CN109135191B - 一种用于芯片堆叠封装的树脂垫片及其制备方法 - Google Patents

一种用于芯片堆叠封装的树脂垫片及其制备方法 Download PDF

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CN109135191B
CN109135191B CN201810923760.8A CN201810923760A CN109135191B CN 109135191 B CN109135191 B CN 109135191B CN 201810923760 A CN201810923760 A CN 201810923760A CN 109135191 B CN109135191 B CN 109135191B
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CN109135191A (zh
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杨国宏
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Suzhou Delintai Seiko Technology Co ltd
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Abstract

本发明涉及一种用于芯片堆叠封装的树脂垫片，以纤维玻璃布为基材，所述纤维玻璃布的重量占比为10‑60wt％，其上附着有以下组分，以占树脂垫片总重量的百分比计：环氧树脂8‑40wt％、石英粉10‑30wt％、氧化铝2‑10wt％、氧化钙1‑8wt％、固化剂1‑8wt％，所述的树脂垫片经树脂调胶、浸胶、半固化、叠构、压合而成。本发明的用于芯片堆叠封装的树脂垫片柔韧性好、不易破裂，可实现芯片在基板上的更多层堆叠，并有效避免减少了封装结构的翘曲和内部芯片的碎裂风险，另外，本发明的树脂垫片电绝缘性优良，亲水效果好，能替代目前广泛使用于芯片堆叠封装的硅基垫片。

Description

一种用于芯片堆叠封装的树脂垫片及其制备方法
技术领域
本发明涉及一种用于芯片堆叠封装的树脂垫片及其制备方法，属于封装芯片的垫片技术领域。
背景技术
随着现代集成电路的发展，微电子行业芯片封装技术已从二维向三维堆叠封装形式迅速发展,以适应芯片封装结构更轻、更薄、更小、高性能、低功耗、低成本的市场要求。三维堆叠封装技术在不增加封装尺寸的条件下，不但提高了封装密度，降低了成本，同时减小了芯片之间的互连导线长度，从而提高了器件的运行速度，而且通过叠层封装还可以实现器件的多功能化。
目前的三维堆叠封装形式主要有：阶梯式和垂直式。无论是阶梯式还是垂直式都需要有垫片，垫片的作用主要：一是确保芯片粘贴平整，防止印刷电路板的不平整造成超薄芯片开裂，二是确保打线有足够空间。但是，目前所有采用此类封装的垫片都是硅基晶圆垫片，此类垫片的缺点是加工工艺包括贴膜、减薄、切割等流程，该加工工艺极其占用正常机器产能，且受硅基晶圆垫片的尺寸限制(最大12寸)，导致出产率低，加工工艺长，消耗辅助材料(粘贴膜，磨轮，切割刀具)多，且由于硅基晶圆垫片容易在加工和使用过程中开裂，影响了产品的成品率，提高了生产成本。另外，硅基晶圆垫片越薄越易碎，致使垫片厚度受到了限制，不能因封装尺寸薄而减薄，使芯片的堆叠层数和堆叠芯片的厚度也受到限制。
发明内容
本发明要解决的技术问题是：为解决及现有芯片封装用硅基晶圆垫片易碎、生产成本高、垫片厚度较厚的技术问题，提供一种用于芯片堆叠封装的树脂垫片及其制备方法。
本发明为解决其技术问题所采用的技术方案是：
一种用于芯片堆叠封装的树脂垫片，以纤维玻璃布为基材，所述纤维玻璃布的重量占比为10-60wt％，其上附着有以下组分，以占树脂垫片总重量的百分比计：环氧树脂8-40wt％、石英粉10-30wt％、氧化铝2-10wt％、氧化钙1-8wt％、固化剂1-8wt％。
优选地，所述用于芯片堆叠封装的树脂垫片，所述纤维玻璃布的重量占比为40-60wt％，其上附着有以下组分，以占树脂垫片总重量的百分比计：环氧树脂30-40wt％、石英粉10-20wt％、氧化铝5-10wt％、氧化钙2-8wt％、固化剂4-8wt％。
优选地，所述环氧树脂为磷化环氧树脂、联苯型环氧树脂、双酚型环氧树脂、酚醛型环氧树脂、甘油环氧树脂、邻甲基酚醛型环氧树脂、萘酚型环氧树脂、双环戊二烯型环氧树脂中的至少一种。
优选地，所述玻璃纤维布的目数为100-200目，所述石英粉的目数为200-400目，所述氧化铝的目数为400-600目，所述氧化钙的目数为200-400目。
优选地，所述固化剂为脂肪胺、脂环胺、芳香族胺、聚酰胺、双氰胺、咪唑类化合物中的至少一种。
优选地，用于芯片堆叠封装的树脂垫片还包括颜料，所述颜料的重量占比为1-3wt％，所述颜料优选为白炭黑、珠光粉中的至少一种。
本发明还提供一种用于芯片堆叠封装的树脂垫片的制备方法，包括如下步骤：
S1：调胶：将8-40重量份的环氧树脂、10-30重量份的石英粉、2-10重量份的氧化铝、1-8重量份的氧化钙加入溶剂中，搅拌溶解，加入1-8重量份的固化剂，分散均匀，得树脂胶液；
S2：浸胶：将10-60重量份的纤维玻璃布浸入配好的树脂胶液中，得浸胶布，控制浸胶量为50-70g/m2；
S3：半固化：将浸胶布进行干燥，预固化度控制在30-50％，制成半固化片；
S4：叠构、压合：将多块半固化片层层叠压，然后进行加热，同时进行压合，保温一段时间后停止加热，冷却后得到一定厚度的树脂垫片；
所述环氧树脂、石英粉、氧化铝、氧化钙、固化剂、纤维玻璃布的总重量份为100份。
优选地，所述树脂垫片的厚度为0.07-0.13mm。
优选地，所述溶剂为丙酮、丁酮、乙酸乙酯、乙酸丁酯、乙醇、乙二醇单甲醚、乙二醇二甲醚、N,N-二甲基甲酰胺、N,N-二甲基乙酰胺、N-甲基吡咯烷酮中的至少一种。
优选地，所述S3步骤的干燥温度为70-120℃。
优选地，所述S4步骤的加热温度为150-180℃，保温时间为8-12h，压合压力为3-10MPa。
本发明的有益效果是：
(1)本发明的用于芯片堆叠封装的树脂垫片柔韧性好，不易破裂、抗老化、易保存，对制程加工要求不高，树脂垫片可以预先加工，尺寸、厚薄无限制，可实现芯片在基板上的更多层堆叠，减低了封装成本，同时保证了完成整个封装后结构的平衡，有效避免减少了封装结构的翘曲和内部芯片的碎裂风险，提高了产品可靠性；而现有的硅基垫片是纯硅，磨成薄片易碎，对制程及设备要求高。
(2)本发明的用于芯片堆叠封装的树脂垫片电绝缘性优良，它能替代目前广泛使用于芯片堆叠封装的硅基垫片，树脂垫片的击穿电压大于39KV/MM；而现有的硅基垫片是半绝缘体，是单向导电，反向击穿电压一般小于1KV/MM。
(3)本发明的用于芯片堆叠封装的树脂垫片亲水效果好，使用普通胶水即可将其与芯片粘合，在固化体系中的醚基、苯环和脂肪羟基不易受酸碱侵蚀；而现有的硅基垫片亲水效果不佳，需要用专业的胶水将其与芯片粘附，价格昂贵，且硅基材料容易受酸碱侵蚀。
具体实施方式
现在结合实施例对本发明作进一步详细的说明。
实施例1
本实施例提供一种用于芯片堆叠封装的树脂垫片，厚度为0.07mm，以100目纤维玻璃布为基材，所述纤维玻璃布的重量占比为60wt％，其上附着有以下组分，以占树脂垫片总重量的百分比计：萘酚型环氧树脂8wt％、200目石英粉10wt％、400目氧化铝10wt％、300目氧化钙8wt％、聚酰胺4wt％。
上述用于芯片堆叠封装的树脂垫片的制备方法，包括以下步骤：
S1：调胶：将8重量份的萘酚型环氧树脂、10重量份的石英粉、10重量份的氧化铝、8重量份的氧化钙加入乙酸乙酯中，搅拌溶解，加入4重量份的聚酰胺，分散均匀，得树脂胶液；
S2：浸胶：将60重量份的纤维玻璃布浸入配好的树脂胶液中，得浸胶布，控制浸胶量为50g/m2；
S3：半固化：将浸胶布在70℃温度下进行干燥，预固化度控制在50％，制成半固化片；
S4：叠构、压合：将多块半固化片层层叠压，然后在150℃温度下进行加热，同时在3MPa压力下进行压合，保温8h后停止加热，冷却后得到0.07mm的树脂垫片。
实施例2
本实施例提供一种用于芯片堆叠封装的树脂垫片，厚度为0.1mm，以200目纤维玻璃布为基材，所述纤维玻璃布的重量占比为10wt％，其上附着有以下组分，以占树脂垫片总重量的百分比计：双酚A环氧树脂17wt％、联苯型环氧树脂20wt％、400目石英粉30wt％、600目氧化铝10wt％、400目氧化钙2wt％、脂肪胺8wt％、3wt％白炭黑。
上述用于芯片堆叠封装的树脂垫片的制备方法，包括以下步骤：
S1：调胶：将20重量份的双酚A环氧树脂、20重量份的联苯型环氧树脂、30重量份的石英粉、10重量份的氧化铝、2重量份的氧化钙加入N,N-二甲基甲酰胺中，搅拌溶解，加入8重量份的脂肪胺，分散均匀，得树脂胶液；
S2：浸胶：将10重量份的纤维玻璃布浸入配好的树脂胶液中，得浸胶布，控制浸胶量为70g/m2；
S3：半固化：将浸胶布在120℃温度下进行干燥，预固化度控制在30％，制成半固化片；
S4：叠构、压合：将多块半固化片层层叠压，然后在160℃温度下进行加热，同时在5MPa压力下进行压合，保温10h后停止加热，冷却后得到0.1mm的树脂垫片。
实施例3
本实施例提供一种用于芯片堆叠封装的树脂垫片，厚度为0.13mm，以150目纤维玻璃布为基材，所述纤维玻璃布的重量占比为40wt％，其上附着有以下组分，以占树脂垫片总重量的百分比计：酚醛环氧树脂19wt％、双环戊二烯型环氧树脂10wt％、300目石英粉20wt％、500目氧化铝2wt％、200目氧化钙7wt％、咪唑1wt％、1wt％珠光粉。
上述用于芯片堆叠封装的树脂垫片的制备方法，包括以下步骤：
S1：调胶：将20重量份的酚醛环氧树脂、10重量份的双环戊二烯型环氧树脂、20重量份的石英粉、2重量份的氧化铝、7重量份的氧化钙加入丙酮中，搅拌溶解，加入1重量份的咪唑，分散均匀，得树脂胶液；
S2：浸胶：将40重量份的纤维玻璃布浸入配好的树脂胶液中，得浸胶布，控制浸胶量为60g/m2；
S3：半固化：将浸胶布在100℃温度下进行干燥，预固化度控制在40％，制成半固化片；
S4：叠构、压合：将多块半固化片层层叠压，然后在180℃温度下进行加热，同时在10MPa压力下进行压合，保温12h后停止加热，冷却后得到0.13mm的树脂垫片。
实施例4
本实施例提供一种用于芯片堆叠封装的树脂垫片，厚度为0.1mm，以150目纤维玻璃布为基材，所述纤维玻璃布的重量占比为50wt％，其上附着有以下组分，以占树脂垫片总重量的百分比计：甘油环氧树脂30wt％、300目石英粉10wt％、500目氧化铝5wt％、300目氧化钙1wt％、间苯二胺4wt％。
上述用于芯片堆叠封装的树脂垫片的制备方法，包括以下步骤：
S1：调胶：将30重量份的甘油环氧树脂、10重量份的石英粉、5重量份的氧化铝、1重量份的氧化钙加入乙二醇单甲醚中，搅拌溶解，加入4重量份的间苯二胺，分散均匀，得树脂胶液；
S2：浸胶：将50重量份的纤维玻璃布浸入配好的树脂胶液中，得浸胶布，控制浸胶量为60g/m2；
S3：半固化：将浸胶布在100℃温度下进行干燥，预固化度控制在40％，制成半固化片；
S4：叠构、压合：将多块半固化片层层叠压，然后在180℃温度下进行加热，同时在10MPa压力下进行压合，保温12h后停止加热，冷却后得到0.1mm的树脂垫片。
实施例5
本实施例提供一种用于芯片堆叠封装的树脂垫片，厚度为0.1mm，以150目纤维玻璃布为基材，所述纤维玻璃布的重量占比为40wt％，其上附着有以下组分，以占树脂垫片总重量的百分比计：磷化环氧树脂30wt％、300目石英粉16wt％、500目氧化铝6wt％、300目氧化钙3wt％、双氰胺5wt％。
上述用于芯片堆叠封装的树脂垫片的制备方法，包括以下步骤：
S1：调胶：将30重量份的磷化环氧树脂、16重量份的石英粉、6重量份的氧化铝、3重量份的氧化钙加入N-甲基吡咯烷酮中，搅拌溶解，加入5重量份的双氰胺，分散均匀，得树脂胶液；
S2：浸胶：将40重量份的纤维玻璃布浸入配好的树脂胶液中，得浸胶布，控制浸胶量为60g/m2；
S3：半固化：将浸胶布在100℃温度下进行干燥，预固化度控制在40％，制成半固化片；
S4：叠构、压合：将多块半固化片层层叠压，然后在160℃温度下进行加热，同时在8MPa压力下进行压合，保温10h后停止加热，冷却后得到0.1mm的树脂垫片。
效果例
根据ASTM D-149标准可从Haefely Hitronics公司获得的DielectricBreakdownTester(介电击穿测试器)、710-56A-B来测量实施例1-5的树脂垫片的击穿电压，实施例1-5的树脂垫片的击穿电压依次为21KV/MM、30KV/MM、39KV/MM、29KV/MM、31KV/MM，而现有的硅基垫片的反向击穿电压一般小于1KV/MM，可见，本发明的用于芯片堆叠封装的树脂垫片电绝缘性优良。
以上述依据本发明的理想实施例为启示，通过上述的说明内容，相关工作人员完全可以在不偏离本项发明技术思想的范围内，进行多样的变更以及修改。本项发明的技术性范围并不局限于说明书上的内容，必须要根据权利要求范围来确定其技术性范围。

Claims (10)

1.一种用于芯片堆叠封装的树脂垫片，其特征在于，以纤维玻璃布为基材，所述纤维玻璃布的重量占比为10-60wt％，其上附着有以下组分，以占树脂垫片总重量的百分比计：环氧树脂8-40wt％、石英粉10-30wt％、氧化铝2-10wt％、氧化钙1-8wt％、固化剂1-8wt％。
2.根据权利要求1所述的用于芯片堆叠封装的树脂垫片，其特征在于，所述纤维玻璃布的重量占比为40-60wt％，其上附着有以下组分，以占树脂垫片总重量的百分比计：环氧树脂30-40wt％、石英粉10-20wt％、氧化铝5-10wt％、氧化钙2-8wt％、固化剂4-8wt％，树脂垫片各组分含量之和为100wt％。
3.根据权利要求1或2所述的用于芯片堆叠封装的树脂垫片，其特征在于，所述环氧树脂为磷化环氧树脂、联苯型环氧树脂、双酚型环氧树脂、酚醛型环氧树脂、甘油环氧树脂、邻甲基酚醛型环氧树脂、萘酚型环氧树脂、双环戊二烯型环氧树脂中的至少一种。
4.根据权利要求1或2所述的用于芯片堆叠封装的树脂垫片，其特征在于，所述玻璃纤维布的目数为100-200目，所述石英粉的目数为200-400目，所述氧化铝的目数为400-600目，所述氧化钙的目数为200-400目。
5.根据权利要求1或2所述的用于芯片堆叠封装的树脂垫片，其特征在于，所述固化剂为脂肪胺、脂环胺、芳香族胺、聚酰胺、双氰胺、咪唑类化合物中的至少一种。
6.根据权利要求1或2所述的用于芯片堆叠封装的树脂垫片，其特征在于，用于芯片堆叠封装的树脂垫片还包括颜料，所述颜料的重量占比为1-3wt％，所述颜料为白炭黑、珠光粉中的至少一种。
7.一种用于芯片堆叠封装的树脂垫片的制备方法，其特征在于，包括如下步骤：
S1：调胶：将8-40重量份的环氧树脂、10-30重量份的石英粉、2-10重量份的氧化铝、1-8重量份的氧化钙加入溶剂中，搅拌溶解，加入1-8重量份的固化剂，分散均匀，得树脂胶液；
S2：浸胶：将10-60重量份的纤维玻璃布浸入配好的树脂胶液中，得浸胶布，控制浸胶量为50-70g/m2；
S3：半固化：将浸胶布进行干燥，预固化度控制在30-50％，制成半固化片；
S4：叠构、压合：将多块半固化片层层叠压，然后进行加热，同时进行压合，保温一段时间后停止加热，冷却后得到一定厚度的树脂垫片；
所述环氧树脂、石英粉、氧化铝、氧化钙、固化剂、纤维玻璃布的总重量份为100份。
8.根据权利要求7所述的用于芯片堆叠封装的树脂垫片的制备方法，其特征在于，所述树脂垫片的厚度为0.07-0.13mm。
9.根据权利要求7或8所述的用于芯片堆叠封装的树脂垫片的制备方法，其特征在于，所述溶剂为丙酮、丁酮、乙酸乙酯、乙酸丁酯、乙醇、乙二醇单甲醚、乙二醇二甲醚、N,N-二甲基甲酰胺、N,N-二甲基乙酰胺、N-甲基吡咯烷酮中的至少一种。
10.根据权利要求7或8所述的用于芯片堆叠封装的树脂垫片的制备方法，其特征在于，所述S3步骤的干燥温度为70-120℃，所述S4步骤的加热温度为150-180℃，保温时间为8-12h，压合压力为3-10MPa。
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