CN109188868A - Wafer handling equipment and the litho machine for applying it - Google Patents
Wafer handling equipment and the litho machine for applying it Download PDFInfo
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- CN109188868A CN109188868A CN201811097650.7A CN201811097650A CN109188868A CN 109188868 A CN109188868 A CN 109188868A CN 201811097650 A CN201811097650 A CN 201811097650A CN 109188868 A CN109188868 A CN 109188868A
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- handling equipment
- feeding
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- 230000007246 mechanism Effects 0.000 claims abstract description 62
- 238000009434 installation Methods 0.000 claims abstract description 25
- 239000000463 material Substances 0.000 claims description 19
- 238000012360 testing method Methods 0.000 claims description 18
- 238000003860 storage Methods 0.000 claims description 14
- 230000000694 effects Effects 0.000 claims description 12
- 238000005520 cutting process Methods 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 235000012431 wafers Nutrition 0.000 description 94
- 238000001514 detection method Methods 0.000 description 12
- 230000006870 function Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000003028 elevating effect Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000008450 motivation Effects 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008447 perception Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
- G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
Abstract
The present invention relates to wafer loading and unloading technical fields, more specifically, it relates to a kind of wafer handling equipment and the litho machine using it, its key points of the technical solution are that: a kind of wafer handling equipment, it includes rack, and the rack is equipped with turntable and the first driving mechanism;The turntable is equipped with magazine installation position, the quantity of the magazine installation position is more than two and successively arranges around the center line of the turntable that the turntable is used to drive the magazine on magazine installation position successively to move to the position for the driving of the first driving mechanism in rotation;First driving mechanism is for driving magazine to move, and to make the wafer in magazine be sequentially located at feeding station in feeding, or so that the wafer in magazine is stored position in blanking and is sequentially located at discharge station.The technical solution provided according to the present invention can reduce the replacement frequency of magazine, improve working efficiency, realize automated production.
Description
Technical field
The present invention relates to wafer loading and unloading technical field, in particular to a kind of wafer handling equipment and the photoetching using it
Machine.
Background technique
Wafer refers to silicon wafer used in silicon semiconductor production of integrated circuits, and the various circuit elements of production can be processed on wafer
Part structure, and become the IC chip for having specific electrical functionality.Wherein, it in the manufacturing process of chip, needs using to litho machine.
In order to improve the photoetching efficiency of litho machine, feeding and blanking generally are carried out to wafer using handling equipment.Wafer is usually to fill
There are multiple wafers to store position in special magazine, inside magazine, each wafer storage position is a slot.Multiple slot
It successively arranges along the length direction of magazine, can be inserted into a wafer in each slot, put wafer in magazine in stratiform.
Only one magazine on existing handling equipment, when upper complete material or under complete material when need to frequently replace magazine, so cause
The working efficiency of blanking device is lower.
Summary of the invention
In view of this, the present invention provides a kind of wafer handling equipment and application its litho machine, main purpose is to solve
Certainly existing handling equipment needs to frequently replace magazine, leads to the technical problem that working efficiency is lower.
In order to achieve the above objectives, present invention generally provides following technical solutions:
On the one hand, the embodiment of the present invention provides a kind of wafer handling equipment, including rack, the rack be equipped with turntable and
First driving mechanism;
The turntable is equipped with magazine installation position, and the quantity of the magazine installation position is more than two and in the turntable
Heart line is successively arranged, and the turntable is used to drive the magazine on magazine installation position successively to move to for the first driving in rotation
The position of mechanism driving;
First driving mechanism, for driving magazine to move, to make the wafer in magazine be sequentially located at feeding work in feeding
Position, or so that the wafer in magazine is stored position in blanking and be sequentially located at discharge station.
Single magazine in compared with the existing technology, due to being provided with two or more on turntable in technical solution of the present invention
Magazine installation position, turntable rotation when can drive the magazine on magazine installation position successively move to for the first driving mechanism drive
Dynamic position makes the first driving mechanism driving magazine feeding or blanking, can so reduce the replacement frequency of magazine, improve this hair
The working efficiency of bright wafer handling equipment.
The present invention is further arranged to: wafer handling equipment further includes testing agency；
The testing agency is for detecting the feeding or cutting material situation of wafer in magazine, to detect magazine in feeding
The interior wafer positioned at feeding station is removed or detects in blanking the wafer storage position new clothes in magazine positioned at discharge station
Driving signal is generated when entering wafer;
First driving mechanism is used to drive magazine to move set distance along first direction according to the driving signal, and described the
One direction is the arragement direction that wafer stores position in magazine, and the set distance is that adjacent two wafer is stored between position in magazine
Distance to make the wafer in the magazine be sequentially located at feeding station in feeding, or makes the crystalline substance in the magazine in blanking
Circle storage position is sequentially located at discharge station.
By using above-mentioned technical proposal, testing agency and the first driving mechanism cooperate, and may be implemented to wafer in magazine
Automatic charging and blanking operation, realize automation loading and unloading, further improve the work of wafer handling equipment of the present invention
Efficiency.
The present invention is further arranged to: the testing agency includes sensor and processing unit；
The sensor is for detecting the feeding or cutting material situation of wafer in magazine；
The processing unit is used for according to the testing result of the sensor, when determining to be located at feeding station in magazine in feeding
Wafer be removed or determine that the wafer storage position for being located at discharge station in magazine generates driving when being newly packed into wafer in blanking
Signal.
By using above-mentioned technical proposal, sensor and processing unit cooperate the function that aforementioned testing agency can be realized,
Since sensor and processing unit are commercially available part, acquisition is more convenient, to implement also more convenient.
The present invention is further arranged to: the sensor is proximity sensor, and is located at outermost layer in magazine when detecting
The side of wafer.
By using above-mentioned technical proposal, since proximity sensor is non-contact detection component, thus will not be to tested
Wafer causes to damage.
The present invention is further arranged to: the sensor can the relatively described rack activity, to move to the first moving position
When the feeding or cutting material situation of wafer in magazine are detected；Position is detected with exiting when moving to the second moving position.
By using above-mentioned technical proposal, detection position is exited when sensor is in idle state, it can be to avoid to magazine
Movement interfere.When the first driving mechanism driving magazine moves to the operating position of feeding or blanking, sensor is transported again
Move to the first moving position with to wafer in magazine feeding or cutting material situation detect.
The present invention is further arranged to: wafer handling equipment, further includes for driving the sensor to move to institute
State the second driving mechanism of the first moving position and the second moving position.
By using above-mentioned technical proposal, with labor-saving technical effect.
The present invention is further arranged to: second driving mechanism includes driving cylinder, to drive institute by the driving cylinder
It states sensor and moves to first moving position and the second moving position.
Above-mentioned driving cylinder can be cylinder or hydraulic cylinder etc., it is preferred that driving cylinder is cylinder, to prevent oil liquid to wafer
It damages.
The present invention is further arranged to: wafer handling equipment, further includes for driving the third of the turntable rotation to drive
Motivation structure
By using above-mentioned technical proposal, there is labor-saving technical effect.
The present invention is further arranged to: first driving mechanism includes motor, screw rod, the spiral shell being set on the screw rod
Base and for the nut seat limit and be oriented to linear guide；
The motor is for driving the screw rod to rotate；
The nut seat is equipped with mandril, and the nut seat drives magazine movement by the mandril for being driven.
By above-mentioned setting, screw rod and nut seat cooperatively form leading screw and nut mechanism, and transmission accuracy is higher, can drive
Magazine is smoothly moved.
On the other hand, the present invention also provides a kind of litho machines comprising wafer handling equipment described in any of the above-described kind.
In the above-described embodiments, reason of the litho machine provided by the invention since above-mentioned wafer handling equipment is arranged, because
This can reduce the replacement frequency of magazine, improve the working efficiency of loading and unloading.
By above-mentioned technical proposal, wafer handling equipment of the present invention and application its litho machine at least have beneficial below
Effect:
Single magazine in compared with the existing technology, due to being provided with more than two material on turntable in technical solution of the present invention
Box installation position, turntable can drive the magazine on magazine installation position successively to move to for the driving of the first driving mechanism in rotation
Position makes the first driving mechanism driving magazine feeding or blanking, can so reduce the replacement frequency of magazine, it is brilliant to improve the present invention
The working efficiency of circle handling equipment.
The above description is only an overview of the technical scheme of the present invention, in order to better understand the technical means of the present invention,
And can be implemented in accordance with the contents of the specification, the following is a detailed description of the preferred embodiments of the present invention and the accompanying drawings.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram for wafer handling equipment that one embodiment of the invention provides；
Fig. 2 is a kind of structural schematic diagram of the wafer handling equipment of one embodiment of the invention offer in feeding.
Appended drawing reference: 1, rack；10, wafer handling equipment；101, turntable；102, the first driving mechanism；1011, magazine
Installation position；103, testing agency；104, the second driving mechanism；1021, first motor；1022, screw rod；1023, nut seat；
1024, linear guide；1025, mandril；1012, via hole；105, third driving mechanism.
Specific embodiment
It is of the invention to reach the technical means and efficacy that predetermined goal of the invention is taken further to illustrate, below in conjunction with
Specific embodiment, structure, feature and its effect applied according to the present invention is described in detail such as in attached drawing and preferred embodiment
Afterwards.In the following description, what different " embodiment " or " embodiment " referred to is not necessarily the same embodiment.In addition, one or more
Special characteristic, structure or feature in a embodiment can be combined by any suitable form.
As depicted in figs. 1 and 2, a kind of wafer handling equipment 10 that one embodiment of the present of invention proposes comprising machine
Frame 1.Rack 1 is equipped with turntable 101 and the first driving mechanism 102.
Turntable 101 is equipped with magazine installation position 1011.The quantity of magazine installation position 1011 is more than two and around turntable
101 center line is successively arranged.Turntable 101 is used to drive the magazine on magazine installation position 1011 successively to move to the in rotation
One position, the first position are the position that magazine drives for the first driving mechanism 102, in other words: the first driving mechanism 102
The magazine of first position can only be driven to move, and the magazine of other positions on turntable 101 cannot be driven to move.When positioned at first
On the magazine set complete material or under complete material when, turntable 101 rotate, another magazine is switched into first position.
First driving mechanism 102 is for driving magazine to move, to make the wafer in magazine be sequentially located at feeding in feeding
Station, or so that the wafer in magazine is stored position in blanking and be sequentially located at discharge station.
First driving mechanism 102 driving magazine movement for convenience, it is preferred that as shown in Fig. 2, magazine is by grafting
Mode is mounted on magazine installation position 1011.There is guide and limit column on magazine installation position 1011, there is limiting slot on magazine.Material
During installation, guide and limit column is inserted into the limiting slot on magazine box.In order to reinforce limit effect, the quantity of guide and limit column can
Think two or more.Certainly, in the example substituted at one, the position of above-mentioned guide and limit column and both limiting slots can be adjusted
It changes, i.e., magazine installation position 1011 is equipped with limiting slot, and magazine is equipped with guide and limit column, so equally can achieve to magazine
The technical effect for being oriented to and being limited is installed.
In the technical solution of above-mentioned offer, due to being provided with more than two magazine installation positions 1011 on turntable 101,
Feeding successively can be carried out to the magazine on each magazine installation position 1011 by the rotation of turntable 101 or blanking operates, work as turntable
On 101 all magazines gone up material or under complete material when, the magazine on turntable 101 can uniformly be replaced.Relative to existing
There is the single magazine in technology, the scheme of multiple magazine installation positions 1011 can be reduced on technical solution of the present invention turntable 101
The replacement frequency of magazine on turntable 101 improves the working efficiency of wafer handling equipment 10 of the present invention.
Further, as depicted in figs. 1 and 2, wafer handling equipment 10 of the invention can also include testing agency
103.Testing agency 103 is for detecting the feeding or cutting material situation of wafer in magazine, to detect magazine in feeding
The interior wafer positioned at feeding station is removed or detects in blanking the wafer storage position new clothes in magazine positioned at discharge station
Driving signal is generated when entering wafer.First driving mechanism 102 is used to drive magazine to move along first direction according to driving signal and set
Set a distance to make the wafer in magazine be sequentially located at feeding station in feeding, or in blanking stores the wafer in magazine
Position is sequentially located at discharge station.Wherein, first direction is the arragement direction that wafer stores position in magazine.Set distance is in magazine
The distance between adjacent two wafers storage position, in other words: when adjacent two wafers storage position is packed into wafer, this is adjacent
The distance between two wafers are above-mentioned set distance.
By above-mentioned setting, testing agency 103 and the first driving mechanism 102 cooperate, and may be implemented to wafer in magazine
Automatic charging and blanking operation, realize automation loading and unloading, further improve the work of wafer handling equipment 10 of the present invention
Make efficiency.
What needs to be explained here is that: at one, specifically using in example, above-mentioned first direction can be vertical direction,
Correspondingly, the first driving mechanism 102 above-mentioned be elevating mechanism, make magazine by vertically rise or fall realization feeding
Or the operation of blanking.
In order to realize the function of aforementioned testing agency 103, the present invention also provides the following technical solutions: detection machine above-mentioned
Structure 103 may include sensor and processing unit.Sensor is for detecting the feeding or cutting material situation of wafer in magazine.
Processing unit is used for the testing result according to sensor, when the wafer for being located at feeding station in judgement magazine in feeding is removed
Or determine to generate driving signal when the wafer storage position for being located at discharge station in magazine is newly packed into wafer in blanking.
By above-mentioned setting, sensor and processing unit cooperate the function that aforementioned testing agency 103 can be realized, due to
Sensor and processing unit are commercially available part, and acquisition is more convenient, to implement also more convenient.
What needs to be explained here is that: above-mentioned processing unit can be for single-chip microcontroller or processor etc., specifically can be according to reality
Border situation is chosen.
At one specifically using in example, sensor above-mentioned is proximity sensor, and is located in magazine when detecting
The side of outermost layer wafer.
Proximity sensor is a kind of device with perception object proximity ability, it has using sensor to close to object
Sensitivity characteristic identify the close of object, and export respective switch signal, therefore, usually proximity sensor be known as again close
Switch.It can replace the detection mode of the contacts such as switch detection formula, without the sensor for the purpose of contacting detected object
General name, it can test object move and there are information, and corresponding information is converted to electric signal.
In the examples described above, since proximity sensor is non-contact detection component, to will not be caused to tested wafer
Damage.
Further, sensor above-mentioned can be with respect to 1 activity of rack, to brilliant in magazine when moving to the first moving position
Round feeding or cutting material situation is detected (as shown in Figure 2)；(such as scheme with detection position is exited when moving to the second moving position
Shown in 1).In this example, detection position is exited when sensor is in idle state, can cause to do to avoid the movement to magazine
It disturbs.When the first driving mechanism 102 driving magazine moves to the operating position of feeding or blanking, it is living that sensor moves to first again
Dynamic position with to wafer in magazine feeding or cutting material situation detect.
Further, as depicted in figs. 1 and 2, wafer handling equipment 10 of the present invention can also include the second driving mechanism
104.Second driving mechanism 104 is for driving sensor to move to the first moving position and the second moving position above-mentioned.At this
In example, by the second driving mechanism 104 of setting, there is labor-saving technical effect.
At one, specifically using in example, the second driving mechanism 104 above-mentioned may include driving cylinder, to pass through driving
Cylinder driving sensor moves to the first moving position and the second moving position above-mentioned.
Above-mentioned driving cylinder can be cylinder or hydraulic cylinder etc., it is preferred that driving cylinder is cylinder, to prevent oil liquid to wafer
It damages.
The shrinkage direction of above-mentioned driving cylinder can be adjusted according to the actual situation, for example specifically apply example at one
In, it can be with respect to the oblique driving sensor movement of the driving direction of the first driving mechanism 102.
Further, in order to realize the function of aforementioned first driving mechanism 102, the present invention also provides following technical sides
Case: as depicted in figs. 1 and 2, the first driving mechanism 102 may include first motor 1021, screw rod 1022, nut seat 1023 and
Linear guide 1024.Nut seat 1023 is set on screw rod 1022.Linear guide 1024 is used to that nut seat 1023 to be limited and be led
To.First motor 1021 is for driving screw rod 1022 to rotate.Nut seat 1023 be equipped with mandril 1025, nut seat 1023 be used for by
It is driven through mandril 1025 and drives magazine movement.
By above-mentioned setting, screw rod 1022 and nut seat 1023 cooperatively form leading screw and nut mechanism, transmission accuracy compared with
Height can drive magazine to be smoothly moved.
Further, as shown in Fig. 2, the via hole 1012 passed through for mandril 1025, top can be equipped on turntable above-mentioned 101
Bar 1025 via the via hole 1012 to the magazine applied force on magazine installation position 1011, to drive magazine to move.
Further, as shown in Figure 1, wafer handling equipment 10 of the present invention can also include third driving mechanism 105.The
Three driving mechanisms 105 are for driving turntable 101 to rotate, to reach labor-saving technical effect.
Preferably, above-mentioned third driving mechanism 105 may include the second motor, to pass through the second motor driven turntable
101 rotations.Second motor is preferably stepper motor.
The embodiment of the present invention also provides a kind of litho machine, may include the wafer loading and unloading dress in any of the above-described example
Set 10.
In the above-described embodiments, reason of the litho machine provided by the invention since above-mentioned wafer handling equipment 10 is arranged,
Therefore the replacement frequency that magazine can be reduced, improves the working efficiency of loading and unloading.
Below using the first driving mechanism 102 be elevating mechanism, sensor as proximity sensor, processing unit be processing utensil
Body illustrates the course of work of wafer handling equipment 10 of the present invention:
As shown in Fig. 2, the first driving mechanism 102 first drives magazine to rise to setting position, in the setting position in feeding
When, undermost wafer is in upper discharge position (take piece manipulator takes piece position) in magazine, and driving cylinder driving is close to sensing
Device is located at the lower section of lowest level wafer in magazine, and the wafer for being now in discharge position is located adjacent to the detection range of sensor
Interior, proximity sensor exports high level signal, and processor controls the first driving mechanism 102 according to the high level signal and keeps closing
It closes, i.e., the first driving mechanism 102 does not work.When taking piece manipulator to take the wafer of upper discharge position away, proximity sensor due to
Do not detect that wafer, proximity sensor export low level signal, processor determines to be located in magazine according to the low level signal
The wafer of feeding station is removed, and processor sends driving signal to the first driving mechanism 102, and the first driving mechanism 102 receives
It drives magazine to move downward set distance after the driving signal, makes one layer of the supreme discharge position of wafer movement, proximity sensor
It detects the close of wafer, and exports high level signal to processor, repeatedly, until the wafer in magazine is all taken
Walk, then driving cylinder driving proximity sensor exits detection position, and turntable 101 rotates, by the magazine of another full box rotate to
The position that can be driven by the first driving mechanism 102.Then above procedure is repeated, with the magazine feeding to another full box.
In blanking, most upper one layer of the wafer storage position of magazine is located at lower discharge position (the i.e. bottom sheet position of bottom sheet manipulator
Set), driving cylinder driving proximity sensor is extend into inside magazine, when the wafer storage position in lower discharge position is newly packed into wafer
When, proximity sensor has detected object close to output high level signal, and processor determines in magazine according to the high level signal
Wafer storage position positioned at discharge station is newly packed into wafer, and processor sends driving signal to the first driving mechanism 102, and first drives
Driving magazine moves upwards set distance after motivation structure 102 receives the driving signal, so that next layer of wafer is stored position and moves to
Lower discharge position, since wafer leaves the detection position of proximity sensor, proximity sensor exports low level signal, processor according to
The low level signal controls the first driving mechanism 102 and remains turned-off, i.e., the first driving mechanism 102 does not work.When newly in blanking
When the wafer storage position of position is newly packed into wafer, proximity sensor sends high level signal to processor again, repeatedly, until
Wafer is filled in magazine, then driving cylinder driving proximity sensor exits detection position, and the first driving mechanism 102 drives under magazine
To reload turntable 101, turntable 101 rotates, another sylphon is rotated to the position that can be driven by the first driving mechanism 102 drop
It sets.Then above procedure is repeated, with the magazine blanking to another sky.
What needs to be explained here is that: in the absence of conflict, those skilled in the art can according to the actual situation by
Relevant technical characteristic is combined with each other in above-mentioned each example, to reach corresponding technical effect, particularly for various combined situations
It will not repeat them here.
The above is only a preferred embodiment of the present invention, protection scope of the present invention is not limited merely to above-mentioned implementation
Example, all technical solutions belonged under thinking of the present invention all belong to the scope of protection of the present invention.It should be pointed out that for the art
Those of ordinary skill for, several improvements and modifications without departing from the principles of the present invention, these improvements and modifications
It should be regarded as protection scope of the present invention.
Claims (10)
1. a kind of wafer handling equipment, which is characterized in that including rack (1), the rack (1) be equipped with turntable (101) and
First driving mechanism (102);
The turntable (101) is equipped with magazine installation position (1011), the quantity of the magazine installation position (1011) be it is more than two,
And successively arrange around the center line of the turntable (101), the turntable (101) is used to drive magazine installation position in rotation
(1011) position that the magazine on successively moves to for the first driving mechanism (102) driving;
First driving mechanism (102), for driving magazine to move, be sequentially located at the wafer in magazine in feeding
Expect station, or so that the wafer in magazine is stored position in blanking and be sequentially located at discharge station.
2. wafer handling equipment according to claim 1, which is characterized in that further include testing agency (103)；
The testing agency (103) is for detecting the feeding or cutting material situation of wafer in magazine, to detect in feeding
Wafer in magazine positioned at feeding station is removed or is detected in blanking in magazine and stored positioned at the wafer of discharge station
Position generates driving signal when being newly packed into wafer;
First driving mechanism (102) is used to drive magazine to move set distance along first direction according to the driving signal,
The first direction is the arragement direction that wafer stores position in magazine, and the set distance is that adjacent two wafer stores position in magazine
The distance between, to make the wafer in the magazine be sequentially located at feeding station in feeding, or make the magazine in blanking
Interior wafer storage position is sequentially located at discharge station.
3. wafer handling equipment according to claim 2, which is characterized in that
The testing agency (103) includes sensor and processing unit；
The sensor is for detecting the feeding or cutting material situation of wafer in magazine；
The processing unit is used for according to the testing result of the sensor, when determining to be located at feeding station in magazine in feeding
Wafer be removed or determine that the wafer storage position for being located at discharge station in magazine generates driving when being newly packed into wafer in blanking
Signal.
4. wafer handling equipment according to claim 3, which is characterized in that
The sensor is proximity sensor, and is located at the side of outermost layer wafer in magazine when detecting.
5. wafer handling equipment according to claim 3 or 4, which is characterized in that
The sensor can the rack (1) activity relatively, to the feeding of wafer in magazine when moving to the first moving position
Or cutting material situation is detected；Position is detected with exiting when moving to the second moving position.
6. wafer handling equipment according to claim 5, which is characterized in that further include for driving the sensor to transport
Move the second driving mechanism (104) to first moving position and the second moving position.
7. wafer handling equipment according to claim 6, which is characterized in that
Second driving mechanism (104) includes driving cylinder, described to drive the sensor to move to by the driving cylinder
First moving position and the second moving position.
8. according to claim 1 to wafer handling equipment described in any one of 4,6,7, which is characterized in that further include being used for
The third driving mechanism (105) for driving the turntable (101) to rotate.
9. according to claim 1 to wafer handling equipment described in any one of 4,6,7, which is characterized in that
First driving mechanism (102) includes first motor (1021), screw rod (1022), is set on the screw rod (1022)
Nut seat (1023) and for the nut seat (1023) limit and be oriented to linear guide (1024)；
The first motor (1021) is for driving the screw rod (1022) to rotate；
The nut seat (1023) is equipped with mandril (1025), and the nut seat (1023) is for being driven through the mandril
(1025) magazine movement is driven.
10. a kind of litho machine, which is characterized in that including wafer handling equipment described in any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811097650.7A CN109188868B (en) | 2018-09-20 | 2018-09-20 | Wafer blanking device and photoetching machine applying same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811097650.7A CN109188868B (en) | 2018-09-20 | 2018-09-20 | Wafer blanking device and photoetching machine applying same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109188868A true CN109188868A (en) | 2019-01-11 |
| CN109188868B CN109188868B (en) | 2024-02-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201811097650.7A Active CN109188868B (en) | 2018-09-20 | 2018-09-20 | Wafer blanking device and photoetching machine applying same |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112420581A (en) * | 2021-01-22 | 2021-02-26 | 山东元旭光电股份有限公司 | Automatic sheet feeding machine |
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|---|---|---|---|---|
| KR20100058869A (en) * | 2008-11-25 | 2010-06-04 | 주식회사 동부하이텍 | Wafer sensing apparatus of wafer transfer system and interlock method using thereof |
| KR20100077622A (en) * | 2008-12-29 | 2010-07-08 | 주식회사 동부하이텍 | Apparatus and method for sensing wafer of wafer transfer system |
| CN102299050A (en) * | 2011-08-01 | 2011-12-28 | 上海宏力半导体制造有限公司 | Wafer position detection device |
| CN206511544U (en) * | 2016-12-31 | 2017-09-22 | 深圳配天智能技术研究院有限公司 | A kind of rotary charging device |
| CN206705273U (en) * | 2017-04-07 | 2017-12-05 | 广东南大机器人有限公司 | A kind of band automatically feeds the material box mechanism of function |
| CN207183239U (en) * | 2017-09-13 | 2018-04-03 | 深圳市矽电半导体设备有限公司 | A kind of expansion crystalline substance ring feeding device of wafer detection equipment |
| CN208922061U (en) * | 2018-09-20 | 2019-05-31 | 深圳市矽电半导体设备有限公司 | Wafer handling equipment and the litho machine for applying it |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112420581A (en) * | 2021-01-22 | 2021-02-26 | 山东元旭光电股份有限公司 | Automatic sheet feeding machine |
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| CN109188868B (en) | 2024-02-02 |
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