CN109254277B - 具有单个2d mems扫描器的芯片级lidar - Google Patents
具有单个2d mems扫描器的芯片级lidar Download PDFInfo
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- CN109254277B CN109254277B CN201810762725.2A CN201810762725A CN109254277B CN 109254277 B CN109254277 B CN 109254277B CN 201810762725 A CN201810762725 A CN 201810762725A CN 109254277 B CN109254277 B CN 109254277B
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
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Classifications
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Abstract
LIDAR系统、LIDAR芯片和制造LIDAR芯片的方法。该LIDAR系统包括光子芯片,其配置为发射所发射光束并且接收反射光束;扫描器,其用于将发射光束引导朝向空间中的方向并且从选定方向接收反射光束;以及基于光纤的光学耦合器。该光子芯片和该扫描器被放置在半导体集成平台(SIP)上。该基于光纤的光学耦合器被放置在该光子芯片的顶部以光学地耦合到该光子芯片用于将来自该光子芯片的发射光束引导到该扫描器,并且用于将来自该扫描器的反射光束引导到该光子芯片。
Description
技术领域
本公开涉及LIDAR(光检测和测距)系统,并且具体地涉及一种形成在芯片上的LIDAR系统。
背景技术
LIDAR是一种遥感方法,它使用脉冲或频率或相位调制激光形式的光来测量选定物体的范围和其它参数。LIDAR系统的使用日益地需要减小外形尺寸和具有更轻的重量,同时仍然提供可靠的测量。因此,希望提供一种重量轻且体积小的LIDAR系统。
发明内容
在一个示例性实施例中,公开了一种LIDAR系统。该LIDAR系统包括光子芯片,其配置为发射所发射光束并且接收反射光束;扫描器,其用于将发射光束引导朝向空间中的方向并且从选定方向接收反射光束;以及基于光纤的光学耦合器,其用于将来自该光子芯片的发射光引导到该扫描器并且用于将来自该扫描器的反射光引导到该光子芯片。
除了本文描述的一个或多个特征以外,该基于光纤的光学耦合器进一步包括基于光纤的环行器和基于光纤的准直器。第一光纤提供发射光束从该光子芯片到该基于光纤的环行器的光学传送,而第二光纤提供反射光束从该基于光纤的环行器到光子芯片的光学传送。该光子芯片进一步包括发射器光束边缘或光栅耦合器,其与该第一光纤对准用于将所发射光束发射到该基于光纤的环行器;以及接收器光束边缘或光栅耦合器,其与该第二光纤对准以用于将该反射光束发射到该光子芯片。该光子芯片和扫描器被设置在半导体集成平台上,而该基于光纤的光学耦合器被设置在光子芯片的顶部上。该系统进一步包括处理器,其配置为操作该光子芯片以产生该发射光并且接收与该反射光有关的数据以便确定物体的参数,该物体经由与该发射光的相互作用而产生该反射光。在各种实施例中,光源是分布式布拉格光栅激光二极管,而扫描器是二维微机电(MEMS)扫描器。
在另一示例性实施例中,公开了一种制造LIDAR芯片的方法。该方法包括将光子芯片和扫描器放置在半导体集成平台(SIP)上、将基于光纤的光学耦合器放置在该光子芯片的顶部以光学地耦合到该光子芯片用于将来自该光子芯片的发射光束引导到该扫描器,并且用于将来自该扫描器的反射光束引导到该光子芯片。
除了本文描述的一个或多个特征以外,该基于光纤的光学耦合器进一步包括基于光纤的环行器和基于光纤的准直器。该基于光纤的光学耦合器被放置在该光子芯片的顶部,以经由第一光纤和第二光纤将该基于光纤的环行器光学地耦合到该光子芯片。具体地,该基于光纤的耦合器被沉积在该光子芯片上,使得该光子芯片的发射器光束边缘或光栅耦合器与该第一光纤对准并且该光子芯片的接收器光束边缘或光栅耦合器与该第二光纤对准。通过将该SIP耦合到包括处理器的印刷电路板来将该光子芯片耦合到该处理器。在各种实施例中,该印刷电路板包括模数转换器。
在又一示例性实施例中,公开了一种LIDAR芯片。该LIDAR芯片包括半导体集成平台(SIP);光子芯片,其耦合到SIP的顶表面并且配置为发射所发射光束并接收反射光束;扫描器,其耦合到该SIP的顶表面并且配置为将发射光束引导朝向空间中的选定方向并从选定方向接收反射光束;以及基于光纤的光学耦合器,其被沉积在该光子芯片的顶部用于将来自该光子芯片的发射光引导到该扫描器并且用于将来自该扫描器的反射光引导到该光子芯片。
除了本文描述的一个或多个特征以外,该基于光纤的光学耦合器进一步包括基于光纤的环行器和基于光纤的准直器。第一光纤提供发射光束从该光子芯片到该基于光纤的环行器的光学传送,而第二光纤提供反射光束从该基于光纤的环行器到光子芯片的光学传送。该光子芯片进一步包括发射器光束边缘或光栅耦合器,其与该第一光纤对准用于将所发射光束发射到该基于光纤的环行器;以及接收器光束边缘或光栅耦合器,其与该第二光纤对准以用于将该反射光束发射到该光子芯片。该SIP耦合到包括处理器的印刷电路板。该处理器配置为向与该光子芯片相关联的光源提供波形,从该光子芯片的光电检测器接收数据,并且根据从该光子芯片接收的数据来确定物体的参数。
从结合附图取得的本公开的最佳模式的以下详细描述,上述特征和优点以及本公开的其它特征和优点容易地显而易见。
附图说明
其它特征、优点和细节仅借助于示例出现在以下详细描述中,该详细描述参考附图,其中:
图1示出了LIDAR系统的框图;
图2示出了适用于图1的LIDAR系统的示例性光子芯片;
图3A示出了示例性实施例中的组装式LIDAR芯片的侧视图;
图3B示出了集成LIDAR芯片的俯视图;并且
图4示出了说明制造LIDAR光子芯片的方法的流程图。
具体实施方式
以下描述仅仅具有示例性本质并且不旨在限制本公开、其应用或用途。应当理解的是,在整个附图中,对应的附图标号指示相同或对应的部分和特征。
根据示例性实施例,图1示出了LIDAR系统100的框图。LIDAR系统100包括光子芯片102、光学耦合器104和微机电系统(MEMS)扫描器106。处理器108控制光子芯片102的操作以便执行LIDAR系统100的操作。在各种实施例中,LIDAR系统100被设置在驻留于印刷电路板上的半导体集成芯片上。如关于图2进一步详细讨论,光子芯片102包括光源,诸如激光器、光学波导网络和一组光电二极管。激光器产生发射光束115,其朝向物体110发射。由于物体110与发射光束115的相互作用而产生的反射光束117在一组光电二极管中与发射光束的一部分(<10%)光学混合。处理器108通过控制调制光源的波形来控制光源的操作。处理器108进一步从光电二极管接收数据,并且根据该数据来确定物体110的各种参数。
在操作中,处理器108控制光子芯片102的光源以产生发射光束115。发射光束115通过光学耦合器104,其准直发射光束115并且将发射光束115引导朝向MEMS扫描器106。MEMS扫描器106使发射光束115在一定角度范围内转向进入LIDAR系统100的周围区域。
MEMS扫描器106包括振动构件,诸如振动镜。处理器108控制振动构件的振荡以便使发射光束115在选定角度范围内转向。在各种实施例中,MEMS扫描器106是二维(2D)MEMS,并且处理器108控制振动构件在两个角度方向上的振荡,诸如方位角和仰角。
当物体110与发射光束115相互作用时,形成反射光束117。在MEMS扫描器106处接收反射光束117的一部分。MEMS扫描器106将反射光束117引导到光学耦合器104中,该光学耦合器将反射光束117改向到光子芯片102中。
在各种实施例中,LIDAR系统100可以与车辆相关联,并且物体110可以是车辆外部的任何物体,诸如另一台车辆、行人、电线杆等。LIDAR系统100确定诸如范围、多普勒效应以及物体110的方位角和仰角等参数,并且车辆使用这些参数来相对于物体110进行导航以避免与物体110接触。
图2示出了适用于图1的LIDAR系统100的示例性光子芯片102。在各种实施例中,光子芯片102是扫描调频连续波(FMCW)LIDAR芯片。在各种实施例中,光子芯片102可以是硅光子芯片。光子芯片102从诸如激光器202等相干光源接收光。激光器202可以独立于光子芯片102,或者可以是光子芯片102的集成部件。激光器202可以是可以进行调频的任何单频激光器。在一个实施例中,激光器202是分布式布拉格反射器(DBR)激光器。在各种实施例中,激光器202产生频率为1550纳米(nm)的光或被认为对人眼安全的其它波长的光。激光器202经由边缘耦合器耦合到发射器波导204,该边缘耦合器从激光器202接收光。发射器波导204将来自激光器202的光经由发射器光束边缘或光栅耦合器220导出光子芯片102作为发射光束115。
本地振荡器(LO)波导206经由位于光源202与边缘或光栅耦合器220之间的定向耦合器/分束器或多模干涉(MMI)耦合器/分束器210光学地耦合到发射器波导204。定向或MMI耦合器/分束器210将来自激光器202的光分束成持续在发射器波导204中传播的发射光束115和在本地振荡器波导206中传播的本地振荡器光束。在各种实施例中,对于发射器波束,分束比可以是90%,而对于本地振荡器波束,分束比可以是10%。本地振荡器光束指向执行光束测量的双平衡光电检测器214。
入射或反射光束117经由接收器光束边缘或光栅耦合器222进入接收器波导208。接收器波导208将反射光束117从接收器光束边缘或光栅耦合器222引导到双平衡光电检测器214。接收器波导208在位于边缘或光栅耦合器222与光电检测器214之间的定向或MMI耦合器/组合器212处光学地耦合到本地振荡器波导206。因此,本地振荡器光束和反射光束117在被接收于双平衡光电检测器214处之前在定向或MMI耦合器/组合器212处彼此相互作用。在各种实施例中,发射器波导204,本地振荡器波导206和接收器波导208可以是光纤。
双平衡光电检测器214检测由于发射器光束从物体110(图1)反射回来而在发射光束115与反射光束117中引起的频率差。双平衡光电检测器214耦合到处理器108(图1)。处理器108(图1)根据频率差来确定物体110的参数,诸如范围或距离、物体110的到达方向以及物体110相对于LIDAR系统100的速度。
图3A示出了示例性实施例中的组装式LIDAR芯片的侧视图300。组装式LIDAR芯片包括光子芯片102、光学耦合器104和MEMS扫描器106。光子芯片102和MEMS扫描器106形成或放置在半导体集成平台(SIP)302的顶表面上。SIP 302固定到印刷电路板320。印刷电路板320可以包括模数转换器和数字信号处理器,诸如图1的处理器108,用于驱动光子芯片102的电子装置并且用于对来自光子芯片102的光电检测器的数据进行后处理。在各种实施例中,光子芯片102包括激光器202(图2)。光学耦合器104被放置在光子芯片102的顶部上,使得发射器光束边缘或光栅耦合器220和接收器光束边缘或光栅耦合器222与光学耦合器104的对应波导对准。光学耦合器104包括基于光纤的环行器306和包封在基板304中并且由该基板支撑的基于光纤的准直器308,该基板可以是塑料基板。包封在基板304中的各种光纤光学地连接环行器306、准直器308以及光学耦合器104的各种输入和输出。典型的光纤312说明了将光子芯片102连接到环行器306的光学波导。图3B示出了示出光学元件之间的光纤连接的更详细视图。
图3B示出了集成LIDAR系统100的俯视图320。俯视图320示出了连接光学耦合器104的各种光学元件的光学波导的细节。具体地,光纤312a提供从发射器光束边缘或光栅耦合器220到环行器306的光学路径。光纤312b提供从环行器306到接收器光束边缘或光栅耦合器222的光学路径。光纤314在环行器306与准直器308之间提供光学路径。
环行器306分离发射光束115和反射光束117的光学路径,使得沿着选定光学路径进入环行器306的反射光束117在光子芯片102的第一位置处被引导到接收器光束边缘或光栅耦合器222中,而经由发射光束边缘或光栅耦合器220在第二位置处离开光子芯片102的发射光束115沿着相同的选定光学路径被引导。
现在参考图3A和3B,离开光子芯片102的发射光束115按顺序传播通过环行器306、准直器308并且从耦合器104中传出以照射在镜310上,该镜将发射光束115反射到MEMS扫描器106上。MEMS扫描器106基于其振动构件的角度定向将发射光束115引导朝向空间中的选定方向。以发射光束115的反方向行进的反射光束117照射在MEMS扫描器106的振动构件上,并且从MEMS扫描器106反射到镜310上并进入准直器308。然后,反射光束117从准直器308通过环行器306并进入光子芯片102。虽然发射光束115和反射光束117在图3A中被示为具有不同的光学路径,但是这仅用于说明目的。在各种实施例中,发射光束115被引导到空间中的选定方向,并且反射光束117从空间中的相同选定方向接收。因此,发射光束115和反射光束117沿着MEMS扫描器106与空间中的选定方向之间的相同光学路径行进。
图4示出了说明制造本文公开的LIDAR光子芯片的方法400的流程图。在框402中,制造光子芯片。光子芯片的制造包括在光子芯片102内形成各种波导(即,发射器光束波导204、本地振荡器波导206和接收器光束波导208)、定向或MMI耦合器/分束器210和212,以及边缘或光栅耦合器220和222。在框404中,还将激光器集成到光子芯片中。在框406中,集成光子芯片102和MEMS扫描器106集成到半导体集成平台(SIP)302上。在框408中,将基于光纤的光学耦合器104放置在光子芯片102的顶部,以便将发射光束边缘或光栅耦合器220与光学耦合器104的光纤312a对准,并且将接收器光束边缘或光栅耦合器222与光学耦合器104的光纤312b对准。在框410中,将SIP 302集成到印刷电路板320上。
虽然已经参考示例性实施例描述了以上公开内容,但是本领域技术人员将会理解,在不脱离本公开内容的范围的情况下,可进行各种改变并且可用等同物替换其元件。另外,在不脱离本公开的实质范围的情况下,可进行许多修改以使特定的情况或材料适应本公开的教导。因此,希望本公开不限于所公开的特定实施例,而是将包括落入本申请范围内的所有实施例。
Claims (4)
1.一种LIDAR系统,包括:
光子芯片,其配置为发射光束并且接收反射光束;
扫描器,其用于将所述发射光束引导朝向空间中的方向并且从选定方向接收所述反射光束;以及
基于光纤的光学耦合器,其用于将来自所述光子芯片的所述发射光束引导到所述扫描器,并且用于将来自所述扫描器的所述反射光束引导到所述光子芯片,其中,所述基于光纤的光学耦合器还包括基于光纤的准直器,以用于接收来自所述扫描器的反射光束;
镜,所述镜用于将从所述光学耦合器中传出的所述发射光束反射到所述扫描器上以及使来自所述扫描器的所述反射光束反射进入所述准直器;
其中所述基于光纤的光学耦合器进一步包括基于光纤的环行器,且来自所述基于光纤的准直器的反射光束穿过所述基于光纤的环行器;
所述系统进一步包括第一光纤,其用于将来自所述光子芯片的所述发射光束光学地传送到所述基于光纤的环行器;以及第二光纤,其用于将来自所述基于光纤的环行器的所述反射光束光学地传送到所述光子芯片;
其中所述光子芯片进一步包括发射器光束边缘或光栅耦合器,其与所述第一光纤对准用于将所述发射光束发射到所述基于光纤的环行器;以及接收器光束边缘或光栅耦合器,其与所述第二光纤对准以用于将所述反射光束发射到所述光子芯片。
2.根据权利要求1所述的LIDAR系统,进一步包括处理器,其配置为操作所述光子芯片以产生所述发射光束并且接收与所述反射光束有关的数据以便确定物体的参数,所述物体经由与所述发射光束的相互作用而产生所述反射光束。
3.一种制造LIDAR芯片的方法,包括:
将光子芯片和扫描器放置在半导体集成平台上;以及
将基于光纤的光学耦合器放置在所述光子芯片的顶部以光学地耦合到所述光子芯片用于将来自所述光子芯片的发射光束引导到所述扫描器,并且用于将来自所述扫描器的反射光束引导到所述光子芯片,其中,所述基于光纤的光学耦合器包括基于光纤的准直器,以用于接收来自所述扫描器的反射光束;
放置镜,所述镜用于将从所述光学耦合器中传出的所述发射光束反射到所述扫描器上,以及使来自所述扫描器的所述反射光束反射进入所述准直器;
其中所述基于光纤的光学耦合器进一步包括基于光纤的环行器,且来自所述基于光纤的准直器的反射光束穿过所述基于光纤的环行器;
所述方法进一步包括将所述基于光纤的光学耦合器放置在所述光子芯片的顶部,以经由第一光纤和第二光纤将所述基于光纤的环行器光学地耦合到所述光子芯片;
所述方法进一步包括将所述基于光纤的耦合器沉积在所述光子芯片上,使得所述光子芯片的发射器光束边缘或光栅耦合器与所述第一光纤对准并且所述光子芯片的接收器光束边缘或光栅耦合器与所述第二光纤对准。
4.根据权利要求3所述的方法,进一步包括经由将所述半导体集成平台耦合到包括处理器的印刷电路板来将所述光子芯片耦合到所述处理器。
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US16/018,831 US11002832B2 (en) | 2017-07-12 | 2018-06-26 | Chip-scale LIDAR with a single 2D MEMS scanner |
US16/018831 | 2018-06-26 |
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CN201810755436.XA Active CN109254305B (zh) | 2017-07-12 | 2018-07-11 | 用于同时距离-多普勒感测的双波长激光器芯片级激光雷达 |
CN201810755828.6A Active CN109254275B (zh) | 2017-07-12 | 2018-07-11 | 激光二极管光学频率调制线性化算法 |
CN201810755512.7A Active CN109254296B (zh) | 2017-07-12 | 2018-07-11 | 异构集成的芯片级激光雷达系统 |
CN201810755894.3A Active CN109254276B (zh) | 2017-07-12 | 2018-07-11 | 用于芯片级激光雷达中的无源对准的曲面镜结构的异质集成 |
CN201810762725.2A Active CN109254277B (zh) | 2017-07-12 | 2018-07-12 | 具有单个2d mems扫描器的芯片级lidar |
CN201810776440.4A Pending CN109254359A (zh) | 2017-07-12 | 2018-07-12 | 减少集成激光二极管的反射的光子集成电路边缘耦合器结构 |
CN201910261645.3A Pending CN110389329A (zh) | 2017-07-12 | 2019-04-02 | 具有集成高功率激光二极管的芯片级相干激光雷达 |
CN201910440470.2A Active CN110646776B (zh) | 2017-07-12 | 2019-05-24 | 紧凑光学封装中具有单个mems扫描器的芯片级lidar |
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Country Status (3)
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Families Citing this family (46)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11226403B2 (en) * | 2017-07-12 | 2022-01-18 | GM Global Technology Operations LLC | Chip-scale coherent lidar with integrated high power laser diode |
US10908372B2 (en) * | 2018-03-05 | 2021-02-02 | The Charles Stark Draper Laboratory, Inc. | Systems and methods for isolating excitation and signal paths for chip-scale LIDAR |
US20200018857A1 (en) * | 2018-07-12 | 2020-01-16 | Silc Technologies, Inc. | Optical Sensor System |
US11796677B2 (en) * | 2018-07-19 | 2023-10-24 | Silc Technologies, Inc. | Optical sensor system |
EP3834012A1 (en) * | 2018-08-09 | 2021-06-16 | FRAUNHOFER-GESELLSCHAFT zur Förderung der angewandten Forschung e.V. | Lidar and method for optical remote sensing |
US11280884B2 (en) * | 2018-08-30 | 2022-03-22 | Photodigm Inc. | LIDAR instrument and method for operating a LIDAR instrument |
JP7406833B2 (ja) * | 2018-10-15 | 2023-12-28 | ビフレスト コミュニケーションズ アぺーエス | 高性能光受信機を含む光学システム及びその方法 |
US11280907B2 (en) * | 2018-12-28 | 2022-03-22 | Texas Instruments Incorporated | Depth imaging system |
CN109730923B (zh) * | 2019-03-04 | 2021-02-19 | 黑龙江中医药大学 | 辅助耳穴压籽的耳部穴位自动定位装置、定位系统及定位方法 |
CN109828286B (zh) * | 2019-03-08 | 2021-07-30 | 上海禾赛科技有限公司 | 激光雷达 |
EP3719537B1 (de) | 2019-04-04 | 2021-03-17 | Sick Ag | Messen von abständen |
US11662435B2 (en) * | 2019-04-04 | 2023-05-30 | Liturex (Guangzhou) Co. Ltd | Chip scale integrated scanning LiDAR sensor |
US11079546B2 (en) * | 2019-04-22 | 2021-08-03 | Blackmore Sensors & Analytics, LLC. | Providing spatial displacement of transmit and receive modes in LIDAR system |
CN110068808A (zh) * | 2019-05-29 | 2019-07-30 | 南京芯视界微电子科技有限公司 | 激光雷达的接收机装置及激光雷达 |
CN112346239B (zh) * | 2019-08-07 | 2022-10-18 | 华为技术有限公司 | 激光扫描装置 |
US11714167B2 (en) * | 2019-08-21 | 2023-08-01 | Silc Technologies, Inc. | LIDAR adapter for use with LIDAR chip |
US11556000B1 (en) | 2019-08-22 | 2023-01-17 | Red Creamery Llc | Distally-actuated scanning mirror |
US11320522B1 (en) * | 2019-09-17 | 2022-05-03 | Aeva, Inc. | System and method for FMCW LIDAR with DC laser |
US10845550B1 (en) * | 2019-10-18 | 2020-11-24 | The Boeing Company | Input coupler for chip-scale laser receiver device |
US11385406B2 (en) * | 2019-10-29 | 2022-07-12 | Waymo Llc | Optical signal routing devices and systems |
US11639988B2 (en) | 2019-10-29 | 2023-05-02 | GM Global Technology Operations LLC | Photonic circulator for a LiDAR device |
WO2021097064A1 (en) * | 2019-11-12 | 2021-05-20 | Pointcloud Inc. | Dual path light detection and ranging system |
CN111257902A (zh) * | 2019-12-17 | 2020-06-09 | 北京理工大学 | 一种基于四象限探测器的调频测距系统及方法 |
US11579272B2 (en) | 2019-12-23 | 2023-02-14 | Toyota Motor Engineering & Manufacturing North America, Inc. | Method and reflect array for alignment calibration of frequency modulated LiDAR systems |
US11480662B2 (en) | 2020-02-12 | 2022-10-25 | Aptiv Technologies Limited | Fast-scanning frequency-modulated continuous wave (FMCW) lidar systems |
KR102275387B1 (ko) * | 2020-02-25 | 2021-07-09 | 한화시스템 주식회사 | 소형 표적 검출 장치 및 방법 |
ES2868473B2 (es) | 2020-04-21 | 2022-02-28 | Mouro Labs S L | Sistema LIDAR con cambio de frecuencia Doppler suprimido |
CN111562564B (zh) * | 2020-05-25 | 2022-04-15 | 浙江光珀智能科技有限公司 | 一种调频连续波激光测距非线性校正装置及方法 |
EP3916424A1 (de) | 2020-05-25 | 2021-12-01 | Scantinel Photonics GmbH | Vorrichtung und verfahren zur scannenden messung des abstands zu einem objekt |
US11454724B2 (en) | 2020-06-12 | 2022-09-27 | Ours Technology, Llc | Lidar beam walk-off correction |
US11428785B2 (en) * | 2020-06-12 | 2022-08-30 | Ours Technology, Llc | Lidar pixel with active polarization control |
US11592562B2 (en) * | 2020-06-22 | 2023-02-28 | LightIC Technologies HK Limited | Continuous-wave light detection and ranging (LiDAR) system |
US11740338B2 (en) | 2020-07-02 | 2023-08-29 | Aptiv Technologies Limited | Resolving return signals among pixels in frequency-modulated continuous-wave (FMCW) lidar systems |
US11940566B2 (en) * | 2020-07-07 | 2024-03-26 | Silc Technologies, Inc. | Sequencing of signals in LIDAR systems |
US11971508B2 (en) | 2020-07-08 | 2024-04-30 | Aptiv Technologies AG | Varying waveforms across frames in frequency-modulated continuous-wave (FMCW) lidar systems |
US11726206B2 (en) | 2020-08-25 | 2023-08-15 | Pony Ai Inc. | Systems and methods for linearizing non-linear chirp signals |
US11740354B2 (en) | 2020-09-30 | 2023-08-29 | Pony Ai Inc. | Methods of linearizing non-linear chirp signals |
US20220120900A1 (en) * | 2020-10-15 | 2022-04-21 | Waymo Llc | Light detection and ranging device using combined pulse and continuous optical signals |
US10976415B1 (en) * | 2020-11-09 | 2021-04-13 | Aeva, Inc. | Techniques for image conjugate pitch reduction |
FR3116615B1 (fr) * | 2020-11-24 | 2022-11-11 | Scintil Photonics | Puce photonique et composant photonique integrant une telle puce |
CN112859256B (zh) * | 2021-01-07 | 2022-07-08 | 天津大学 | 一种基于图像识别的光栅耦合器定位测量方法 |
CN112953645B (zh) * | 2021-01-27 | 2023-02-28 | 吉林大学 | 一种同时实现激光测距与通信的系统与方法 |
EP4199378A1 (en) * | 2021-12-20 | 2023-06-21 | Imec VZW | A photonics device and a method for suppressing backreflections in a photonics device |
US11719895B1 (en) | 2022-02-24 | 2023-08-08 | Globalfoundries U.S. Inc. | Spot-size converters with angled facets |
DE102023204477A1 (de) | 2022-05-12 | 2023-11-16 | Carl Zeiss Smt Gmbh | Mikroelektromechanisches System (MEMS) |
CN114942424B (zh) * | 2022-07-25 | 2022-11-25 | 苏州旭创科技有限公司 | 激光雷达芯片和激光雷达 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106415309A (zh) * | 2014-06-27 | 2017-02-15 | Hrl实验室有限责任公司 | 扫描激光雷达及其制造方法 |
CN106443634A (zh) * | 2016-10-31 | 2017-02-22 | 上海博未传感技术有限公司 | 一种固态激光雷达系统 |
Family Cites Families (84)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4394060A (en) * | 1981-04-15 | 1983-07-19 | Canon Kabushiki Kaisha | Light beam scanning system with saw transducer |
JPH0681098B2 (ja) * | 1985-09-06 | 1994-10-12 | 日本電信電話株式会社 | 光デイジタル送信器 |
JPH04371911A (ja) | 1991-06-21 | 1992-12-24 | Hitachi Ltd | 光アイソレータおよび希土類添加ファイバ光増幅装置 |
US5139879A (en) | 1991-09-20 | 1992-08-18 | Allied-Signal Inc. | Fluoropolymer blend anti-reflection coatings and coated articles |
US5499132A (en) | 1992-05-13 | 1996-03-12 | Matsushita Electric Industrial Co., Ltd. | Optical passive components |
JPH0659038A (ja) * | 1992-08-07 | 1994-03-04 | Nissan Motor Co Ltd | 車両用レーザレーダ |
US5835199A (en) * | 1996-05-17 | 1998-11-10 | Coherent Technologies | Fiber-based ladar transceiver for range/doppler imaging with frequency comb generator |
US5852492A (en) * | 1996-06-07 | 1998-12-22 | Lockheed Martin Vought Systems Corp. | Fused lasar range/intensity image display for a human interpretation of lasar data |
US6229947B1 (en) | 1997-10-06 | 2001-05-08 | Sandia Corporation | Tapered rib fiber coupler for semiconductor optical devices |
JPH11218721A (ja) | 1997-11-07 | 1999-08-10 | Samsung Electronics Co Ltd | 多段複合光学装置 |
EP1754994B1 (en) | 1998-09-22 | 2007-12-12 | FUJIFILM Corporation | Process for the preparation of an anti-reflection film |
US6480331B1 (en) | 1999-11-10 | 2002-11-12 | Avanex Corporation | Reflection-type polarization-independent optical isolator, optical isolator/amplifier/monitor, and optical system |
JP2001201573A (ja) * | 2000-01-20 | 2001-07-27 | Mitsubishi Electric Corp | コヒーレントレーザレーダ装置および目標測定方法 |
JP2001264694A (ja) | 2000-03-15 | 2001-09-26 | Shin Etsu Chem Co Ltd | 偏波無依存型光アイソレータ |
JP3771777B2 (ja) * | 2000-05-12 | 2006-04-26 | 三菱電機株式会社 | レーザレーダ装置 |
US6442310B1 (en) | 2000-07-14 | 2002-08-27 | Jds Uniphase Inc. | Optical coupling device and method |
WO2003044580A2 (en) | 2001-04-03 | 2003-05-30 | Little Optics, Inc. | Optical waveguide mode transformer |
US6962345B2 (en) | 2002-02-15 | 2005-11-08 | Dana Corporation | MLS gasket with bore edge stopper bead |
US7031574B2 (en) | 2002-07-10 | 2006-04-18 | Finisar Corporation | Plug-in module for providing bi-directional data transmission |
US6839170B2 (en) | 2002-10-15 | 2005-01-04 | Oplink Communications, Inc. | Optical isolator |
JP4053542B2 (ja) * | 2002-12-27 | 2008-02-27 | 三菱電機株式会社 | レーザーレーダ装置 |
US7359593B2 (en) | 2003-10-09 | 2008-04-15 | Infinera Corporation | Integrated optical mode shape transformer and method of fabrication |
JP4672273B2 (ja) | 2004-03-24 | 2011-04-20 | 富士通株式会社 | 波長多重光伝送システム及びそれにおける送信波長制御方法 |
ITRM20040291A1 (it) * | 2004-06-16 | 2004-09-16 | Alenia Spazio Spa | Apparato di separzione di fascio per lidar monostatici. |
US20060002443A1 (en) | 2004-06-30 | 2006-01-05 | Gennady Farber | Multimode external cavity semiconductor lasers |
JP5112870B2 (ja) * | 2004-09-28 | 2013-01-09 | キネテイツク・リミテツド | 周波数掃引の直線性が改善された周波数変調持続波(fmcw)レーダ |
GB0421520D0 (en) * | 2004-09-28 | 2004-10-27 | Qinetiq Ltd | Frequency modulated continuous wave (FMCW) radar having improved frquency sweep linearity |
CN101166947B (zh) * | 2005-02-14 | 2010-05-19 | 数字信号公司 | 用于提供线性调频电磁辐射的系统和方法 |
US7139446B2 (en) * | 2005-02-17 | 2006-11-21 | Metris Usa Inc. | Compact fiber optic geometry for a counter-chirp FMCW coherent laser radar |
WO2008121159A2 (en) * | 2006-10-19 | 2008-10-09 | Los Alamos National Security Llc | Active terahertz metamaterial devices |
US7481588B2 (en) | 2006-11-21 | 2009-01-27 | Kvh Industries, Inc. | Optical fiber composite, devices, and methods of making same |
CN101849196A (zh) * | 2007-10-09 | 2010-09-29 | 丹麦技术大学 | 基于半导体激光器和放大器的相干激光雷达系统 |
US8836439B2 (en) * | 2007-10-12 | 2014-09-16 | Los Alamos National Security Llc | Dynamic frequency tuning of electric and magnetic metamaterial response |
US8121450B2 (en) | 2007-12-12 | 2012-02-21 | Lightwire, Inc. | Coupling between free space and optical waveguide using etched coupling surfaces |
US8674792B2 (en) * | 2008-02-07 | 2014-03-18 | Toyota Motor Engineering & Manufacturing North America, Inc. | Tunable metamaterials |
US8687173B2 (en) * | 2008-09-11 | 2014-04-01 | Nikon Metrology N.V. | Compact fiber optic geometry for a counter chirp FMCW coherent laser radar |
US8193555B2 (en) | 2009-02-11 | 2012-06-05 | Megica Corporation | Image and light sensor chip packages |
CN101561554A (zh) * | 2009-05-20 | 2009-10-21 | 中国科学院上海光学精密机械研究所 | 相位可控双折射空间光桥接器 |
US8934509B2 (en) * | 2009-11-23 | 2015-01-13 | Lockheed Martin Corporation | Q-switched oscillator seed-source for MOPA laser illuminator method and apparatus |
WO2011084863A2 (en) * | 2010-01-07 | 2011-07-14 | Cheetah Omni, Llc | Fiber lasers and mid-infrared light sources in methods and systems for selective biological tissue processing and spectroscopy |
CN102004255B (zh) * | 2010-09-17 | 2012-07-04 | 中国科学院上海技术物理研究所 | 啁啾调幅激光雷达距离-多普勒零差探测系统 |
US8878095B2 (en) | 2010-12-17 | 2014-11-04 | Electro Scientific Industries, Inc. | Reducing back-reflection in laser micromachining systems |
US20140080729A1 (en) * | 2011-03-22 | 2014-03-20 | Research Triangle Institute, International | Optical sensing device for sensing analytes and related apparatus and methods |
KR101883946B1 (ko) * | 2012-01-03 | 2018-07-31 | 현대모비스 주식회사 | 밸런스 구조의 fmcw 레이더 장치 |
US10288805B2 (en) | 2012-02-13 | 2019-05-14 | Mellanox Technologies Silicon Photonics Inc. | Coupling between optical devices |
US9638799B2 (en) * | 2012-11-21 | 2017-05-02 | Nikon Corporation | Scan mirrors for laser radar |
US10119816B2 (en) * | 2012-11-21 | 2018-11-06 | Nikon Metrology Nv | Low drift reference for laser radar |
US9618619B2 (en) * | 2012-11-21 | 2017-04-11 | Nikon Corporation | Radar systems with dual fiber coupled lasers |
US8908251B2 (en) * | 2013-01-30 | 2014-12-09 | Hrl Laboratories, Llc | Tunable optical metamaterial |
US9285461B2 (en) * | 2013-03-12 | 2016-03-15 | Nokia Technologies Oy | Steerable transmit, steerable receive frequency modulated continuous wave radar transceiver |
DE102013211846A1 (de) * | 2013-06-21 | 2014-12-24 | Robert Bosch Gmbh | Verfahren zum Betrieb eines Umfelderfassungssystems eines Fahrzeugs |
US9683928B2 (en) * | 2013-06-23 | 2017-06-20 | Eric Swanson | Integrated optical system and components utilizing tunable optical sources and coherent detection and phased array for imaging, ranging, sensing, communications and other applications |
US9470913B2 (en) * | 2013-07-01 | 2016-10-18 | The Boeing Company | Integrated photonic frequency converter and mixer |
US9122037B2 (en) | 2013-07-18 | 2015-09-01 | Cisco Technology, Inc. | Coupling system for optical fibers and optical waveguides |
US9720218B2 (en) | 2013-08-06 | 2017-08-01 | Howard Hughes Medical Institute | Volume imaging |
KR101896726B1 (ko) * | 2013-12-02 | 2018-09-07 | 주식회사 만도 | Cw 레이더 센싱 신호 및 fmcw 레이더 센싱 신호 기반의 주변 환경 감지 방법 및 장치 |
CN103760548B (zh) * | 2014-01-09 | 2016-02-03 | 中国科学院电子学研究所 | 一种基于相干体制激光雷达波形的信号处理方法 |
WO2015184406A1 (en) * | 2014-05-30 | 2015-12-03 | Texas Tech University System | Hybrid fmcw-intererometry radar for positioning and monitoring and methods of using the same |
CN104035101B (zh) * | 2014-06-12 | 2016-03-30 | 中国科学院上海技术物理研究所 | 基于强度编码的合成孔径激光雷达系统 |
GB201411206D0 (en) * | 2014-06-24 | 2014-08-06 | Sec Dep For Business Innovation & Skills The And Usw Commercial Services Ltd | Dual laser frequency sweep interferometry system and method |
WO2016118637A1 (en) | 2015-01-20 | 2016-07-28 | Volfson Leo | Single aperture laser range finder |
KR102679530B1 (ko) | 2015-02-18 | 2024-06-27 | 스마트 포토닉스 홀딩 비.브이. | 포토닉 ic 특성화 및 패키징을 위한 멀티-포트 광 프로브 |
CN104698541B (zh) * | 2015-03-09 | 2017-11-21 | 哈尔滨工程大学 | 一种径向偏振光产生装置 |
US9335480B1 (en) | 2015-03-17 | 2016-05-10 | Huawei Technologies Co., Ltd. | Optical alignment using multimode edge couplers |
KR20180030057A (ko) * | 2015-06-26 | 2018-03-21 | 메즈메리즈, 인코포레이티드. | 비트 신호 대역폭 압축 방법, 장치 및 애플리케이션 |
US9704260B2 (en) * | 2015-07-28 | 2017-07-11 | The Nielsen Company (Us), Llc | Methods and apparatus to improve detection and false alarm rate over image segmentation |
US9673847B1 (en) * | 2015-11-25 | 2017-06-06 | Analog Devices, Inc. | Apparatus and methods for transceiver calibration |
WO2017095817A1 (en) * | 2015-11-30 | 2017-06-08 | Luminar Technologies, Inc. | Lidar system with distributed laser and multiple sensor heads and pulsed laser for lidar system |
CN105549001B (zh) * | 2015-12-02 | 2019-01-04 | 大连楼兰科技股份有限公司 | 车载毫米波雷达系统多目标检测方法 |
CN105425224B (zh) * | 2015-12-02 | 2019-01-04 | 大连楼兰科技股份有限公司 | 车载毫米波雷达系统多目标个数获取方法及装置 |
US9823118B2 (en) | 2015-12-26 | 2017-11-21 | Intel Corporation | Low power, high resolution solid state LIDAR circuit |
CN105529538B (zh) * | 2016-01-12 | 2018-12-18 | 电子科技大学 | 一种基于连续光栅结构的高功率毫米波宽带模式变换器 |
US20170336565A1 (en) | 2016-05-20 | 2017-11-23 | Judson D. Ryckman | Single mode optical coupler |
CN205982626U (zh) * | 2016-06-30 | 2017-02-22 | 南京信息工程大学 | 基于双标准具的测速系统 |
US20180081031A1 (en) * | 2016-09-19 | 2018-03-22 | Delphi Technologies, Inc. | Coherent lidar system for automated vehicles |
US10886437B2 (en) | 2016-11-03 | 2021-01-05 | Lumileds Llc | Devices and structures bonded by inorganic coating |
CN106772407A (zh) * | 2016-12-02 | 2017-05-31 | 深圳市镭神智能系统有限公司 | 基于mems微镜扫描的激光雷达系统 |
CN106707291B (zh) * | 2016-12-09 | 2020-01-03 | 中国科学技术大学 | 一种双频线性调频相干测风激光雷达 |
US9810775B1 (en) * | 2017-03-16 | 2017-11-07 | Luminar Technologies, Inc. | Q-switched laser for LIDAR system |
US10254762B2 (en) | 2017-03-29 | 2019-04-09 | Luminar Technologies, Inc. | Compensating for the vibration of the vehicle |
US11226403B2 (en) * | 2017-07-12 | 2022-01-18 | GM Global Technology Operations LLC | Chip-scale coherent lidar with integrated high power laser diode |
US10615568B2 (en) * | 2017-07-12 | 2020-04-07 | GM Global Technology Operations LLC | Antireflection structure for integrated laser diode/photonic chip interface |
CN107272013A (zh) * | 2017-08-02 | 2017-10-20 | 周虎基 | 激光雷达装置与激光雷达检测系统 |
US11726184B2 (en) * | 2019-03-08 | 2023-08-15 | Leddartech Inc. | Component for a LIDAR sensor system, LIDAR sensor system, LIDAR sensor device, method for a LIDAR sensor system and method for a LIDAR sensor device |
-
2018
- 2018-04-20 US US15/957,974 patent/US11226403B2/en active Active
- 2018-06-25 US US16/017,278 patent/US10914821B2/en active Active
- 2018-06-26 US US16/018,716 patent/US10914822B2/en active Active
- 2018-06-26 US US16/018,831 patent/US11002832B2/en active Active
- 2018-06-26 US US16/018,730 patent/US10976414B2/en active Active
- 2018-06-27 US US16/019,691 patent/US10564263B2/en active Active
- 2018-06-27 US US16/020,214 patent/US11092671B2/en active Active
- 2018-06-27 US US16/019,686 patent/US20190018198A1/en not_active Abandoned
- 2018-06-27 US US16/020,202 patent/US11067670B2/en active Active
- 2018-07-10 CN CN201810751217.4A patent/CN109254278B/zh active Active
- 2018-07-11 CN CN201810755436.XA patent/CN109254305B/zh active Active
- 2018-07-11 CN CN201810755828.6A patent/CN109254275B/zh active Active
- 2018-07-11 CN CN201810755512.7A patent/CN109254296B/zh active Active
- 2018-07-11 CN CN201810755894.3A patent/CN109254276B/zh active Active
- 2018-07-12 CN CN201810762725.2A patent/CN109254277B/zh active Active
- 2018-07-12 CN CN201810776440.4A patent/CN109254359A/zh active Pending
-
2019
- 2019-04-02 CN CN201910261645.3A patent/CN110389329A/zh active Pending
- 2019-04-11 DE DE102019109649.9A patent/DE102019109649A1/de active Pending
- 2019-05-24 CN CN201910440470.2A patent/CN110646776B/zh active Active
- 2019-05-29 DE DE102019114579.1A patent/DE102019114579A1/de active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106415309A (zh) * | 2014-06-27 | 2017-02-15 | Hrl实验室有限责任公司 | 扫描激光雷达及其制造方法 |
CN106443634A (zh) * | 2016-10-31 | 2017-02-22 | 上海博未传感技术有限公司 | 一种固态激光雷达系统 |
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