CN109254296A - 异构集成的芯片级激光雷达系统 - Google Patents

异构集成的芯片级激光雷达系统 Download PDF

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Publication number
CN109254296A
CN109254296A CN201810755512.7A CN201810755512A CN109254296A CN 109254296 A CN109254296 A CN 109254296A CN 201810755512 A CN201810755512 A CN 201810755512A CN 109254296 A CN109254296 A CN 109254296A
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directing device
photon chip
beam directing
reception
signal
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CN109254296B (zh
Inventor
P·R·帕特森
B·黄
J·H·莎夫纳
K·萨亚赫
O·叶菲莫夫
R·萨基西安
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GM Global Technology Operations LLC
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GM Global Technology Operations LLC
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
    • G01S7/481—Constructional features, e.g. arrangements of optical elements
    • G01S7/4814—Constructional features, e.g. arrangements of optical elements of transmitters alone
    • G01S7/4815—Constructional features, e.g. arrangements of optical elements of transmitters alone using multiple transmitters
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
    • G01S7/481—Constructional features, e.g. arrangements of optical elements
    • G01S7/4817—Constructional features, e.g. arrangements of optical elements relating to scanning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
    • G—PHYSICS
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    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
    • G01S17/003—Bistatic lidar systems; Multistatic lidar systems
    • G—PHYSICS
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    • G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Optical Radar Systems And Details Thereof (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Optical Integrated Circuits (AREA)
  • Traffic Control Systems (AREA)

Abstract

激光雷达系统包括光子芯片，其包括光源和用于提供输出信号进行发射的发射光束耦合器。输出信号是调频连续波(FMCW)信号。发射光束引导装置从光子芯片的发射光束耦合器发射输出信号。接收光束引导装置获得目标对输出信号的反射，并且将反射作为接收信号提供给光子芯片的接收光束耦合器。光子芯片、发射光束引导装置和接收光束引导装置异构地集成到光学引擎中。

Description

异构集成的芯片级激光雷达系统
技术领域
本主题公开涉及异构集成的芯片级激光雷达系统。
背景技术
车辆(例如，汽车、卡车、建筑设施、农场设施、自动化工厂设施)越来越多地配备有提供信息以增强或自动化车辆操作的传感器。示例性传感器包括无线电检测和测距(雷达)系统、相机、麦克风以及光探测和测距(激光雷达)系统。示例性激光雷达系统是相干激光雷达系统，其发射调频连续波(FMCW)信号并且依赖于发射信号与由于目标对发射信号的反射散射引起的回波信号之间的光学相干性以执行目标的检测。在诸如车辆应用等应用中，由于空间可用性有限，传感器的紧凑设计是重要的。因此，希望提供一种异构集成的芯片级激光雷达系统。
发明内容
在一个示例性实施例中，激光雷达系统包括光子芯片，其包括光源和用于提供输出信号进行发射的发射光束耦合器，其中输出信号是调频连续波(FMCW)信号。激光雷达系统还包括发射光束引导装置和接收光束引导装置，发射光束引导装置从光子芯片的发射光束耦合器发射输出信号，接收光束引导装置获得目标对输出信号的反射并且将反射作为接收信号提供给光子芯片的接收光束耦合器，其中光子芯片、发射光束引导装置和接收光束引导装置异构地集成到光学引擎中。
除了本文描述的一个或多个特征之外，发射光束引导装置和接收光束引导装置是被制造为管芯的二维微机电系统(2D MEMS)镜。
除了本文描述的一个或多个特征之外，光学引擎异构地集成在具有蚀刻有用于放置2D MEMS镜的凹坑的半导体板上。
除了本文描述的一个或多个特征之外，发射光束引导装置被放置成与光子芯片的发射光束耦合器光学对准，而接收光束引导装置被放置成与光子芯片的接收光束耦合器光学对准。
除了本文描述的一个或多个特征之外，光子芯片、发射光束引导装置和接收光束引导装置接合到公共半导体板以被动地保持光学对准。
除了本文描述的一个或多个特征以外，激光雷达系统还包括与光学引擎耦合的驱动电子装置。驱动电子装置包括调制激光器驱动器和控制驱动器，调制激光器驱动器用于调制光源并且产生FMCW信号，控制驱动器用于发射光束引导装置和接收光束引导装置。
除了本文描述的一个或多个特征以外，激光雷达系统还包括后检测电子装置以处理由光子芯片的光电检测器提供的电信号。
除了本文描述的一个或多个特征以外，光学引擎、驱动电子装置和后检测电子装置形成在第一印刷电路板上，而控制驱动器形成在第二印刷电路板上。
除了本文描述的一个或多个特征以外，将控制驱动器制造为第一专用集成电路(ASIC)，而将驱动电子装置和后检测电子装置制造为第二ASIC。
除了本文描述的一个或多个特征以外，激光雷达系统在车辆中。
在另一个示例性实施例中，一种封装激光雷达系统的方法包括制造光子芯片。光子芯片包括光源和用于提供输出信号进行发射的发射光束耦合器，并且输出信号是调频连续波(FMCW)信号。方法还包括将发射光束引导装置耦合到光子芯片以从光子芯片的发射光束耦合器发射输出信号，并且将接收光束引导装置耦合到光子芯片以获得目标对输出信号的反射并且将反射作为接收信号提供给光子芯片的接收光束耦合器。光子芯片、发射光束引导装置和接收光束引导装置异构地集成到光学引擎中。
除了本文描述的一个或多个特征以外，方法还包括将发射光束引导装置和接收光束引导装置制造为二维微机电系统(2D MEMS)镜管芯，其中异构地集成光学引擎包括将2DMEMS镜管芯放置在蚀刻于硅板中的凹坑中。
除了本文描述的一个或多个特征以外，方法还包括将发射光束引导装置放置成与光子芯片的发射光束耦合器光学对准，将接收光束引导装置放置成与光子芯片的接收光束耦合器光学对准，以及将光子芯片、发射光束引导装置和接收光束引导装置被动地接合到公共半导体板以保持光学对准。
除了本文描述的一个或多个特征以外，方法还包括将驱动电子装置与光学引擎耦合，其中驱动电子装置包括调制激光器驱动器和控制驱动器，调制激光器驱动器调制光源并且产生FMCW信号，控制驱动器用于发射光束引导装置和接收光束引导装置，以及将后检测电子装置耦合到光学引擎以处理由光子芯片的光电检测器提供的电信号。
除了本文描述的一个或多个特征以外，方法还包括将光学引擎、驱动电子装置和后检测电子装置形成在第一印刷电路板上，并且将控制驱动器形成在第二印刷电路板上，或者将控制驱动器制造为第一专用集成电路(ASIC)，并且将驱动电子装置和后检测电子装置制造为第二ASIC。
在又一示例性实施例中，一种车辆包括激光雷达系统，激光雷达系统包括光子芯片，其包括光源和用于提供输出信号进行发射的发射光束耦合器。输出信号是调频连续波(FMCW)信号。激光雷达系统还包括发射光束引导装置和接收光束引导装置，发射光束引导装置从光子芯片的发射光束耦合器发射输出信号，接收光束引导装置获得目标对输出信号的反射并且将反射作为接收信号提供给光子芯片的接收光束耦合器。光子芯片、发射光束引导装置和接收光束引导装置异构地集成到光学引擎中。车辆还包括车辆控制器以基于来自激光雷达系统的信息来增强或自动化车辆的操作。
除了本文描述的一个或多个特征以外，发射光束引导装置和接收光束引导装置是制造为管芯的二维微机电系统(2D MEMS)镜，而光学引擎异构地集成在具有蚀刻用于放置2D MEMS镜的凹坑的半导体板上。
除了本文描述的一个或多个特征以外，发射光束引导装置被放置成与光子芯片的发射光束耦合器光学对准，接收光束引导装置被放置成与光子芯片的接收光束耦合器光学对准，并且光子芯片、发射光束引导装置和接收光束引导装置被动地接合到公共半导体板以保持光学对准。
除了本文描述的一个或多个特征以外，车辆还包括与光学引擎耦合的驱动电子装置。驱动电子装置包括调制激光器驱动器和控制驱动器以及后检测电子装置，调制激光器驱动器用于调制光源并且产生FMCW信号，控制驱动器用于发射光束引导装置和接收光束引导装置，后检测电子装置处理由光子芯片的光电检测器提供的电信号。
除了本文描述的一个或多个特征以外，光学引擎、驱动电子装置和后检测电子装置形成在第一印刷电路板上，而控制驱动器形成在第二印刷电路板上，或者将控制驱动器制造为第一专用集成电路(ASIC)，而将驱动电子装置和后检测电子装置制造为第二ASIC。
从结合附图取得的本公开的最佳模式的以下详细描述，上述特征和优点以及本公开的其它特征和优点容易地显而易见。
附图说明
其它特征、优点和细节仅借助于示例出现在以下详细描述中，该详细描述参考附图，其中：
图1是根据一个或多个实施例的涉及芯片级相干激光雷达系统的场景的框图。
图2是详述根据一个或多个实施例的激光雷达系统的光子引擎的框图；并且
图3是详述根据一个或多个实施例的激光雷达系统110的各方面的框图。
具体实施方式
以下描述仅仅具有示例性本质并且不旨在限制本公开、其应用或用途。应当理解的是，在整个附图中，对应的附图标号指示相同或对应的部分和特征。
如前所述，相干激光雷达系统是可以用于增强或自动化车辆操作的传感器之一。在涉及传感器和其它系统的有限空间的应用(诸如车辆应用)中，紧凑性是重要的。另外，光学元件的被动对准而不是基于反馈的主动对准过程提高了效率并降低了系统的成本。本文详述的系统和方法的实施例涉及异构集成的芯片级激光雷达系统。异构集成是指将分别制造的部件组装和封装到单个芯片上。根据一个或多个实施例，光子芯片和光束引导装置(例如，扫描微镜管芯的二维微机电系统(MEM))被异构地集成到激光雷达系统的光学引擎中。另外，驱动电子装置和后检测电子装置与光学引擎一起封装在印刷电路板上或专用集成电路(ASIC)中，例如，作为紧凑的激光雷达系统。
根据示例性实施例，图1是涉及芯片级相干激光雷达系统110的场景的框图。图1中所示的车辆100是汽车101。在汽车101的车顶上示出了参考图2进一步详述的相干激光雷达系统110。根据替代或另外的实施例，一个或多个激光雷达系统110可以位于车辆100上的其它位置。还示出了另一个传感器115(例如，相机、声纳、雷达系统)。由激光雷达系统110和一个或多个其它传感器115获得的信息可以被提供给控制器120(例如，电子控制单元(ECU))以用于图像或数据处理、目标识别和随后的车辆控制。
控制器120可以使用信息来控制一个或多个车辆系统130。在示例性实施例中，车辆100可以是自主车辆，并且控制器120可以使用来自激光雷达系统110和其它来源的信息来执行已知的车辆操作控制。在替代实施例中，控制器120可以使用来自激光雷达系统110和作为已知系统(例如，防撞系统、自适应巡航控制系统)的一部分的其它来源的信息来增强车辆操作。激光雷达系统110和一个或多个其它传感器115可以用于检测物体140，诸如图1中所示的行人145。控制器120可以包括处理电路，其可以包括专用集成电路(ASIC)、电子电路、处理器(共享、专用或成组)以及执行一个或多个软件或固件程序的存储器、组合逻辑电路和/或提供所述功能性的其它合适部件。
图2是详述根据一个或多个实施例的激光雷达系统110的光子引擎210的框图。光子引擎210由光子芯片220与光束引导装置的异构集成而产生。每个示例性光束引导装置是二维微机电系统(2D MEMS)微镜管芯。示出了用于发射的2D MEMS镜230a和用于接收的2DMEMS镜230b(通常称为230)。根据示例性实施例，可以使用纳米级精度工艺来制造具有用于附接2D MEMS镜230的凹坑的半导体集成平台。该工艺可以包括例如光刻和干式蚀刻技术。例如，光束引导装置(例如，2D MEMS镜230)被固定(例如，接合)在半导体(例如，硅)板上，使得它们与也接合在半导体板上的光子芯片220对准。通过将2D MEMS镜230与光子芯片220被动地对准，可以避免基于反馈控制的耗时主动对准过程。
光子芯片220包括由参考图3进一步讨论的激光驱动电子装置310调制的光源225。光源225是根据示例性实施例的激光二极管。可以由光源225基于调制来输出调频连续波(FMCW)信号。分束器240(例如，波导分束器)将FMCW信号分成输出信号245和被提供给组合器260的本地振荡器(LO)信号247。输出信号245被提供给与2D MEMS镜230a光学对准的发射光束250(例如，光栅耦合器、边缘耦合器)。2D MEMS镜230a将输出信号245从激光雷达系统110中导出。MEMS驱动器和同步电子装置330可以耦合到光学引擎210以控制2D MEMS镜230。虽然出于解释目的它们在图2中单独示出，但是根据示例性实施例，激光驱动电子装置310和MEMS驱动器以及同步电子装置330可以组装在一起作为驱动电子装置340，如图3中所指示。
当输出信号245遇到目标140时，由目标140散射的一些光(即，输出信号245)由2DMEMS镜230b获得并且作为接收信号270被提供给接收光束耦合器265(例如，光栅耦合器、边缘耦合器)。接收信号270也被提供给组合器260。正如发射光束耦合器250与2D MEMS镜230a光学对准一样，接收光束耦合器265与2D MEMS镜230b光学对准。LO信号247与接收信号270的组合被分束为组合信号275a、275b(通常称为275)并且分别被提供给光电检测器280a、280b(通常称为280)。
每个组合信号275中的接收信号270和LO信号247干扰对应的光电检测器280以产生电信号285a、285b(通常称为285)，该电信号也被称为差拍信号。两个光电检测器280可以是根据已知的平衡检测器技术使用的双平衡光电检测器，以消除为两个光电检测器280所共有的LO信号247中的强度噪声(其由光源225引起，并且因此在输出信号245中是相同的)。电信号285被提供给也参考图3详述的后检测电子装置320。连接器290a、290b将光子引擎210连接到MEMS驱动器和同步电子装置330(图3)。
图3是详述根据一个或多个实施例的激光雷达系统110的各方面的框图。具体地，更详细地示出了与光学引擎210集成的驱动电子装置340和后检测电子装置320的示例性实施例。包括在驱动电子装置340中的激光驱动电子装置310调制光源225，其参考图2描述为光子引擎210的光子芯片220的一部分。示例性激光驱动电子装置310包括调制电压源305、电阻器R、二极管D1、D2和D3，以及低噪声电流源315。二极管D3是激光二极管。
示例性后检测电子装置320可以是自动平衡检测器，其包括信号光电二极管350、比较光电二极管355、跨阻抗放大器360以及集成后置放大器365，跨阻抗放大器将由两个光电检测器280(图2)产生的差分电流信号(基于电流285)转换为具有某个增益的电压信号，集成后置放大器进一步放大所产生的电压信号。如图2中所指示，来自每个光电检测器280的电流285与来自MEMS镜230的2D位置数据一起被后检测电子装置320组合和处理以获得三维信息，如相距目标140的距离以及目标140相对于激光雷达系统110的相对速度，该相对速度作为二维空间坐标的函数。
另外，如图2中所示，MEMS驱动器和同步电子装置330可以驱动图2中所示的2DMEMS镜230。根据示例性实施例，激光雷达系统110的驱动电子装置340、光学引擎210和后检测电子装置320可以组装在一个印刷电路板上。根据替代实施例，激光驱动电子装置310、光学引擎210和后检测电子装置320可以组装在一个印刷电路板上，而MEMS驱动器和同步电子装置330在第二堆叠的印刷电路板上。在另一个替换实施例中，如前所述，一个或多个ASIC可以与激光雷达系统110的驱动电子装置340、MEMS驱动器和同步电子装置330以及后检测电子装置320一起制造。例如，MEMS驱动器和同步电子装置330可以被制造为ASIC，而激光器驱动电子装置310和后检测电子装置320可以被制造为与包括光学引擎210的异构集成芯片集成的第二ASIC。
虽然已经参考示例性实施例描述了以上公开内容，但是本领域技术人员将会理解，在不脱离本公开内容的范围的情况下，可进行各种改变并且可用等同物替换其元件。另外，在不脱离本公开的实质范围的情况下，可进行许多修改以使特定的情况或材料适应本公开的教导。因此，希望本公开不限于所公开的特定实施例，而是将包括落入本申请范围内的所有实施例。

Claims (10)

1.一种激光雷达系统，包括：
光子芯片，其包括光源和被配置为提供输出信号进行发射的发射光束耦合器，其中所述输出信号是调频连续波(FMCW)信号；
发射光束引导装置，其被配置为从所述光子芯片的所述发射光束耦合器发射所述输出信号；以及
接收光束引导装置，其被配置为获得目标对所述输出信号的反射并且将所述反射作为接收信号提供给所述光子芯片的接收光束耦合器，其中所述光子芯片、所述发射光束引导装置和所述接收光束引导装置异构地集成到光学引擎中。
2.根据权利要求1所述的激光雷达系统，其中所述发射光束引导装置和所述接收光束引导装置是被制造为管芯的二维微机电系统(2D MEMS)镜。
3.根据权利要求2所述的激光雷达系统，其中所述光学引擎异构地集成在具有蚀刻有用于放置所述2D MEMS镜的凹坑的半导体板上。
4.根据权利要求1所述的激光雷达系统，其中所述发射光束引导装置被放置成与所述光子芯片的所述发射光束耦合器光学对准，所述接收光束引导装置被放置成与所述光子芯片的所述接收光束耦合器光学对准，所述光子芯片、所述发射光束引导装置和所述接收光束引导装置接合到公共半导体板以被动地保持所述光学对准。
5.根据权利要求1所述的激光雷达系统，进一步包括与所述光学引擎耦合的驱动电子装置，所述驱动电子装置包括调制激光器驱动器和控制驱动器，所述调制激光器驱动器调制所述光源并且产生所述FMCW信号，所述控制驱动器用于所述发射光束引导装置和所述接收光束引导装置，并且所述激光雷达系统还包括后检测电子装置，所述后检测电子装置被配置为处理由所述光子芯片的光电检测器提供的电信号，其中所述光学引擎、所述驱动电子装置和所述后检测电子装置形成在第一印刷电路板上，所述控制驱动器形成在第二印刷电路板上，所述控制驱动器被制造为第一专用集成电路(ASIC)，而所述驱动电子装置和所述后检测电子装置被制造为第二ASIC。
6.根据权利要求1所述的激光雷达系统，其中所述激光雷达系统位于车辆中。
7.一种封装激光雷达系统的方法，所述方法包括：
制造光子芯片，其中所述光子芯片包括光源和用于提供输出信号进行发射的发射光束耦合器，并且所述输出信号是调频连续波(FMCW)信号；
将发射光束引导装置耦合到所述光子芯片以从所述光子芯片的所述发射光束耦合器发射所述输出信号；
将接收光束引导装置耦合到所述光子芯片以获得目标对所述输出信号的反射，并且将所述反射作为接收信号提供给所述光子芯片的接收光束耦合器；以及
将所述光子芯片、所述发射光束引导装置和所述接收光束引导装置异构地集成到光学引擎中。
8.根据权利要求7所述的方法，进一步包括将所述发射光束引导装置和所述接收光束引导装置制造为二维微机电系统(2D MEMS)镜管芯，其中所述异构地集成所述光学引擎包括将所述2D MEMS镜管芯放置在蚀刻于硅板中的凹坑中。
9.根据权利要求7所述的方法，进一步包括将所述发射光束引导装置放置成与所述光子芯片的所述发射光束耦合器光学对准，将所述接收光束引导装置放置成与所述光子芯片的所述接收光束耦合器光学对准，以及将所述光子芯片、所述发射光束引导装置和所述接收光束引导装置被动地接合到公共半导体板以保持所述光学对准。
10.根据权利要求7所述的方法，进一步包括将驱动电子装置与所述光学引擎耦合，其中所述驱动电子装置包括调制激光器驱动器和控制驱动器，所述调制激光器驱动器调制所述光源并且产生所述FMCW信号，所述控制驱动器用于所述发射光束引导装置和所述接收光束引导装置，所述方法包括将后检测电子装置耦合到所述光学引擎以处理由所述光子芯片的光电检测器提供的电信号，将所述光学引擎、所述驱动电子装置和所述后检测电子装置形成在第一印刷电路板上，并且将所述控制驱动器形成在第二印刷电路板上，或者将所述控制驱动器制造为第一专用集成电路(ASIC)，并且将所述驱动电子装置和所述后检测电子装置制造为第二ASIC。
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