopper is equipped with rounded corner, and the diameter of the rounded corner is D1, described
The diameter of first reinforcement ball and the second reinforcement ball is D2, and the D2 is greater than D1, and D2 subtracts D1 equal to 8~25 μm.The present embodiment
The diameter of the rounded corner of chopper is set smaller than the first reinforcement ball and second and reinforces the diameter of ball, and then may insure chopper not
Can have an adverse effect to LED chip.As the first preferred embodiment, the D1 is 38 μm, and the D2 is 46~63 μm, as
Second of preferred embodiment, the D1 are 46 μm, and the D2 is 54~71 μm, and as the third preferred embodiment, the D1 is 53 μm,
The D2 is 61~78 μm.
Correspondingly, inventor is according to different bonding wire shapes and chopper size by the arc of camber and the prior art of the invention
Height is compared, shown in table one specific as follows.Wherein, the former camber range in following table is not influenced by T value, can be 127 μm,
It can be 155 μm, the scope of application of the camber of corresponding bank is all the same.
The comparison of one camber of table
Wherein, the T value of chopper is the head diameter value of chopper, the i.e. diameter value of the lower end of chopper.
Q bank refers to two-dimentional bank traditional in the prior art, and it is CN204204914U that Q bank, which is specifically referred to notification number,
Chinese utility model patent background technique in gold thread.
SQ bank refers to plane bank, similar with above-mentioned Q bank, only an intermediate mostly horizontal segment, i.e., it include according to
Vertical section, horizontal segment and the tilting section of secondary setting.
J bank refers to non-planar bank, specifically sets there are two round part, J bank be specifically referred to be for publication No.
The conductive bonding wire of the Chinese invention patent of CN106784242A.
It can be concluded that according to above-mentioned comparison
1, the camber for the LED component processed using packaging technology of the invention is lower than the camber of prior art synteny,
And when camber relatively low bonding wire corresponding LED component the service life can greatly improve, and then improve making for LED component
Use the service life.
2, in a certain range, the head diameter of chopper is bigger, and corresponding camber is lower, illustrates the weldering using the present embodiment
Line packaging technology is influenced greatly by chopper size.
In addition, inventor has carried out quick-cooling, heating impact test to Q bank, SQ bank and J bank, such as two institute of following table
Show, the following are the comparisons of test result.Wherein, the condition of test is -65 DEG C/15min to 150 DEG C/15min, and every 0.5h mono-
A circulation, it is more harsh relative to general cooling Shock Environmental Condition.
The comparison of two cold shock testing of table
It can be obtained according to above-mentioned experimental data, Q bank, SQ bank and J bank are plus the failure ratio after the double-deck reinforcement ball
Example is lower than without the failure ratio plus the double-deck reinforcement ball, such as Q bank starts to lose when cooling thermal impact is 100 bout
Effect, and subsequent crash rate is bigger, and use the crash rate for adding the double-deck Q bank for reinforcing ball when cooling thermal impact is 100 bout
Be 0, it is seen then that using upper layer reinforce ball Q bank the service life is longer.Similarly, after other banks combine the double-deck reinforcement ball
Failure ratio is below not plus the double-deck bank for reinforcing ball.It follows that the bonding wire packaging technology using the present embodiment adds
The reliability of the bonding wire of the LED component of work is better than the bank of the prior art.The i.e. provable bonding wire using the present embodiment seals
The service life for filling the LED component of technique processing is better than the prior art.
In addition, it should be noted that, the welding wire of the prior art generally uses alloy wire, but the alloy wire of the prior art holds
Halogen reflection easily occurs to black, brightness is caused to reduce.In addition, the intensity of the alloy wire of the prior art is not high, it is unfavorable for enhancing weldering
The reliability of silk.
To solve the above-mentioned problems, the preferably described welding wire of the present embodiment is silver alloy wire rod, the table of the silver alloy wire rod
Face is coated with palladium layers.Preferably, the silver alloy wire rod is cylinder, the thickness between the diameter and palladium layers of the silver alloy wire rod
Than for (400:1)~(800:1).
By plating palladium in silver alloy wire surface sulfuration resistant performance can be improved, wire rod is not easy to black, light in the present embodiment
It declines obviously smaller than the reduction of alloy wire, is specifically referred to following vulcanization light decay contrast tables, from following table three as can be seen that passing through
After vulcanization test, the brightness for plating the brightness ratio alloy wire of palladium line keeps more preferable.
Table three plates palladium line, alloy wire vulcanization light decay comparison
The discoloration in addition, palladium does not react with halogen, can solve the problems, such as alloy wire sulfide staining.
Further, the intensity ratio Yin Genggao of palladium, a degree of intensity for improving wire rod of energy, increases the reliable of wire rod
Property, following cooling thermal impact test tables are specifically referred to, as shown in following table four, since plating 100 sample fails rates of palladium line are
43%, and the crash rate of alloy wire is 96%, therefore the intensity for plating palladium line is obviously higher than alloy wire, good reliability.
Four wire rod cooling thermal impact test comparison of table
Embodiment two
Referring to attached drawing 4, present embodiment discloses a kind of bonding wire packaging technologies of LED component, what is different from the first embodiment is that
The bonding wire packaging technology of the present embodiment uses the anti-form beaten, i.e. bonding wire is drawn from bracket to LED chip.
Specifically, the LED component includes that LED chip, the bracket for carrying LED chip and at least one electrical property connect
The bonding wire of LED chip and bracket is connect, the bonding wire packaging technology specifically includes following step.
S21, welding wire is mounted on the chopper of bonding equipment, and the bracket for being equipped with chip is located in wire welding area.Its
In, the wire welding area is that bonding equipment is used for localization region when welding for LED component.
S22, be sintered the end of welding wire to form assistant reinforcement ball, and by assistant reinforcement ball bonding LED chip electrode
On.Specifically, the end of the welding wire forms assistant reinforcement ball by fire stick sparking sintering, the assistant reinforcement ball passes through super
Sound is welded on the electrode of LED chip.
S23, cutting welding wire, the welding wire on chopper is sintered to form the first reinforcement ball, and the first reinforcement ball bonding is being propped up
The welding section of frame.
The end of welding wire, along the operation of setting track, is then welded on assistant reinforcement under the driving of chopper by S24, welding wire
On ball, to form the bonding wire of connection LED chip and bracket.The end of signified welding wire refers at the knife mouth of chopper lower end herein
Welding wire.The bonding wire of the present embodiment can be two-dimensional structure, be also possible to three-dimensional structure, when bonding wire is two-dimensional structure, bonding wire
It is projected as straight line in horizontal plane, when bonding wire is three-dimensional structure, bonding wire is projected as warp architecture horizontal plane.It can
See, the bonding wire packaging technology of the present embodiment corresponds to welding wire setting track and can be in same plane operation, is also possible to not
Coplanar operation.
S25, cutting welding wire, sinter the welding wire on chopper into second reinforcement ball, then reinforce ball bonding for second
One reinforces on ball, and the second reinforcement ball is made at least to cover the intermediate location of the first reinforcement ball and bonding wire, has welded second and has added
Welding wire is cut off after strong ball.The process of bonding wire cutting are as follows: the welding wire is clamped by the wire clamp above chopper, is then split by movement
Knife is so that welding wire is broken.
S26, the end of welding wire is sintered to form third reinforcement ball, third is then reinforced into ball bonding in assistant reinforcement ball
On, and third is made to reinforce ball at least covering part bonding wire.It can in order to further reinforce connecting between bonding wire and LED chip
By property, the present embodiment covers upper third again on assistant reinforcement ball and reinforces ball, and third, which reinforces ball, can reinforce bonding wire and assist adding
The fastness of strong ball connection transition portion.
The present embodiment bonding wire plays a certain protective role LED core plate electrode by assistant reinforcement ball, and can be improved
The reliability that bonding wire is connect with LED core plate electrode.In addition, the present embodiment, which reinforces ball and second by first, reinforces the hot shadow of ball raising
It rings area and reinforces the reliability of transition portion between ball, the explanation of specific detailed in Example.
In addition, the welding wire of the present embodiment can be using the welding wire in embodiment one, referring in particular to the content in embodiment one.
The chopper of the present embodiment, the first diameter Relationship reinforced between ball and the second reinforcement ball can also be using pairs in embodiment one
The technical solution answered.
Embodiment three
Referring to attached drawing 5, present embodiment discloses a kind of bonding wire packaging technologies of LED component, what is different from the first embodiment is that
The bonding wire packaging technology of the present embodiment is for connecting between two LED chips.
Specifically, the LED component includes that LED chip, the bracket for carrying LED chip and at least one electrical property connect
The bonding wire of two LED chips is connect, the bonding wire encapsulation specifically includes following step.
S31, welding wire is mounted on the chopper of bonding equipment, and the bracket for being equipped with chip is located in wire welding area.Its
In, the wire welding area is that bonding equipment is used for localization region when welding for LED component.
S32, it is sintered the end of welding wire to form assistant reinforcement ball, and by an assistant reinforcement ball bonding LED core wherein
On the electrode of piece, welding wire is then cut off.Specifically, the end of the welding wire forms assistant reinforcement by fire stick sparking sintering
Ball, the assistant reinforcement ball is by being ultrasonically welded on the electrode of LED chip.
S33, the end of welding wire is sintered to form the first reinforcement ball, and reinforces ball bonding in another LED chip for first
Electrode on.
The end of welding wire, along the operation of setting track, is then welded on assistant reinforcement under the driving of chopper by S34, welding wire
On ball, to form the bonding wire of two LED chips of connection.The end of signified welding wire refers at the knife mouth of chopper lower end herein
Welding wire.The bonding wire of the present embodiment can be two-dimensional structure, be also possible to three-dimensional structure, and when bonding wire is two-dimensional structure, bonding wire exists
Horizontal plane is projected as straight line, and when bonding wire is three-dimensional structure, bonding wire is projected as warp architecture horizontal plane.As it can be seen that
The bonding wire packaging technology of the present embodiment corresponds to welding wire setting track and can be in same plane operation, is also possible to flat in difference
Face operation.
S35, cutting welding wire, sinter the welding wire on chopper into second reinforcement ball, then reinforce ball bonding for second
One reinforces on ball, and the second reinforcement ball is made at least to cover the intermediate location of the first reinforcement ball and bonding wire, has welded second and has added
Welding wire is cut off after strong ball.The process of bonding wire cutting are as follows: the welding wire is clamped by the wire clamp above chopper, is then split by movement
Knife is so that welding wire is broken.
S36, the end of welding wire is sintered to form third reinforcement ball, third is then reinforced into ball bonding in assistant reinforcement ball
On, and third is made to reinforce ball at least covering part bonding wire.It can in order to further reinforce connecting between bonding wire and LED chip
By property, the present embodiment covers upper third again on assistant reinforcement ball and reinforces ball, and third, which reinforces ball, can reinforce bonding wire and assist adding
The fastness of strong ball connection transition portion.
Unlike above-described embodiment one and embodiment two, the bonding wire of the present embodiment is used to connect two LED chips, by
It is more fragile in the electrode of LED chip, it is necessary to the reliability that bonding wire connection is improved by reinforcing ball accordingly, so the present embodiment
LED component be provided with corresponding ball of reinforcing on the electrode of two LED chips and carried out necessary booster action.
The corresponding welding wire of the present embodiment and size etc. are referred to the particular content in above-described embodiment one.
Example IV
Referring to attached drawing 6, present embodiment discloses a kind of LED components, including LED chip 1c, for carrying LED chip 1c's
Bracket 2c and at least one is electrically connected the bonding wire 3c of LED chip 1c and bracket 2c.Wherein, the heat affected area of the bonding wire 3c
It can also be introduced in detail below in the one end bracket 2c in the one end LED chip 1c.
First way is welded with one end of the first reinforcement ball 4c, the bonding wire 3c by the electrode of the LED chip 1c
One reinforcement ball 4c, which is drawn to bracket 2c, to be connect, and is welded with covering at least partly the second of bonding wire 3c on the first reinforcement ball 4c and is added
Strong ball 5c.This mode, which is that LED component is counter, beats packaging technology.The LED component of this i.e. structure shown in attached drawing 5.
Preferably, the bracket 2c is equipped with assistant reinforcement ball, and the bonding wire is connect with assistant reinforcement ball, is added by auxiliary
Strong ball improves the reliability that bonding wire is connect with bracket.
The second way is welded with assistant reinforcement ball on the electrode of the LED chip, the first reinforcement is welded on the bracket
Ball, one end of the bonding wire, which is drawn by the first reinforcement ball to assistant reinforcement ball, to be connect, and is welded with covering on the first reinforcement ball
At least partly the second of bonding wire reinforces ball.This mode is that LED component just beats packaging technology.
The further preferred scheme of LED component as above two mode is welded with covering on the assistant reinforcement ball extremely
The third of small part bonding wire reinforces ball.Reinforce the reliability that ball further increases bonding wire by third.
Wherein, the bonding wire is silver alloy wire rod, and the surface of the silver alloy wire rod is equipped with palladium layers.Referring in particular to embodiment
Solder wire material in one.Since the electrode of LED chip is more fragile, it is necessary to by reinforce accordingly ball improve bonding wire connection can
By property, so the LED component of the present embodiment is provided with corresponding ball of reinforcing on the electrode of two LED chips and has carried out necessity
Booster action.
The LED component of the present embodiment improves bonding wire and LED chip electricity by burn-oning corresponding reinforcement ball on LED chip
The reliability connected between pole, in addition, the reinforcement ball burn-on on LED chip can prevent bonding wire from connecting with LED core plate electrode
LED core plate electrode is generated in journey and is directly oppressed, and then improves the reliability when encapsulation of LED component bonding wire.
Using the present embodiment LED component when, bonding wire by first reinforce ball draw, bonding wire and first reinforcement ball between formed
The most weak transition portion in heat affected area pass through the covering of the second reinforcement ball again, the second reinforcement ball can be improved the first reinforcement ball and
The fastness of bonding wire connection.Even if packaging plastic LED component work when generate it is biggish expand with heat and contract with cold, bonding wire with first reinforcement ball
The position of transition is also less likely to occur to be broken under the protection of the first reinforcement ball and the second reinforcement ball.As it can be seen that using present invention weldering
The service life of bonding wire can be improved in the LED component of line packaging technology processing, and then improves the whole service life of LED component.
In addition, using the present embodiment LED component when, due to the reliability raising of the first bonding wire for connect of reinforcement ball,
At this point, bonding wire is not easy to reinforce ball disengaging with first, so one end that bonding wire is connect with the first reinforcement ball is erected without in addition setting
Straight section, and then the difference in height between bonding wire highest point and LED chip can be reduced, and lower bonding wire can be further improved weldering
The service life of line.
Embodiment five
Referring to attached drawing 7, present embodiment discloses a kind of LED component, including at least two LED chips, for carrying LED core
The bracket 1d of piece and at least one is electrically connected the bonding wire of two LED chips, and two LED chips are respectively the first LED chip
2d and the second LED chip 3d is welded with assistant reinforcement ball 4d, the second LED chip 3d on the electrode of the first LED chip 2d
Electrode on be welded with the first reinforcement ball 5d, one end of the bonding wire, which is drawn by the first reinforcement ball 5d to assistant reinforcement ball 4d, to be connected
It connects, is welded with the second of covering at least partly bonding wire on the first reinforcement ball 5d and reinforces ball 6d.
Preferably, the third that covering at least partly bonding wire is welded on the assistant reinforcement ball 4d reinforces ball 7d.Pass through third
Reinforce ball 7d and further increases the reliability that bonding wire is connect with the first LED chip.
Unlike example IV, the bonding wire in the LED component of the present embodiment is used to connect two LED components, due to
The electrode of LED chip is more fragile, it is necessary to the reliability of bonding wire connection is improved by reinforcing ball accordingly, so the present embodiment
LED component is provided with corresponding ball of reinforcing on the electrode of two LED chips and has carried out necessary booster action.
The LED component of the present embodiment improves bonding wire and LED chip electricity by burn-oning corresponding reinforcement ball on LED chip
The reliability connected between pole, in addition, the reinforcement ball burn-on on LED chip can prevent bonding wire from connecting with LED core plate electrode
LED core plate electrode is generated in journey and is directly oppressed, and then improves the reliability when encapsulation of LED component bonding wire.
Using the present embodiment LED component when, bonding wire by first reinforce ball 5d draw, bonding wire and first reinforce ball 5d between
The most weak transition portion in the heat affected area of formation passes through the second reinforcement ball 6d covering again, and the second reinforcement ball 6d can be improved first
Reinforce the fastness that ball 5d is connected with bonding wire.Even if packaging plastic LED component work when generate it is biggish expand with heat and contract with cold, bonding wire with
The position of first reinforcement ball 5d transition is also less likely to occur to be broken under the protection of the first reinforcement ball 5d and the second reinforcement ball 6d.It can
See, the service life of bonding wire can be improved using the LED component that bonding wire packaging technology of the present invention is processed, and then improve LED component
Whole service life.
In addition, using the present embodiment LED component when, since the reliability of bonding wire connecting with the first reinforcement ball 5d mentions
Height, at this point, bonding wire is not easy to reinforce ball 5d disengaging with first, so one end that bonding wire is connect with the first reinforcement ball 5d is without in addition
Vertical section is set, and then the difference in height between bonding wire highest point and LED chip can be reduced, and lower bonding wire can be further
Improve the service life of bonding wire.
Embodiment six
Present embodiment discloses a kind of LED light, including LED component described at least one example IV or embodiment five.
The long service life of the LED light of the present embodiment.
The above is a preferred embodiment of the present invention, it is noted that for those skilled in the art
For, various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications are also considered as
Protection scope of the present invention.
Claims (14)
1. a kind of bonding wire packaging technology of LED component, the LED component includes LED chip, the bracket for carrying LED chip
And at least one be electrically connected LED chip and bracket bonding wire, which is characterized in that the bonding wire packaging technology includes following step
It is rapid:
(1) welding wire is mounted on the chopper of bonding equipment, and the bracket for being equipped with chip is located in wire welding area；
(2) end of welding wire is sintered to form the first reinforcement ball, and reinforces ball bonding on the electrode of LED chip for first；
(3) then the end of welding wire is welded on bracket, along the operation of setting track under the driving of chopper thus shape by welding wire
At the bonding wire of connection LED chip and bracket；
(4) welding wire is cut off, sinters the welding wire on chopper into second reinforcement ball, then reinforces ball bonding for second and reinforces first
On ball, and the second reinforcement ball is made at least to cover the first intermediate location for reinforcing ball and bonding wire, after having welded the second reinforcement ball
Cut off welding wire.
2. the bonding wire packaging technology of LED component according to claim 1, which is characterized in that the step (1) and step
(2) step (11) are equipped between, the step (11) includes: to be sintered the end of soldered ball to form assistant reinforcement ball, and will assist
Reinforce ball bonding in the welding section of bracket, then cuts off welding wire；
In step (3), the end of the welding wire is welded on assistant reinforcement ball.
3. the bonding wire packaging technology of LED component according to claim 2, which is characterized in that it further include step (5), it is described
Step (5) includes: to be sintered the end of welding wire to form third reinforcement ball, and third is reinforced ball bonding on assistant reinforcement ball,
And third is made to reinforce ball at least covering part bonding wire.
4. a kind of bonding wire packaging technology of LED component, the LED component includes LED chip, the bracket for carrying LED chip
And at least one be electrically connected LED chip and bracket bonding wire, which is characterized in that the bonding wire packaging technology includes following step
It is rapid:
(1) welding wire is mounted on the chopper of bonding equipment, and the bracket for being equipped with chip is located in wire welding area；
(2) end of welding wire is sintered to form assistant reinforcement ball, and by assistant reinforcement ball bonding on the electrode of LED chip；
(3) welding wire is cut off, the welding wire on chopper is sintered to form the first reinforcement ball, and reinforces ball bonding in the weldering of bracket for first
Meet area；
(4) then the end of welding wire is welded on assistant reinforcement ball by welding wire along the operation of setting track under the driving of chopper,
To form the bonding wire of connection LED chip and bracket；
(5) welding wire is cut off, sinters the welding wire on chopper into second reinforcement ball, then reinforces ball bonding for second and reinforces first
On ball, and the second reinforcement ball is made at least to cover the first intermediate location for reinforcing ball and bonding wire, after having welded the second reinforcement ball
Cut off welding wire.
5. the bonding wire packaging technology of LED component according to claim 4, which is characterized in that it further include step (6), it is described
Step (6) includes: to be sintered the end of welding wire to form third reinforcement ball, and third is then reinforced ball bonding in assistant reinforcement ball
On, and third is made to reinforce ball at least covering part bonding wire.
6. a kind of bonding wire packaging technology of LED component, the LED component includes LED chip, the bracket for carrying LED chip
And at least one be electrically connected two LED chips bonding wire, which is characterized in that the bonding wire packaging technology includes following step
It is rapid:
(1) welding wire is mounted on the chopper of bonding equipment, and the bracket for being equipped with chip is located in wire welding area；
(2) end of welding wire is sintered to form assistant reinforcement ball, and by assistant reinforcement ball bonding a wherein LED chip electricity
On extremely, welding wire is then cut off；
(3) end of welding wire is sintered to form the first reinforcement ball, and reinforces ball bonding in the electrode of another LED chip for first
On；
(4) then the end of welding wire is welded on assistant reinforcement ball by welding wire along the operation of setting track under the driving of chopper,
To form the bonding wire of two LED chips of connection；
(5) welding wire is cut off, sinters the welding wire on chopper into second reinforcement ball, then reinforces ball bonding for second and reinforces first
On ball, and the second reinforcement ball is made at least to cover the first intermediate location for reinforcing ball and bonding wire, after having welded the second reinforcement ball
Cut off welding wire.
7. the bonding wire packaging technology of LED component according to claim 6, which is characterized in that it further include step (6), it is described
Step (6) includes: to be sintered the end of welding wire to form third reinforcement ball, and third is then reinforced ball bonding in assistant reinforcement ball
On, and third is made to reinforce ball at least covering part bonding wire.
8. the bonding wire packaging technology of LED component according to any one of claims 1 to 7, which is characterized in that the chopper
Lower end is equipped with rounded corner, and the diameter of the rounded corner is D1, and the diameter of the first reinforcement ball and the second reinforcement ball is D2, institute
D2 is stated greater than D1, and D2 subtracts D1 equal to 8~25 μm.
9. the bonding wire packaging technology of LED component according to any one of claims 1 to 7, which is characterized in that the welding wire is
The surface of silver alloy wire rod, the silver alloy wire rod is coated with palladium layers.
10. the bonding wire packaging technology of LED component according to claim 9, which is characterized in that the silver alloy wire rod is circle
Cylindricality, the thickness ratio between the diameter and palladium layers of the silver alloy wire rod are (400:1)~(800:1).
11. a kind of LED component, bracket and at least one including LED chip, for carrying LED chip are electrically connected LED core
The bonding wire of piece and bracket, which is characterized in that be welded with the first reinforcement ball on the electrode of the LED chip, one end of the bonding wire by
First reinforcement ball, which is drawn to bracket, to be connect, and is welded with the second of covering at least partly bonding wire on the first reinforcement ball and is reinforced ball；
Alternatively, being welded with assistant reinforcement ball on the electrode of the LED chip, the first reinforcement ball, the bonding wire are welded on the bracket
One end drawn to assistant reinforcement ball and connect by the first reinforcement ball, be welded on the first reinforcement ball and cover at least partly bonding wire
Second reinforce ball.
12. a kind of LED component, the bracket and at least one including at least two LED chips, for carrying LED chip is electrically
The bonding wire of two LED chips is connected, two LED chips are respectively the first LED chip and the second LED chip, which is characterized in that institute
It states and is welded with assistant reinforcement ball on the electrode of the first LED chip, the first reinforcement ball, institute are welded on the electrode of second LED chip
The one end for stating bonding wire, which is drawn by the first reinforcement ball to assistant reinforcement ball, to be connect, and is welded with covering at least portion on the first reinforcement ball
The second of point bonding wire reinforces ball.
13. LED component according to claim 11 or 12, which is characterized in that the bonding wire is silver alloy wire rod, the silver
The surface of alloy wire is equipped with palladium layers.
14. a kind of LED light, which is characterized in that including the described in any item LED components of at least one claim 11 to 13.
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| CN201811105067.6A CN109301059A (en) | 2018-09-21 | 2018-09-21 | Bonding wire packaging technology, LED component and the LED light of LED component |
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