CN209133533U - LED component and LED light - Google Patents
LED component and LED light Download PDFInfo
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- CN209133533U CN209133533U CN201821555937.5U CN201821555937U CN209133533U CN 209133533 U CN209133533 U CN 209133533U CN 201821555937 U CN201821555937 U CN 201821555937U CN 209133533 U CN209133533 U CN 209133533U
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- ball
- bonding wire
- led
- welded
- led chip
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Abstract
The utility model discloses a kind of LED components, bracket and at least one including LED chip, for carrying LED chip are electrically connected the bonding wire of LED chip and bracket, the first reinforcement ball is welded on the electrode of the LED chip, one end of the bonding wire is drawn to bracket by the first reinforcement ball and is connect, and is welded with the second of covering at least partly bonding wire on the first reinforcement ball and reinforces ball；Alternatively, being welded with the first reinforcement ball on the LED support, one end of the bonding wire, which is drawn by the first reinforcement ball to the electrode with LED chip, to be connect, and is welded with the second of covering at least partly bonding wire on the first reinforcement ball and is reinforced ball.The invention also discloses a kind of LED light.The LED component of the utility model and the service life of LED light increase.
Description
Technical field
The utility model relates to the LED etc. of semiconductor field more particularly to a kind of LED component and the application LED component.
Background technique
The LED component of the prior art includes bracket, LED chip and bonding wire, the LED chip by bonding wire and bracket or
The connection of another LED chip of person covers packing colloid after the welding of LED component completion bonding wire again.Wherein, the weldering in LED component
Line is to guide bonding wire mobile according to the track of setting by chopper, and blade structure is as shown in Fig. 1, and chopper 1a is equipped with for bonding wire 2a
The top of the centre bore 11a passed through, chopper 1a are equipped with wire clamp 3a, when encapsulating the bonding wire of LED component, pass through the fixed bonding wire of wire clamp 3a
2a, convenient for bonding wire cutting etc..
Since the electrode of chip is more fragile, so a soldered ball generally can be first put on chip electrode, then again by soldered ball
Draw bonding wire outward to be formed in LED component for connecting the bonding wire of chip and substrate or chip and chip.Wherein, bonding wire
It is that soldered ball is sintered by electronic flame-off wand sparking, the bonding wire after being struck sparks by electronic flame-off wand with soldered ball adjacent part will form
Heat affected area, heat affected area is since coarse grains, mechanical performance are declined relative to other positions, especially in soldered ball and weldering
The part of line transition is the most fragile, when packing colloid can generate certain answer to bonding wire due to expanding with heat and contract with cold at work
Power, at this point, the part of bonding wire and soldered ball transition is easy to be torn, to influence the service life of entire device.Similarly, work as bonding wire
The bracket connection of heat affected area and LED component there is also identical problems.
The heat affected area service life in order to solve the problems, such as bonding wire is low, and the prior art is arranged to linearly at the both ends of bonding wire.
Such as notification number be CN204204914U Chinese utility model patent, the both ends of disclosed bonding wire be respectively vertical section 1b and
Straightway 2b, wherein the length of vertical section 1b and straightway 2b are greater than the length of heat affected area, i.e., heat are avoided at the position of bending
The zone of influence, to improve the whole service life of bonding wire.
Bonding wire will receive the influence that packaging plastic expands with heat and contract with cold during LED component use, the different parts of bonding wire
Thermal stress also can be different, and when bonding wire whole height is higher, service life can be shorter.And use LED disclosed in above-mentioned China
When encapsulating structure, necessarily it will affect since it is equipped with vertical section so the height of bonding wire is at least greater than the height of vertical section
The service life of bonding wire.
On the basis of the LED encapsulation structure disclosed in above-mentioned China, the prior art, which has been done, further to be improved, but is improved
LED component afterwards is using the arc for changing bonding wire to improve its service life, such as Publication No. CN 106784242A
The Chinese invention patent of Chinese invention patent and CN107978668A.Which kind of, regardless of the bonding wire using arc, it is necessarily required to
It solves the problems, such as that the heat affected area of bonding wire is fragile by vertical section, and will affect the whole height of bonding wire using vertical section,
Its service life that still will affect bonding wire.In addition, Publication No. CN 106784242A and Publication No. CN107978668A
Two parts of Chinese invention patents be required to using specific arc can achieve the effect that improve the service life, thus improve bonding wire plus
Work difficulty, and will limit the scope of application of bonding wire.
Summary of the invention
Technical problem to be solved by the utility model is to provide a kind of LED component, bonding wire in LED component is improved
Service life.
In order to solve the above-mentioned technical problem, the utility model provides a kind of LED component, including LED chip, for carrying
The bracket of LED chip and at least one be electrically connected LED chip and bracket bonding wire, be welded on the electrode of the LED chip
First reinforces ball, and one end of the bonding wire, which is drawn by the first reinforcement ball to bracket, to be connect, and is welded with and covers on the first reinforcement ball
The second of lid at least partly bonding wire reinforces ball；
Alternatively, be welded with the first reinforcement ball on the LED support, one end of the bonding wire by the first reinforcement ball draw to
The electrode of LED chip connects, and is welded with the second of covering at least partly bonding wire on the first reinforcement ball and reinforces ball.
As an improvement of the above scheme, when first reinforce ball bonding when on the electrode of LED chip, be welded on the bracket auxiliary
Reinforcement ball is helped, one end that the bonding wire is connect with bracket is welded on assistant reinforcement ball.
As an improvement of the above scheme, the third that covering at least partly bonding wire is welded on the assistant reinforcement ball reinforces ball.
As an improvement of the above scheme, when it is described first reinforce ball bonding when on bracket, welded on the electrode of the LED chip
There is assistant reinforcement ball, one end that the bonding wire is connect with LED chip is welded on assistant reinforcement ball.
As an improvement of the above scheme, the third that covering at least partly bonding wire is welded on the assistant reinforcement ball reinforces ball.
As another real-time mode of LED component, the LED component includes at least two LED chips, for carrying
The bonding wire of the bracket of LED chip and at least one two LED chips of electric connection, two LED chips are respectively the first LED core
Piece and the second LED chip, are welded with the first reinforcement ball on the electrode of first LED chip, one end of the bonding wire by first plus
Strong ball, which is drawn to the electrode of the second LED chip, to be connect, and is welded with the second of covering at least partly bonding wire on the first reinforcement ball
Reinforce ball.
As an improvement of the above scheme, assistant reinforcement ball, the bonding wire and are welded on the electrode of second LED chip
One end of two LED chips connection is welded on assistant reinforcement ball.
As an improvement of the above scheme, the third that covering at least partly bonding wire is welded on the assistant reinforcement ball reinforces ball.
As an improvement of the above scheme, the bonding wire is silver alloy wire rod, and the surface of the silver alloy wire rod is equipped with palladium layers.
Correspondingly, the invention also discloses a kind of LED light, including at least one LED device described in the utility model
Part.
Implement the embodiments of the present invention, has the following beneficial effects:
Bonding wire in the LED component of the utility model is reinforced ball by first and is drawn, and is formed between bonding wire and the first reinforcement ball
The most weak transition portion in heat affected area pass through the covering of the second reinforcement ball again, the second reinforcement ball can be improved the first reinforcement ball and
The fastness of bonding wire connection.Even if packaging plastic LED component work when generate it is biggish expand with heat and contract with cold, bonding wire with first reinforcement ball
The position of transition is also less likely to occur to be broken under the protection of the first reinforcement ball and the second reinforcement ball.As it can be seen that practical new using this
The service life of bonding wire can be improved in the LED component of type, and then improves the whole service life of LED component.
In addition, using the utility model LED component when, since the reliability of bonding wire connecting with the first reinforcement ball mentions
Height, at this point, bonding wire is not easy to reinforce ball disengaging with first, so one end that bonding wire is connect with the first reinforcement ball is without in addition setting
Vertical section, and then the difference in height between bonding wire highest point and LED chip can be reduced, and lower bonding wire can be further improved
The service life of bonding wire.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of chopper and welding wire；
Fig. 2 is the structural schematic diagram for the corresponding bonding wire of Chinese utility model patent that notification number is CN204204914U；
The structural schematic diagram of the first structure in Fig. 3 the utility model LED component first embodiment；
Fig. 4 is the structural schematic diagram of the utility model LED component second embodiment.
Specific embodiment
It is practical new to this below in conjunction with attached drawing to keep the purpose of this utility model, technical solution and advantage clearer
Type is described in further detail.Only this state, the utility model occur in the text or will occur upper and lower, left and right, it is preceding,
Afterwards, the orientation such as inside and outside word is not the specific restriction to the utility model only on the basis of the attached drawing of the utility model.
Embodiment one
Referring to attached drawing 1, the utility model discloses a kind of LED components, including LED chip 1, for carrying LED chip 1
The bonding wire 3 of bracket 2 and at least one electric connection LED chip 1 and bracket 2.Wherein, the heat affected area of the bonding wire 3 can be with
It is located at 1 one end of LED chip, 2 one end of bracket can also be located at, introduced in detail below.
The first structure is welded with the first reinforcement ball 4c on the electrode of the LED chip 1, and one end of the bonding wire 3 is by first
Reinforcement ball 4c, which is drawn to bracket 2, to be connect, and is welded with the second of covering at least partly bonding wire 3 on the first reinforcement ball 4c and is reinforced ball
5c.Ball 4c and second is reinforced by first using the LED component of the method and reinforces the weldering that ball 5c raising has heat affected area one end
The reliability that line 3 connects.
Preferably, assistant reinforcement ball 6c is welded on the bracket 2, one end that the bonding wire 3 is connect with bracket 2 is welded in auxiliary
Reinforce on ball 6c.The reliability that bonding wire 3 is connect with bracket 2 is improved by assistant reinforcement ball 6c.
In order to further increase the reliability that bonding wire 3 is connect with bracket 2, the LED component of the utility model is in the auxiliary
The third for reinforcing being welded with covering at least partly bonding wire 3 on ball 6c reinforces ball 7c.
The LED component of i.e. the present embodiment the first structure shown in attached drawing 3.
Second of structure, the first reinforcement ball is welded on the LED support, and ball traction is reinforced by first in one end of the bonding wire
To being connect with the electrode of LED chip, the second of covering at least partly bonding wire is welded on the first reinforcement ball and reinforces ball.Using this
The LED component of mode is connected by the first reinforcement ball and the second reinforcement ball raising with the bonding wire of heat affected area one end reliable
Property.
Using second of structure LED component when, be welded with assistant reinforcement ball, the bonding wire on the electrode of the LED chip
The one end connecting with LED chip is welded on assistant reinforcement ball.
In order to further increase the reliability that bonding wire is connect with LED chip, covering is welded on the assistant reinforcement ball at least
The third of part bonding wire reinforces ball.
It should be noted that the reliability for the bonding wire connecting in the LED component of the present embodiment with the first reinforcement ball improves, this
When, bonding wire is not easy to reinforce ball disengaging with first, so one end that bonding wire is connect with the first reinforcement ball is not necessarily in addition setting vertically
Section, and then the difference in height between bonding wire highest point and LED chip can be reduced, and lower bonding wire can be further improved bonding wire
Service life.
In bonding wire no setting is required vertical section, the height of bonding wire can press it is very low, at this point, the camber of bonding wire mainly by
Into bonding wire encapsulation process, chopper and bonding wire select the influence of shape.
As the preferred embodiment of chopper, the lower end of the chopper is equipped with rounded corner, and the diameter of the rounded corner is D1, described
The diameter of first reinforcement ball and the second reinforcement ball is D2, and the D2 is greater than D1, and D2 subtracts D1 equal to 8~25 μm.The present embodiment
The diameter of the rounded corner of chopper is set smaller than the first reinforcement ball and second and reinforces the diameter of ball, and then may insure chopper not
Can have an adverse effect to LED chip.As the first preferred embodiment, the D1 is 38 μm, and the D2 is 46~63 μm, as
Second of preferred embodiment, the D1 are 46 μm, and the D2 is 54~71 μm, and as the third preferred embodiment, the D1 is 53 μm,
The D2 is 61~78 μm.
Correspondingly, inventor is according to different bonding wire shapes and chopper size by the arc of camber and the prior art of the invention
Height is compared, shown in table one specific as follows.Wherein, the former camber range in following table is not influenced by T value, can be 127 μm,
It can be 155 μm, the scope of application of the camber of corresponding bank is all the same.
The comparison of one camber of table
Wherein, the T value of chopper is the head diameter value of chopper, the i.e. diameter value of the lower end of chopper.
Q bank refers to two-dimentional bank traditional in the prior art, and it is CN204204914U that Q bank, which is specifically referred to notification number,
Chinese utility model patent background technique in gold thread.
SQ bank refers to plane bank, similar with above-mentioned Q bank, only an intermediate mostly horizontal segment, i.e., it include according to
Vertical section, horizontal segment and the tilting section of secondary setting.
J bank refers to non-planar bank, specifically sets there are two round part, J bank be specifically referred to be for publication No.
The conductive bonding wire of the Chinese invention patent of CN106784242A.
It can be concluded that according to above-mentioned comparison
1, the camber for the LED component processed using packaging technology of the invention is lower than the camber of prior art synteny,
And when camber relatively low bonding wire corresponding LED component the service life can greatly improve, and then improve making for LED component
Use the service life.
2, in a certain range, the head diameter of chopper is bigger, and corresponding camber is lower, illustrates the weldering using the present embodiment
Line packaging technology is influenced greatly by chopper size.
In addition, inventor has carried out quick-cooling, heating impact test, two institute of following table to Q bank, SQ bank and J bank
Show, the following are the comparisons of test result.Wherein, the condition of test is -65 DEG C/15min to 150 DEG C/15min, and every 0.5h mono-
A circulation, it is more harsh relative to general cooling Shock Environmental Condition.
The comparison of two cold shock testing of table
It can be obtained according to above-mentioned experimental data, Q bank, SQ bank and J bank are plus the failure ratio after the double-deck reinforcement ball
Example is lower than without the failure ratio plus the double-deck reinforcement ball, such as Q bank starts to lose when cooling thermal impact is 100 bout
Effect, and subsequent crash rate is bigger, and use the crash rate for adding the double-deck Q bank for reinforcing ball when cooling thermal impact is 100 bout
Be 0, it is seen then that using upper layer reinforce ball Q bank the service life is longer.Similarly, after other banks combine the double-deck reinforcement ball
Failure ratio is below not plus the double-deck bank for reinforcing ball.It follows that the bonding wire packaging technology using the present embodiment adds
The reliability of the bonding wire of the LED component of work is better than the bank of the prior art.The i.e. provable bonding wire using the present embodiment seals
The service life for filling the LED component of technique processing is better than the prior art.
In bonding wire no setting is required vertical section, the height of bonding wire can press it is very low, at this point, the camber of bonding wire mainly by
Into bonding wire encapsulation process, chopper and bonding wire select the influence of shape.
In addition, it should be noted that, the welding wire of the prior art generally uses alloy wire, but the alloy wire of the prior art holds
Halogen reflection easily occurs to black, brightness is caused to reduce.In addition, the intensity of the alloy wire of the prior art is not high, it is unfavorable for enhancing weldering
The reliability of silk.
To solve the above-mentioned problems, bonding wire described in the present embodiment is silver alloy wire rod, the surface of the silver alloy wire rod
Equipped with palladium layers.Preferably, the silver alloy wire rod is cylinder, the thickness ratio between the diameter and palladium layers of the silver alloy wire rod
For (400:1)~(800:1).
By plating palladium in silver alloy wire surface sulfuration resistant performance can be improved, wire rod is not easy to black, light in the present embodiment
It declines obviously smaller than the reduction of alloy wire, is specifically referred to following vulcanization light decay contrast tables, from following table three as can be seen that passing through
After vulcanization test, the brightness for plating the brightness ratio alloy wire of palladium line keeps more preferable.
Table three plates palladium line, alloy wire vulcanization light decay comparison
The discoloration in addition, palladium does not react with halogen, can solve the problems, such as alloy wire sulfide staining.
Further, the intensity ratio Yin Genggao of palladium, a degree of intensity for improving wire rod of energy, increases the reliable of wire rod
Property, following cooling thermal impact test tables are specifically referred to, as shown in following table four, since plating 100 sample fails rates of palladium line are
43%, and the crash rate of alloy wire is 96%, therefore the intensity for plating palladium line is obviously higher than alloy wire, good reliability.
Four wire rod cooling thermal impact test comparison of table
Embodiment two
Embodiment discloses a kind of LED component, what is different from the first embodiment is that being used in the LED component of the present embodiment
Connect two LED chips.
Referring to attached drawing 4, the LED component of the present embodiment includes at least two LED chips, the bracket for carrying LED chip
1d and at least one is electrically connected the bonding wire 2d of two LED chips, and two LED chips are respectively the first LED chip 3d and the
Two LED chip 4d are welded with the first reinforcement ball 5d on the electrode of the first LED chip 3d, and one end of the bonding wire 2d is by first
Reinforcement ball 5d, which is drawn to the electrode of the second LED chip 4d, to be connect, and is welded with covering on the first reinforcement ball 5d and is at least partly welded
The second of line 2d reinforces ball 6d.
In order to improve the reliability that bonding wire 2d is connect with the second LED chip 4d, the utility model is in second LED chip
Assistant reinforcement ball 7d is welded on the electrode of 4d, the bonding wire 2d is welded in assistant reinforcement ball with the one end connecting the second LED chip 4d
On 7d.The present embodiment improves the reliability that bonding wire 2d is connect with the second LED chip 4d by assistant reinforcement ball 7d.
In order to further increase the reliability that bonding wire 2d is connect with the second LED chip 4d, welded on the assistant reinforcement ball 7d
There is the third of covering at least partly bonding wire 2d to reinforce ball 8d.
Embodiment three
Embodiment discloses a kind of LED light, including LED component described at least one embodiment one or embodiment two.This
The long service life of the LED light of embodiment.
The above is preferred embodiments of the present invention, it is noted that for the ordinary skill of the art
For personnel, without departing from the principle of this utility model, several improvements and modifications can also be made, these are improved and profit
Decorations are also considered as the protection scope of the utility model.
Claims (10)
1. a kind of LED component, bracket and at least one including LED chip, for carrying LED chip are electrically connected LED core
The bonding wire of piece and bracket, which is characterized in that be welded with the first reinforcement ball on the electrode of the LED chip, one end of the bonding wire by
First reinforcement ball, which is drawn to bracket, to be connect, and is welded with the second of covering at least partly bonding wire on the first reinforcement ball and is reinforced ball；
Alternatively, be welded with the first reinforcement ball on the LED support, one end of the bonding wire by the first reinforcement ball draw to LED core
The electrode of piece connects, and is welded with the second of covering at least partly bonding wire on the first reinforcement ball and reinforces ball.
2. LED component according to claim 1, which is characterized in that when the first reinforcement ball bonding is on the electrode of LED chip
When, assistant reinforcement ball is welded on the bracket, and one end that the bonding wire is connect with bracket is welded on assistant reinforcement ball.
3. LED component according to claim 2, which is characterized in that be welded with covering on the assistant reinforcement ball at least partly
The third of bonding wire reinforces ball.
4. LED component according to claim 1, which is characterized in that when it is described first reinforce ball bonding when on bracket, it is described
Assistant reinforcement ball is welded on the electrode of LED chip, one end that the bonding wire is connect with LED chip is welded on assistant reinforcement ball.
5. LED component according to claim 4, which is characterized in that be welded with covering on the assistant reinforcement ball at least partly
The third of bonding wire reinforces ball.
6. LED component according to any one of claims 1 to 5, which is characterized in that the bonding wire is silver alloy wire rod, institute
The surface for stating silver alloy wire rod is equipped with palladium layers.
7. a kind of LED component, bracket and at least one including at least two LED chips, for carrying LED chip electrically connect
The bonding wire of two LED chips is connect, two LED chips are respectively the first LED chip and the second LED chip, which is characterized in that described
Be welded with the first reinforcement ball on the electrode of first LED chip, one end of the bonding wire by the first reinforcement ball draw to the second LED core
The electrode of piece connects, and is welded with the second of covering at least partly bonding wire on the first reinforcement ball and reinforces ball.
8. LED component according to claim 7, which is characterized in that be welded with auxiliary on the electrode of second LED chip and add
Strong ball, one end that the bonding wire is connect with the second LED chip are welded on assistant reinforcement ball.
9. LED component according to claim 8, which is characterized in that be welded with covering on the assistant reinforcement ball at least partly
The third of bonding wire reinforces ball.
10. a kind of LED light, which is characterized in that including the described in any item LED components of at least one claim 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821555937.5U CN209133533U (en) | 2018-09-21 | 2018-09-21 | LED component and LED light |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821555937.5U CN209133533U (en) | 2018-09-21 | 2018-09-21 | LED component and LED light |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209133533U true CN209133533U (en) | 2019-07-19 |
Family
ID=67228599
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821555937.5U Active CN209133533U (en) | 2018-09-21 | 2018-09-21 | LED component and LED light |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209133533U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109301059A (en) * | 2018-09-21 | 2019-02-01 | 佛山市国星光电股份有限公司 | Bonding wire packaging technology, LED component and the LED light of LED component |
-
2018
- 2018-09-21 CN CN201821555937.5U patent/CN209133533U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109301059A (en) * | 2018-09-21 | 2019-02-01 | 佛山市国星光电股份有限公司 | Bonding wire packaging technology, LED component and the LED light of LED component |
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