CN109256409B - 显示装置 - Google Patents

显示装置 Download PDF

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Publication number
CN109256409B
CN109256409B CN201810756615.5A CN201810756615A CN109256409B CN 109256409 B CN109256409 B CN 109256409B CN 201810756615 A CN201810756615 A CN 201810756615A CN 109256409 B CN109256409 B CN 109256409B
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China
Prior art keywords
conductive layer
light emitter
disposed
load matching
display device
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CN201810756615.5A
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English (en)
Chinese (zh)
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CN109256409A (zh
Inventor
金正训
边敏雨
全炳鞠
权镐均
李根洙
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Samsung Display Co Ltd
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Samsung Display Co Ltd
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Publication of CN109256409A publication Critical patent/CN109256409A/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/441—Interconnections, e.g. scanning lines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/60—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/60—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
    • H10D89/601—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs
    • H10D89/931—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs characterised by the dispositions of the protective arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • H10K59/1213—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/805—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Manufacturing & Machinery (AREA)
  • Optics & Photonics (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electroluminescent Light Sources (AREA)
CN201810756615.5A 2017-07-13 2018-07-11 显示装置 Active CN109256409B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020170088914A KR102357393B1 (ko) 2017-07-13 2017-07-13 디스플레이 장치
KR10-2017-0088914 2017-07-13

Publications (2)

Publication Number Publication Date
CN109256409A CN109256409A (zh) 2019-01-22
CN109256409B true CN109256409B (zh) 2023-09-29

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Country Status (5)

Country Link
US (2) US10461070B2 (enExample)
EP (1) EP3428968B1 (enExample)
JP (1) JP7301505B2 (enExample)
KR (1) KR102357393B1 (enExample)
CN (1) CN109256409B (enExample)

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KR102357393B1 (ko) * 2017-07-13 2022-02-03 삼성디스플레이 주식회사 디스플레이 장치
WO2019187151A1 (ja) * 2018-03-30 2019-10-03 シャープ株式会社 表示デバイス
CN108666442B (zh) * 2018-05-14 2020-04-21 昆山国显光电有限公司 驱动基板和显示面板
CN108511503B (zh) * 2018-05-28 2020-11-24 京东方科技集团股份有限公司 一种电致发光显示面板、其制作方法及显示装置
KR102649144B1 (ko) 2018-06-25 2024-03-21 삼성디스플레이 주식회사 디스플레이 장치
KR102835222B1 (ko) * 2019-02-11 2025-07-18 삼성디스플레이 주식회사 표시 장치
CN110164869B (zh) * 2019-04-12 2021-07-30 上海中航光电子有限公司 显示面板和显示装置
KR102907359B1 (ko) * 2019-05-31 2026-01-02 삼성디스플레이 주식회사 표시패널
KR102763276B1 (ko) 2019-07-29 2025-02-10 삼성디스플레이 주식회사 표시 장치
CN111192909B (zh) * 2020-01-09 2023-06-02 武汉华星光电半导体显示技术有限公司 有源矩阵有机发光二极体显示面板
CN114930435B (zh) * 2020-01-20 2023-08-22 夏普株式会社 显示装置
US12302703B2 (en) * 2020-12-15 2025-05-13 Samsung Display Co., Ltd. Display device and method of manufacturing display device
KR102971138B1 (ko) * 2021-04-08 2026-05-29 삼성디스플레이 주식회사 디스플레이 장치
CN113506795B (zh) * 2021-05-26 2024-08-27 昆山工研院新型平板显示技术中心有限公司 静电防护结构及显示模组
US12444057B2 (en) * 2021-12-31 2025-10-14 Rivian Ip Holdings, Llc Systems and methods for improved three-dimensional data association using information from two-dimensional images
JP7743643B2 (ja) 2022-10-14 2025-09-24 日東電工株式会社 補強フィルム、補強フィルム付きデバイスおよびその製造方法
WO2024247886A1 (ja) 2023-05-29 2024-12-05 日東電工株式会社 補強フィルム、補強フィルム付きデバイスおよびその製造方法
US12033569B1 (en) 2023-06-02 2024-07-09 Samsung Display Co., Ltd. Display device

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CN106843389A (zh) * 2017-01-09 2017-06-13 广东欧珀移动通信有限公司 电子装置

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JP4889228B2 (ja) 2005-03-28 2012-03-07 株式会社アルバック 電界放出型表示装置
TWI318698B (en) 2005-10-06 2009-12-21 Au Optronics Corp Display panels
JP5027441B2 (ja) * 2006-05-11 2012-09-19 ルネサスエレクトロニクス株式会社 半導体装置
JP5299730B2 (ja) 2006-10-13 2013-09-25 Ｎｌｔテクノロジー株式会社 表示装置
KR101718819B1 (ko) 2008-08-19 2017-03-23 삼성디스플레이 주식회사 모패널 및 이를 이용한 표시패널의 제조방법
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CN103399434B (zh) * 2013-08-01 2015-09-16 深圳市华星光电技术有限公司 显示面板及其扇出线结构
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Also Published As

Publication number Publication date
JP7301505B2 (ja) 2023-07-03
JP2019020726A (ja) 2019-02-07
EP3428968A1 (en) 2019-01-16
KR102357393B1 (ko) 2022-02-03
KR20190008459A (ko) 2019-01-24
US10910360B2 (en) 2021-02-02
EP3428968B1 (en) 2021-12-01
US10461070B2 (en) 2019-10-29
US20190019789A1 (en) 2019-01-17
US20200020680A1 (en) 2020-01-16
CN109256409A (zh) 2019-01-22

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