CN109192720B - 一种基于树脂垫片的阶梯式堆叠芯片封装结构及加工工艺 - Google Patents

一种基于树脂垫片的阶梯式堆叠芯片封装结构及加工工艺 Download PDF

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CN109192720B
CN109192720B CN201810924734.7A CN201810924734A CN109192720B CN 109192720 B CN109192720 B CN 109192720B CN 201810924734 A CN201810924734 A CN 201810924734A CN 109192720 B CN109192720 B CN 109192720B
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chip
resin
gasket
circuit board
resin gasket
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CN109192720A (zh
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杨国宏
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Suzhou Delintai Seiko Technology Co ltd
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Suzhou Delintai Seiko Technology Co ltd
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Priority to CN201810924734.7A priority Critical patent/CN109192720B/zh
Priority to US17/043,735 priority patent/US11462448B2/en
Priority to PCT/CN2018/111152 priority patent/WO2020034386A1/zh
Priority to KR1020207030304A priority patent/KR102479636B1/ko
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Abstract

本发明涉及一种基于树脂垫片的阶梯式堆叠芯片封装结构，包含塑封材料、电路板、树脂垫片、第一芯片、第二芯片及电性连接组件，树脂垫片、第一芯片及第二芯片依次堆叠设置在电路板上，第二芯片以阶梯式堆叠在第一芯片上，电路板、第一芯片及第二芯片通过电性连接组件电性连接在一起，树脂垫片以纤维玻璃布为基材，纤维玻璃布的重量占比为10‑60wt％，其上附着有以下重量份的组分：环氧树脂8‑40wt％、石英粉10‑30wt％、氧化铝2‑10wt％、氧化钙1‑8wt％、固化剂1‑8wt％。本发明还提供一种阶梯式堆叠芯片封装结构的加工工艺：将树脂垫片背面粘贴上粘贴膜、切割，再将粘贴有粘贴膜的树脂垫片进行芯片的阶梯式封装。

Description

一种基于树脂垫片的阶梯式堆叠芯片封装结构及加工工艺
技术领域
本发明涉及一种基于树脂垫片的阶梯式堆叠芯片封装结构及加工工艺，属于芯片封装技术领域。
背景技术
随着现代集成电路的发展，微电子行业芯片封装技术已从二维向三维堆叠封装形式迅速发展,以适应芯片封装结构更轻、更薄、更小、高性能、低功耗、低成本的市场要求。三维堆叠封装技术在不增加封装尺寸的条件下，不但提高了封装密度，降低了成本，加快了封装速度，多功能集成度也大大加强。
目前，三维堆叠芯片封装结构所用的垫片都是硅基晶圆垫片，此类垫片的缺点是加工工艺包括贴膜、减薄、切割等流程，该加工工艺极其占用正常机器产能，且受硅基晶圆垫片的尺寸限制(最大12寸)，导致出产率低，加工工艺长，消耗辅助材料(粘贴膜，磨轮，切割刀具)多，且由于硅基晶圆垫片容易在加工和使用过程中开裂，影响了产品的成品率，提高了生产成本。另外，硅基晶圆垫片越薄越易碎，致使垫片厚度受到了限制，不能因封装尺寸薄而减薄，使堆叠芯片的厚度也受到限制。
发明内容
本发明要解决的技术问题是：为解决现有芯片堆叠封装结构的封装尺寸大，及现有芯片封装用硅基晶圆垫片易碎、生产成本高、垫片厚度较厚、加工工艺长、消耗辅助材料的技术问题，提供一种基于树脂垫片的阶梯式堆叠芯片封装结构及加工工艺。
本发明为解决其技术问题所采用的技术方案是：
一种基于树脂垫片的阶梯式堆叠芯片封装结构，包含塑封材料、电路板、树脂垫片、第一芯片、第二芯片及电性连接组件；
所述树脂垫片、第一芯片及第二芯片依次堆叠在电路板上，所述第二芯片以阶梯式堆叠在第一芯片上；
所述电性连接组件包括串联连接的第一焊线及第二焊线，所述电路板、第一芯片及第二芯片的同一侧上表面边缘设有数个焊垫，第一焊线电性连接第一芯片的焊垫与电路板的焊垫，第二焊线电性连接第二芯片的焊垫与第一芯片的焊垫；
所述电路板、树脂垫片、第一芯片和第二芯片通过粘贴层粘连在一起；
所述塑封材料将树脂垫片、第一芯片、第二芯片、电性连接组件及粘贴层密封在电路板上；
所述树脂垫片以纤维玻璃布为基材，所述纤维玻璃布的重量占比为10-60wt％，其上附着有以下组分，以占树脂垫片总重量的百分比计：环氧树脂8-40wt％、石英粉10-30wt％、氧化铝2-10wt％、氧化钙1-8wt％、固化剂1-8wt％。
优选地，所述树脂垫片以纤维玻璃布为基材，纤维玻璃布的重量占比为40-60wt％，其上附着有以下组分，以占树脂垫片总重量的百分比计：环氧树脂30-40wt％、石英粉10-20wt％、氧化铝5-10wt％、氧化钙2-8wt％、固化剂4-8wt％。
优选地，用于芯片堆叠封装的树脂垫片还包括颜料，所述颜料的重量占比为1-3wt％，所述颜料优选为白炭黑、珠光粉中的至少一种。
优选地，所述环氧树脂为磷化环氧树脂、联苯型环氧树脂、双酚型环氧树脂、酚醛型环氧树脂、甘油环氧树脂、邻甲基酚醛型环氧树脂、萘酚型环氧树脂、双环戊二烯型环氧树脂中的至少一种。
优选地，所述固化剂为脂肪胺、脂环胺、芳香族胺、聚酰胺、双氰胺、咪唑类化合物中的至少一种。
优选地，所述纤维玻璃布的目数为100-200目，所述石英粉的目数为200-400目，所述氧化铝的目数为400-600目，所述氧化钙的目数为200-400目
优选地，所述树脂垫片的厚度为0.07-0.13mm。
优选地，所述第二芯片的上方以阶梯式堆叠一层或者多层芯片，通过焊线电性连接相邻芯片上的焊垫，相邻的焊线串联连接。
本发明还提供一种基于树脂垫片的阶梯式堆叠芯片封装结构的加工工艺，包括如下步骤：
将树脂垫片背面粘贴上粘贴膜，然后切割，得到所需尺寸的粘贴有粘贴膜的树脂垫片；
提供电路板、第一芯片及第二芯片，将粘贴有粘贴膜的树脂垫片、第一芯片及第二芯片依次堆叠于电路板上，第二芯片呈阶梯式堆叠于第一芯片上，并通过粘接膜将电路板、树脂垫片、第一芯片和第二芯片粘连在一起；
利用第一焊线电性连接第一芯片的焊垫与电路板的焊垫，利用第二焊线电性连接第二芯片的焊垫与第一芯片的焊垫，使第一焊线与第二焊线串联连接；
利用塑封材料将树脂垫片、第一芯片、第二芯片、第一焊线及第二焊线密封在电路板上。
优选地，所述树脂垫片是由如下方法制备的，包括如下步骤：
S1：调胶：将8-40重量份的环氧树脂、10-30重量份的石英粉、2-10重量份的氧化铝、1-8重量份的氧化钙加入溶剂中，搅拌溶解，加入1-8重量份的固化剂，分散均匀，得树脂胶液；
S2：浸胶：将10-60重量份的纤维玻璃布浸入配好的树脂胶液中，得浸胶布，控制浸胶量为50-70g/m2；
S3：半固化：将浸胶布进行干燥，预固化度控制在30-50％，制成半固化片；
S4：叠构、压合：将多块半固化片层层叠压，然后进行加热，同时进行压合，保温一段时间后停止加热，冷却后得到一定厚度的树脂垫片；
所述环氧树脂、石英粉、氧化铝、氧化钙、固化剂和纤维玻璃布的总重量份为100份。
优选地，所述S3步骤的干燥温度为70-120℃，所述S4步骤的加热温度为150-180℃，保温时间为8-12h，压合压力为3-10MPa。
优选地，所述溶剂为丙酮、丁酮、乙酸乙酯、乙酸丁酯、乙醇、乙二醇单甲醚、乙二醇二甲醚、N,N-二甲基甲酰胺、N,N-二甲基乙酰胺、N-甲基吡咯烷酮中的至少一种。
本发明的有益效果是：
(1)本发明提供了一种基于树脂垫片的阶梯式堆叠芯片封装结构及加工工艺，使用一种由特定材料组成的树脂垫片来代替常规的硅基垫片，树脂垫片的厚度可以做的更薄，实现了芯片在基板上的更多层堆叠的可行性，减小了封装尺寸，同时也能保证完成整个封装后结构的平衡,并有效避免芯片翘曲和内部开裂带来的风险；另外，用于芯片封装的树脂垫片的加工工艺无贴膜、减薄等流程，减低了封装成本，缩短了加工周期。
(2)本发明的用于芯片堆叠封装的树脂垫片柔韧性好，不易破裂、抗老化、易保存，树脂垫片可以预先加工，尺寸、厚薄无限制，且树脂垫片电绝缘性优良，树脂垫片的击穿电压远远大于硅基垫片的击穿电压，另外，本发明的树脂垫片亲水效果好，使用普通胶水即可将其与芯片粘合，在固化体系中的醚基、苯环和脂肪羟基不易受酸碱侵蚀，它能替代目前广泛使用于芯片堆叠封装的硅基垫片。
附图说明
下面结合附图和实施例对本发明进一步说明。
图1是实施例1的基于树脂垫片的阶梯式堆叠芯片封装结构的剖视图；
图中的附图标记为：1-塑封材料，2-电路板，3-树脂垫片，4-第一芯片，5-第二芯片，6-电性连接组件，61-第一焊线，62-第二焊线，7-粘结层。
具体实施方式
现在结合附图对本发明作进一步详细的说明。这些附图均为简化的示意图，仅以示意方式说明本发明的基本结构，因此其仅显示与本发明有关的构成。
实施例1
本实施例提供一种基于树脂垫片的阶梯式堆叠芯片封装结构，如图1所示，包含塑封材料1、电路板2、树脂垫片3、第一芯片4、第二芯片5及电性连接组件6；
所述树脂垫片3、第一芯片4及第二芯片5依次堆叠在电路板2上，所述第二芯片5以阶梯式堆叠在第一芯片4上，以不妨碍第一芯片4焊垫的打线作业，树脂垫片3可以防止电路板2的不平整造成超薄芯片开裂；
所述电性连接组件6包括串联连接的第一焊线61及第二焊线62，所述电路板2、第一芯片4及第二芯片5的同一侧上表面边缘设有多个焊垫，例如各以至少一排的方式分别排列在所述电路板2、第一芯片4及第二芯片5同一侧上表面，第一焊线61电性连接第一芯片4的焊垫与电路板2的焊垫，第二焊线62电性连接第二芯片5的焊垫与第一芯片4的焊垫；
所述堆叠芯片封装结构还包含数片粘贴层7，分别位于电路板2与树脂垫片3之间、第一芯片4与树脂垫片3之间以及第一芯片4与第二芯片5之间，以将电路板2、树脂垫片3、第一芯片4和第二芯片5粘连在一起。本实施例的数个粘贴层7是一具有粘性且具有绝缘性质的膜片，所述粘贴层7在堆叠组装前即预先分别粘贴于所述树脂垫片3、第一芯片4及第二芯片5的背面，且各所述粘贴层7与其对应组件的背面大致具有相同的长宽尺寸，所述粘贴层7的厚度优选为10～25微米。
所述塑封材料1将树脂垫片3、第一芯片4、第二芯片5、电性连接组件6及粘贴层7密封在电路板2上；
所述树脂垫片3以纤维玻璃布为基材，所述纤维玻璃布的重量占比为10-60wt％，其上附着有以下组分，以占树脂垫片3总重量的百分比计：环氧树脂8-40wt％、石英粉10-30wt％、氧化铝2-10wt％、氧化钙1-8wt％、固化剂1-8wt％。
优选地，所述树脂垫片3以纤维玻璃布为基材，纤维玻璃布的重量占比为40-60wt％，其上附着有以下组分，以占树脂垫片3总重量的百分比计：环氧树脂30-40wt％、石英粉10-20wt％、氧化铝5-10wt％、氧化钙2-8wt％、固化剂4-8wt％。
优选地，用于芯片堆叠封装的树脂垫片还包括颜料，所述颜料的重量占比为1-3wt％，所述颜料优选为白炭黑、珠光粉中的至少一种。
优选地，所述环氧树脂为磷化环氧树脂、联苯型环氧树脂、双酚型环氧树脂、酚醛型环氧树脂、甘油环氧树脂、邻甲基酚醛型环氧树脂、萘酚型环氧树脂、双环戊二烯型环氧树脂中的至少一种。
优选地，所述纤维玻璃布的目数为100-200目(如100目，150目，200目)，所述石英粉的目数为200-400目(如200目，300目，400目)，所述氧化铝的目数为400-600目(如400目，500目，600目)，所述氧化钙的目数为200-400目(如200目，300目，400目)。
优选地，所述固化剂为脂肪胺、脂环胺、芳香族胺、聚酰胺、双氰胺、咪唑类化合物中的至少一种。
优选地，所述树脂垫片3的厚度为0.07-0.13mm(如0.07mm、0.1mm、0.13mm)。
优选地，所述第二芯片5的上方以阶梯式堆叠一层或者多层芯片，通过焊线电性连接相邻芯片上的焊垫，相邻的焊线串联连接。
实施例2
本实施例提供一种基于树脂垫片的阶梯式堆叠芯片封装结构的加工工艺，包括如下步骤：
将树脂垫片背面粘贴上粘贴膜，然后切割，得到所需尺寸的粘贴有粘贴膜的树脂垫片；
提供电路板、第一芯片及第二芯片，将树脂垫片、第一芯片及第二芯片依次堆叠于电路板上，第二芯片呈阶梯式堆叠于第一芯片上，并通过粘接膜将电路板、树脂垫片、第一芯片和第二芯片粘连在一起；
利用第一焊线电性连接第一芯片的焊垫与电路板的焊垫，利用第二焊线电性连接第二芯片的焊垫与第一芯片的焊垫，使第一焊线与第二焊线串联连接；
利用塑封材料将树脂垫片、第一芯片、第二芯片、第一焊线及第二焊线密封在电路板上。
目前应用于堆叠芯片封装结构的硅基垫片的制备方法是：提供晶圆，在晶圆正面粘贴上保护膜；用抛光机对未贴保护膜的晶圆背面进行减薄到需要的厚度；在晶圆背面贴上粘贴胶带，并将其固定在基板上；把背面的保护膜撕掉，用切割刀切割成需要的尺寸；紫外线照射以固化粘贴胶带。可见，与硅基垫片相比，应用于堆叠芯片封装结构的小尺寸树脂垫片的制备不再使用贴膜机、减薄磨片机这些芯片制造瓶颈设备，因此生产成本低，制作周期短，堆叠封装的可靠性高。
所述树脂垫片的制备方法，包括如下步骤：
S1：调胶：将8-40重量份的环氧树脂、10-30重量份的石英粉、2-10重量份的氧化铝、1-8重量份的氧化钙加入溶剂中，搅拌溶解，加入1-8重量份的固化剂，分散均匀，得树脂胶液；
S2：浸胶：将10-60重量份的纤维玻璃布浸入配好的树脂胶液中，得浸胶布，控制浸胶量为50-70g/m2(如50g/m2、60g/m2、70g/m2)；
S3：半固化：将浸胶布在70-120℃(如70℃、100℃、120℃)温度下进行干燥，预固化度控制在30-50％(如30％、40％、50％)，制成半固化片；
S4：叠构、压合：将多块半固化片层层叠压，然后在150-180℃(如150℃、160℃、180℃)的温度下进行加热，同时在3-10MPa的压力下进行压合，保温8-12h(如8h、10h、12h)后停止加热，冷却后得到一定厚度的树脂垫片。
优选地，所述溶剂为丙酮、丁酮、乙酸乙酯、乙酸丁酯、乙醇、乙二醇单甲醚、乙二醇二甲醚、N,N-二甲基甲酰胺、N,N-二甲基乙酰胺、N-甲基吡咯烷酮中的至少一种。
以上述依据本发明的理想实施例为启示，通过上述的说明内容，相关工作人员完全可以在不偏离本项发明技术思想的范围内，进行多样的变更以及修改。本项发明的技术性范围并不局限于说明书上的内容，必须要根据权利要求范围来确定其技术性范围。

Claims (10)

1.一种基于树脂垫片的阶梯式堆叠芯片封装结构，其特征在于，包含塑封材料(1)、电路板(2)、树脂垫片(3)、第一芯片(4)、第二芯片(5)及电性连接组件(6)；
所述树脂垫片(3)、第一芯片(4)及第二芯片(5)依次堆叠在电路板(2)上，所述第二芯片(5)以阶梯式堆叠在第一芯片(4)上；
所述电性连接组件(6)包括串联连接的第一焊线(61)及第二焊线(62)，所述电路板(2)、第一芯片(4)及第二芯片(5)的同一侧上表面边缘设有数个焊垫，第一焊线(61)电性连接第一芯片(4)的焊垫与电路板(2)的焊垫，第二焊线(62)电性连接第二芯片(5)的焊垫与第一芯片(4)的焊垫；
所述电路板(2)、树脂垫片(3)、第一芯片(4)和第二芯片(5)通过粘贴层(7)粘连在一起；
所述塑封材料(1)将树脂垫片(3)、第一芯片(4)、第二芯片(5)、电性连接组件(6)及粘贴层(7)密封在电路板(2)上；
所述树脂垫片(3)以纤维玻璃布为基材，所述纤维玻璃布的重量占比为10-60wt％，其上附着有以下组分，以占树脂垫片(3)总重量的百分比计：环氧树脂8-40wt％、石英粉10-30wt％、氧化铝2-10wt％、氧化钙1-8wt％、固化剂1-8wt％。
2.根据权利要求1所述的基于树脂垫片的阶梯式堆叠芯片封装结构，其特征在于，所述树脂垫片(3)以纤维玻璃布为基材，纤维玻璃布的重量占比为40-60wt％，其上附着有以下组分，以占树脂垫片(3)总重量的百分比计：环氧树脂30-40wt％、石英粉10-20wt％、氧化铝5-10wt％、氧化钙2-8wt％、固化剂4-8wt％。
3.根据权利要求1或2所述的基于树脂垫片的阶梯式堆叠芯片封装结构，其特征在于，所述环氧树脂为磷化环氧树脂、联苯型环氧树脂、双酚型环氧树脂、酚醛型环氧树脂、甘油环氧树脂、邻甲基酚醛型环氧树脂、萘酚型环氧树脂、双环戊二烯型环氧树脂中的至少一种，所述固化剂为脂肪胺、脂环胺、芳香族胺、聚酰胺、双氰胺、咪唑类化合物中的至少一种。
4.根据权利要求1或2所述的基于树脂垫片的阶梯式堆叠芯片封装结构，其特征在于，所述树脂垫片(3)的厚度为0.07-0.13mm，所述纤维玻璃布的目数为100-200目，所述石英粉的目数为200-400目，所述氧化铝的目数为400-600目，所述氧化钙的目数为200-400目。
5.根据权利要求1或2所述的基于树脂垫片的阶梯式堆叠芯片封装结构，其特征在于，所述树脂垫片(3)还包括颜料，所述颜料的重量占比为1-3wt％。
6.根据权利要求5所述的基于树脂垫片的阶梯式堆叠芯片封装结构，其特征在于，所述颜料为白炭黑、珠光粉中的至少一种。
7.根据权利要求1或2所述的基于树脂垫片的阶梯式堆叠芯片封装结构，其特征在于，所述第二芯片(5)的上方以阶梯式堆叠一层或者多层芯片，通过焊线电性连接相邻芯片上的焊垫，相邻的焊线串联连接。
8.一种基于树脂垫片的阶梯式堆叠芯片封装结构的加工工艺，其特征在于，包括如下步骤：
将树脂垫片背面粘贴上粘贴膜，然后切割，得到所需尺寸的粘贴有粘贴膜的树脂垫片；
提供电路板、第一芯片及第二芯片，将粘贴有粘贴膜的树脂垫片、第一芯片及第二芯片依次堆叠于电路板上，第二芯片呈阶梯式堆叠于第一芯片上，并通过粘接膜将电路板、树脂垫片、第一芯片和第二芯片粘连在一起；
利用第一焊线电性连接第一芯片的焊垫与电路板的焊垫，利用第二焊线电性连接第二芯片的焊垫与第一芯片的焊垫，使第一焊线与第二焊线串联连接；
利用塑封材料将树脂垫片、第一芯片、第二芯片、第一焊线及第二焊线密封在电路板上；
所述基于树脂垫片的阶梯式堆叠芯片封装结构的加工工艺还包括树脂垫片的制备，步骤如下：
S1：调胶：将8-40重量份的环氧树脂、10-30重量份的石英粉、2-10重量份的氧化铝、1-8重量份的氧化钙加入溶剂中，搅拌溶解，加入1-8重量份的固化剂，分散均匀，得树脂胶液；
S2：浸胶：将10-60重量份的纤维玻璃布浸入配好的树脂胶液中，得浸胶布，控制浸胶量为50-70g/m2；
S3：半固化：将浸胶布进行干燥，预固化度控制在30-50％，制成半固化片；
S4：叠构、压合：将多块半固化片层层叠压，然后进行加热，同时进行压合，保温一段时间后停止加热，冷却后得到一定厚度的树脂垫片；
所述环氧树脂、石英粉、氧化铝、氧化钙、固化剂和纤维玻璃布的总重量份为100份。
9.根据权利要求8所述的基于树脂垫片的阶梯式堆叠芯片封装结构的加工工艺，其特征在于，所述S3步骤的干燥温度为70-120℃，所述S4步骤的加热温度为150-180℃，保温时间为8-12h，压合压力为3-10MPa。
10.根据权利要求8或9所述的基于树脂垫片的阶梯式堆叠芯片封装结构的加工工艺，其特征在于，所述溶剂为丙酮、丁酮、乙酸乙酯、乙酸丁酯、乙醇、乙二醇单甲醚、乙二醇二甲醚、N,N-二甲基甲酰胺、N,N-二甲基乙酰胺、N-甲基吡咯烷酮中的至少一种。
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