CN109188868B - Wafer blanking device and photoetching machine applying same - Google Patents
Wafer blanking device and photoetching machine applying same Download PDFInfo
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- CN109188868B CN109188868B CN201811097650.7A CN201811097650A CN109188868B CN 109188868 B CN109188868 B CN 109188868B CN 201811097650 A CN201811097650 A CN 201811097650A CN 109188868 B CN109188868 B CN 109188868B
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- 238000001259 photo etching Methods 0.000 title abstract description 7
- 235000012431 wafers Nutrition 0.000 claims abstract description 123
- 239000000463 material Substances 0.000 claims abstract description 118
- 238000009434 installation Methods 0.000 claims abstract description 11
- 238000001514 detection method Methods 0.000 claims description 32
- 238000007599 discharging Methods 0.000 claims description 28
- 230000000670 limiting effect Effects 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 230000000694 effects Effects 0.000 description 8
- 238000001459 lithography Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
- G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention relates to the technical field of blanking on a wafer, in particular to a blanking device on a wafer and a photoetching machine applying the blanking device, which has the technical scheme that: the wafer blanking device comprises a frame, a turntable and a first driving mechanism are arranged on the frame, more than two material box installation positions are arranged on the turntable, the material boxes on the material box installation positions are sequentially arranged around the central line of the turntable, the turntable is used for driving the material boxes on the material box installation positions to sequentially move to a position capable of being driven by the first driving mechanism when rotating, and the first driving mechanism is used for driving the material boxes to move so that wafers in the material boxes are sequentially located at a feeding station when feeding or wafer storage positions in the material boxes are sequentially located at a blanking station when blanking. According to the technical scheme provided by the invention, the replacement frequency of the material box can be reduced, the working efficiency is improved, and the automatic production is realized.
Description
Technical Field
The invention relates to the technical field of blanking on wafers, in particular to a blanking device on a wafer and a photoetching machine using the same.
Background
The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and various circuit element structures can be manufactured on the wafer to form an IC chip with specific electrical functions. In the manufacturing process of the chip, a photoetching machine is needed. In order to improve the lithography efficiency of the lithography machine, a loading and unloading device is generally used for loading and unloading wafers. Wafers are typically housed in a special magazine having a plurality of wafer receiving locations therein, each wafer receiving location being a slot. The plurality of slots are sequentially arranged along the length direction of the material box, and each slot can be inserted with a wafer, so that the wafers are layered in the material box. Only one material box is arranged on the existing loading and unloading device, and the material box needs to be frequently replaced when loading and unloading are finished, so that the working efficiency of the loading and unloading device is lower.
Disclosure of Invention
In view of the above, the invention provides a loading and unloading device on a wafer and a lithography machine using the same, and mainly aims to solve the technical problem that the existing loading and unloading device needs to replace a material box frequently, so that the working efficiency is low.
In order to achieve the above purpose, the present invention mainly provides the following technical solutions:
in one aspect, an embodiment of the invention provides a wafer blanking device, which comprises a frame, wherein a turntable and a first driving mechanism are arranged on the frame;
the rotary table is used for driving the material boxes on the material box mounting positions to sequentially move to a position which can be driven by the first driving mechanism when rotating;
the first driving mechanism is used for driving the material box to move so that wafers in the material box are sequentially located at a feeding station during feeding or wafer storage positions in the material box are sequentially located at a discharging station during discharging.
Compared with a single material box in the prior art, in the technical scheme of the invention, as more than two material box installation positions are arranged on the rotary table, the rotary table can drive the material boxes on the material box installation positions to sequentially move to the positions driven by the first driving mechanism when rotating, so that the first driving mechanism drives the material boxes to feed or discharge, the replacement frequency of the material boxes can be reduced, and the working efficiency of the material discharging device on the wafer is improved.
The invention is further provided with: the wafer blanking device further comprises a detection mechanism;
the detection mechanism is used for detecting the loading or unloading condition of the wafers in the material box so as to generate a driving signal when detecting that the wafers positioned at the loading station in the material box are taken away during loading or detecting that the wafer storage positions positioned at the unloading station in the material box are newly loaded with the wafers during unloading;
the first driving mechanism is used for driving the material box to move along a first direction by a set distance according to the driving signal, the first direction is the arrangement direction of the wafer storage positions in the material box, and the set distance is the distance between two adjacent wafer storage positions in the material box, so that the wafers in the material box are sequentially located at a feeding station during feeding or the wafer storage positions in the material box are sequentially located at a discharging station during discharging.
By adopting the technical scheme, the detection mechanism is matched with the first driving mechanism, so that automatic feeding and discharging operations of wafers in the material box can be realized, automatic feeding and discharging are realized, and the working efficiency of the feeding and discharging device on the wafer is further improved.
The invention is further provided with: the detection mechanism comprises a sensor and a processing unit;
the sensor is used for detecting the loading or unloading condition of the wafer in the material box;
and the processing unit is used for judging that the wafer positioned at the feeding station in the material box is taken away during feeding or generating a driving signal when the wafer storage position positioned at the discharging station in the material box is newly loaded with the wafer according to the detection result of the sensor.
Through adopting above-mentioned technical scheme, the function of aforementioned detection mechanism can be realized in sensor and processing unit cooperation, because sensor and processing unit are the commercial spare, acquire more conveniently to it is also more convenient to implement.
The invention is further provided with: the sensor is a proximity sensor and is positioned at one side of the outermost wafer in the material box during detection.
By adopting the technical scheme, the proximity sensor is a non-contact detection component, so that the detected wafer cannot be damaged.
The invention is further provided with: the sensor can move relative to the frame to detect the feeding or discharging condition of the wafer in the material box when moving to the first moving position; and exiting the detection position when moving to the second active position.
By adopting the technical scheme, when the sensor is in the idle state, the sensor exits from the detection position, so that the interference to the movement of the material box can be avoided. When the first driving mechanism drives the material box to move to the working position of feeding or discharging, the sensor moves to the first movable position again so as to detect the feeding or discharging condition of the wafer in the material box.
The invention is further provided with: the wafer blanking device further comprises a second driving mechanism for driving the sensor to move to the first movable position and the second movable position.
By adopting the technical scheme, the device has the technical effect of saving manpower.
The invention is further provided with: the second drive mechanism includes a drive cylinder to drive the sensor to move to the first and second active positions via the drive cylinder.
The driving cylinder can be a cylinder or a hydraulic cylinder, and the like, and is preferably a cylinder, so as to prevent the wafer from being damaged by oil.
The invention is further provided with: the blanking device on the wafer further comprises a third driving mechanism for driving the turntable to rotate
By adopting the technical scheme, the device has the technical effect of saving manpower.
The invention is further provided with: the first driving mechanism comprises a motor, a screw rod, a nut seat sleeved on the screw rod and a linear guide rail used for limiting and guiding the nut seat;
the motor is used for driving the screw rod to rotate;
the nut seat is provided with a push rod, and the nut seat is used for being driven to drive the material box to move through the push rod.
Through the arrangement, the screw rod and the nut seat are matched to form a screw rod nut mechanism, so that the transmission precision is high, and the material box can be driven to move stably.
On the other hand, the invention also provides a photoetching machine, which comprises the blanking device on the wafer.
In the above embodiment, the lithography machine provided by the invention is provided with the wafer blanking device, so that the replacement frequency of the material box can be reduced, and the loading and blanking working efficiency can be improved.
By means of the technical scheme, the wafer blanking device and the photoetching machine applying the same have the following beneficial effects:
compared with a single material box in the prior art, in the technical scheme of the invention, as more than two material box installation positions are arranged on the rotary table, the rotary table can drive the material boxes on the material box installation positions to sequentially move to the positions driven by the first driving mechanism when rotating, so that the first driving mechanism drives the material boxes to feed or discharge, the replacement frequency of the material boxes can be reduced, and the working efficiency of the material discharging device on the wafer is improved.
The foregoing description is only an overview of the present invention, and is intended to provide a better understanding of the present invention, as it is embodied in the following description, with reference to the preferred embodiments of the present invention and the accompanying drawings.
Drawings
FIG. 1 is a schematic diagram of a blanking device on a wafer according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a loading and unloading device for wafers according to an embodiment of the present invention.
Reference numerals: 1. a frame; 10. a blanking device on the wafer; 101. a turntable; 102. a first driving mechanism; 1011. a magazine mounting position; 103. a detection mechanism; 104. a second driving mechanism; 1021. a first motor; 1022. a screw rod; 1023. a nut seat; 1024. a linear guide rail; 1025. a push rod; 1012. a via hole; 105. and a third driving mechanism.
Detailed Description
In order to further describe the technical means and effects adopted for achieving the preset aim of the invention, the following detailed description refers to the specific implementation, structure, characteristics and effects according to the application of the invention with reference to the accompanying drawings and preferred embodiments. In the following description, different "an embodiment" or "an embodiment" do not necessarily refer to the same embodiment. Furthermore, the particular features, structures, or characteristics of one or more embodiments may be combined in any suitable manner.
As shown in fig. 1 and 2, a wafer blanking device 10 according to an embodiment of the present invention includes a frame 1. The frame 1 is provided with a turntable 101 and a first driving mechanism 102.
The turntable 101 is provided with a magazine mounting position 1011. The number of the magazine mounting positions 1011 is two or more, and are sequentially arranged around the center line of the turntable 101. The turntable 101 is configured to rotate to drive the cartridges on the cartridge mounting location 1011 to sequentially move to a first position where the cartridges are driven by the first driving mechanism 102, in other words: the first drive mechanism 102 can only drive the cartridge in a first position and not in other positions on the turntable 101. When a cartridge in the first position is loaded or unloaded, the turntable 101 rotates to switch another cartridge to the first position.
The first driving mechanism 102 is used for driving the material box to move, so that wafers in the material box are sequentially located at a loading station during loading, or wafer storage positions in the material box are sequentially located at a unloading station during unloading.
In order to facilitate the movement of the cartridge driven by the first driving mechanism 102, it is preferable that the cartridge is mounted on the cartridge mounting location 1011 by plugging as shown in fig. 2. The magazine mounting position 1011 is provided with a guiding limit column, and the magazine is provided with a limit groove. When the material box is installed, the guiding limit column is inserted into the limit groove on the material box. In order to enhance the limiting effect, the number of the guiding limiting columns can be more than two. Of course, in an alternative example, the positions of the guiding and limiting columns and the limiting grooves can be exchanged, that is, the limiting groove is arranged on the mounting position 1011 of the material box, and the guiding and limiting column is arranged on the material box, so that the technical effects of guiding and limiting the mounting of the material box can be achieved.
In the above-mentioned technical scheme, because more than two magazine mounting positions 1011 are arranged on the turntable 101, the feeding or discharging operation can be sequentially performed on the magazines on each magazine mounting position 1011 through the rotation of the turntable 101, and when all the magazines on the turntable 101 are fed or discharged, the magazines on the turntable 101 can be uniformly replaced. Compared with a single material box in the prior art, the scheme of the plurality of material box mounting positions 1011 on the turntable 101 in the technical scheme of the invention can reduce the replacement frequency of the material boxes on the turntable 101 and improve the working efficiency of the material discharging device 10 on the wafer.
Further, as shown in fig. 1 and 2, the wafer blanking device 10 of the present invention may further include a detection mechanism 103. The detection mechanism 103 is used for detecting the loading or unloading condition of the wafer in the material box, so as to generate a driving signal when detecting that the wafer in the material box at the loading station is taken away or detecting that the wafer storage position in the material box at the unloading station is newly loaded with the wafer during unloading. The first driving mechanism 102 is configured to drive the magazine to move along a first direction by a set distance according to a driving signal, so that wafers in the magazine are sequentially located at a loading station during loading, or wafer storage positions in the magazine are sequentially located at a unloading station during unloading. The first direction is the arrangement direction of the wafer storage positions in the material box. The set distance is the distance between two adjacent wafer storage locations in the magazine, in other words: when two adjacent wafer storage positions are all filled with wafers, the distance between the two adjacent wafers is the set distance.
Through the arrangement, the detection mechanism 103 is matched with the first driving mechanism 102, so that automatic feeding and discharging operations of wafers in the material box can be realized, automatic feeding and discharging are realized, and the working efficiency of the wafer feeding and discharging device 10 is further improved.
What needs to be explained here is: in a specific application example, the first direction may be a vertical direction, and correspondingly, the first driving mechanism 102 is a lifting mechanism, so that the feeding or discharging operation of the cartridge is realized through lifting or lowering in a vertical direction.
In order to realize the function of the detection mechanism 103, the invention further provides the following technical scheme: the aforementioned detection mechanism 103 may include a sensor and a processing unit. The sensor is used for detecting the loading or unloading condition of the wafer in the material box. The processing unit is used for judging that the wafer positioned at the feeding station in the material box is taken away during feeding or generating a driving signal when the wafer accommodating position positioned at the discharging station in the material box is newly filled with the wafer during discharging according to the detection result of the sensor.
Through the arrangement, the function of the detection mechanism 103 can be realized by matching the sensor with the processing unit, and the sensor and the processing unit are commercially available parts, so that the acquisition is more convenient, and the implementation is also more convenient.
What needs to be explained here is: the processing unit can be a singlechip or a processor, and the like, and can be specifically selected according to actual conditions.
In a specific application example, the sensor is a proximity sensor and is located on the side of the outermost wafer in the cartridge during inspection.
A proximity sensor is a device having the ability to sense the proximity of an object, which uses the sensitive characteristics of the sensor to recognize the proximity of an object to the object and outputs a corresponding switching signal, and is therefore also commonly referred to as a proximity switch. The sensor can replace a contact detection mode such as a switch and the like, is a generic term of a sensor for the purpose of not contacting a detected object, can detect movement and existence information of the object, and can convert corresponding information into an electric signal.
In the above example, the proximity sensor is a noncontact detection device, so that the wafer to be measured is not damaged.
Further, the sensor can move relative to the frame 1 to detect the loading or unloading condition of the wafer in the material box when moving to the first moving position (as shown in fig. 2); and exits the detection position when moved to the second active position (as shown in fig. 1). In this example, the sensor is withdrawn from the detection position when it is in an idle state, which may avoid interfering with the movement of the cartridge. When the first driving mechanism 102 drives the material box to move to the working position for loading or unloading, the sensor moves to the first movable position again to detect the loading or unloading condition of the wafer in the material box.
Further, as shown in fig. 1 and 2, the wafer blanking device 10 of the present invention may further include a second driving mechanism 104. The second drive mechanism 104 is used to drive the sensor to move to the first and second active positions described above. In this example, by providing the second driving mechanism 104, there is a technical effect of saving labor.
In one specific example of an application, the second drive mechanism 104 may include a drive cylinder to drive the sensor to move to the first and second active positions.
The driving cylinder can be a cylinder or a hydraulic cylinder, and the like, and is preferably a cylinder, so as to prevent the wafer from being damaged by oil.
The retraction direction of the driving cylinder may be adjusted according to the actual situation, for example, in a specific application example, the sensor may be driven to move obliquely relative to the driving direction of the first driving mechanism 102.
Further, in order to implement the function of the first driving mechanism 102, the present invention further provides the following technical solutions: as shown in fig. 1 and 2, the first driving mechanism 102 may include a first motor 1021, a screw 1022, a nut mount 1023, and a linear guide 1024. The nut seat 1023 is sleeved on the screw rod 1022. The linear guide 1024 is used to limit and guide the nut seat 1023. The first motor 1021 is used for driving the screw 1022 to rotate. The nut seat 1023 is provided with an ejector rod 1025, and the nut seat 1023 is used for being driven to drive the material box to move through the ejector rod 1025.
Through the arrangement, the screw 1022 and the nut seat 1023 are matched to form a screw-nut mechanism, so that the transmission precision is high, and the material box can be driven to move stably.
Further, as shown in fig. 2, the turntable 101 may be provided with a through hole 1012 through which a push rod 1025 passes, and the push rod 1025 applies a force to the cartridge on the cartridge mounting location 1011 via the through hole 1012 to drive the cartridge to move.
Further, as shown in fig. 1, the wafer blanking device 10 of the present invention may further include a third driving mechanism 105. The third driving mechanism 105 is used for driving the turntable 101 to rotate, so as to achieve the technical effect of saving manpower.
Preferably, the third driving mechanism 105 may include a second motor to drive the turntable 101 to rotate by the second motor. The second motor is preferably a stepper motor.
Embodiments of the present invention also provide a lithographic apparatus that may include the wafer blanking apparatus 10 in any of the above examples.
In the above embodiment, the lithography machine provided by the invention is provided with the above-mentioned wafer blanking device 10, so that the replacement frequency of the material box can be reduced, and the loading and blanking working efficiency can be improved.
The following specifically describes the working procedure of the blanking device 10 on a wafer according to the present invention, using the first driving mechanism 102 as a lifting mechanism, using the sensor as a proximity sensor, and using the processing unit as a processor:
as shown in fig. 2, during loading, the first driving mechanism 102 drives the magazine to rise to a set position, and in the set position, the wafer at the lowest layer in the magazine is at the loading position (i.e. the wafer taking position of the wafer taking manipulator), the driving cylinder drives the proximity sensor to be located below the wafer at the lowest layer in the magazine, at this time, the wafer at the loading position is located in the detection range of the proximity sensor, the proximity sensor outputs a high-level signal, and the processor controls the first driving mechanism 102 to keep closed according to the high-level signal, i.e. the first driving mechanism 102 does not work. When the wafer is taken away from the loading position by the wafer taking manipulator, the proximity sensor outputs a low-level signal because the proximity sensor does not detect the wafer, the processor judges that the wafer positioned at the loading station in the material box is taken away according to the low-level signal, the processor sends a driving signal to the first driving mechanism 102, the first driving mechanism 102 drives the material box to move downwards for a set distance after receiving the driving signal, so that the wafer at the upper layer moves to the loading position, the proximity sensor detects the approach of the wafer, and outputs a high-level signal to the processor, and the process is repeated until the wafer in the material box is completely taken away, then the driving cylinder drives the proximity sensor to withdraw from the detection position, and the turntable 101 rotates to rotate the material box full of the other material box to a position which can be driven by the first driving mechanism 102. The above process is then repeated to load the cartridge of the other full cartridge.
When the material box is fed, the wafer storage position of the uppermost layer of the material box is positioned at the material box position (namely the material box position of the material box manipulator), the driving cylinder drives the proximity sensor to extend into the material box, when the wafer storage position positioned at the material box position is newly filled with wafers, the proximity sensor detects that objects are close to output high-level signals, the processor judges that the wafers are newly filled in the wafer storage position positioned at the material box position in the material box according to the high-level signals, the processor sends driving signals to the first driving mechanism 102, the first driving mechanism 102 drives the material box to move upwards for a set distance after receiving the driving signals, so that the next layer of wafer storage position moves to the material box position, and the proximity sensor outputs low-level signals because the wafers leave the detection position of the proximity sensor, and the processor controls the first driving mechanism 102 to keep closed according to the low-level signals, namely the first driving mechanism 102 does not work. When a wafer is newly loaded into the wafer storage position at the unloading position, the proximity sensor sends a high-level signal to the processor again, and the process is repeated until the wafer is fully loaded in the material box, then the driving cylinder drives the proximity sensor to exit the detection position, the first driving mechanism 102 drives the material box to descend so as to reload the turntable 101, and the turntable 101 rotates so as to rotate another empty box to a position which can be driven by the first driving mechanism 102. The above process is then repeated to empty the other empty cartridge.
What needs to be explained here is: under the condition of no conflict, the technical features related to the examples can be combined with each other according to actual situations by a person skilled in the art so as to achieve corresponding technical effects, and specific details of the combination situations are not described in detail herein.
The above description is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above examples, and all technical solutions belonging to the concept of the present invention belong to the protection scope of the present invention. It should be noted that modifications and adaptations to the present invention may occur to one skilled in the art without departing from the principles of the present invention and are intended to be within the scope of the present invention.
Claims (4)
1. The wafer blanking device is characterized by comprising a frame (1), wherein a turntable (101), a first driving mechanism (102), a detection mechanism (103) and a second driving mechanism (104) are arranged on the frame (1);
the rotary table (101) is provided with material box installation positions (1011), the number of the material box installation positions (1011) is more than two, the material box installation positions (1011) are sequentially distributed around the central line of the rotary table (101), and the rotary table (101) is used for driving the material boxes on the material box installation positions (1011) to sequentially move to a position capable of being driven by the first driving mechanism (102) during rotation;
the first driving mechanism (102) is used for driving the material box to move so as to enable wafers in the material box to be sequentially positioned at a feeding station during feeding or enable wafer storage positions in the material box to be sequentially positioned at a discharging station during discharging; also comprises;
the detection mechanism (103) is used for detecting the loading or unloading condition of the wafers in the material box so as to generate a driving signal when the wafers in the material box at the loading station are detected to be taken away during loading or when the wafer storage position in the material box at the unloading station is detected to be newly loaded with the wafers during unloading;
the first driving mechanism (102) is used for driving the material box to move along a first direction according to the driving signal by a set distance, wherein the first direction is the arrangement direction of the wafer storage positions in the material box, and the set distance is the distance between two adjacent wafer storage positions in the material box, so that the wafers in the material box are sequentially positioned at a feeding station during feeding or are sequentially positioned at a discharging station during discharging;
the detection mechanism (103) comprises a sensor and a processing unit;
the sensor is used for detecting the loading or unloading condition of the wafer in the material box;
the processing unit is used for judging that the wafer positioned at the feeding station in the material box is taken away during feeding or judging that the wafer storage position positioned at the discharging station in the material box is newly filled with the wafer during discharging according to the detection result of the sensor;
the sensor is a proximity sensor and is positioned at one side of the outermost wafer in the material box during detection;
the sensor can move relative to the frame (1) to detect the feeding or discharging condition of the wafer in the material box when moving to a first moving position; and exiting the detection position when moving to the second active position;
the second driving mechanism (104) is used for driving the sensor to move to the first active position and the second active position;
the second driving mechanism (104) comprises a driving cylinder, so that the sensor is driven to move to the first active position and the second active position by the driving cylinder, and the driving cylinder is an air cylinder.
2. The wafer blanking device according to claim 1, further comprising a third driving mechanism (105) for driving the turntable (101) to rotate.
3. The apparatus of claim 1, wherein,
the first driving mechanism (102) comprises a first motor (1021), a screw rod (1022), a nut seat (1023) sleeved on the screw rod (1022), and a linear guide rail (1024) used for limiting and guiding the nut seat (1023);
the first motor (1021) is used for driving the screw rod (1022) to rotate;
the nut seat (1023) is provided with an ejector rod (1025), and the nut seat (1023) is used for being driven to drive the material box to move through the ejector rod (1025).
4. A lithographic apparatus comprising the wafer blanking device of any of claims 1 to 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811097650.7A CN109188868B (en) | 2018-09-20 | 2018-09-20 | Wafer blanking device and photoetching machine applying same |
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| CN201811097650.7A CN109188868B (en) | 2018-09-20 | 2018-09-20 | Wafer blanking device and photoetching machine applying same |
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| CN109188868A CN109188868A (en) | 2019-01-11 |
| CN109188868B true CN109188868B (en) | 2024-02-02 |
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| CN112420581B (en) * | 2021-01-22 | 2021-04-16 | 山东元旭光电股份有限公司 | Automatic sheet feeding machine |
| CN114864461A (en) * | 2022-03-25 | 2022-08-05 | 苏州精濑光电有限公司 | Automatic feeding and discharging method and device for hoop blue film and detection equipment |
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| KR20100058869A (en) * | 2008-11-25 | 2010-06-04 | 주식회사 동부하이텍 | Wafer sensing apparatus of wafer transfer system and interlock method using thereof |
| KR20100077622A (en) * | 2008-12-29 | 2010-07-08 | 주식회사 동부하이텍 | Apparatus and method for sensing wafer of wafer transfer system |
| CN102299050A (en) * | 2011-08-01 | 2011-12-28 | 上海宏力半导体制造有限公司 | Wafer position detection device |
| CN206511544U (en) * | 2016-12-31 | 2017-09-22 | 深圳配天智能技术研究院有限公司 | A kind of rotary charging device |
| CN206705273U (en) * | 2017-04-07 | 2017-12-05 | 广东南大机器人有限公司 | A kind of band automatically feeds the material box mechanism of function |
| CN207183239U (en) * | 2017-09-13 | 2018-04-03 | 深圳市矽电半导体设备有限公司 | A kind of expansion crystalline substance ring feeding device of wafer detection equipment |
| CN208922061U (en) * | 2018-09-20 | 2019-05-31 | 深圳市矽电半导体设备有限公司 | Wafer handling equipment and the litho machine for applying it |
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| CN109188868A (en) | 2019-01-11 |
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