CN109129949B - Silicon wafer multi-wire cutting machine - Google Patents
Silicon wafer multi-wire cutting machine Download PDFInfo
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- CN109129949B CN109129949B CN201811245167.9A CN201811245167A CN109129949B CN 109129949 B CN109129949 B CN 109129949B CN 201811245167 A CN201811245167 A CN 201811245167A CN 109129949 B CN109129949 B CN 109129949B
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- 238000005520 cutting process Methods 0.000 title claims abstract description 54
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 33
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 33
- 239000010703 silicon Substances 0.000 title claims abstract description 33
- 239000000110 cooling liquid Substances 0.000 claims abstract description 23
- 238000005507 spraying Methods 0.000 claims abstract description 20
- 238000004804 winding Methods 0.000 claims abstract description 20
- 239000000463 material Substances 0.000 claims abstract description 17
- 239000013078 crystal Substances 0.000 claims abstract description 14
- 239000007921 spray Substances 0.000 claims abstract description 13
- 238000003860 storage Methods 0.000 claims abstract description 8
- 230000007704 transition Effects 0.000 claims description 88
- 239000007788 liquid Substances 0.000 claims description 31
- 230000001502 supplementing effect Effects 0.000 claims description 31
- 235000012431 wafers Nutrition 0.000 claims description 25
- 238000003825 pressing Methods 0.000 claims description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- 230000006835 compression Effects 0.000 claims description 4
- 238000007906 compression Methods 0.000 claims description 4
- 239000000428 dust Substances 0.000 claims description 3
- 230000002035 prolonged effect Effects 0.000 abstract description 3
- 229910000831 Steel Inorganic materials 0.000 description 14
- 239000010959 steel Substances 0.000 description 14
- 238000005516 engineering process Methods 0.000 description 6
- 238000009434 installation Methods 0.000 description 5
- 238000005299 abrasion Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The invention discloses a silicon wafer multi-wire cutting machine which has a simple structure, is convenient for arrangement of cutting wires, reduces friction of the cutting wires, and can uniformly spray cooling liquid on the cutting wires. The silicon wafer multi-wire cutting machine comprises a frame, wherein a feeding cavity is arranged on the frame, a crystal dragging connector is arranged at the top of the feeding cavity, a vertical telescopic device and a cooling liquid storage box are arranged above the feeding cavity, and a telescopic shaft of the vertical telescopic device is connected with the crystal dragging connector; the lower part of the frame is provided with two wire guide rollers with mutually parallel axes, and the wire guide rollers are in running fit with the frame; a receiving box is arranged between the two wire guide rollers; a wiring device is arranged below the material receiving box; a spraying device is arranged above the wire guide roller; one side of the frame is provided with a winding device. The service life of the cutting line can be effectively prolonged by adopting the silicon wafer multi-wire saw.
Description
Technical Field
The invention relates to silicon wafer cutting, in particular to a silicon wafer multi-wire cutting machine.
Background
It is well known that: silicon wafers are the main production materials in the semiconductor and photovoltaic fields. The multi-wire cutting technology of silicon wafers is a relatively advanced silicon wafer processing technology in the world at present, is different from the traditional cutting modes of a knife saw blade, a grinding wheel and the like, is also different from advanced laser cutting and inner circle cutting, and is based on the principle that a steel wire moving at high speed drives a cutting blade material attached to a steel wire to rub a silicon rod, so that the cutting effect is achieved. In the whole process, the steel wire is guided by more than ten wire guide wheels to form a wire net on the main wire roller, and the workpiece to be processed is fed by the lowering of the workbench. Compared with other technologies, the silicon wafer multi-wire cutting technology comprises the following steps: high efficiency, high productivity, high precision and the like. The silicon wafer multi-wire cutting technology is the most widely adopted silicon wafer cutting technology at present. But the friction of the steel wire is increased due to the fact that the steel wire is guided through a plurality of pulleys, so that the service life of the steel wire is short.
Secondly, when the steel wire cuts the silicon wafer, the temperature of the steel wire is increased due to friction, so that a steel wire cooling liquid spraying device is generally arranged for reducing the temperature of the steel wire, and most of the existing cooling liquid spraying devices adopt spray heads; because the position of the spray head is fixed, the cooling liquid received by each steel wire in the steel wire net on the wire guide roller is uneven, so that the temperature of each part of the steel wire is uneven, and the service life of the steel wire is reduced.
Disclosure of Invention
The invention aims to solve the technical problem of providing the silicon wafer multi-wire cutting machine which has a simple structure, is convenient for the arrangement of cutting wires, reduces the friction of the cutting wires and can uniformly spray cooling liquid on the cutting wires.
The technical scheme adopted for solving the technical problems is as follows: the multi-wire cutting machine for the silicon wafers comprises a frame, wherein a feeding cavity is arranged on the frame, a crystal dragging connector is arranged at the top of the feeding cavity, a vertical telescopic device and a cooling liquid storage box are arranged above the feeding cavity, and a telescopic shaft of the vertical telescopic device is connected with the crystal dragging connector; the lower part of the frame is provided with two wire guide rollers with mutually parallel axes, and the wire guide rollers are in running fit with the frame; a receiving box is arranged between the two wire guide rollers; the frame is provided with a material taking opening, and the material taking opening is positioned at one end of the material receiving box; a wiring device is arranged below the material receiving box; a spraying device is arranged above the wire guide roller; one side of the frame is provided with a winding device;
the second mounting plate is covered by the winding device, and a paying-off device and a wire collecting device are arranged at the lower part of the side surface of the bracket; the second mounting plate is parallel to the side surface of the frame and is vertically arranged; the paying-off device comprises a paying-off roller and a paying-off roller rotation driving device, and the winding device comprises a winding roller and a winding roller rotation driving device;
the paying-off roller rotation driving device and the winding roller rotation driving device are arranged on the side face of the frame, and the paying-off roller and the winding roller are horizontally arranged; a paying-off compression wheel is arranged above the paying-off roller, and a wire-collecting compression wheel is arranged above the wire-collecting roller;
a paying-off transition wheel and a taking-up transition wheel are arranged at the top of the second mounting plate; a horizontal mounting plate is arranged between the lower parts of the side surfaces of the frame and the lower parts of the second mounting plates; two height-adjusting transition wheels are arranged on the horizontal mounting plate and are distributed right below the paying-off transition wheel and the taking-up transition wheel;
two horizontal transition wheels are arranged on the horizontal mounting plate, and a wire passing port is arranged at the lower part of the frame; the horizontal transition wheel is flush with the wire passing opening; two vertical transition wheels are arranged between the horizontal transition wheel and the height adjustment transition wheel; the horizontal transition wheels, the vertical transition wheels and the height adjustment transition wheels are in one-to-one correspondence;
the wiring device comprises a wiring board and two groups of wire wheels, wherein the two groups of wire wheels are distributed in parallel; each group of wire dividing wheels comprises at least three wire dividing wheels; each of the two sets of wire dividing wheels is aligned one by one; the wire placing roller is provided with a cutting wire; the cutting line sequentially bypasses the paying-off pinch roller, the paying-off transition roller, the vertical transition roller, the horizontal transition roller, the two groups of wire distribution rollers and the two wire guide rollers, sequentially bypasses the horizontal transition roller, the vertical transition roller, the wire collecting transition roller and the wire collecting pinch roller, and finally returns to the wire collecting roller;
the spraying device comprises a spraying device body, wherein a transverse liquid supplementing groove and an overflow groove are arranged on the spraying device body, and the overflow groove is positioned at one side of the liquid supplementing groove; the height of the opening of the overflow groove is lower than that of the liquid supplementing groove; the bottom of the overflow groove is provided with a through hole communicated with the bottom of the liquid supplementing groove; a cover plate is arranged at the opening of the liquid supplementing groove; a liquid supplementing pipe communicated with the liquid supplementing groove is arranged in the middle of the cover plate; one side of the opening of the overflow groove is provided with an overflow plate which is inclined downwards; mounting plates are arranged at two ends of the spray device body; the spray device body is arranged on the frame through a mounting plate; the cooling liquid storage box is communicated with the liquid supplementing pipe through a water pump.
Specifically, a dovetail groove is formed in the crystal mop connector, and a wedge block is arranged on the inner wall of one side of the dovetail groove; the wedge block is provided with a connecting shaft, one end of the connecting shaft is connected with the wedge block, and the other end of the connecting shaft penetrates through the inner wall of the dovetail groove and is provided with a locking nut; the lock nut is in threaded fit with the connecting shaft.
Further, the paying-off pressing wheel and the winding-up pressing wheel are installed on the frame through an elastic device, the paying-off pressing wheel is provided with an installation seat, and the installation seat is hinged with one end of the elastic device.
Further, the paying-off transition wheel and the taking-up transition wheel are both arranged on the second mounting plate through the support frame, and the mounting seat of the paying-off transition wheel is hinged with one end of the support frame.
Further, the height-adjusting transition wheel is arranged on the horizontal mounting plate through the vertical lifting device.
Further, a drain outlet is formed in the bottom of the liquid supplementing groove, an outlet is formed in one side of the spraying device body, and a plug is arranged at the outlet.
Further, a dust cover is arranged above the overflow plate.
Preferably, the paying-off roller rotation driving device and the winding-up roller rotation driving device adopt motors or hydraulic motors.
The beneficial effects of the invention are as follows: according to the silicon wafer multi-wire cutting machine, the cutting wires sequentially bypass the paying-off pinch roller, the paying-off transition roller, the vertical transition roller, the horizontal transition roller and the two groups of wire dividing rollers, then sequentially bypass the horizontal transition roller, the vertical transition roller, the wire collecting transition roller and the wire collecting pinch roller, and finally return to the wire collecting roller; thus, the cutting line passes through fewer guide wheels, thereby reducing the path; meanwhile, unnecessary abrasion of the cutting line is reduced, and the service life of the cutting line is prolonged. Meanwhile, the guiding path is short, so that the arrangement of the cutting line path is facilitated, and the occupied space of the equipment can be reduced.
And the overflow plate is arranged at one side of the overflow groove, so that the cooling liquid overflows from one side of the overflow groove with a lower opening, and flows downwards on the overflow plate to form a water curtain after separating from the overflow plate.
Drawings
FIG. 1 is a perspective view of a silicon wafer multi-wire saw in an embodiment of the invention;
FIG. 2 is a perspective view of a silicon wafer multi-wire saw with a transition wheel removed in an embodiment of the invention;
FIG. 3 is a front view of a multi-wire saw for silicon wafers in an embodiment of the invention;
FIG. 4 is a top view of a multi-wire saw for silicon wafers in an embodiment of the invention;
FIG. 5 is a cross-sectional view A-A of FIG. 4;
FIG. 6 is a B-B cross-sectional view of FIG. 3;
FIG. 7 is a schematic view of a wiring device according to an embodiment of the present invention;
FIG. 8 is a perspective view of a spray device in an embodiment of the invention;
FIG. 9 is a schematic view of a spray device in accordance with an embodiment of the present invention;
the figures indicate: the device comprises a frame, a 2-vertical telescopic device, a 3-telescopic shaft, a 4-crystal pulling connector, a 5-wedge block, a 6-connecting shaft, a 7-locking nut, an 8-cooling liquid storage box, a 9-spraying device, a 10-receiving box, an 11-wire guide roller, a 12-wiring board, a 13-wire distributing wheel, a 14-horizontal transition wheel, a 15-vertical transition wheel, a 16-wire releasing roller, a 17-wire releasing roller rotation driving device, a 18-wire releasing pinch roller, a 19-elastic device, a 20-wire releasing transition wheel, a 21-support frame, a 22-cutting wire, a 23-second mounting plate, a 24-height adjustment transition wheel, a 25-vertical lifting device, a 26-material taking opening, a 27-wire collecting roller, a 28-wire collecting roller rotation driving device, a 29-mounting seat, a 31-wire collecting pinch roller, a 32-wire collecting transition wheel and a 33-horizontal mounting plate.
Detailed Description
The invention will be further described with reference to the drawings and examples.
As shown in fig. 1 to 9, the multi-wire cutting machine for silicon wafers comprises a frame 1, wherein a feeding cavity is arranged on the frame 1, a wafer dragging connector 4 is arranged at the top of the feeding cavity, a vertical telescopic device 2 and a cooling liquid storage box 8 are arranged above the feeding cavity, and a telescopic shaft 3 of the vertical telescopic device 2 is connected with the wafer dragging connector 4; the lower part of the frame 1 is provided with two wire guide rollers 11 with axes parallel to each other, and the wire guide rollers 11 are in running fit with the frame 1; a material receiving box 10 is arranged between the two wire guide rollers 11; a material taking opening 26 is formed in the frame 1, and the material taking opening 26 is positioned at one end of the material receiving box 10; a wiring device is arranged below the material receiving box; a spraying device is arranged above the wire guide roller 11; one side of the frame 1 is provided with a winding device;
the second mounting plate 23 of the winding device package and the lower part of the side surface of the bracket 1 are provided with a paying-off device and a winding device; the second mounting plate 23 is parallel to the side surface of the frame 1 and is vertically arranged; the paying-off device comprises a paying-off roller 16 and a paying-off roller rotation driving device 17, and the winding device comprises a winding roller 27 and a winding roller rotation driving device 28;
the paying-off roller rotation driving device 17 and the take-up roller rotation driving device 28 are arranged on the side surface of the frame 1, and the paying-off roller 16 and the take-up roller 27 are horizontally arranged; a paying-off pinch roller 18 is arranged above the paying-off roller 16, and a wire-collecting pinch roller 31 is arranged above the wire-collecting roller 27;
the top of the second mounting plate 23 is provided with a paying-off transition wheel 20 and a taking-up transition wheel 32; a horizontal mounting plate 33 is arranged between the lower parts of the side surfaces of the frame 1 and the lower parts of the second mounting plates 23; two height-adjusting transition wheels 24 are arranged on the horizontal mounting plate 33, and the two height-adjusting transition wheels 24 are distributed and positioned right below the paying-off transition wheel 20 and the taking-up transition wheel 32;
two horizontal transition wheels 14 are arranged on the horizontal mounting plate 33, and a wire passing port is arranged at the lower part of the frame 1; the horizontal transition wheel 14 is flush with the wire passing opening; two vertical transition wheels 15 are arranged between the horizontal transition wheel 14 and the height adjustment transition wheel 24; the horizontal transition wheels 14, the vertical transition wheels 15 and the height adjustment transition wheels 24 are in one-to-one correspondence;
the wiring device comprises a wiring board 12 and two groups of wire wheels 13, wherein the two groups of wire wheels 13 are distributed in parallel; and each group of wire dividing wheels comprises at least three wire dividing wheels 13; each of the two sets of wire-dividing wheels 13 is aligned one to one; a cutting line is arranged on the paying-off roller 16; the cutting line 22 sequentially bypasses the paying-off pinch roller 18, the paying-off transition roller 20, the height adjustment transition roller 24, the vertical transition roller 15, the horizontal transition roller 14, the two groups of wire distribution rollers 13 and the two wire guide rollers 11, sequentially bypasses the horizontal transition roller 14, the vertical transition roller 15, the height adjustment transition roller 24, the wire collecting transition roller 32 and the wire collecting pinch roller 31, and finally returns to the wire collecting roller 27;
the spraying device comprises a spraying device body 91, wherein a transverse liquid supplementing groove 92 and an overflow groove 93 are arranged on the spraying device body 91, and the overflow groove 93 is positioned on one side of the liquid supplementing groove 92; the height of the opening of the overflow groove 93 is lower than that of the liquid supplementing groove 92; the bottom of the overflow groove 93 is provided with a through hole 97 communicated with the bottom of the liquid supplementing groove 92; a cover plate 95 is arranged at the opening of the fluid supplementing groove 92; a liquid supplementing pipe 96 communicated with the liquid supplementing groove 92 is arranged in the middle of the cover plate 95; one side of the opening of the overflow groove 93 is provided with an overflow plate 94 which is inclined downwards; mounting plates 98 are arranged at two ends of the spray device body 91; the spray device body 91 is mounted on the frame 1 through a mounting plate 98; the cooling liquid storage tank 8 is communicated with the liquid supplementing pipe 96 through a water pump.
In the working process, a crystal puller with a silicon rod is arranged on a crystal puller connector 4; then, the take-up roll rotation driving device 28 and the pay-off roll rotation driving device 17 are started to enable the take-up roll 27 and the pay-off roll 16 to synchronously rotate; the cutting line 22 is sent by the paying-off roller 16 to bypass the paying-off pinch roller 18, the paying-off pinch roller 20, the height adjusting pinch roller 24, the vertical pinch roller 15, the horizontal pinch roller 14, the two groups of wire distributing rollers 13 and the wire guide roller 11 in sequence, then bypass the horizontal pinch roller 14, the vertical pinch roller 15, the height adjusting pinch roller 24, the wire collecting pinch roller 32 and the wire collecting pinch roller 31 in sequence, and finally returns to the wire collecting roller 27; it should be noted that when the wire separating wheel 13 and the wire guiding roller 11 are wound, parallel wire webs are formed on the wire guiding roller, and offset parallel wire webs are formed between the wire separating wheels 13, as shown in fig. 7. The last take-up roller 27 thus recovers the wire paid out in the pay-off roller 16; and to provide a certain tension to the cutting line 22. Meanwhile, the spraying device is started, cooling liquid is supplemented into the liquid supplementing groove through the liquid supplementing pipe 96, when the liquid level of the cooling liquid in the liquid supplementing groove 92 is higher than the opening of the overflow groove 93, the cooling liquid overflows from one side of the opening of the overflow groove 93 and then flows onto the overflow plate 94, laminar flow is formed on the overflow plate 94, a water curtain is formed after the cooling liquid is separated from the overflow plate 94, and then the cooling liquid is sprayed onto a cutting line below, so that uniform spraying is realized, and the cooling liquid contacted by the cutting line is uniform.
Then the vertical telescopic device 2 is started to enable the silicon rod to move downwards; when the silicon rod passes through the wire mesh on the wire guide roller 11, friction is generated between the cutting wire 22 and the silicon rod due to high-speed movement of the cutting wire, so that the silicon rod is cut to obtain the silicon wafer.
In summary, according to the silicon wafer multi-wire cutting machine disclosed by the invention, the cutting wires sequentially bypass the paying-off pinch roller, the paying-off transition roller, the vertical transition roller, the horizontal transition roller and the two groups of wire dividing rollers, and then sequentially bypass the horizontal transition roller, the vertical transition roller, the wire collecting transition roller and the wire collecting pinch roller, and finally return to the wire collecting roller; thus, the cutting line passes through fewer guide wheels, thereby reducing the path; meanwhile, unnecessary abrasion of the cutting line is reduced, and the service life of the cutting line is prolonged. Meanwhile, the guiding path is short, so that the arrangement of the cutting line path is facilitated, and the occupied space of the equipment can be reduced.
And the overflow plate is arranged at one side of the overflow groove, so that the cooling liquid overflows from one side of the overflow groove with a lower opening, and flows downwards on the overflow plate to form a water curtain after separating from the overflow plate.
In order to facilitate the installation of the crystal puller, a dovetail groove is further arranged on the crystal puller connector 4, and a wedge block 5 is arranged on the inner wall of one side of the dovetail groove; a connecting shaft 6 is arranged on the wedge block 5, one end of the connecting shaft 6 is connected with the wedge block 5, and the other end of the connecting shaft penetrates through the inner wall of the dovetail groove and is provided with a locking nut 7; the lock nut 7 is in threaded fit with the connecting shaft 6.
For cost reduction and control convenience, further, the paying-off roller rotation driving device 17 and the take-up roller rotation driving device 28 adopt motors or hydraulic motors.
In order to enable the paying-off pressing wheel 18 and the winding-up pressing wheel 31 to have large pressing force, specifically, the paying-off pressing wheel 18 and the winding-up pressing wheel 31 are mounted on the frame 1 through the elastic device 19, and the paying-off pressing wheel 18 is provided with a mounting seat 29, and the mounting seat 29 is hinged with one end of the elastic device 19. The elastic means 19 may be a telescopic shaft with a spring, or a rubber column.
In order to avoid that when a certain deviation occurs on the cutting line on the path, larger friction occurs between the cutting line and the guiding transition wheel, specifically, the paying-off transition wheel 20 and the taking-up transition wheel 32 are both installed on the second installation plate 23 through the support frame 21, and the installation seat of the paying-off transition wheel 20 is hinged with one end of the support frame 21.
To facilitate the adjustment of the height of the cutting line 22 to the horizontal transition wheel 14 so that the cutting line 22 can be passed horizontally around the horizontal transition wheel 14, further, the height adjustment transition wheel 24 is mounted on the horizontal mounting plate 33 by means of the vertical lifting device 25. The concrete vertical lifting device 25 adopts a hydraulic cylinder.
In order to facilitate cleaning of the remaining cooling liquid in the liquid supplementing tank 92, further, a drain outlet 910 is arranged at the bottom of the liquid supplementing tank 92, and the drain outlet 910 is provided with an outlet at one side of the spray device body 91, and the outlet is provided with a plug 911. In order to avoid pollution of the cooling liquid, a dust cover 99 is further arranged above the overflow plate 94.
Claims (3)
1. The multi-wire cutting machine for the silicon wafers is characterized in that: the crystal pulling device comprises a frame (1), wherein a feeding cavity is arranged on the frame (1), a crystal pulling connector (4) is arranged at the top of the feeding cavity, a vertical telescopic device (2) and a cooling liquid storage box (8) are arranged above the feeding cavity, and a telescopic shaft (3) of the vertical telescopic device (2) is connected with the crystal pulling connector (4); the lower part of the frame (1) is provided with two wire guide rollers (11) with mutually parallel axes, and the wire guide rollers (11) are in running fit with the frame (1); a receiving box (10) is arranged between the two wire guide rollers (11); a material taking opening (26) is formed in the frame (1), and the material taking opening (26) is positioned at one end of the material receiving box (10); a wiring device is arranged below the material receiving box; a spraying device is arranged above the wire guide roller (11); one side of the frame (1) is provided with a winding device;
the winding device comprises a second mounting plate (23) and a paying-off device and a winding device are arranged at the lower part of the side face of the bracket (1); the second mounting plate (23) is parallel to the side surface of the frame (1) and is vertically arranged; the paying-off device comprises a paying-off roller (16) and a paying-off roller rotation driving device (17), and the winding device comprises a winding roller (27) and a winding roller rotation driving device (28);
the paying-off roller rotation driving device (17) and the take-up roller rotation driving device (28) are arranged on the side surface of the frame (1), and the paying-off roller (16) and the take-up roller (27) are horizontally arranged; a paying-off compression wheel (18) is arranged above the paying-off roller (16), and a wire-collecting compression wheel (31) is arranged above the wire-collecting roller (27);
a paying-off transition wheel (20) and a taking-up transition wheel (32) are arranged at the top of the second mounting plate (23); a horizontal mounting plate (33) is arranged between the lower part of the side surface of the frame (1) and the lower part of the second mounting plate (23); two height-adjusting transition wheels (24) are arranged on the horizontal mounting plate (33), and the two height-adjusting transition wheels (24) are distributed under the paying-off transition wheel (20) and the taking-up transition wheel (32);
two horizontal transition wheels (14) are arranged on the horizontal mounting plate (33), and a wire passing port is arranged at the lower part of the frame (1); the horizontal transition wheel (14) is flush with the wire passing port; two vertical transition wheels (15) are arranged between the horizontal transition wheel (14) and the height adjustment transition wheel (24); the horizontal transition wheels (14), the vertical transition wheels (15) and the height adjustment transition wheels (24) are in one-to-one correspondence;
the wiring device comprises a wiring board (12) and two groups of wire-distributing wheels (13), wherein the two groups of wire-distributing wheels (13) are distributed in parallel; and each group of wire separating wheels comprises at least three wire separating wheels (13); each of the two sets of wire separating wheels (13) is aligned one by one; a cutting line is arranged on the paying-off roller (16); the cutting line (22) sequentially bypasses the paying-off pinch roller (18), the paying-off pinch roller (20), the height-adjusting pinch roller (24), the vertical pinch roller (15), the horizontal pinch roller (14), the two groups of wire distributing rollers (13) and the two wire rollers (11), sequentially bypasses the horizontal pinch roller (14), the vertical pinch roller (15), the height-adjusting pinch roller (24), the wire collecting pinch roller (32) and the wire collecting pinch roller (31), and finally returns to the wire collecting roller (27);
the spraying device comprises a spraying device body (91), wherein a transverse liquid supplementing groove (92) and an overflow groove (93) are arranged on the spraying device body (91), and the overflow groove (93) is positioned on one side of the liquid supplementing groove (92); the height of the opening of the overflow groove (93) is lower than that of the liquid supplementing groove (92); the bottom of the overflow groove (93) is provided with a through hole (97) communicated with the bottom of the liquid supplementing groove (92); a cover plate (95) is arranged at the opening of the liquid supplementing groove (92); a liquid supplementing pipe (96) communicated with the liquid supplementing groove (92) is arranged in the middle of the cover plate (95); one side of the opening of the overflow groove (93) is provided with an overflow plate (94) which is inclined downwards; mounting plates (98) are arranged at two ends of the spray device body (91); the spraying device body (91) is arranged on the frame (1) through a mounting plate (98); the cooling liquid storage box (8) is communicated with the liquid supplementing pipe (96) through a water pump;
the height-adjusting transition wheel (24) is arranged on the horizontal mounting plate (33) through the vertical lifting device (25); the vertical lifting device (25) adopts a hydraulic cylinder;
the crystal puller connector (4) is provided with a dovetail groove, and the inner wall of one side of the dovetail groove is provided with a wedge block (5); a connecting shaft (6) is arranged on the wedge block (5), one end of the connecting shaft (6) is connected with the wedge block (5), and the other end of the connecting shaft penetrates through the inner wall of the dovetail groove and is provided with a locking nut (7); the lock nut (7) is in threaded fit with the connecting shaft (6);
the paying-off pressing wheel (18) and the taking-up pressing wheel (31) are arranged on the frame (1) through the elastic device (19), the paying-off pressing wheel (18) is provided with a mounting seat, and the mounting seat is hinged with one end of the elastic device (19);
a drain outlet (910) is formed in the bottom of the liquid supplementing groove (92), an outlet is formed in one side of the spray device body (91) of the drain outlet (910), and a plug (911) is arranged at the outlet; a dust cover (99) is arranged above the overflow plate (94).
2. The silicon wafer multi-wire saw as defined in claim 1, wherein: the paying-off transition wheel (20) and the taking-up transition wheel (32) are mounted on the second mounting plate (23) through the support frame (21), and a mounting seat of the paying-off transition wheel (20) is hinged with one end of the support frame (21).
3. The silicon wafer multi-wire saw as defined in claim 2, wherein: the paying-off roller rotation driving device (17) and the winding-up roller rotation driving device (28) adopt motors or hydraulic motors.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811245167.9A CN109129949B (en) | 2018-10-24 | 2018-10-24 | Silicon wafer multi-wire cutting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811245167.9A CN109129949B (en) | 2018-10-24 | 2018-10-24 | Silicon wafer multi-wire cutting machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109129949A CN109129949A (en) | 2019-01-04 |
| CN109129949B true CN109129949B (en) | 2024-02-23 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811245167.9A Active CN109129949B (en) | 2018-10-24 | 2018-10-24 | Silicon wafer multi-wire cutting machine |
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| CN (1) | CN109129949B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111098419B (en) * | 2019-12-30 | 2021-07-13 | 郑州合晶硅材料有限公司 | Slicing device for silicon wafer production |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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